Add Wi-Fi to any low-cost, low-power microcontroller (MCU) for Internet of Things (IoT) applications using
the CC3100 Module BoosterPack (CC3100MODBOOST), which hosts the CC3100 module
(CC3100MOD). The CC3100MOD is FCC, IC, CE, and Wi-Fi certified. It integrates all protocols for Wi-Fi
and Internet, greatly minimizing host MCU software requirements. With built-in security protocols, the
CC3100MOD solution provides a robust and simple security experience. The CC3100MOD integrates the
serial flash, RF filter, crystal, and all required passive components.
This document explains the various configurations, usage, and versatility of the CC3100MODBOOST.
First, it can be connected to a TI MCU LaunchPad (provided examples for MSPEXP430F5529LP).
Second, it can be plugged into a CC31XXEMUBOOST board and connected to a PC for MCU emulation.
The CC3100MODBOOST firmware updates requires either the CC31XXEMUBOOST board, or the microcontroller over-the-air(OTA) software and access to a server. Finally, the exposed signals on the 20 pin
connector provide an interface to an additional microcontroller or platforms beyond TI's LaunchPads. The
CC3100MODBOOST is a complete platform solution, including various tools and software, sample
applications, user and programming guides, reference designs, and the TI E2E™ support community. Visit
the CC3100 Wiki page for design resources and example projects
User's Guide
SWRU396B–December 2014–Revised May 2018
Figure 1. CC3100MOD BoosterPack Board With the CC3100MOD
1.2What is Included
•The CC3100MODBOOST board
•One Micro USB cable
•Quick Start guide
1.3FCC/IC Regulatory Compliance
The CC3100MOD SimpleLink Wi-Fi and IoT Solution module is FCC Part 15 and IC ICES-003 Class A
Certified.
D5RedPWR IndicationON, when the 3.3-V power is provided to the board.
D1YellownRESET
D6GreennHIB
2.3.2Jumper Settings
ReferenceUsageComments
J7USB connector
J8Power selection
J6
J5OOB Demo
J10, J9
J3RF TestMurata connector (MM8030-2610) for production line tests.
J2RF TestU.FL connector for conducted testing in the lab.
Current
measurement
Booster pack
header
Hardware Description
Table 2. LEDs
This LED indicates the state of the nRESET pin. If this LED is glowing, the device
This LED indicates the state of the nHIB pin. When the LED is OFF, the device is
is functional.
in hibernate state.
Table 3. Jumper Settings
For powering the booster pack when mated with a Launchpad. This is mandatory when using
“Z” devices. For example, CC3100HZ.
Choose the power supply from the Launchpad or the on-board USB.
J8 (1-2) power from MCU Launchpad
J8 (2-3) power from on-board USB using 3.3-V LDO
For Hibernate and LPDS currents, connect an ammeter across J26 : Range (<500 uA)
For Active current, mount an 0.1-Ω resistor on R42 and measure the voltage across the 0.1-Ω
resistor using a voltmeter. Range (<50 mV peak-peak)
Closed: GPIO_12 is hard pulled to V
Open: GPIO_12 is pulled to GND using 33K resistor.
2×10 pins each connected to the Launchpad.
cc
2.3.32x20 Pin Connector Assignment
The signal assignment on the 2×20 pin connector is shown in Figure 4. The convention of J1..J4 is
replaced with P1…P4 to avoid confusion with the actual board reference.
NOTE:All signals are 3.3-V CMOS 400-mA logic levels, and are referred w.r.t. CC3100MOD IC.
For example, UART1_TX is an output from the CC3100MOD. For the SPI lines, the
CC3100MOD always acts like a slave.
2.4Power
The board is designed to accept power from a connected LaunchPad or from the CC3100EMUBOOST
board. Some of the LaunchPads are not capable of sourcing the peak current requirements of Wi-Fi. In
this case, the USB connector on the CC3100MODBOOST can be used to aid the peak current. The use of
Schottky diodes ensure that the load sharing occurs between the USB connectors on the LaunchPad and
the BoosterPack without any board modifications.
The 3.3-V power can also be sourced from the LaunchPad, or from the 3.3-V LDO on the board by using
jumper J8. If the LaunchPad is not able to source the 3.3 V up to 350 mA, configure the J8 to work from
the on-board LDO.
2.4.1Power From the LaunchPad or CC3100EMUBOOST
The most common scenario is to power the CC3100MODBOOST from the connected LaunchPad. In this
case, the LaunchPad provides 3.3 V to the BoosterPack for its operation (see Figure 5). In addition to the
3.3 V, some LaunchPads provide a 5 V from the USB (see Figure 6), used to drive a 3.3-V LDO on the
BoosterPack. If the LaunchPad is not able to provide the 5 V (for example, the LaunchPad with only 20
pins), then the USB connector on the CC3100MODBOOST should be used to provide the LDO input as
shown below.
Figure 6. Feed USB on the BoosterPack (if the LaunchPad Cannot Source 5 V on 20-Pin Connector)
2.4.2On-Board LDO Power Supply
On some LaunchPads, the 3.3 V is not capable of sourcing the 350-mA peak current needed for the
CC3100MODBOOST. In this case, the on-board 3.3-V LDO can be used (see Figure 7). This LDO is
sourced from the USB connector on the CC3100MODBOOST and the LaunchPad in a shared load
manner.
Figure 8. Feed USB on the BoosterPack (Always While Using the Onboard LDO)
2.5Measure the CC3100 Current Drawn
2.5.1Low Current Measurement (Hibernate and LPDS)
To measure the current drawn from the CC3100 device, a jumper is provided on the board labeled J6. By
removing this jumper, the user can place an ammeter into this path and observe the current. This method
is recommended for measuring LPDS and hibernate currents that are just a few 10s of micro amps. The
jumper is removed and an ammeter is added in series to measure the hibernate and LPDS currents (see
NOTE: If the device uses service pack 1.1.0 or higher, the R113 resistor must be removed to get
lower LPDS currents. This resistor can leak an extra 33 uA from the 3.3-V supply in LPDS
mode, if the SPI is used as the host interface.
2.5.2Active Current Measurement
To measure active current in a profile form, use a 0.1-Ω 1% resistor on the board and measure the
differential voltage across it. This can be done using a voltmeter or an oscilloscope for measuring the
current profile.
Hardware Description
Figure 10. Active Current Measurement
2.6Performing Conducted Testing
By default, the BoosterPack ships with the RF signal connected to the on-board chip antenna. Figure 11
illustrates a miniature UMC connector (Murata MM8030-2610) on the board's RF path for measuring the
performance in a conducted mode.
In addition to the Murata connector, a U.FL connector on the board (see Figure 12) for conducting testing
or to connect an external antenna. This requires a board modification, as illustrated in the figures below.
The CC31XXEMUBOOST is designed to connect the CC3100 module BoosterPack board to a PC using a
USB connection. This updates the firmware patches, which are stored in the serial flash, on the
BoosterPack; and in software development using SimpleLink Studio.
The board has two FTDI ICs to enumerate multiple COM and D2XX ports. The details of the ports are
given in Table 6.
www.ti.com
Table 6. Ports Available on J6
Port
Number
1D2XXSPI port for SL Studio
2D2XXGPIO for SL StudioControl the nRESET, nHIB, IRQ
3VCP
4VCPNWP
Port TypeUsageComments
COM port for Flash
programming
Network processor logger output. Used with specific tools to analyze the
network processor logs. For TI use only.
NOTE: On the PC, only two of the four ports are visible on the Device Manager. The D2XX ports are
not listed under the Ports tab.
The first COM port in the list is used for the Flash programming.
Figure 14. Portable Devices
Port
Number
1VCPRT3Used for TI internal debug only.
2VCPMAC loggerUsed for TI internal debug only.
Port TypeUsageComments
3.1.3Driver Requirements
The FTDI Debug board requires installing the associated drivers on a PC. This package is available as
part of the SDK release and is located at: [Install-Path]\cc3100-sdk\tools\cc31xx_board_drivers\.
The install path is usually C:\ti\cc3100SDK.
3.2Connecting the Boards
Figure 15 shows the connection of the CC3100MOODBOOST to the EMUBOOST Board. The connectors
should be aligned carefully, as there is no polarity protection and the sFlash can be erased as a result.
The pins #1 of the connectors are marked on the board using a small triangle marking; these should be
aligned while connecting.
The CC3100MODBOOST can be directly connected to a compatible LaunchPad using the standard 2×20
pin connectors. The necessary jumper settings for this connection are the same as those for the
EMUBOOST board as described in Section 3.4.
Ensure that the Pin1 of the 2×20 pins is aligned correctly before pairing. Figure 16 illustrates the
connected setup. Note that the USB cable is directly connected to the BoosterPack to power it only. For
debugging, the USB cable on the LaunchPad is also required.
Figure 16. CC3100MODBOOST Connected to MSP430F5529 LaunchPad
www.ti.com
4.1LaunchPad Current Limitation
Some of the LaunchPads, including the MSP430FRAM, do not provide enough current to power the
CC3100MODBOOST. The BoosterPack can consume up to 400-mA peak from the 3.3 V, and may need
power separately.
For this, a USB connector is provided on the BoosterPack to provide the 3.3 V.
The power supply jumpers should be configured as shown in Figure 17 when the power is supplied from
the on-board USB connector.
Figure 17. Jumper Settings When Used With LaunchPad
NOTE: Because there are two power sources in this setup, it is important to follow the power-up
sequence.
16
NOTE: Always power the BoosterPack before powering the LaunchPad.
All design files including schematics, layout, Bill of Materials (BOM), Gerber files, and documentation are
made available in a zip folder that can be downloaded from www.ti.com/tool/CC3100MODBOOST.
5.2Software
All design files, including TI-TXT object-code firmware images, software example projects, and
documentation are available from the CC3100MOD device’s product page.
The Software Development Kit (SDK) for use with the CC3100MOD BoosterPack is available from
http://www.ti.com/tool/cc3100sdk.
5.3Hardware Change Log
PCB RevisionDescription
Rev. 1Initial Release
5.4Known Limitations
1. The serial flash on the module can be programmed mainly through the UART of the
CC3100MODBOOST board.
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from A Revision (September 2015) to B Revision .......................................................................................... Page
•Updated 3.3-V Power From LDO image.............................................................................................. 10
STANDARD TERMS FOR EVALUATION MODULES
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20
Revision History
4EVM Use Restrictions and Warnings:
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STANDARD TERMS FOR EVALUATION MODULES (continued)
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