3-State Inverting Outputs Drive Bus Lines
Directly
D
Full Parallel Access for Loading
D
Flow-Through Architecture to Optimize
PCB Layout
D
EPIC
(Enhanced-Performance Implanted
CMOS) 1-µm Process
D
Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), Thin Shrink Small-Outline (PW),
Ceramic Chip Carriers (FK) and
Flatpacks (W), and Standard Plastic (N) and
Ceramic (J) DIPs
description
SN54AC564 ...J OR W PACKAGE
SN74AC564 . . . DB, DW, N, OR PW PACKAGE
SN54ACT564 . . . FK PACKAGE
OE
1D
2D
3D
4D
5D
6D
7D
8D
GND
(TOP VIEW)
20
1
19
2
18
3
17
4
16
5
15
6
14
7
13
8
12
9
11
10
(TOP VIEW)
V
CC
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
CLK
The ’AC564 are octal D-type edge-triggered
flip-flops that feature inverting 3-state outputs
designed specifically for driving highly capacitive
or relatively low-impedance loads. They are
particularly suitable for implementing buffer
registers, I/O ports, bidirectional bus drivers, and
working registers.
On the positive transition of the clock (CLK) input,
the Q
outputs are set to the inverse logic levels set
3D
4D
5D
6D
7D
2D1DOE
3 2 1 20 19
4
5
6
7
8
910111213
V
CC
1Q
18
17
16
15
14
2Q
3Q
4Q
5Q
6Q
up at the data (D) inputs.
A buffered output-enable (OE) input places the
8D
GND
CLK
8Q
7Q
eight outputs in either a normal logic state (high or
low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive
the bus lines significantly . The high-impedance state and increased drive provide the capability to drive bus lines
without interface or pullup components.
OE does not affect internal operations of the flip-flops. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
The SN54AC564 is characterized for operation over the full military temperature range of –55°C to 125°C. The
SN74AC564 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
(each flip-flop)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments Incorporated.
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
INPUTS
OECLKD
L↑HL
L↑LH
LH or LXQ
HXXZ
OUTPUT
Q
0
Copyright 1996, Texas Instruments Incorporated
1
SN54AC564, SN74AC564
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCAS551A – NOVEMBER 1995 – REVISED MA Y 1996
logic symbol
OE
CLK
1D
2D
3D
4D
5D
6D
7D
8D
†
This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
†
1
11
2
3
4
5
6
7
8
9
EN
1D
C1
1
19
18
17
16
15
14
13
12
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
logic diagram (positive logic)
1
OE
11
CLK
C1
1D
2
1D
To Seven Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Maximum power dissipation at TA = 55°C (in still air) (see Note 2): DB package 0.6 W. . . . . . . . . . . . . . . . . .
Storage temperature range, T
‡
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils,
except for the N package, which has a trace length of zero.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
TA = 25°CSN54AC564SN74AC564
MINTYPMAXMINMAXMINMAX
I
I
I
C
OH
OL
I
OZ
CC
i
CC
3 V2.92.92.9
IOH = –50 µA
IOH = –12 mA3 V2.562.42.46
= –24
OH
IOL = 50 µA
IOL = 12 mA3 V0.360.50.44
= 24
OL
VI = VCC or GND5.5 V±0.1±1±1µA
VO = VCC or GND5.5 V±0.5±5±5µA
VI = VCC or GND,IO = 05.5 V48040µA
VI = VCC or GND5 V4.5pF
4.5 V4.44.44.4
5.5 V5.45.45.4
4.5 V3.863.73.76
5.5 V4.864.74.76
3 V0.10.10.1
4.5 V0.10.10.1
5.5 V0.10.10.1
4.5 V0.360.50.44
5.5 V0.360.50.44
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
SN54AC564, SN74AC564
UNIT
UNIT
PARAMETER
UNIT
CLK
Q
ns
OE
Q
ns
OE
Q
ns
PARAMETER
UNIT
CLK
Q
ns
OE
Q
ns
OE
Q
ns
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCAS551A – NOVEMBER 1995 – REVISED MA Y 1996
timing requirements over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V
(unless otherwise noted) (see Figure 1)
TA = 25°CSN54AC564SN74AC564
MINMAXMINMAXMINMAX
t
Pulse duration, CLK high or low67.57ns
w
t
Setup time, data before CLK↑2.54.53ns
su
t
Hold time, data after CLK↑22.52ns
h
timing requirements over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V
(unless otherwise noted) (see Figure 1)
TA = 25°CSN54AC564SN74AC564
MINMAXMINMAXMINMAX
t
Pulse duration, CLK high or low455ns
w
t
Setup time, data before CLK↑23.52.5ns
su
t
Hold time, data after CLK↑22.52ns
h
switching characteristics over recommended operating free-air temperature range,
= 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
Power dissipation capacitanceCL = 50 pF, f = 1 MHz50pF
pd
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
From Output
Under Test
CL = 50 pF
(see Note A)
Input
PARAMETER MEASUREMENT INFORMATION
500 Ω
500 Ω
LOAD CIRCUIT
t
w
50% V
CC
VOLTAGE WAVEFORMS
S1
50% V
CC
2 × V
V
CC
0 V
SN54AC564, SN74AC564
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCAS551A – NOVEMBER 1995 – REVISED MA Y 1996
CC
Open
Timing Input
Data Input
TESTS1
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
t
su
50% V
CC
VOLTAGE WAVEFORMS
2 × V
50% V
Open
Open
CC
50% V
CC
t
h
CC
V
0 V
V
0 V
CC
CC
Input
t
PLH
In-Phase
Output
t
PHL
Out-of-Phase
Output
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one input transition per measurement.
50% V
CC
50% V
50% V
VOLTAGE WAVEFORMS
50% V
CC
CC
Figure 1. Load Circuit and Voltage Waveforms
CC
t
PHL
50% V
t
PLH
50% V
CC
CC
V
0 V
V
V
V
V
CC
OH
OL
OH
OL
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 2 × V
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
CC
t
PZL
t
50% V
50% V
PZH
VOLTAGE WAVEFORMS
CC
t
PLZ
t
PHZ
50% V
CC
CC
50% V
CC
VOL + 0.3 V
VOH – 0.3 V
V
0 V
[
V
V
[
CC
V
OL
OH
0 V
CC
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICA TIONS USING SEMICONDUCT OR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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