SOIC
DW
ACT374
40°C to 85°C
SN54ACT374, SN74ACT374
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCAS539F – OCTOBER 1995 – REVISED NOVEMBER 2002
D
4.5-V to 5.5-V VCC Operation
D
Inputs Accept Voltages to 5.5 V
D
Max tpd of 10 ns at 5 V
D
Inputs Are TTL-Voltage Compatible
description/ordering information
These 8-bit flip-flops feature 3-state outputs
designed specifically for driving highly capacitive
or relatively low-impedance loads. The devices
are particularly suitable for implementing buffer
registers, I/O ports, bidirectional bus drivers, and
working registers.
The eight flip-flops of the ’ACT374 devices are
D-type edge-triggered flip-flops. On the positive
transition of the clock (CLK) input, the Q outputs
are set to the logic levels set up at the data (D)
inputs.
A buffered output-enable (OE
to place the eight outputs in either a normal logic
state (high or low logic levels) or the
high-impedance state. In the high-impedance
state, the outputs neither load nor drive the bus
lines significantly. The high-impedance state and
the increased drive provide the capability to drive
bus lines in bus-organized systems without need
for interface or pullup components.
OE
does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while
the outputs are in the high-impedance state.
) input can be used
SN54ACT374 ...J OR W PACKAGE
SN74ACT374 . . . DB, DW, N, NS, OR PW PACKAGE
SN54ACT374 . . . FK PACKAGE
2D
2Q
3Q
3D
4D
OE
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
4
5
6
7
8
(TOP VIEW)
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
(TOP VIEW)
GND
V
CLK
CC
5Q
1D1QOE
3 2 1 20 19
9 10 11 12 13
4Q
V
CC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
CLK
8Q
18
17
16
15
14
5D
8D
7D
7Q
6Q
6D
T o ensure the high-impedance state during power up or power down, OE
should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMA TION
T
A
PDIP – N Tube SN74ACT374N SN74ACT374N
–
–
–55°C to 125°C
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
SOP – NS Tape and reel SN74ACT374NSR ACT374
SSOP – DB Tape and reel SN74ACT374DBR AD374
TSSOP – PW Tape and reel SN74ACT374PWR AD374
CDIP – J Tube SNJ54ACT374J SNJ54ACT374J
CFP – W Tube SNJ54ACT374W SNJ54ACT374W
LCCC – FK Tube SNJ54ACT374FK SNJ54ACT374FK
PACKAGE
†
Tube SN74ACT374DW
Tape and reel SN74ACT374DWR
ORDERABLE
PART NUMBER
Copyright 2002, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
TOP-SIDE
MARKING
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
SN54ACT374, SN74ACT374
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCAS539F – OCTOBER 1995 – REVISED NOVEMBER 2002
FUNCTION TABLE
(each flip-flop)
INPUTS
OE
CLK D
L ↑ H H
L ↑ LL
L H or L X Q
H X X Z
logic diagram (positive logic)
1
OE
11
CLK
OUTPUT
Q
0
1D
C1
3
To Seven Other Channels
1D
2
1Q
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
Input voltage range, V
Output voltage range, V
Input clamp current, I
Output clamp current, I
Continuous output current, I
Continuous current through V
Package thermal impedance, θ
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
–0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CC
(see Note 1) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I
(see Note 1) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
O
(VI < 0 or VI > V
IK
(VO < 0 or VO > V
OK
(VO = 0 to VCC) ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
O
or GND ±200 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CC
(see Note 2): DB package 70°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
JA
±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CC)
±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CC)
DW package 58°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 69°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 60°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 83°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
stg
†
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
UNIT
PARAMETER
TEST CONDITIONS
V
UNIT
I
50 µA
V
I
24 mA
V
I
50 µA
V
I
24 mA
V
SN54ACT374, SN74ACT374
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCAS539F – OCTOBER 1995 – REVISED NOVEMBER 2002
recommended operating conditions (see Note 3)
SN54ACT374 SN74ACT374
MIN MAX MIN MAX
V
V
V
V
V
I
OH
I
OL
∆t/∆v Input transition rise or fall rate 8 8 ns/V
T
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
†
Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms.
‡
This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC.
Supply voltage 4.5 5.5 4.5 5.5 V
CC
High-level input voltage 2 2 V
IH
Low-level input voltage 0.8 0.8 V
IL
Input voltage 0 V
I
Output voltage 0 V
O
High-level output current –24 –24 mA
Low-level output current 24 24 mA
Operating free-air temperature –55 125 –40 85 °C
A
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
TA = 25°C SN54ACT374 SN74ACT374
MIN TYP MAX MIN MAX MIN MAX
I
I
I
∆I
C
OH
OL
OZ
I
CC
i
CC
CC
= –
OH
= –
OH
IOH = –50 mA
IOH = –75 mA
=
OL
=
OL
IOL = 50 mA
IOL = 75 mA
VO = VCC or GND 5.5 V ±0.25 ±5 ±2.5 µA
VI = VCC or GND 5.5 V ±0.1 ±1 ±1 µA
VI = VCC or GND, IO = 0 5.5 V 4 80 40 µA
‡
One input at 3.4 V ,
Other inputs at GND or V
VI = VCC or GND 5 V 4.5 pF
†
†
†
†
CC
4.5 V 4.4 4.49 4.4 4.4
5.5 V 5.4 5.49 5.4 5.4
4.5 V 3.86 3.7 3.76
5.5 V 4.86 4.7 4.76
5.5 V 3.85
5.5 V 3.85
4.5 V 0.1 0.1 0.1
5.5 V 0.1 0.1 0.1
4.5 V 0.36 0.44 0.44
5.5 V 0.36 0.5 0.44
5.5 V 1.65
5.5 V 1.65
5.5 V 0.6 1.6 1.5 mA
CC
CC
0 V
0 V
CC
CC
V
V
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
SN54ACT374, SN74ACT374
UNIT
PARAMETER
UNIT
CLK
Q
ns
OE
Q
ns
OE
Q
ns
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCAS539F – OCTOBER 1995 – REVISED NOVEMBER 2002
timing requirements over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V
(unless otherwise noted) (see Figure 1)
TA = 25°C SN54ACT374 SN74ACT374
MIN MAX MIN MAX MIN MAX
f
clock
t
w
t
su
t
h
switching characteristics over recommended operating free-air temperature range,
V
CC
Clock frequency 100 70 90 MHz
Pulse duration, CLK high or low 5 5 5 ns
Setup time, data before CLK↑ 5 5.5 5.5 ns
Hold time, data after CLK↑ 1.5 1.5 1.5 ns
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
TA = 25°C SN54ACT374 SN74ACT374
MIN TYP MAX MIN MAX MIN MAX
100 160 70 90 MHz
2 8.5 10 1.5 12 2 11.5
2 8 9.5 1.5 11.5 1.5 11
2 8 9.5 1.5 11.5 1.5 10.5
1.5 8 9 1.5 11.5 1.5 10.5
1.5 8.5 11.5 1.5 13 1 12.5
1.5 7 8.5 1.5 11 1 10
f
max
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
FROM TO
(INPUT) (OUTPUT)
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
C
Power dissipation capacitance CL = 50 pF, f = 1 MHz 40 pF
pd
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
From Output
Under Test
CL = 50 pF
(see Note A)
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
SCAS539F – OCTOBER 1995 – REVISED NOVEMBER 2002
PARAMETER MEASUREMENT INFORMATION
2 × V
CC
Open
500 Ω
500 Ω
S1
SN54ACT374, SN74ACT374
WITH 3-STATE OUTPUTS
TEST S1
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
Open
2 × V
Open
CC
LOAD CIRCUIT
t
w
Input
Input
Output
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one input transition per measurement.
1.5 V 1.5 V
VOLTAGE WAVEFORMS
1.5 V 1.5 V
t
PLH
50% V
VOLTAGE WAVEFORMS
CC
t
50% V
PHL
3 V
0 V
V
CC
V
3 V
0 V
OH
OL
Timing Input
Data Input
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 2 × V
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
CC
1.5 V
t
su
1.5 V 1.5 V
VOLTAGE WAVEFORMS
1.5 V 1.5 V
t
PZL
50% V
t
PZH
50% V
VOLTAGE WAVEFORMS
CC
CC
t
h
VOL + 0.3 V
VOH – 0.3 V
t
PLZ
t
PHZ
3 V
0 V
3 V
0 V
3 V
0 V
≈V
V
OL
V
OH
≈0 V
CC
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable Device Status
5962-87631012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
5962-8763101RA ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type
5962-8763101SA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type
5962-8763101VRA ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type
5962-8763101VSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type
SN74ACT374DBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI
SN74ACT374DBR ACTIVE SSOP DB 20 2000 Green (RoHS &
SN74ACT374DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS &
SN74ACT374DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS &
SN74ACT374DW ACTIVE SOIC DW 20 25 Green (RoHS &
SN74ACT374DWE4 ACTIVE SOIC DW 20 25 Green (RoHS &
SN74ACT374DWG4 ACTIVE SOIC DW 20 25 Green (RoHS &
SN74ACT374DWR ACTIVE SOIC DW 20 2000 Green (RoHS &
SN74ACT374DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS &
SN74ACT374DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS&
SN74ACT374N ACTIVE PDIP N 20 20 Pb-Free
SN74ACT374NE4 ACTIVE PDIP N 20 20 Pb-Free
SN74ACT374NSR ACTIVE SO NS 20 2000 Green (RoHS &
SN74ACT374NSRE4 ACTIVE SO NS 20 2000 Green (RoHS &
SN74ACT374NSRG4 ACTIVE SO NS 20 2000 Green (RoHS &
SN74ACT374PW ACTIVE TSSOP PW 20 70 Green (RoHS &
SN74ACT374PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS &
SN74ACT374PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS &
SN74ACT374PWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI
SN74ACT374PWR ACTIVE TSSOP PW 20 2000 Green (RoHS &
SN74ACT374PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS &
SN74ACT374PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS&
SNJ54ACT374FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
9-Oct-2007
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
9-Oct-2007
(3)
SNJ54ACT374J ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type
SNJ54ACT374W ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type
(1)
The marketing status values are defined asfollows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the devicewill be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but isnot in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production ofthe device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information andadditional product content details.
TBD: The Pb-Free/Green conversion plan has notbeen defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products aresuitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
TAPE AND REEL INFORMATION
11-Mar-2008
*All dimensions are nominal
Device Package
SN74ACT374DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
SN74ACT374DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1
SN74ACT374PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74ACT374DBR SSOP DB 20 2000 346.0 346.0 33.0
SN74ACT374DWR SOIC DW 20 2000 346.0 346.0 41.0
SN74ACT374PWR TSSOP PW 20 2000 346.0 346.0 33.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,65
28
1
2,00 MAX
0,38
0,22
15
14
A
0,05 MIN
0,15
5,60
5,00
M
8,20
7,40
Seating Plane
0,10
0,25
0,09
0°–ā8°
Gage Plane
0,25
0,95
0,55
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
14
6,50
6,50
5,905,90
2016
7,50
6,90
24
8,50
28
10,50
9,907,90
30
10,50
9,90
38
12,90
12,30
4040065 /E 12/01
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
1,20 MAX
14
0,30
0,19
8
4,50
4,30
PINS **
7
Seating Plane
0,15
0,05
8
1
A
DIM
14
0,10
6,60
6,20
M
0,10
0,15 NOM
0°–8°
2016
Gage Plane
24
0,25
0,75
0,50
28
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A SQ
B SQ
19
20
22
23
24
25
21
12826 27
12
1314151618 17
0.020 (0,51)
0.010 (0,25)
MIN
0.342
(8,69)
0.442
0.640
0.739
0.938
1.141
A
0.358
(9,09)
0.458
(11,63)
0.660
(16,76)
0.761
(19,32)(18,78)
0.962
(24,43)
1.165
(29,59)
NO. OF
TERMINALS
**
11
10
9
8
7
6
5
432
20
28
44
52
68
84
0.020 (0,51)
0.010 (0,25)
(11,23)
(16,26)
(23,83)
(28,99)
MINMAX
0.307
(7,80)
0.406
(10,31)
0.495
(12,58)
0.495
(12,58)
0.850
(21,6)
1.047
(26,6)
0.080 (2,03)
0.064 (1,63)
B
MAX
0.358
(9,09)
0.458
(11,63)
0.560
(14,22)
0.560
(14,22)
0.858
(21,8)
1.063
(27,0)
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
4040140/D 10/96
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