1.3MHzindicates current limit and the second shows a
– SLEW RATE: 40V/μs
•DIODE FOR JUNCTION TEMPERATURE
MONITORING
•HTSSOP-20, HSOP-20 PowerPAD™
PACKAGES
(Bottom- and Top-Side Thermal Pad Versions)
APPLICATIONS
•POWERLINE COMMUNICATIONS
•VALVE, ACTUATOR DRIVER
•V
•MOTOR DRIVER
•AUDIO POWER AMPLIFIER
•POWER-SUPPLY OUTPUT AMPLIFIER
•TEST EQUIPMENT AMPLIFIER
•TRANSDUCER EXCITATION
•LASER DIODE DRIVER
•GENERAL-PURPOSE LINEAR POWER
DRIVER
COM
BOOSTER
SBOS372C –OCTOBER 2008–REVISED NOVEMBER 2009
DESCRIPTION
The OPA564 is a low-cost, high-current operational
amplifier that is ideal for driving up to 1.5A into
reactive loads. The high slew rate provides 1.3MHz
full-power bandwidth and excellent linearity. These
monolithic integrated circuits provide high reliability in
demanding powerline communications and motor
control applications.
The OPA564 operates from a single supply of 7V to
24V, or dual power supplies of ±3.5V to ±12V. In
single-supply operation, the input common-mode
range extends to the negative supply. At maximum
output current, a wide output swing provides a 20V
(I
= 1.5A) capability with a nominal 24V supply.
OUT
TheOPA564isinternallyprotectedagainst
over-temperature conditions and current overloads. It
is designed to provide an accurate, user-selected
current limit. Two flag outputs are provided; one
thermal over-temperature condition. It also has an
Enable/Shutdown pin that can be forced low to shut
down the output, effectively disconnecting the load.
The OPA564 is housed in a thermally-enhanced,
surface-mount PowerPAD™ package (HSOP-20) with
the choice of the thermal pad on either the top side or
the bottomside ofthe package,andin an
HTSSOP-20 package with thermal pad on the
bottom. Operation for all versions is specified over
the industrial temperature range, –40°C to +85°C.
Power Operational Amplifier, 1.2A,
15V, 17MHz, 50V/μs
PGA112
OPA365
TL074
OPA561
PP
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2PowerPAD is a trademark of Texas Instruments, Inc.
3All other trademarks are the property of their respective owners.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
(1)
PACKAGE
PRODUCTPACKAGE-LEADDESIGNATORPACKAGE MARKING
HSOP-20 (PowerPAD on bottom)DWPOPA564
OPA564HSOP-20 (PowerPAD on top)DWDOPA564
HTSSOP-20 (PowerPAD on bottom)
(2)
PWPOPA564
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Product-preview device.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range (unless otherwise noted)
OPA564UNIT
Supply Voltage, VS= (V+) – (V–)+26V
(2)
Signal Input
Terminals
Signal Output
Terminals
Output Short-Circuit
Operating Junction Temperature, T
Storage Temperature, T
Junction Temperature, T
Voltage
(2)
Current
Voltage(V–)–0.4 to (V+)+0.4V
(3)
Current
(4)
J
A
J
Human Body Model (HBM)4000V
ESD RatingsCharged Device Model (CDM)1000V
Machine Model (MM)200V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.4V beyond the supply rails should
be current limited to 10mA or less.
(3) Output terminals are diode-clamped to the power-supply rails. Input signals forcing the output terminal more than 0.4V beyond the
supply rails should be current limited to 10mA or less.
(4) Short-circuit to ground within SOA. See Power Dissipation and Safe Operating Area for more information.
Boldface limits apply over the specified temperature range: TA= –40°C to +85°C.
At T
OUTPUT, continued
Maximum Continuous Current, dcI
Output Impedance, closed loopR
Output Impedance, open loopZ
Output Current Limit Range
Current Limit EquationI
Current Limit AccuracyI
Current Limit Overshoot
Output Shut Down
Capacitive Load DriveC
DIGITAL CONTROL
Enable/Shutdown Mode INPUTV
Output Shutdown Time1μs
Output Enable Time3μs
Current Limit Flag Output
Thermal Shutdown
Junction Temperature at Shutdown
T
(2) Under safe operating conditions. See Power Dissipation and Safe Operating Area for safe operating area (SOA) information.
(3) Minimum current limit is 0.4A. See Adjustable Current Limit in the Applications section.
(4) Quiescent current increases when the current limit is increased (see Typical Characteristics).
(5) RCL(current limit) can range from 55kΩ (I
(6) See Typical Characteristics.
(7) Transient load transition time must be ≥ 200ns.
(8) See Enable/Shutdown (E/S) Pin in the Applications section.
(9) When sourcing, the V
(10) Characterized, but not production tested.
= +25°C, VS= ±12V, R
CASE
= 20kΩ to GND, and E/S pin enabled, unless otherwise noted.
LOAD
OPA564
PARAMETERSCONDITIONSMINTYPMAXUNIT
(2)
OUT
O
O
(3)
LIM
f = 100kHz10Ω
G = +2, f = 100kHzSee Figure 24, Typical Characteristics
I
@ 20k • (1.2V/RCL+ 5kΩ)
LIM
Solved for RCL(Current Limit)RCL@ (24k/I
= 1.5A10%
(6) (7)
Output Impedance
V
High (output enabled)E/S Pin Open or Forced High(V–)+2(V–)+V
(11) Power-supply sequencing requirements must be observed. See Power Supplies section for more information.
(12) Quiescent current increases when the current limit is increased (see Typical Characteristics).
(13) I
(14) The OPA564 typically goes into thermal shutdown at a junction temperature above +140°C.
(15) Thermal modeling of the DWD-20 package was done based on a 1-inch AAVID Thermalloy heatsink (Thermalloy part no. 65810).
= +25°C, VS= ±12V, R
CASE
= 20kΩ to GND, and E/S pin enabled, unless otherwise noted.
LOAD
OPA564
PARAMETERSCONDITIONSMINTYPMAXUNIT
(11)
±12V
(12)
S
I
I
Q
Connected to V–
SET
(13)
, I
= 03950mA
OUT
Over Temperature50mA
I
QSD
DIG
DIG
HSOP-20 DWP PowerPAD (Pad Down)θ
HSOP-20 DWD PowerPAD (Pad Up)
(15)
HTSSOP-20 PWP PowerPADθ
should not be connected to V– because this consumes excessive current. A 7.5kΩ resistor connected in series sets I
(1)PowerPADisinternallyconnectedtoV ,
Soldering the PowerPAD to the PCB is
always required, even with applications that
havelowpowerdissipation.
-
OPA564
SBOS372C –OCTOBER 2008–REVISED NOVEMBER 2009
OPA564AIDWP, OPA564AIPWPOPA564AIDWD
HSOP-20, HTSSOP-20HSOP-20
PowerPAD on BottomPowerPAD on Top
www.ti.com
PIN CONFIGURATIONS
PIN DESCRIPTIONS
OPA564AIDWP
OPA564AIPWPOPA564AIDWD
(PAD DOWN)(PAD UP)
PIN NO.PIN NO.NAMEDESCRIPTION
1, 10, 11, 201, 10, 11, 20V––Supply for Amplifier, PWR Out, and Metal PowerPAD
219V++Supply for Signal Amplifier
318T
417E/SEnable/Shutdown Output Stage; take E/S low to shut down output
516+INNoninverting Op Amp Input
615–INInverting Op Amp Input