SN74AHCT373 . . . DB, DGV, DW, N, NS, OR PW PACKAGE
SN54AHCT373 ...J OR W PACKAGE
(TOP VIEW)
20
OE
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
1
2
3
4
5
6
7
8
9
10
19
18
17
16
15
14
13
12
11
V
8Q
8D
7D
7Q
6Q
6D
5D
5Q
LE
CC
description/ordering information
SN54AHCT373, SN74AHCT373
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCLS239M – OCTOBER 1995 – REVISED JUL Y 2003
D
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SN54AHCT373 . . . FK PACKAGE
2D
2Q
3Q
3D
4D
(TOP VIEW)
1D1QOE
3 2 1 20 19
4
5
6
7
8
9 10 11 12 13
LE
4Q
GND
V
CC
5Q
8Q
18
17
16
15
14
5D
8D
7D
7Q
6Q
6D
The ’AHCT373 devices are octal-transparent D-type latches. When the latch-enable (LE) input is high, the Q
outputs follow the data (D) inputs. When LE is low, the Q outputs are latched at the logic levels of the D inputs.
A buffered output-enable (OE
) input can be used to place the eight outputs in either a normal logic state (high
or low) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines
significantly. The high-impedance state and increased drive provide the capability to drive bus lines without
interface or pullup components.
OE
does not affect the internal operations of the latches. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
T o ensure the high-impedance state during power up or power down, OE
should be tied to V
through a pullup
CC
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMA TION
T
A
PDIP – NTubeSN74AHCT373NSN74AHCT373N
°
–
–55°C to 125°C
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 2003, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
1
SN54AHCT373, SN74AHCT373
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCLS239M – OCTOBER 1995 – REVISED JULY 2003
FUNCTION TABLE
INPUTS
OELED
LHHH
LHL L
LLX Q
HXXZ
logic diagram (positive logic)
1
OE
11
LE
(each latch)
OUTPUT
Q
0
1D
3
To Seven Other Channels
C1
1D
2
1Q
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
Input voltage range, V
Output voltage range, V
Input clamp current, I
Output clamp current, I
Continuous output current, I
Continuous current through V
Package thermal impedance, θ
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
TA = 25°CSN54AHCT373SN74AHCT373
MINTYPMAXMINMAXMINMAX
4.44.54.44.4
3.943.83.8
0.10.10.1
0.360.440.44
I
I
I
∆I
C
C
OH
OL
OZ
I
CC
i
o
CC
CC
IOH = –50 mA
IOH = –8 mA
IOL = 50 mA
IOL = 8 mA
VO = VCC or GND5.5 V±0.25±2.5±2.5
VI = 5.5 V or GND0 V to 5.5 V±0.1±1*±1
VI = VCC or GND, IO = 05.5 V44040
One input at 3.4 V ,
†
Other inputs at VCC or GND
VI = VCC or GND5 V41010pF
VO = VCC or GND5 V9pF
5.5 V1.351.51.5mA
CC
0V
CC
V
m
A
m
A
m
A
timing requirements over recommended operating free-air temperature range, V
(unless otherwise noted) (see Figure 1)
TA = 25°CSN54AHCT373SN74AHCT373
MINMAXMINMAXMINMAX
t
w
t
su
t
h
Pulse duration, LE high6.56.56.5ns
Setup time, data before LE↓
Hold time, data after LE↓3.53.53.5ns
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1.51.51.5ns
= 5 V ± 0.5 V
CC
3
SN54AHCT373, SN74AHCT373
PARAMETER
UNIT
DQC
15 pF
ns
LEQC
15 pF
ns
OE
Q
C
15 pF
ns
OE
Q
C
15 pF
ns
DQC
50 pF
ns
LEQC
50 pF
ns
OE
Q
C
50 pF
ns
OE
Q
C
50 pF
ns
PARAMETER
UNIT
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCLS239M – OCTOBER 1995 – REVISED JULY 2003
switching characteristics over recommended operating free-air temperature range,
V
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
CC
FROMTOLOAD
(INPUT)(OUTPUT)CAPACITANCE
t
PLH
t
PHL
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
PLH
t
PHL
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
sk(o)
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
** On products compliant to MIL-PRF-38535, this parameter does not apply.
NOTE 4: Characteristics are for surface-mount packages only.
Quiet output, maximum dynamic V
Quiet output, minimum dynamic V
Quiet output, minimum dynamic V
High-level dynamic input voltage2V
Low-level dynamic input voltage0.8V
operating characteristics, V
C
Power dissipation capacitanceNo load,f = 1 MHz17pF
pd
= 5 V, CL = 50 pF, TA = 25°C (see Note 4)
CC
OL
OL
OH
= 5 V, TA = 25°C
CC
PARAMETERTEST CONDITIONSTYPUNIT
SN74AHCT373
MINTYPMAX
0.81.2V
–0.8–1.2V
4.1V
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
From Output
Under Test
(see Note A)
SN54AHCT373, SN74AHCT373
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCLS239M – OCTOBER 1995 – REVISED JULY 2003
PARAMETER MEASUREMENT INFORMATION
V
Test
Point
C
L
From Output
Under Test
(see Note A)
C
L
RL = 1 kΩ
S1
CC
Open
GND
TESTS1
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
Open Drain
Open
V
CC
GND
V
CC
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
t
w
Input
Input
In-Phase
Output
Out-of-Phase
Output
INVERTING AND NONINVERTING OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
The marketing status values are definedas follows:
ACTIVE: Product device recommended for newdesigns.
LIFEBUY: TI has announced that thedevice will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced butis not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the productionof the device.
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-NC-NC-NC
CU NIPDAULevel-NC-NC-NC
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
(3)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability informationand additional product content details.
TBD: The Pb-Free/Green conversion plan hasnot been defined.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free productsare suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do notexceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available forrelease.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
26-Sep-2005
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A SQ
B SQ
19
20
21
22
23
24
25
1282627
12
131415161817
0.020 (0,51)
0.010 (0,25)
MIN
0.342
(8,69)
0.442
0.640
0.739
0.938
1.141
A
0.358
(9,09)
0.458
(11,63)
0.660
(16,76)
0.761
(19,32)(18,78)
0.962
(24,43)
1.165
(29,59)
NO. OF
TERMINALS
**
11
10
9
8
7
6
5
432
20
28
44
52
68
84
0.020 (0,51)
0.010 (0,25)
(11,23)
(16,26)
(23,83)
(28,99)
MINMAX
0.307
(7,80)
0.406
(10,31)
0.495
(12,58)
0.495
(12,58)
0.850
(21,6)
1.047
(26,6)
0.080 (2,03)
0.064 (1,63)
B
MAX
0.358
(9,09)
0.458
(11,63)
0.560
(14,22)
0.560
(14,22)
0.858
(21,8)
1.063
(27,0)
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
4040140/D 10/96
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,65
28
1
2,00 MAX
0,38
0,22
15
14
A
0,05 MIN
0,15
5,60
5,00
M
8,20
7,40
Seating Plane
0,10
0,25
0,09
0°–ā8°
Gage Plane
0,25
0,95
0,55
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
14
6,50
6,50
5,905,90
2016
7,50
6,90
24
8,50
28
10,50
9,907,90
30
10,50
9,90
38
12,90
12,30
4040065 /E 12/01
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
1,20 MAX
14
0,30
0,19
8
4,50
4,30
PINS **
7
Seating Plane
0,15
0,05
8
1
A
DIM
14
0,10
6,60
6,20
M
0,10
0,15 NOM
2016
0°–8°
Gage Plane
24
0,25
0,75
0,50
28
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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