•VTTBus Termination Output•57 W/in3Power Density
(Output Tracks the System V
•10 A Output CurrentUL/cUL60950, EN60950, VDE
•3.3-V, 5-V or 12-V Input Voltage•Point-of-Load Alliance (POLA™) Compatible
•DDR and QDR Compatible
•On/Off Inhibit (for VTTStandby)
•Undervoltage Lockout
•Operating Temperature: –40°Cto85°C
•Efficiencies up to 91%
•Output Overcurrent Protection (Non-Latching,
Auto-Reset)
DESCRIPTION
The PTHxx060Y are a series of ready-to-use switching regulator modules from Texas Instruments designed
specifically for bus termination in DDR and QDR memory applications. Operating from either a 3.3-V, 5-V or 12-V
input, the modules generate a VTToutput that will source or sink up to 10 A of current to accurately track their
V
input. VTTis the required bus termination supply voltage, and V
REF
and chipset bus receiver comparators. V
Both the PTHxx060Y series employs an actively switched synchronous rectifier output to provide state-of-the-art
stepdown switching conversion. The products are small in size (1 in × 0.62 in), and are an ideal choice where
space, performance, and high efficiency are desired, along with the convenience of a ready-to-use module.
Operating features include an on/off inhibit and output over-current protection (source mode only). The on/off
inhibit feature allows the VTTbus to be turned off to save power in a standby mode of operation. To ensure tight
load regulation, an output remote sense is also provided. Package options include both throughhole and surface
mount configurations.
REF
)
is usually set to half the V
REF
•Safety Agency Approvals:
is the reference voltage for the memory
REF
power supply voltage.
DDQ
V
IN
V
DDQ
1 k
1 %
1 k
1 %
C
IN
(Required)
Q
1
Standby
GND
CIN = Required Capacitor; 330µF (3.3 ± 5 V Input), 560 µF (12 V Input).
Co
= Required Low-ESR Electrolyitic Capacitor; 470 µF (3.3 ± 5 V Input), 940 µF (12 V Input).
1
= Ceramic Capacitance for Optimum Response to a 3 A (+ 1.5 A) Load Transient; 200 µF (3.3 ± 5 V Input), 400 µF (12 V Input).
Co
2
Co
= Distributed hf-Ceramic Decoupling Capacitors for VTT bus; as Recommended for DDR Memory Applications.
n
BSS138
(Optional)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
POLA is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
(1) Add T to end of part number for tape and reel on SMD packages only.
(2) Reference the applicable package reference drawing for the dimensions and PC board layout.
(3) Lead (Pb) –free option specifies Sn/Ag pin solder material.
(4) Standard option specifies 63/37, Sn/Pb pin solder material.
(1)
DESCRIPTIONPb – free andMechanical Package
RoHS
(4)
(4)
(4)
(2)
(3)
EUW
EUY
(3)
(3)
EUY
EUW
EUY
(3)
(3)
EUY
EUW
EUY
(3)
EUY
ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS
voltages are with respect to GND
UNIT
V
T
T
T
T
(1) For operation below 0°C, the external capacitors must have stable characteristics, use either a low ESR tantalum, Os-Con, or ceramic
(2) During soldering of package version, do not elevate peak temperature of the module, pins or internal components above the stated
Control input voltage–0.3 V to Vin+03 V
REF
Operating temperatureOver VINrange–40°Cto85°C
A
range
Wave solder temperatureSurface temperature of module body or pinsPTHXX060YAH260°C
wave
Solder reflow temperatureSurface temperature of module body or pins
(1) Rating is conditional on the module being directly soldered to a 4-layer PCB with 1 oz. copper. See the SOA curves or contact the
factory for appropriate derating.
(2) This control pin has an internal pull-up to the input voltage VIN. If it is left open-circuit the module will operate when input power is
applied. A small low-leakage (<100 nA) MOSFET is recommended for control. For further information, consult the related application
note.
(3) An input capacitor is required for proper operation. The capacitor must be rated for a minimum of 300 mA rms (750 mA rms for 12-V
input) of ripple current.
(4) The minimum value of external output capacitance value ensures that VTT meets the specified transient performance requirements for
the memory bus terminations. Lower values of capacitance may be possible when the measured peak change in output current is
consistently less than 3 A.
(5) This is the calculated maximum. The minimum ESR limitation will often result in a lower value. Consult the capacitor application notes
for further guidance.
(6) This is the typcial ESR for all the electrolytic (non-ceramic) output capacitance. Use 7 mΩ as the minimum when using max-ESR values
to calculate.
3
www.ti.com
PTH03060Y
PTH05060Y, PTH12060Y
SLTS222A–MARCH 2004 – REVISED OCTOBER 2005
TERMINAL
NAMENO.
V
IN
GND1, 7
V
REF
V
TT
VoSense5
Inhibit3
N/C4, 9, 10No connect
DESCRIPTION
2The positive input voltage power node to the module, which is referenced to common GND.
This is the common ground connection for the VINand VTTpower connections. It is also the 0-VDC reference
for the control inputs.
The module senses the voltage at this input to regulate the output voltage, VTT. The voltage at V
the reference voltage for the system bus receiver comparators. It is normally set to precisely half the bus
8driver supply voltage (V
V
pin should not exceed 500 Ω. See the Typical DDR Application Diagram in the Application Information
REF
section for reference.
This is the regulated power output from the module with respect to the GND node, and the tracking
termination supply for the application data and address buses. It is precisely regulated to the voltage applied
6
to the module's V
module. Once active it will track the voltage applied at V
The sense input allows the regulation circuit to compensate for voltage drop between the module and the
load. For optimal voltage accuracy VoSense should be connected to VTT.
The Inhibit pin is an open-collector/drain negative logic input that is referenced to GND. Applying a low-level
ground signal to this input turns off the output voltage, VTT. Although the module is inhibited, a voltage, V
will be present at the output terminals, fed through the DDR memory. When the Inhibit is active, the input
current drawn by the regulator is significantly reduced. If the Inhibit pin is left open circuit, the module will
produce an output whenever a valid input source is applied. See the Typical DDR Application Diagram in the
Application Information section for reference.
Terminal Functions
÷ 2), using a resistor divider. The Thevenin impedance of the network driving the
DDQ
input, and is active active about 20 ms after a valid input source is applied to the
REF
REF
.
REF
is also
DDQ
1
7
PTHXX060
(Top View)
10 98
2
6
543
4
0
1
2
3
4
2468100
IL − Load Current − A
VIN = 3.3 V
VIN = 12 V
VIN = 5 V
− Power Dissipation − W
P
D
20
30
40
50
60
70
80
90
400 LFM
200 LFM
100 LFM
Nat Cinv
VIN = 12 V
24680
I
L
− Load Current − A
10
T
A
− Ambient Temperature −
5
C
PTH03060Y
PTH05060Y, PTH12060Y
www.ti.com
10 0
90
80
70
Efficiency − %
60
50
SLTS222A–MARCH 2004 – REVISED OCTOBER 2005
TYPICAL CHARACTERISTICS (V
=1.25 V)
REF
(1)(2)
EFFICIENCYOUTPUT RIPPLEPOWER DISSIPATION
vsvsvs
LOAD CURRENTLOAD CURRENTLOAD CURRENT
Output Ripple − mV
60
50
40
30
20
10
VIN = 5 V
0
2
− Load Current − A
I
L
VIN = 3.3 V
VIN = 12 V
46 8100
VIN = 5 V
2468100
VIN = 3.3 V
VIN = 12 V
IL − Load Current − A
Figure 1.Figure 2.Figure 3.
PTH03060Y/PTH05060Y ATPTH12060Y ONLY; VIN=12V
NOMINAL V
TEMPERATURE DERATINGvs LOAD CURRENT
IN
TEMPERATURE DERATING
vs LOAD CURRENT
90
80
C
5
70
60
50
40
− Ambient Temperature −
A
T
30
20
Nat Cinv
200 LFM
100 LFM
400 LFM
2468100
IL − Load Current − A
Figure 4.Figure 5.
(1) The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the
converter. Applies to Figure 1, Figure 2, and Figure 3.
(2) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum
operating temperatures. Derating limits apply to modules soldered directly to a 4 in x 4 in double-sided PCB with 1 oz. copper. For
surface mount packages (AS and AZ suffix), multiple vias (plated through holes) are required to add thermal paths around the power
pins. Please refer to the mechanical specification for more information. Applies to Figure 4, and Figure 5.