CC3100MOD SimpleLink™ Wi-Fi® Network Processor Module - BoosterPack Hardware
User's Guide
Literature Number: SWRU396B
December 2014–Revised May 2018
Contents
1 Introduction......................................................................................................................... 4
1.1 CC3100 Module BoosterPack (CC3100MODBOOST).............................................................. 4
1.2 What is Included.......................................................................................................... 4
1.3 FCC/IC Regulatory Compliance........................................................................................ 4
2 Hardware Description ........................................................................................................... 5
2.1 Block Diagram ............................................................................................................ 6
2.2 Hardware Features....................................................................................................... 6
2.3 Connector and Jumper Descriptions .................................................................................. 6
2.4 Power...................................................................................................................... 8
2.5 Measure the CC3100 Current Drawn................................................................................ 10
2.6 Performing Conducted Testing ....................................................................................... 11
3 Connecting to the PC Using EMUBOOST .............................................................................. 13
3.1 CC31XXEMUBOOST .................................................................................................. 13
3.2 Connecting the Boards................................................................................................. 14
3.3 Jumper Settings on the CC3100MODBOOST...................................................................... 15
3.4 Jumper Settings on the EMUBOOST................................................................................ 15
4 Connecting to a LaunchPad................................................................................................. 16
4.1 LaunchPad Current Limitation ........................................................................................ 16
5 Additional Information ........................................................................................................ 17
5.1 Design Files ............................................................................................................. 17
5.2 Software.................................................................................................................. 17
5.3 Hardware Change Log................................................................................................. 17
5.4 Known Limitations ...................................................................................................... 17
Revision History.......................................................................................................................... 18
2
Table of Contents
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1 CC3100MOD BoosterPack Board With the CC3100MOD ............................................................. 4
2 CC3100MODBOOST Front Side .......................................................................................... 5
3 CC3100MODBOOST Block Diagram ..................................................................................... 6
4 Signal Assignments.......................................................................................................... 7
5 3.3-V Power From MCU ................................................................................................... 9
6 Feed USB on the BoosterPack (if the LaunchPad Cannot Source 5 V on 20-Pin Connector).................... 9
7 3.3-V Power From LDO ................................................................................................... 10
8 Feed USB on the BoosterPack (Always While Using the Onboard LDO) .......................................... 10
9 Low Current Measurement................................................................................................ 11
10 Active Current Measurement ............................................................................................. 11
11 Connectors on the Board ................................................................................................. 12
12 Resistor Switch for Radiated versus Conducted Tests................................................................ 12
13 CC31XXEMUBOOST Board.............................................................................................. 13
14 Portable Devices ........................................................................................................... 14
15 The CC3100BOOST Connected to the EMUBOOST ................................................................ 15
16 CC3100MODBOOST Connected to MSP430F5529 LaunchPad.................................................... 16
17 Jumper Settings When Used With LaunchPad ........................................................................ 16
List of Figures
List of Tables
1 Push Buttons ................................................................................................................. 6
2 LEDs........................................................................................................................... 7
3 Jumper Settings.............................................................................................................. 7
4 Outer Row Connectors...................................................................................................... 8
5 Inner Row Connectors ...................................................................................................... 8
6 Ports Available on J6 ...................................................................................................... 14
7 Ports Available on J5 ...................................................................................................... 14
8 CC3100MODBOOST Jumper Settings.................................................................................. 15
9 EMUBOOST Jumper Settings ........................................................................................... 15
10 Hardware Change Log..................................................................................................... 17
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List of Figures
3
CC3100MOD SimpleLink™ Wi-Fi® Network Processor
Module BoosterPack Hardware
1 Introduction
1.1 CC3100 Module BoosterPack (CC3100MODBOOST)
Add Wi-Fi to any low-cost, low-power microcontroller (MCU) for Internet of Things (IoT) applications using
the CC3100 Module BoosterPack (CC3100MODBOOST), which hosts the CC3100 module
(CC3100MOD). The CC3100MOD is FCC, IC, CE, and Wi-Fi certified. It integrates all protocols for Wi-Fi
and Internet, greatly minimizing host MCU software requirements. With built-in security protocols, the
CC3100MOD solution provides a robust and simple security experience. The CC3100MOD integrates the
serial flash, RF filter, crystal, and all required passive components.
This document explains the various configurations, usage, and versatility of the CC3100MODBOOST.
First, it can be connected to a TI MCU LaunchPad (provided examples for MSPEXP430F5529LP).
Second, it can be plugged into a CC31XXEMUBOOST board and connected to a PC for MCU emulation.
The CC3100MODBOOST firmware updates requires either the CC31XXEMUBOOST board, or the microcontroller over-the-air(OTA) software and access to a server. Finally, the exposed signals on the 20 pin
connector provide an interface to an additional microcontroller or platforms beyond TI's LaunchPads. The
CC3100MODBOOST is a complete platform solution, including various tools and software, sample
applications, user and programming guides, reference designs, and the TI E2E™ support community. Visit
the CC3100 Wiki page for design resources and example projects
User's Guide
SWRU396B–December 2014–Revised May 2018
Figure 1. CC3100MOD BoosterPack Board With the CC3100MOD
1.2 What is Included
• The CC3100MODBOOST board
• One Micro USB cable
• Quick Start guide
1.3 FCC/IC Regulatory Compliance
The CC3100MOD SimpleLink Wi-Fi and IoT Solution module is FCC Part 15 and IC ICES-003 Class A
Certified.
4
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2 Hardware Description
Hardware Description
Figure 2. CC3100MODBOOST Front Side
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Hardware Description
2.1 Block Diagram
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Figure 3. CC3100MODBOOST Block Diagram
2.2 Hardware Features
• CC3100MOD module with fully integrated solution
• 2×20 pin stackable connectors
• Power from on-board LDO, using USB or 3.3 V from MCU LaunchPad
• Three (3) push buttons
• Jumper for current measurement with provision to mount 0.1R resistor for measurement with voltmeter
• 8 Mbit serial flash (M25PX80 from Micron)
• 40-MHz crystal, 32-KHz crystal, and optional 32-KHz oscillator
• 2-layer PCB with 6-mil spacing and track width
2.3 Connector and Jumper Descriptions
2.3.1 Push Buttons and LEDs
Reference Usage Comments
SW1 OOB Demo Used as an input for the OOB demo.
SW2 RESET Resets the device to a known state. The use of this pin is optional.
SW3 nHIB
Boots the device to the bootloader mode for flashing the firmware over a universal
Table 1. Push Buttons
asynchronous receiver/transmitter (UART).
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Reference Color Usage Comments
D5 Red PWR Indication ON, when the 3.3-V power is provided to the board.
D1 Yellow nRESET
D6 Green nHIB
2.3.2 Jumper Settings
Reference Usage Comments
J7 USB connector
J8 Power selection
J6
J5 OOB Demo
J10, J9
J3 RF Test Murata connector (MM8030-2610) for production line tests.
J2 RF Test U.FL connector for conducted testing in the lab.
Current
measurement
Booster pack
header
Hardware Description
Table 2. LEDs
This LED indicates the state of the nRESET pin. If this LED is glowing, the device
This LED indicates the state of the nHIB pin. When the LED is OFF, the device is
is functional.
in hibernate state.
Table 3. Jumper Settings
For powering the booster pack when mated with a Launchpad. This is mandatory when using
“Z” devices. For example, CC3100HZ.
Choose the power supply from the Launchpad or the on-board USB.
J8 (1-2) power from MCU Launchpad
J8 (2-3) power from on-board USB using 3.3-V LDO
For Hibernate and LPDS currents, connect an ammeter across J26 : Range (<500 uA)
For Active current, mount an 0.1-Ω resistor on R42 and measure the voltage across the 0.1-Ω
resistor using a voltmeter. Range (<50 mV peak-peak)
Closed: GPIO_12 is hard pulled to V
Open: GPIO_12 is pulled to GND using 33K resistor.
2×10 pins each connected to the Launchpad.
cc
2.3.3 2x20 Pin Connector Assignment
The signal assignment on the 2×20 pin connector is shown in Figure 4. The convention of J1..J4 is
replaced with P1…P4 to avoid confusion with the actual board reference.
Figure 4. Signal Assignments
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Pin No Signal Name Direction Pin No Signal Name Direction
P1.1 VCC (3.3 V) IN P2.1 GND IN
P1.2 UNUSED NA P2.2 IRQ OUT
P1.3 UART1_TX OUT P2.3 SPI_CS IN
P1.4 UART1_TX IN P2.4 UNUSED NA
P1.5 nHIB IN P2.5 nRESET IN
P1.6 UNUSED NA P2.6 SPI_MOSI IN
P1.7 SPI_CLK IN P2.7 SPI_MISO OUT
P1.8 UNUSED NA P2.8 UNUSED NA
P1.9 UNUSED NA P2.9 UNUSED NA
P1.10 UNUSED NA P2.10 UNUSED NA
Pin No Signal Name Direction Pin No Signal Name Direction
P3.1 +5 V IN P4.1 UNUSED OUT
P3.2 GND IN P4.2 UNUSED OUT
P3.3 UNUSED NA P4.3 UNUSED NA
P3.4 UNUSED NA P4.4 UART1_CTS IN
P3.5 UNUSED NA P4.5 UART1_RTS OUT
P3.6 UNUSED NA P4.6 UNUSED NA
P3.7 UNUSED NA P4.7 NWP_LOG_TX OUT
P3.8 UNUSED NA P4.8 WLAN_LOG_TX OUT
P3.9 UNUSED NA P4.9 UNUSED IN
P3.10 UNUSED NA P4.10 UNUSED
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Table 4. Outer Row Connectors
Table 5. Inner Row Connectors
NOTE: All signals are 3.3-V CMOS 400-mA logic levels, and are referred w.r.t. CC3100MOD IC.
For example, UART1_TX is an output from the CC3100MOD. For the SPI lines, the
CC3100MOD always acts like a slave.
2.4 Power
The board is designed to accept power from a connected LaunchPad or from the CC3100EMUBOOST
board. Some of the LaunchPads are not capable of sourcing the peak current requirements of Wi-Fi. In
this case, the USB connector on the CC3100MODBOOST can be used to aid the peak current. The use of
Schottky diodes ensure that the load sharing occurs between the USB connectors on the LaunchPad and
the BoosterPack without any board modifications.
The 3.3-V power can also be sourced from the LaunchPad, or from the 3.3-V LDO on the board by using
jumper J8. If the LaunchPad is not able to source the 3.3 V up to 350 mA, configure the J8 to work from
the on-board LDO.
2.4.1 Power From the LaunchPad or CC3100EMUBOOST
The most common scenario is to power the CC3100MODBOOST from the connected LaunchPad. In this
case, the LaunchPad provides 3.3 V to the BoosterPack for its operation (see Figure 5). In addition to the
3.3 V, some LaunchPads provide a 5 V from the USB (see Figure 6), used to drive a 3.3-V LDO on the
BoosterPack. If the LaunchPad is not able to provide the 5 V (for example, the LaunchPad with only 20
pins), then the USB connector on the CC3100MODBOOST should be used to provide the LDO input as
shown below.
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Hardware Description
Figure 5. 3.3-V Power From MCU
Figure 6. Feed USB on the BoosterPack (if the LaunchPad Cannot Source 5 V on 20-Pin Connector)
2.4.2 On-Board LDO Power Supply
On some LaunchPads, the 3.3 V is not capable of sourcing the 350-mA peak current needed for the
CC3100MODBOOST. In this case, the on-board 3.3-V LDO can be used (see Figure 7). This LDO is
sourced from the USB connector on the CC3100MODBOOST and the LaunchPad in a shared load
manner.
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Figure 7. 3.3-V Power From LDO
Figure 8. Feed USB on the BoosterPack (Always While Using the Onboard LDO)
2.5 Measure the CC3100 Current Drawn
2.5.1 Low Current Measurement (Hibernate and LPDS)
To measure the current drawn from the CC3100 device, a jumper is provided on the board labeled J6. By
removing this jumper, the user can place an ammeter into this path and observe the current. This method
is recommended for measuring LPDS and hibernate currents that are just a few 10s of micro amps. The
jumper is removed and an ammeter is added in series to measure the hibernate and LPDS currents (see
Figure 9).
10
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Figure 9. Low Current Measurement
NOTE: If the device uses service pack 1.1.0 or higher, the R113 resistor must be removed to get
lower LPDS currents. This resistor can leak an extra 33 uA from the 3.3-V supply in LPDS
mode, if the SPI is used as the host interface.
2.5.2 Active Current Measurement
To measure active current in a profile form, use a 0.1-Ω 1% resistor on the board and measure the
differential voltage across it. This can be done using a voltmeter or an oscilloscope for measuring the
current profile.
Hardware Description
Figure 10. Active Current Measurement
2.6 Performing Conducted Testing
By default, the BoosterPack ships with the RF signal connected to the on-board chip antenna. Figure 11
illustrates a miniature UMC connector (Murata MM8030-2610) on the board's RF path for measuring the
performance in a conducted mode.
In addition to the Murata connector, a U.FL connector on the board (see Figure 12) for conducting testing
or to connect an external antenna. This requires a board modification, as illustrated in the figures below.
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Figure 11. Connectors on the Board
12
Figure 12. Resistor Switch for Radiated versus Conducted Tests
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3 Connecting to the PC Using EMUBOOST
3.1 CC31XXEMUBOOST
3.1.1 Overview
The CC31XXEMUBOOST is designed to connect the CC3100 module BoosterPack board to a PC using a
USB connection. This updates the firmware patches, which are stored in the serial flash, on the
BoosterPack; and in software development using SimpleLink Studio.
3.1.2 Hardware Details
Connecting to the PC Using EMUBOOST
Figure 13. CC31XXEMUBOOST Board
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Connecting to the PC Using EMUBOOST
The board has two FTDI ICs to enumerate multiple COM and D2XX ports. The details of the ports are
given in Table 6.
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Table 6. Ports Available on J6
Port
Number
1 D2XX SPI port for SL Studio
2 D2XX GPIO for SL Studio Control the nRESET, nHIB, IRQ
3 VCP
4 VCP NWP
Port Type Usage Comments
COM port for Flash
programming
Network processor logger output. Used with specific tools to analyze the
network processor logs. For TI use only.
NOTE: On the PC, only two of the four ports are visible on the Device Manager. The D2XX ports are
not listed under the Ports tab.
The first COM port in the list is used for the Flash programming.
Figure 14. Portable Devices
Port
Number
1 VCP RT3 Used for TI internal debug only.
2 VCP MAC logger Used for TI internal debug only.
Port Type Usage Comments
3.1.3 Driver Requirements
The FTDI Debug board requires installing the associated drivers on a PC. This package is available as
part of the SDK release and is located at: [Install-Path]\cc3100-sdk\tools\cc31xx_board_drivers\.
The install path is usually C:\ti\cc3100SDK.
3.2 Connecting the Boards
Figure 15 shows the connection of the CC3100MOODBOOST to the EMUBOOST Board. The connectors
should be aligned carefully, as there is no polarity protection and the sFlash can be erased as a result.
The pins #1 of the connectors are marked on the board using a small triangle marking; these should be
aligned while connecting.
Table 7. Ports Available on J5
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Connecting to the PC Using EMUBOOST
Figure 15. The CC3100BOOST Connected to the EMUBOOST
CAUTION
Align the pin-1 of the boards together using the triangle marking on the PCB.
An incorrect connection can destroy the boards permanently.
Ensure that none of the header pins are bent before connecting the two boards.
3.3 Jumper Settings on the CC3100MODBOOST
Table 8 specifies the jumpers to be installed on the CC3100MODBOOST before pairing with the
EMUBOOST board.
Table 8. CC3100MODBOOST Jumper Settings
No. Jumper Settings Notes
1 J8 (1-2)
3 J6 (short) No current measurement
4 J5 (short) OOB demo jumper
Power the BoosterPack from the EMU BOOST. Place the jumper near the edge of the
3.4 Jumper Settings on the EMUBOOST
Table 9 specifies the jumpers to be installed while pairing with the FTDI board.
Table 9. EMUBOOST Jumper Settings
No. Jumper Settings Notes
1 J4 (short) Provide 3.3 V to the BoosterPack
2 J22 (short) Provide 5.0 V to the BoosterPack
3 J3 (1-2) Route the NWP logs to the dual port
PCB.
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Connecting to a LaunchPad
4 Connecting to a LaunchPad
The CC3100MODBOOST can be directly connected to a compatible LaunchPad using the standard 2×20
pin connectors. The necessary jumper settings for this connection are the same as those for the
EMUBOOST board as described in Section 3.4.
Ensure that the Pin1 of the 2×20 pins is aligned correctly before pairing. Figure 16 illustrates the
connected setup. Note that the USB cable is directly connected to the BoosterPack to power it only. For
debugging, the USB cable on the LaunchPad is also required.
Figure 16. CC3100MODBOOST Connected to MSP430F5529 LaunchPad
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4.1 LaunchPad Current Limitation
Some of the LaunchPads, including the MSP430FRAM, do not provide enough current to power the
CC3100MODBOOST. The BoosterPack can consume up to 400-mA peak from the 3.3 V, and may need
power separately.
For this, a USB connector is provided on the BoosterPack to provide the 3.3 V.
The power supply jumpers should be configured as shown in Figure 17 when the power is supplied from
the on-board USB connector.
Figure 17. Jumper Settings When Used With LaunchPad
NOTE: Because there are two power sources in this setup, it is important to follow the power-up
sequence.
16
NOTE: Always power the BoosterPack before powering the LaunchPad.
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5 Additional Information
5.1 Design Files
All design files including schematics, layout, Bill of Materials (BOM), Gerber files, and documentation are
made available in a zip folder that can be downloaded from www.ti.com/tool/CC3100MODBOOST.
5.2 Software
All design files, including TI-TXT object-code firmware images, software example projects, and
documentation are available from the CC3100MOD device’s product page.
The Software Development Kit (SDK) for use with the CC3100MOD BoosterPack is available from
http://www.ti.com/tool/cc3100sdk.
5.3 Hardware Change Log
PCB Revision Description
Rev. 1 Initial Release
5.4 Known Limitations
1. The serial flash on the module can be programmed mainly through the UART of the
CC3100MODBOOST board.
Additional Information
Table 10. Hardware Change Log
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Revision History
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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from A Revision (September 2015) to B Revision .......................................................................................... Page
• Updated 3.3-V Power From LDO image.............................................................................................. 10
STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components,
and/or documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in
accordance with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate
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Software
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3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
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write software applications for use with the end product. This kit is not a finished product and when assembled may not
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CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device
may not cause harmful interference, and (2) this device must accept any interference received, including interference
that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority
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FCC Interference Statement for Class A EVM devices
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STANDARD TERMS FOR EVALUATION MODULES (continued)
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the
equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio
communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case
the user will be required to correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try
to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
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3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
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may cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2)
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Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or
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Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne
d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les
risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de
sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement
d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner
avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise
pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain
maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本
国内に輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
SWRU396B–December 2014–Revised May 2018
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3.4 European Union
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STANDARD TERMS FOR EVALUATION MODULES (continued)
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be
certified by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to
EVMs (which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of
Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule
for Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect
to EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of
Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee.
Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of
Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備
でご使用いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものと
します。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・
イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
Notice for EVMs for Power Line Communication: Please see
3.3.3
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected
to a low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic
environment this product may cause radio interference in which case the user may be required to take adequate
measures.
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4 EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT
NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to
handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important
safety information related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
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STANDARD TERMS FOR EVALUATION MODULES (continued)
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in
the user guide, other available documentation provided by TI, and any other applicable requirements and employ
reasonable and customary safeguards. Exceeding the specified performance ratings and specifications
(including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM
may cause personal injury or death, or property damage. If there are questions concerning performance ratings
and specifications, User should contact a TI field representative prior to connecting interface electronics including
input power and intended loads. Any loads applied outside of the specified output range may also result in
unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface
electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is
uncertainty as to the load specification, please contact a TI field representative. During normal operation, even
with the inputs and outputs kept within the specified allowable ranges, some circuit components may have
elevated case temperatures. These components include but are not limited to linear regulators, switching
transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may
become very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with
the dangers and application risks associated with handling electrical mechanical components, systems, and
subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by
User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure
that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with
suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock
hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by
User or its employees, affiliates, contractors or designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international,
federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User
assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all
responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international,
federal, state, and local requirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as
accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information
on its websites as accurate, complete, reliable, current, or error-free.
6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH
ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS,
INCLUDING BUT NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD
PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL
BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER
INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES,
LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION
WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR
ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8. Limitations on Damages and Liability:
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8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of
EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or
otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery
violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the
return of the components(s), excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of
Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of
or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas
County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI
may seek injunctive relief in any United States or foreign court.
www.ti.com
STANDARD TERMS FOR EVALUATION MODULES (continued)
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF
THESE TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF
REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR
SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION
SHALL BE BROUGHT AGAINST TI MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO
THE CAUSE OF ACTION HAS OCCURRED.
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE
PARTICULAR EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES
OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND
THIS LIMIT.
22
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Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
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(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
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You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
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TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
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TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
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POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
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