L H H or L H or L X X Input Input Isolation
L H ↑↑X X Input Input Store A and B data
X H ↑ H or L X X Input Unspecified
‡
Store A, hold B
H H ↑↑X
‡
X Input Output Store A in both registers
L X H or L ↑ X X Unspecified
‡
Input Hold A, store B
L L ↑↑XX‡Output Input Store B in both registers
L L X X X L Output Input Real-time B data to A bus
L L X H or L X H Output Input Stored B data to A bus
H H X X L X Input Output Real-time A data to B bus
H H H or L X H X Input Output Stored A data to B bus
H L H or L H or L H H Output Output
Stored A data to B bus and
Stored B data to A bus
†
The data output functions may be enabled or disabled by a variety of level combinations at the OEAB or OEBA inputs. Data input functions are
always enabled; i.e., data at the bus terminals is stored on every low-to-high transition on the clock inputs.
‡
Select control = L; clocks can occur simultaneously.
Select control = H; clocks must be staggered in order to load both registers.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
§
Supply voltage range, V
CC
–0.5 V to 4.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, V
I
: Except I/O ports (see Note 1) –0.5 V to 4.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I/O ports (see Notes 1 and 2) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO (see Notes 1 and 2) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0) –50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, I
OK
(VO < 0 or VO > VCC) ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±100 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum power dissipation at TA = 55°C (in still air) (see Note 3): DGG package 1 W. . . . . . . . . . . . . . . . . .
DL package 1.4 W. . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
§
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This value is limited to 4.6 V maximum.
3. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils.
For more information, refer to the
Package Thermal Considerations
application note in the 1994
ABT Advanced BiCMOS T echnology
Data Book
, literature number SCBD002B.