Latch-Up Performance Exceeds 500 mA Per
JEDEC Standard JESD-17
D
T ypical V
(Output Ground Bounce) < 1 V
OLP
at VCC = 5 V, TA = 25°C
D
High-Drive Outputs (–32-mA IOH, 64-mA IOL)
D
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
D
Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), and Thin Shrink Small-Outline (PW)
Packages, Ceramic Chip Carriers (FK),
Plastic (N) and Ceramic (J) DIPs, and
Ceramic Flat (W) Package
description
These 8-bit flip-flops with 3-state outputs are
designed specifically for driving highly capacitive
or relatively low-impedance loads. They are
particularly suitable for implementing buffer
registers, I/O ports, bidirectional bus drivers, and
working registers.
The eight flip-flops are edge-triggered D-type
flip-flops. On the positive transition of the clock
(CLK), the Q
the logic levels set up at the data (D) inputs.
outputs are set to the complement of
SN54ABT534 ...J OR W PACKAGE
SN74ABT534A . . . DB, DW, N, OR PW PACKAGE
SN54ABT534 . . . FK PACKAGE
2D
2Q
3Q
3D
4D
(TOP VIEW)
OE
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
(TOP VIEW)
1D1QOE
3212019
4
5
6
7
8
9
4Q
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
CC
V
10 11 12 13
5Q
CLK
GND
V
CC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
CLK
8Q
18
17
16
15
14
5D
8D
7D
7Q
6Q
6D
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high
or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive
the bus lines significantly . The high-impedance state and increased drive provide the capability to drive bus lines
without need for interface or pullup components.
OE does not affect the internal operations of the flip-flop. Previously stored data can be retained or new data
can be entered while the outputs are in the high-impedance state.
T o ensure the high-impedance state during power up or power down, OE
should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54ABT534 is characterized for operation over the full military temperature range of –55°C to 125°C. The
SN74ABT534A is characterized for operation from –40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC-ΙΙB is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright 1997, Texas Instruments Incorporated
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
SN54ABT534, SN74ABT534A
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCBS187F – JANUARY 1991 – REVISED JANUARY 1997
FUNCTION TABLE
(each flip-flop)
INPUTS
OECLKD
L↑HL
L↑LH
LH or LXQ
HXXZ
OUTPUT
Q
0
logic symbol
1
OE
11
CLK
3
1D
4
2D
7
3D
8
4D
13
5D
14
6D
17
7D
18
8D
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and
IEC Publication 617-12.
†
EN
C1
12
15
16
19
2
1Q
5
2Q
6
3Q
9
4Q
5Q
6Q
7Q
8Q
1D
logic diagram (positive logic)
1
OE
11
CLK
C1
1D
1D
3
To Seven Other Channels
2
1Q
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51, except for through-hole packages,
which use a trace length of zero.
Other inputs at VCC or GND
VI = 2.5 V or 0.5 V3.5pF
VO = 2.5 V or 0.5 V6.5pF
2.52.52.5
333
22
2*2
0.550.55
0.55*0.55
100mV
‡
‡
‡
–50–180
1250250250
24303030
0.5250250250
1.51.51.5mA
10
–10
CC
‡
‡
‡
–50–180
0V
10
–10
CC
V
‡
µA
‡
µA
‡
mA
µA
mA
µA
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
SN54ABT534, SN74ABT534A
CLK
Q
ns
OE
Q
ns
OE
Q
ns
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCBS187F – JANUARY 1991 – REVISED JANUARY 1997
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
SN54ABT534
VCC = 5 V,
f
clock
t
w
t
su
t
h
TA = 25°C
MINMAX
Clock frequency125125MHz
Pulse durationCLK high or low3.53.5ns
Setup time, data before CLK↑
Hold time, data after CLK↑High or low1.61.6ns
High or low1.61.6ns
MINMAX
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
SN74ABT534A
VCC = 5 V,
f
clock
t
w
t
su
t
h
†
This data sheet limit may vary among suppliers.
Clock frequency125125MHz
Pulse durationCLK high or low3.53.5ns
Setup time, data before CLK↑
Hold time, data after CLK↑High or low2
TA = 25°C
MINMAX
High or low1.61.6ns
†
MINMAX
†
2
UNIT
UNIT
ns
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, C
PARAMETER
f
max
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
= 50 pF (unless otherwise noted) (see Figure 1)
L
FROM
(INPUT)
TO
(OUTPUT)
SN54ABT534
VCC = 5 V,
TA = 25°C
MINTYPMAX
125175125MHz
2.64.56.12.67
3.45.56.73.47.9
13.45.215.8
2.645.82.67
2.44.76.62.47.6
2.33.85.82.36.8
MINMAX
UNIT
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CLK
Q
ns
OE
Q
ns
OE
Q
ns
SN54ABT534, SN74ABT534A
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCBS187F – JANUARY 1991 – REVISED JANUARY 1997
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, C
PARAMETER
f
max
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
= 50 pF (unless otherwise noted) (see Figure 1)
L
FROM
(INPUT)
TO
(OUTPUT)
SN74ABT534A
VCC = 5 V,
TA = 25°C
MINTYPMAX
125175125MHz
2.64.55.92.66.7
3.45.56.73.47.6
13.44.215
2.645.82.66.8
2.44.76.62.47.3
2.33.85.82.36.5
MINMAX
UNIT
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
SN54ABT534, SN74ABT534A
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCBS187F – JANUARY 1991 – REVISED JANUARY 1997
PARAMETER MEASUREMENT INFORMATION
500 Ω
t
w
1.5 V
500 Ω
1.5 V
1.5 V1.5 V
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
Input
Input
Output
Output
INVERTING AND NONINVERTING OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
1.5 V
VOLTAGE WAVEFORMS
PULSE DURATION
1.5 V1.5 V
t
PLH
t
PHL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
S1
t
PHL
1.5 V
t
PLH
3 V
0 V
V
V
V
V
7 V
GND
OH
OL
OH
OL
Open
3 V
0 V
Timing Input
Data Input
Output
Output
Control
Control
Output
Waveform 1
S1 at 7 V
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
TESTS1
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
t
su
1.5 V1.5 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
t
PZL
t
PLZ
1.5 V
t
t
PZH
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
PHZ
1.5 V
Open
Open
1.5 V
t
7 V
h
1.5 V1.5 V
VOL + 0.3 V
VOH – 0.3 V
3 V
0 V
3 V
0 V
3 V
0 V
3.5 V
V
OL
V
OH
≈ 0 V
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable DeviceStatus
5962-9314701Q2AACTIVELCCCFK201TBDPOST-PLATE N / A for Pkg Type
5962-9314701QRAACTIVECDIPJ201TBDA42 SNPBN /A for Pkg Type
5962-9314701QSAACTIVECFPW201TBDA42N / A for Pkg Type
SN74ABT534ADBLEOBSOLETESSOPDB20TBDCall TICall TI
SN74ABT534ADBRACTIVESSOPDB202000 Green (RoHS &
SN74ABT534ADBRE4ACTIVESSOPDB202000 Green(RoHS &
SN74ABT534ADBRG4ACTIVESSOPDB202000 Green (RoHS &
SN74ABT534ADWACTIVESOICDW2025Green (RoHS &
SN74ABT534ADWE4ACTIVESOICDW2025Green (RoHS &
SN74ABT534ADWG4ACTIVESOICDW2025Green (RoHS &
SN74ABT534ADWRACTIVESOICDW202000 Green (RoHS &
SN74ABT534ADWRE4ACTIVESOICDW202000 Green (RoHS&
SN74ABT534ADWRG4ACTIVESOICDW202000 Green(RoHS&
SN74ABT534ANACTIVEPDIPN2020Pb-Free
SN74ABT534ANE4ACTIVEPDIPN2020Pb-Free
SN74ABT534ANSRACTIVESONS202000 Green (RoHS &
SN74ABT534ANSRE4ACTIVESONS202000 Green (RoHS &
SN74ABT534ANSRG4ACTIVESONS202000 Green (RoHS &
SN74ABT534APWACTIVETSSOPPW2070Green (RoHS &
SN74ABT534APWE4ACTIVETSSOPPW2070Green (RoHS &
SN74ABT534APWG4ACTIVETSSOPPW2070Green (RoHS &
SN74ABT534APWLEOBSOLETETSSOPPW20TBDCall TICall TI
SN74ABT534APWRACTIVETSSOPPW202000 Green (RoHS &
SN74ABT534APWRE4ACTIVETSSOPPW202000 Green (RoHS &
SN74ABT534APWRG4ACTIVETSSOPPW202000 Green (RoHS&
SNJ54ABT534FKACTIVELCCCFK201TBDPOST-PLATE N / A forPkg Type
SNJ54ABT534JACTIVECDIPJ201TBDA42 SNPBN / A for Pkg Type
SNJ54ABT534WACTIVECFPW201TBDA42N / A for PkgType
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAUN / A for Pkg Type
CU NIPDAUN / A for Pkg Type
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
9-Oct-2007
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
(1)
The marketing status values are defined asfollows:
9-Oct-2007
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the devicewill be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but isnot in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production ofthe device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information andadditional product content details.
TBD: The Pb-Free/Green conversion plan has notbeen defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products aresuitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
14
6,50
6,50
5,905,90
2016
7,50
6,90
24
8,50
28
10,50
9,907,90
30
10,50
9,90
38
12,90
12,30
4040065 /E 12/01
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A SQ
B SQ
19
20
21
22
23
24
25
1282627
12
131415161817
0.020 (0,51)
0.010 (0,25)
MIN
0.342
(8,69)
0.442
0.640
0.739
0.938
1.141
A
0.358
(9,09)
0.458
(11,63)
0.660
(16,76)
0.761
(19,32)(18,78)
0.962
(24,43)
1.165
(29,59)
(10,31)
(12,58)
(12,58)
NO. OF
TERMINALS
**
11
10
9
8
7
6
5
432
20
28
44
52
68
84
0.020 (0,51)
0.010 (0,25)
(11,23)
(16,26)
(23,83)
(28,99)
MINMAX
0.307
(7,80)
0.406
0.495
0.495
0.850
(21,6)
1.047
(26,6)
0.080 (2,03)
0.064 (1,63)
B
MAX
0.358
(9,09)
0.458
(11,63)
0.560
(14,22)
0.560
(14,22)
0.858
(21,8)
1.063
(27,0)
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
4040140/D 10/96
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
1,20 MAX
14
0,30
0,19
8
4,50
4,30
PINS **
7
Seating Plane
0,15
0,05
8
1
A
DIM
6,60
6,20
14
0,10
M
0,10
0,15 NOM
0°–8°
2016
Gage Plane
24
0,25
0,75
0,50
28
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153