Texas Instruments SimpleLink Ethernet MSP432E401Y User Manual

User's Guide
SLAU748B–October 2017–Revised September 2018
LaunchPad™ Development Kit (MSP-EXP432E401Y)
The SimpleLink™ Ethernet MSP432E401Y Microcontroller LaunchPad™ Development Kit is a low-cost evaluation platform for SimpleLink Arm®Cortex®-M4F-based Ethernet microcontrollers. The Ethernet LaunchPad development kit highlights the MSP432E401Y microcontroller with its on-chip 10/100 Ethernet MAC and PHY, USB 2.0, hibernation module, motion control pulse-width modulation, and a multitude of simultaneous serial connectivity.
Contents
1 Board Overview.............................................................................................................. 2
1.1 Kit Contents.......................................................................................................... 3
1.2 Using the Ethernet LaunchPad Development Kit............................................................... 3
1.3 Features.............................................................................................................. 3
1.4 BoosterPack Plug-in Modules..................................................................................... 4
1.5 Specifications........................................................................................................ 4
2 Hardware Description ....................................................................................................... 5
2.1 Functional Description.............................................................................................. 5
2.2 Power Management............................................................................................... 20
2.3 Debug Interface.................................................................................................... 21
3 Software Development .................................................................................................... 21
3.1 Software Description.............................................................................................. 21
3.2 Source Code....................................................................................................... 21
3.3 Tool Options ....................................................................................................... 21
3.4 Programming the Ethernet LaunchPad Development Kit.................................................... 22
4 PCB Schematics ........................................................................................................... 22
1 SimpleLink Ethernet MSP432E401Y LaunchPad Development Kit................................................... 2
2 SimpleLink Ethernet LaunchPad Development Kit Block Diagram ................................................... 5
3 Default Jumper Locations ................................................................................................. 18
4 BSL Header and Resistors................................................................................................ 19
5 Ethernet LaunchPad Development Kit Schematics (1 of 5) .......................................................... 23
6 Ethernet LaunchPad Development Kit Schematics (2 of 5) .......................................................... 24
7 Ethernet LaunchPad Development Kit Schematics (3 of 5) .......................................................... 25
8 Ethernet LaunchPad Development Kit Schematics (4 of 5) .......................................................... 26
9 Ethernet LaunchPad Development Kit Schematics (5 of 5) .......................................................... 27
1 MSP-EXP432E401Y Specifications ....................................................................................... 4
2 BoosterPack Plug-in Module Interface 1 GPIO and Signal Muxing................................................... 8
3 BoosterPack 2 GPIO and Signal Muxing ............................................................................... 11
4 X11 Breadboard Adapter Odd-Numbered Pad GPIO and Signal Muxing.......................................... 14
5 X11 Breadboard Adapter Even-Numbered Pad GPIO and Signal Muxing......................................... 15
6 Resistors for Serial Bootloader Protocols............................................................................... 19
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List of Figures
List of Tables
SimpleLink™ Ethernet MSP432E401Y Microcontroller LaunchPad™
Copyright © 2017–2018, Texas Instruments Incorporated
Development Kit (MSP-EXP432E401Y)
1
Board Overview
Trademarks
SimpleLink, LaunchPad, BoosterPack, Code Composer Studio are trademarks of Texas Instruments. Arm, Cortex, Keil, RealView are registered trademarks of Arm Limited. IAR Embedded Workbench is a registered trademark of IAR Systems. All other trademarks are the property of their respective owners.
1 Board Overview
The SimpleLink Ethernet MSP432E401Y Microcontroller LaunchPad Development Kit is a low-cost evaluation platform for SimpleLink Arm Cortex-M4F-based Ethernet microcontrollers. The Ethernet LaunchPad development kit design highlights the MSP432E401Y microcontroller with its on-chip 10/100 Ethernet MAC and PHY, USB 2.0, hibernation module, motion control pulse-width modulation, and a multitude of simultaneous serial connectivity. The Ethernet LaunchPad development kit also features two user switches, four user LEDs, dedicated reset and wake switches, a breadboard expansion option and two independent BoosterPack™ XL expansion connectors. The preprogrammed quick start application on the Ethernet LaunchPad development kit also enables remote monitoring and control of the evaluation board from an internet browser anywhere in the world. The web interface is provided by a third party,
Exosite. Each Ethernet LaunchPad development kit is enabled on the Exosite platform allowing users to
create and customize their own Internet-of-Things applications.
Figure 1 shows the Ethernet LaunchPad development kit with key features highlighted.
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Figure 1. SimpleLink Ethernet MSP432E401Y LaunchPad Development Kit
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1.1 Kit Contents
The Ethernet LaunchPad development kit contains the following items:
SimpleLink Ethernet MSP432E401Y LaunchPad Development Board (MSP-EXP432E401Y)
USB Micro-B plug to USB-A plug cable
Quick Start Guide
1.2 Using the Ethernet LaunchPad Development Kit
The recommended steps for using the Ethernet LaunchPad development kit are:
1. Run the Out of Box demo software. For detailed instruction on how to run the out of box demo, visit this SimpleLink Academy tutorial.
2. Take the first step towards developing your own applications. The Ethernet LaunchPad development kit is supported by the SimpleLink MSP432E4 SDK. After installing the SDK, look in the following installation directories for bare metal and rtos based examples
a. examples\nortos\MSP_EXP432E401Y\ b. examples\rtos\MSP_EXP432E401Y\
See Section 3 for more details about software development.
3. Experiment with BoosterPack plug-in modules. This development kit conforms to the latest revision of the BoosterPack plug-in module pinout standard. It has two independent BoosterPack plug-in module connections to enable a multitude of expansion opportunities.
4. Customize and integrate the hardware to suit your end application. This development kit can be used as a reference for building your own custom circuits based on SimpleLink microcontrollers or as a foundation for expansion with your custom BoosterPack plug-in module or other circuit. This manual can serve as a starting point for this endeavor.
5. More Resources. See the TI MCU LaunchPad web page for more information and available BoosterPack modules.
Board Overview
1.3 Features
The Ethernet LaunchPad development kit includes the following features:
SimpleLink MSP432E401Y microcontroller
Ethernet connectivity with fully integrated 10/100 Ethernet MAC and PHY
Motion Control PWM
USB 2.0 Micro A/B connector
4 user LEDs
2 user switches
1 independent hibernate wake switch
1 independent microcontroller reset switch
Jumper for selecting power source: – XDS-110 USB – USB Device – BoosterPack
Preloaded Internet-of-Things application
I/O brought to board edge for breadboard expansion
Two independent BoosterPack XL standard connectors featuring stackable headers to maximize expansion through BoosterPack plug-in module ecosystem
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Development Kit (MSP-EXP432E401Y)
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Board Overview
1.4 BoosterPack Plug-in Modules
The Ethernet LaunchPad development kit provides an easy and inexpensive way to develop applications with the MSP432E401YPDT microcontroller. BoosterPack plug-in modules are add-on boards that follow a pinout standard created by TI. The TI and third-party ecosystem of BoosterPack plug-in modules greatly expands the peripherals and potential applications that you can easily explore with the Ethernet LaunchPad development kit.
You can also build your own BoosterPack plug-in module by following the design guidelines on the TI
website. TI even helps you promote your BoosterPack plug-in module to other members of the
community. TI offers a variety of avenues for you to reach potential customers with your solutions.
1.5 Specifications
Table 1 summarizes the specifications for the Ethernet LaunchPad.
Table 1. MSP-EXP432E401Y Specifications
Parameter Value
4.75 VDC to 5.25 VDC from one of the following sources:
• XDS-110 USB Micro-B cable connected to PC or other compatible power source
Board Supply Voltage
Dimensions 6.85 in × 2.5 in × .425 in (17.4 cm × 6.35 cm × 10.8 mm) (L × W × H)
Break-out Power Output
RoHS Status Compliant
• Target USB (U7) USB Micro-B cable connected to PC or other compatible power source
• BoosterPack 1 Interface (J3-21)
• BoosterPack 2 Interface (J7-21)
• 5-V Power header (J13-1)
• Breadboard expansion header (J10-2 or J10-97). See schematic symbol JP1 for power input selection.
• 5 VDC to BoosterPack modules, current limited by TPS2052B. Nominal rating is 1 A. Board input power supply limitations may also apply.
• 3.3 VDC to BoosterPack modules, limited by output of TPS79601 LDO. This 3.3-V plane is shared with onboard components. Total output power limit of TPS79601 is 1 A.
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2 Hardware Description
The Ethernet LaunchPad development kit includes an MSP432E401YPDT microcontroller with an integrated 10/100 Ethernet MAC and PHY. This advanced Arm Cortex-M4F MCU has a wide range of peripherals that are made available to users through the onboard accessories and the BoosterPack plug­in module connectors. This chapter explains how those peripherals operate and interface to the microcontroller.
Figure 2 shows a high-level block diagram of the Ethernet LaunchPad development kit.
Hardware Description
Figure 2. SimpleLink Ethernet LaunchPad Development Kit Block Diagram
2.1 Functional Description
2.1.1 Microcontroller
The MSP432E401Y is a 32-bit Arm Cortex-M4F based microcontroller with 1024KB of flash memory, 256KB of SRAM, 6KB of EEPROM, and 120-MHz operation, integrated 10/100 Ethernet MAC and PHY, integrated USB 2.0 connectivity with external high-speed USB 3.0 PHY capability, a hibernation module, a multitude of serial connectivity and motion control PWM, as well as a wide range of other peripherals. See the MSP432E401Y microcontroller data sheet for more complete details.
Most of the microcontroller signals are routed to 0.1-in (2.54-mm) pitch headers or through-hole solder pads. An internal multiplexor allows different peripheral functions to be assigned to each of these GPIO pads. When adding external circuitry, consider the additional load on the evaluation board power rails.
The MSP432E401Y microcontroller is factory-programmed with a quick start demo program. The quick start program resides in on-chip Flash memory and runs each time power is applied, unless the quick start application has been replaced with a user program. The quick start application automatically connects to
http://ti.exosite.com when an internet connection is provided through the RJ45 Ethernet jack on the
evaluation board.
2.1.2 Ethernet Connectivity
The Ethernet LaunchPad development kit is designed to connect directly to an Ethernet network using RJ45 style connectors. The microcontroller contains a fully integrated Ethernet MAC and PHY. This integration creates a simple, elegant and cost-saving Ethernet circuit design. Example code is available for LwIP TCP/IP protocol stack. The embedded Ethernet on this device can be programmed to act as an HTTP server, client or both. The design and integration of the circuit and microcontroller also enable users to synchronize events over the network using the IEEE1588 precision time protocol.
When configured for Ethernet operation, it is recommended that the user configure LED D3 and D4 to be controlled by the Ethernet PHY to indicate connection and transmit or receive status.
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Hardware Description
2.1.2.1 RJ-45 Connections
To improve EMI performance, use a metal-shielded RJ-45 connector with the shield connected to chassis ground.
Bob Smith termination to the RJ-45 connector involves 75-Ω termination resistors connected to the unused differential pair connections on the RJ-45 connector. Bob Smith termination is used to reduce noise that results from common-mode current flows and to reduce susceptibility to noise from unused wire pairs on the RJ-45.
NOTE: Power Over Ethernet (PoE) applications require a modified Bob Smith termination, which
consists of DC-blocking capacitors in series with the 75-Ω termination resistors.
2.1.3 USB Connectivity
The Ethernet LaunchPad development kit is designed to be USB 2.0 ready. A TPS2052B load switch is connected to and controlled by the microcontroller USB peripheral, which manages power to the USB micro A/B connector when functioning in a USB host. When functioning as a USB device, the entire Ethernet LaunchPad development kit can be powered directly from the USB micro A/B connector. Use JP1 to select the desired power source.
USB 2.0 functionality is provided and supported directly out of the box with the target USB micro A/B connector. High-speed USB 3.0 functionality can be enabled by adding an external USB PHY. The USB external PHY control and data signals are provided on the breadboard expansion header J10.
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2.1.4 Motion Control
The Ethernet LaunchPad development kit includes motion control functionality through the use of a PWM module capable of generating eight PWM outputs. The PWM module provides a great deal of flexibility and can generate simple PWM signals – for example, those required by a simple charge pump – as well as paired PWM signals with dead-band delays, such as those required by a half-H bridge driver. Three generator blocks can also generate the full six channels of gate controls required by a 3-phase inverter bridge.
A quadrature encoder interface (QEI) is also available to provide motion control feedback. See Section 2.1.6 for details about the availability of these signals on the BoosterPack interfaces.
2.1.5 User Switches and LEDs
Two user switches are provided for input and control of the MSP432E401Y software. The switches are connected to GPIO pins PJ0 and PJ1.
A reset switch and a wake switch are also provided. The reset switch initiates a system reset of the microcontroller whenever it is pressed and released. Pressing the reset switch also asserts the reset signal to the BoosterPack plug-in module and Breadboard headers. The wake switch is one way to bring the device out of hibernate mode.
Four user LEDs are provided on the board. D1 and D2 are connected to GPIOs PN1 and PN0. These LEDs are dedicated for use by the software application. D3 and D4 are connected to GPIOs PF4 and PF0, which can be controlled by user’s software or the integrated Ethernet module of the microcontroller.
A power LED is also provided to indicate that 3.3-V power is present on the board.
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2.1.6 BoosterPack Plug-in Modules and Headers
2.1.6.1 BoosterPack Plug-in Module Interface 1
The Ethernet LaunchPad development kit features two fully independent BoosterPack XL connectors. BoosterPack Plug-in Module Interface 1, located near the XDS110 emulator, is fully compliant with the BoosterPack plug-in module standard.
I2C is provided in both the original BoosterPack plug-in module standard configuration as well as the updated standard location. Use of I2C on the bottom left of the BoosterPack plug-in module connections per the updated standard is highly encouraged whenever possible.
Motion control advanced PWM connections are provided on the inner right connector for motion control applications.
Table 2 lists the BoosterPack plug-in module pins and the GPIO alternate functions available on each pin.
The MSP432E401Y GPIO register GPIOPCTL values are shown for each configuration. The headers in this table are labeled from left to right in ten pin columns. J1 and J2 make up the outer BoosterPack plug­in module standard pins, and J3 and J4 make up the inner BoosterPack XL standard pins.
Hardware Description
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Development Kit (MSP-EXP432E401Y)
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Hardware Description
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Table 2. BoosterPack Plug-in Module Interface 1 GPIO and Signal Muxing
Header Pin
Standard Function
GPIO MCU Pin Analog
Digital Function (GPIOPCTL Bit Encoding)
1 2 3 5 6 7 8 11 13 14 15
J1 1 3.3 V 3.3 V J1 2 Analog PE4 123 AIN9 U1RI SSI1XDAT0 J1 3 UART RX PC4 25 C1- U7Rx EPI0S7 J1 4 UART TX PC5 24 C1+ U7Tx RTCCLK EPI0S6 J1 5 GPIO PC6 23 C0+ U5Rx EPI0S5 J1 6 Analog PE5 124 AIN8 SSIXDAT1 J1 7 SPI CLK PD3 4 AIN12 I2C8SDA T1CCP1 SSI2CLk J1 8 GPIO PC7 22 C0- U5Tx EPI0S4 J1 9 I2C SCL PB2 91 I2C0SCL T5CCP0 USB0STP EPI0S27 J1 10 I2C SDA PB3 92 I2C0SDA T5CCP1 USB0CLK EPI0S28 J3 21 5 V 5 V J3 22 ground GND J3 23 Analog PE0 15 AIN3 U1RTS – J3 24 Analog PE1 14 AIN2 U1DSR – J3 25 Analog PE2 13 AIN1 U1DCD – J3 26 Analog PE3 12 AIN0 U1DTR – J3 27 Analog PD7 128 AIN4 U2CTS T4CCP1 USB0PFLT NMI SSI2XDAT2 J3 28 Analog PD6 127 AIN5 U2RTS T4CCP0 USB0EPEN SSI2XDAT3 J3 29 A out PM4 74 TMPR3 U0CTS T4CCP0 – J3 30 A out PM5 73 TMPR2 U0DCD T4CCP1 – J4 40 PWM PF1 43 EN0LED2 M0PWM1 SSI3XDAT0 TRD1 J4 39 PWM PF2 44 M0PWM2 SSI3Fss TRD0 J4 38 PWM PF3 45 M0PWM3 SSI3Clk TRCLK J4 37 PWM PG0 49 I2C1SCL EN0PPS M0PWM4 EPI0S11 J4 36 Capture PL4 85 T0CCP0 USB0D4 EPI0S26 J4 35 Capture PL5 86 T0CCP1 USB0D5 EPI0S33 J4 34 GPIO PL0 81 I2C2SDA M0FAULT3 USB0D0 EPI0S16 J4 33 GPIO PL1 82 I2C2SCL PhA0 USB0D1 EPI0S17 J4 32 GPIO PL2 83 C0o PhB0 USB0D2 EPI0S18 J4 31 GPIO PL3 84 C1o IDX0 USB0D3 EPI0S19 J2 11 ground GND J2 12 PWM PM3 75 T3CCP1 EPI0S12 J2 13 GPIO PH2 31 U0DCD EPI0S2 J2 14 GPIO PH3 32 U0DSR EPI0S3 J2 15 reset RESET J2 16 SPI MOSI PD1 2 AIN14 I2C7SDA T0CCP1 C1o SSI2XDAT0 J2 17 SPI MISO PD0 1 AIN15 I2C7SCL T0CCP0 C0o SSI2XDAT1 J2 18 GPIO PN2 109 U1DCD U2RTS EPI0S29 J2 19 GPIO PN3 110 U1DSR U2CTS EPI0S30
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Hardware Description
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SimpleLink™ Ethernet MSP432E401Y Microcontroller LaunchPad™
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Table 2. BoosterPack Plug-in Module Interface 1 GPIO and Signal Muxing (continued)
Header Pin
Standard Function
GPIO MCU Pin Analog
Digital Function (GPIOPCTL Bit Encoding)
1 2 3 5 6 7 8 11 13 14 15
J2 20 GPIO PP2 103 U0DTR USB0NXT EPI0S29
Hardware Description
2.1.6.2 BoosterPack Plug-in Module Interface 2
The second BoosterPack XL interface is located near the bottom of the board. This interface is fully compliant with the BoosterPack plug-in module standard, and adds features not covered by the BoosterPack plug-in module standard that enable operation with additional BoosterPack plug-in modules.
Using the jumpers JP4 and JP5, Controller Area Network (CAN) digital receive and transmit signals can be optionally routed to the BoosterPack Plug-in Module Interface 2 connector. In the default configuration, UART0 is used for the XDS-110 backchannel UART and CAN is not present on the BoosterPack plug-in module headers. In this configuration, the ROM serial bootloader can be used over the XDS-110 backchannel UART. When the jumpers are configured for CAN on the BoosterPack plug-in module interface, then UART2 must be used for the XDS-110 backchannel UART.
To comply with both the original and the new BoosterPack plug-in module standard, I2C is provided on both sides of the BoosterPack plug-in module connection. Use of I2C on the bottom left of the BoosterPack plug-in module connection is highly encouraged where possible, to be in compliance with the new BoosterPack plug-in module standard. To provide I2C capability on the right side of the connector, per the original standard, two 0-Ω resistors (R19 and R20) are used to combine the SPI and I2C signals. These signals are not shared with any other pins on the LaunchPad development kit and therefore removal of these zero-ohm resistors should not be required. Software should be certain that unused GPIO signals are configured as inputs.
Table 3 lists the BoosterPack plug-in module pins and the GPIO alternate functions available at each pin.
The MSP432E401Y GPIO register GPIOPCTL values are shown for each configuration. The headers in this table are labeled from left to right in ten pin columns. J5 and J6 make up the outer BoosterPack standard pins, J7 and J8 make up the inner BoosterPack XL standard pins.
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