Latch-Up Performance Exceeds 500 mA Per
JEDEC Standard JESD-17
D
Typical V
(Output Ground Bounce)
OLP
< 0.8 V at VCC = 5 V, TA = 25°C
D
High-Impedance State During Power Up
and Power Down
D
Distributed VCC and GND Pin Configuration
Minimizes High-Speed Switching Noise
D
Flow-Through Architecture Optimizes PCB
Layout
D
High-Drive Outputs (–32-mA IOH, 64-mA IOL)
D
Package Options Include Plastic 300-mil
Shrink Small-Outline (DL) and Thin Shrink
Small-Outline (DGG) Packages and 380-mil
Fine-Pitch Ceramic Flat (WD) Package
Using 25-mil Center-to-Center Spacings
description
The ’ABT16373A are 16-bit transparent D-type
latches with 3-state outputs designed specifically
for driving highly capacitive or relatively
low-impedance loads. They are particularly
suitable for implementing buffer registers, I/O
ports, bidirectional bus drivers, and working
registers.
SN54ABT16373A . . . WD PACKAGE
SN74ABT16373A . . . DGG OR DL PACKAGE
1OE
1Q1
1Q2
GND
1Q3
1Q4
V
CC
1Q5
1Q6
GND
1Q7
1Q8
2Q1
2Q2
GND
2Q3
2Q4
V
CC
2Q5
2Q6
GND
2Q7
2Q8
2OE
(TOP VIEW)
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
1LE
1D1
1D2
GND
1D3
1D4
V
CC
1D5
1D6
GND
1D7
1D8
2D1
2D2
GND
2D3
2D4
V
CC
2D5
2D6
GND
2D7
2D8
2LE
These devices can be used as two 8-bit latches or one 16-bit latch. When the latch-enable (LE) input is high,
the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the levels set up
at the D inputs.
A buffered output-enable (OE
) input can be used to place the eight outputs in either a normal logic state (high
or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive
the bus lines significantly . The high-impedance state and the increased drive provide the capability to drive bus
lines without need for interface or pullup components.
OE does not affect internal operations of the latch. Old data can be retained or new data can be entered while
the outputs are in the high-impedance state.
When VCC is between 0 and 2.1 V , the device is in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 2.1 V, OE should be tied to VCC through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54ABT16373A is characterized for operation over the full military temperature range of –55°C to 125°C.
The SN74ABT16373A is characterized for operation from –40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus and EPIC-ΙΙB are trademarks of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright 1997, Texas Instruments Incorporated
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
SN54ABT16373A, SN74ABT16373A
16-BIT TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
Package thermal impedance, θ
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51.
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
#
4
t
w
t
su
t
h
These values apply only to the SN74ABT16373A.
Pulse duration, LE high3.33.33.3ns
Setup time, data before LE↓1.52.41.5ns
Hold time, data after LE↓12.21ns
VCC = 5 V,
TA = 25°C
MINMAXMINMAXMINMAX
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
#
SN54ABT16373ASN74ABT16373A
UNIT
D
Q
ns
LE
Q
ns
OE
Q
ns
OE
Q
ns
D
Q
ns
LE
Q
ns
OE
Q
ns
OE
Q
ns
SN54ABT16373A, SN74ABT16373A
16-BIT TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS160C – DECEMBER 1992 – REVISED MA Y 1997
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, C
PARAMETER
t
PLH
t
PHL
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, C
PARAMETER
t
PLH
t
PHL
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
= 50 pF (unless otherwise noted) (see Figure 1)
L
FROM
(INPUT)
= 50 pF (unless otherwise noted) (see Figure 1)
L
FROM
(INPUT)
TO
(OUTPUT)
TO
(OUTPUT)
SN54ABT16373A
VCC = 5 V,
TA = 25°C
MINTYPMAX
1.43.75.31.46.5
245.426.5
1.74.15.71.77
2.34.35.62.36.3
1.13.451.16.4
1.53.54.91.55.8
2.45.17.12.48.3
1.64.46.31.68
SN74ABT16373A
VCC = 5 V,
TA = 25°C
MINTYPMAX
1.43.75.31.46.3
245.426.2
1.74.15.71.76.7
2.34.35.62.36.1
1.13.451.16.1
1.53.54.91.55.6
2.45.17.12.48.1
1.64.45.81.66.5
MINMAX
MINMAX
UNIT
UNIT
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
SN54ABT16373A, SN74ABT16373A
16-BIT TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS160C – DECEMBER 1992 – REVISED MA Y 1997
PARAMETER MEASUREMENT INFORMATION
500 Ω
t
w
1.5 V
500 Ω
1.5 V
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
Input
Input
Output
Output
INVERTING AND NONINVERTING OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
(3)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MCFP010B – JANUARY 1995 – REVISED NOVEMBER 1997
WD (R-GDFP-F**)CERAMIC DUAL FLATPACK
48 LEADS SHOWN
0.120 (3,05)
0.075 (1,91)
A
0.370 (9,40)
0.250 (6,35)
0.009 (0,23)
0.004 (0,10)
1.130 (28,70)
0.870 (22,10)
0.390 (9,91)
0.370 (9,40)
1
48
0.370 (9,40)
0.250 (6,35)
0.025 (0,635)
0.014 (0,36)
0.008 (0,20)
24
NO. OF
LEADS**
A MAX
A MIN
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification only
E. Falls within MIL STD 1835: GDFP1-F48 and JEDEC MO-146AA
GDFP1-F56 and JEDEC MO-146AB
48
(16,26)
0.610
(15,49)
25
56
0.7400.640
(18,80)
0.710
(18,03)
4040176/D 10/97
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
48
1
0.110 (2,79) MAX
0.0135 (0,343)
0.008 (0,203)
25
0.299 (7,59)
0.291 (7,39)
24
A
0.008 (0,20) MIN
0.005 (0,13)
0.420 (10,67)
0.395 (10,03)
Seating Plane
0.004 (0,10)
M
0.010 (0,25)
0.005 (0,13)
Gage Plane
0.010 (0,25)
0°–ā8°
0.040 (1,02)
0.020 (0,51)
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
0.380
(9,65)
0.370
(9,40)
4828
0.630
(16,00)
0.620
(15,75)
56
0.730
(18,54)
0.720
(18,29)
4040048/E 12/01
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,50
48
1
1,20 MAX
0,27
0,17
25
24
A
0,15
0,05
0,08
M
6,20
8,30
6,00
7,90
Seating Plane
0,10
0,15 NOM
Gage Plane
0,25
0°–8°
0,75
0,50
DIM
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
PINS **
A MAX
A MIN
48
12,60
12,40
56
14,10
13,90
64
17,10
16,90
4040078/F 12/97
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
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