Texas Instruments SN74AC564DBLE, SN74AC564DBR, SN74AC564DW, SN74AC564DWR, SN74AC564N Datasheet

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SN54AC564, SN74AC564
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCAS551A – NOVEMBER 1995 – REVISED MA Y 1996
D
D
Full Parallel Access for Loading
D
Flow-Through Architecture to Optimize PCB Layout
D
EPIC
(Enhanced-Performance Implanted
CMOS) 1-µm Process
D
Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW), Ceramic Chip Carriers (FK) and Flatpacks (W), and Standard Plastic (N) and Ceramic (J) DIPs
description
SN54AC564 ...J OR W PACKAGE
SN74AC564 . . . DB, DW, N, OR PW PACKAGE
SN54ACT564 . . . FK PACKAGE
OE
1D 2D 3D 4D 5D 6D 7D 8D
GND
(TOP VIEW)
20
1
19
2
18
3
17
4
16
5
15
6
14
7
13
8
12
9
11
10
(TOP VIEW)
V
CC
1Q 2Q 3Q 4Q 5Q 6Q 7Q 8Q CLK
The ’AC564 are octal D-type edge-triggered flip-flops that feature inverting 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
On the positive transition of the clock (CLK) input, the Q
outputs are set to the inverse logic levels set
3D 4D 5D 6D 7D
2D1DOE
3 2 1 20 19
4 5 6 7 8
910111213
V
CC
1Q
18 17 16 15 14
2Q 3Q 4Q 5Q 6Q
up at the data (D) inputs. A buffered output-enable (OE) input places the
8D
GND
CLK
8Q
7Q
eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly . The high-impedance state and increased drive provide the capability to drive bus lines without interface or pullup components.
OE does not affect internal operations of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.
The SN54AC564 is characterized for operation over the full military temperature range of –55°C to 125°C. The SN74AC564 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
(each flip-flop)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments Incorporated.
UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
INPUTS
OE CLK D
L H L L LH L H or L X Q
H X X Z
OUTPUT
Q
0
Copyright  1996, Texas Instruments Incorporated
1
SN54AC564, SN74AC564 OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS WITH 3-STATE OUTPUTS
SCAS551A – NOVEMBER 1995 – REVISED MA Y 1996
logic symbol
OE
CLK
1D 2D 3D 4D 5D 6D 7D 8D
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
1
11
2 3 4 5 6 7 8 9
EN
1D
C1
1
19 18 17 16 15 14 13 12
1Q 2Q 3Q 4Q 5Q 6Q 7Q 8Q
logic diagram (positive logic)
1
OE
11
CLK
C1
1D
2
1D
To Seven Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO (see Note 1) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, I
Continuous output current, IO (VO = 0 to VCC) ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±200 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum power dissipation at TA = 55°C (in still air) (see Note 2): DB package 0.6 W. . . . . . . . . . . . . . . . . .
Storage temperature range, T
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils, except for the N package, which has a trace length of zero.
(VO < 0 or VO > VCC) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OK
DW package 1.6 W. . . . . . . . . . . . . . . . . .
N package 1.3 W. . . . . . . . . . . . . . . . . . . .
PW package 0.7 W. . . . . . . . . . . . . . . . . .
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
stg
19
1Q
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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