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SERIES 2000 MINI RADIO FREQUENCY MODULE
FEATURES APPLICATIONS
• Best In Class Performance Through Patented
HDX Technology
• Reduced Power Output For Handheld And
Medium Read/Write Range Applications
• Proven In Harsh Industrial Environments
• Best Value
• Easy To Install And Use
RI-RFM-003B
SCBS849 – NOVEMBER 2002
• Access Control
• Vehicle Identification
• Container Tracking
• Asset Management
• Waste Management
DESCRIPTION
The Texas Instruments low-frequency (LF) reader module provides all the functionality required to communicate
with Texas Instruments 134.2 kHz LF transponders which are available in a variety of form factors. The
RI-RFM-003B radio frequency power (RFM) module is capable driving a variety of antennas with inductance
ranges from 115µH to 117µH including TI standard RI-ANT-P02A stick antenna.
The RI-RFM-007 is designed to be connected to control module RI-CTL-MB2A (RS232 interface) or
RI-CTL-MB6A (RS422/485 interface) which provides the interface to a host system, power supply connectors
and additional I/O’s. The RI-RFM-003B module in combination with a control module is well suited for usage in a
broad range of applications including, but not limited to, access control, vehicle identification, container tracking,
asset management and waste management applications.
The Series 2000 Mini Radio Frequency Module is the interface between a 134.2 kHz HDX/FSK transponder and
the Data Processing Unit.
It sends an energizing signal to the transponder, modulates the RF signal to send data to the transponder,
receives the identification signal and processes it for digital decoding. The small size and low supply voltage
make the Mini RF Module well suited for portable read/ write units.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002, Texas Instruments Incorporated
www.ti.com
RI-RFM-003B
SCBS849 – NOVEMBER 2002
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
Operating Temperature 0 to +50 ° C
Storage Temperature –25 to +85 ° C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
Power Supply
OPERATING CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER UNIT
Relative Humidity <97% non-condensing, IEC 68-2-30 Test Db, 21 cycles
RF Transmit Frequency 134.2 kHz
Antenna Specification Inductivity: 115 to 117 µ H Q: min. 200
Antenna Recommended or
Antenna Resonance Voltage max. 240 V peak
Transponder Types 134.2 kHz HDX / FSK
Dimensions (60.2 × 55.1 × 11.5 ) ± 1.0 mm
Weight approx. 40 g
Drop Test 1 m on concrete, 3 axes, mounted in moulded aluminum case
Vibration Test 2 g, 5-500 Hz, displacement 15 mm, 1 oct / min, 3 axes, 3 hrs / axis
Reference Documentation Guide
Approvals CE; FCC
(1)
Logic Part: 4.75 to 5.25 VDC, regulated; max. 80mA
TX Power Stage: 4.50 to 6.00 VDC, regulated; max. 1.2A
Ferrite Stick Antenna RI-ANT-P02A
Air Coil Antenna
11-06-29-030 (SCBU021) Reference
11-08-22-003 (SCBS845) Data Sheet
RI-RFM-003B UNIT
RI-RFM-003B
(depending on the repetition rate and antenna used)
PART NUMBER
RI-RFM-003B
Inductivity: 115 to 117 µ H; Q: min. 200
Inductivity: 116.5 to 119 µ H; Q: min. 100
S2000 Mini RF Module RI-RFM-003B
S2000 Antennas RI-ANT-P02A
2
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PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2007
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
RI-RFM-003B-00 ACTIVE 1 10 TBD Call TI Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
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accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
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