Texas Instruments Modular MSOP8 EVM, Modular MSOP8 User Manual

Modular MSOP8 EVM

User’ s Gu ide

September 2003 Data Acquisition

SLAU1 15

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty . Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Following are URLs where you can obtain information on other Texas Instruments products & application
solutions:

Products Applications

Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive

DSP dsp.ti.com Broadband www.ti.com/broadband
Interface interface.ti.com Digital Control www.ti.com/digitalcontrol
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Secruity www.ti.com/security

Telephony www.ti.com/telephony
Video & Imaging www.ti.com/video
Wireless www.ti.com/wireless

Mailing Address: Texas Instruments
Post Office Box 655303 Dallas, Texas 75265

Copyright  2003, Texas Instruments Incorporated

EVM IMPORTANT NOTICE

Texas Instruments (TI) provides the enclosed product(s) under the following conditions:
This evaluation kit being sold by TI is intended for use for ENGINEERING DEVELOPMENT OR EVALUATION

PURPOSES ONLY and is not considered by TI to be fit for commercial use. As such, the goods being provided
may not be complete in terms of required design-, marketing-, and/or manufacturing-related protective
considerations, including product safety measures typically found in the end product incorporating the goods.
As a prototype, this product does not fall within the scope of the European Union directive on electromagnetic
compatibility and therefore may not meet the technical requirements of the directive.

Should this evaluation kit not meet the specifications indicated in the EVM User’s Guide, the kit may be returned
within 30 days from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE
WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED,
IMPLIED, OR S TATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY
PARTICULAR PURPOSE.

The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user
indemnifies TI from all claims arising from the handling or use of the goods. Please be aware that the products
received may not be regulatory compliant or agency certified (FCC, UL, CE, etc.). Due to the open construction
of the product, it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic
discharge.

EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE
TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.

TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not
exclusive.

TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein.

Please read the EVM User’s Guide and, specifically, the EVM Warnings and Restrictions notice in the EVM
User’s Guide prior to handling the product. This notice contains important safety information about temperatures
and voltages. For further safety concerns, please contact the TI application engineer.

Persons handling the product must have electronics training and observe good laboratory practice standards.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any

machine, process, or combination in which such TI products or services might be or are used.

Mailing Address:

Texas Instruments
Post Office Box 655303
Dallas, Texas 75265

Copyright  2003, Texas Instruments Incorporated

EVM WARNINGS AND RESTRICTIONS

It is important to operate this EVM within the input voltage range of 1.8 VDC to 5 VDC and the
output voltage range of 0 VDC and 5 VDC.

Exceeding the specified input range may cause unexpected operation and/or irreversible
damage to the EVM. If there are questions concerning the input range, please contact a TI
field representative prior to connecting the input power.

Applying loads outside of the specified output range may result in unintended operation and/or
possible permanent damage to the EVM. Please consult the EVM User’s Guide prior to
connecting any load to the EVM output. If there is uncertainty as to the load specification,
please contact a TI field representative.

During normal operation, some circuit components may have case temperatures greater than
30°C. The EVM is designed to operate properly with certain components above 85°C as long
as the input and output ranges are maintained. These components include but are not limited
to linear regulators, switching transistors, pass transistors, and current sense resistors. These
types of devices can be identified using the EVM schematic located in the EVM User’s Guide.
When placing measurement probes near these devices during operation, please be aware
that these devices may be very warm to the touch.

Mailing Address:

Texas Instruments
Post Office Box 655303
Dallas, Texas 75265

Copyright  2003, Texas Instruments Incorporated

About This Manual

This user’s guide describes the characteristics, operation, and use of the
Modular MSOP8 EVM. This EVM is a multi-device, 12 to 16 bit, SSI, analog
to digital converter Evaluation Module. A complete circuit description, as well
as schematic diagram and bill of materials, are included.

How to Use This Manual

This document contains the following chapters:

Preface

Read This First

Chapter 1—EVM Overview
Chapter 2—Analog Interface
Chapter 3—Digital Interface
Chapter 4—Power Supplies
Chapter 5—EVM Operation
Chapter 6—EVM Bill of Materials and Schematic

Information About Cautions and Warnings

This book may contain cautions and warnings.

This is an example of a caution statement.
A caution statement describes a situation that could potentially

damage your software or equipment.

This is an example of a warning statement.
A warning statement describes a situation that could potentially

cause harm to you

.

Read This First

-3

The information in a caution or a warning is provided for your protection.
Please read each caution and warning carefully.

Related Documentation From Texas Instruments

To obtain a copy of any of the following TI documents, call the Texas
Instruments Literature Response Center at (800) 477 - 8924 or the Product
Information Center (PIC) at (972) 644 -5580. When ordering, identify this
booklet by its title and literature number. Updated documents can also be
obtained through our website at www.ti.com.

EVM Compatible Device Data Sheets: Literature Number:

ADS7816 SBAS110
ADS7817 SBAS230
ADS7818 SBAS078
ADS7822 SBAS062
ADS7834 SBAS098
ADS7835 SBAS102
ADS8320 SBAS108
ADS8321 SBAS123
ADS8324 SBAS172
ADS8325 SBAS226

FCC Warning

Application Notes/Additional Literature: Literature Number:

Op Amps for Everyone SLOD006
5-6K Interface Board SLAU104
Single and Bipolar Supply Signal Conditioning Boards SLAU105

Third Party Tools: Vendor Website:

HPA449 Development Board (MSP430 Tools) www.softbaugh.com
Speedy 33 (DSP Tools) www.hyperception.com

This equipment is intended for use in a laboratory test environment only. It gen­erates, uses, and can radiate radio frequency energy and has not been tested
for compliance with the limits of computing devices pursuant to subpart J of
part 15 of FCC rules, which are designed to provide reasonable protection
against radio frequency interference. Operation of this equipment in other en­vironments may cause interference with radio communications, in which case
the user at his own expense will be required to take whatever measures may
be required to correct this interference.

-4

Contents

1 EVM Overview 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.1 Features 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2 Introduction 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2 Analog Interface 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3 Digital Interface 3-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4 Power Supplies 4-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.1 ADC Power 4-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.2 Stand Alone Operation 4-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.3 Reference Voltage 4-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5 EVM Operation 5-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.1 Analog Input 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.2 Digital Control 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.3 Chip Select (Shut Down) 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.4 Digital I/O Buffers 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.5 Default Jumper Locations 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6 EVM BOM and Schematic 6-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.1 EVM Schematic 6-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Tables

2-1 Analog Interface Pin Out 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3-1 Digital Interface Pin Out 3-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4-1 Power Supply Pin Out 4-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5-1 List of Jumpers 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6-1 Bill of Materials 6-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Contents

-1

-2

Chapter 1

EVM Overview

The following section gives a general overview of the Modular MSOP8
evaluation board.

Topic Page

1.1 Features 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2 Introduction 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

EVM Overview

1-1

Features

1.1 Features

1.2 Introduction

Full-featured evaluation board for a variety of single channel, eight pin Mi­cro SOP, 12 and 16-bit, serial Output, analog to digital converters

On-board reference and buffer circuits
High-speed serial interface
Modular design for use with a variety of DSP and micro controller interface

board

s

The Modular MSOP8 Evaluation Module is an updated version of the
Burr-Brown DEM-MSOP8 evaluation board. The EVM is designed so that a
single printed wiring board (PWB) supports a variety of high speed 12 and 16
bit serial ADC’s.

The modular EVM form factor allows for direct evaluation of the ADC’s
performance and operating characteristics. This EVM is compatible with the
5-6K Interface Board (SLAU104) from Texas Instruments and additional 3
party boards such as the HPA449 demonstration board from SoftBaugh, Inc.
(www.softbaugh.com) and the Speedy33t from Hyperception, Inc.
(www.hyperception.com).

rd

1-2

Chapter 2

Analog Interface

For maximum flexibility, the Modular MSOP8 EVM is designed for easy
interfacing to multiple analog sources. Samtec part numbers
SSW-110-22-F-D-VS-K and TSM-110-01-T-DV-P provide a convenient 10-pin
dual row header/socket combination at J1. This header/socket provides
access to the analog input pins of the ADC. Consult Samtec at
www.samtec.com o r call 1-800-SAMTEC-9 for a variety of mating connector
options.

Table 2-1.Analog Interface Pin Out

Pin Number Signal Description

J1.2 AD_IN+ Noninverting Input (Differential Devices)/Analog Input (Single Ended Devices)
J1.4 AD_IN- Inverting Input (Differential Devices)/Analog Ground (Single Ended Devices)
J1.6 Unused

J1.8 Unused
J1.10 Unused
J1.12 Unused
J1.14 Unused
J1.16 Unused
J1.18 REF(-) Unused
J1.20 REF(+) External Reference Source Input (2.5V NOM, 2.525 MAX)
J1.15 Unused

J1.1- J1.19

(odd)

AGND Analog ground connections (except J1.15)

Pins are unused and should be left open for use with future amplifier and sensor

Pins are unused and should be left open for use with future amplifier and sensor
input modules.

Analog Interface

2-1

2-2

Chapter 3

Digital Interface

The Modular MSOP8 EVM is designed for easy interfacing to multiple control
platforms. Samtec part numbers, SSW-110-22-F-D-VS-K and
TSM-110-01-T-DV-P, provide a convenient 10-pin dual row header/socket
combination at J2. This header/socket provides access to the digital control
and serial data pins of the MSOP8 EVM. Consult Samtec at www.samtec.com
or 1-800-SAMTEC-9 for a variety of mating connector options.

Table 3-1.Digital Interface Pin Out

Pin Number Signal Description

J2.1 CS Chip Select – Active low signal, enables data transfer – jumper configurable

(see schematic)
J2.3 SCLK Serial Clock
J2.5 SCLKR Serial Clock Return (for DSP Host systems)
J2.7 FS Frame Sync for DSP host systems – alternate Chip Select through JMP2 (see

schematic)
J2.9 FSR Frame Sync Return (for DSP Host systems)

J2.11 Unused
J2.13 SDO Serial Data Output
J2.15 Unused
J2.17 Unused
J2.19 SPARE

Digital Interface

3-1

3-2

The Modular MSOP8 EVM board requires 5 V dc for the analog section. This
includes the voltage reference (U2), the reference buffer (U4), and optionally,
the ADC installed on the EVM (via JMP1). Supply voltages of 1.8 V to 5 V dc
for the digital section are also required. When used in combination with one
of the DAP Interface boards, J3 provides connection to the common power bus
described in document SLAU104. Table 4-1 shows the pin out of J3.

Table 4-1.Power Supply Pin Out

Unused 1 2 Unused
+5VA 3 4 Unused
DGND 5 6 AGND
+1.8VD 7 8 +VD1
+3.3VD 9 10 +5VD

Chapter 4

Power Supplies

Signal Pin Number Signal

When power is supplied to J3, JMP3 allows for one of four different dc voltages
to be applied to the digital sections of the ADC. See the schematic and PWB
silkscreen for details.

Topic Page

4.1 ADC Power 4-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.2 Stand Alone Operation 4-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.3 Reference Voltage 4-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power Supplies

4-1

ADC Power

4.1 ADC Power

The device installed on the modular MSOP8 EVM has several options in
regards to its power source. Refer to the schematic for the following
discussion.

JMP1 and JMP3 allow the user to select the power supply used by the ADC.
When JMP1 is in the default factory position (Shunt on pins 1-2), power to the
ADC comes from J3.3 or TP5. Single gate digital buffers (U3, U5, and U6) are
installed on the ADC’s digital input/output lines to allow operation with low
voltage controllers, such as the MSP430. The supply voltage to these buffers
is determined by JMP3 or the voltage applied to TP7.

4.2 Stand Alone Operation

When used as a stand alone EVM, the analog power can be applied to TP5,
referenced to TP6. Digital power can be applied to TP7 referenced to TP4.
While filters are provided for all power supply inputs, optimal performance of
the EVM requires a clean, well-regulated power source.

Caution
The ADC’s that are compatible with this EVM have a variety of

power supply requirements. Check the appropriate data sheets
and verify all power supplies are within the safe operating limits of
the ADC before applying power to the EVM.

4.3 Reference Voltage

The modular MSOP8 can be configured to use the onboard reference/buffer
circuits (U2 and U4) or an external reference applied to J1.20. Jumpers JMP5
and JMP6 control the reference source. In the factory default position (shunt
on JMP5 pins 1-2), a 2.5 V reference is supplied by U2. Moving the shunt at
JMP5 to positions 2 - 3 allows an external reference applied to J1.20 to be
used.

Caution
The ADC’s that are compatible with this EVM have a variety of

reference requirements. Check the appropriate data sheets and
verify external reference sources are within the safe operating
limits of the ADC before applying power to the EVM.

JMP6 controls the actual application of the reference source to the ADC. Note
that JMP6 is not installed on EVM boards for ADS7818, ADS7834, and
ADS7835 devices. In the factory default position (shunt on pins 1 - 2), the
reference source is the on board reference/buffer circuit. Moving the shunt on
JMP6 to pins 2-3 allows the voltage applied to the ADC (+Vadc) to be used
as the reference source.

4-2

Chapter 5

EVM Operation

The following section provides information in the analog input, digital control,
and general operating conditions of the Modular MSOP8 EVM.

Topic Page

5.1 Analog Input 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.2 Digital Control 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.3 Chip Select (Shut Down) 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.4 Digital I/O Buffers 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.5 Default Jumper Locations 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

EVM Operation

5-1

Analog Input

5.1 Analog Input

The analog input source can be applied directly to J1 (top or bottom side) or
through optional amplifier and signal conditioning modules. The analog input
range is dependent on the configuration of the EVM and the ADC installed at
location U1. Consult the datasheet for the device to determine the maximum
analog input range.

5.2 Digital Control

The digital control signals can be applied directly to J2 (top or bottom side).
The modular MSOP8 EVM can also be connected directly to a DSP or a micro
controller interface board, such as the HPA449. See the product folder for the
EVM or the installed device for a current list of compatible interface and/or
accessory boards.

5.3 Chip Select (Shut Down)

Jumper JMP2 is provided to allow the selection of the signals applied to the
chip select (/CS) or shutdown (SHDN) pin of the ADC installed on the EVM.
The factory default condition for the EVM is to place a shunt jumper between
pins 1 - 2 of JMP2. This allows the Frame Sync (FS) signal from DSP host
systems to be used as a chip select for the ADC. This signal originates from
J2.7. When JMP2 is moved to pins 2-3, the /CS (SHDN) signal is applied via
J2.1.

5.4 Digital I/O Buffers

Single gate buffers U3, U5 and U6 are provided to ensure the safe operation
of the modular MSOP8 EVM with low voltage host controllers. The digital I/O
voltage applied to these buffers via JMP3 should be set in accordance with the
operating voltage of the host controller.

5.5 Default Jumper Locations

Table 5-1 provides a list of jumpers found on the EVM and their factory default
conditions.

Table 5-1.List of Jumpers

Jumper Shunt Position Jumper Description

JMP1 Pins 1-2 Controls ADC Supply Voltage (default is +5Va Source)
JMP2 Pins 1-2 Controls ADC /CS(SHDN) Pin (default is FS from DSP Host)
JMP3 Pins 5-6 Controls Digital I/O Voltage (default is +3.3Vd Source)
JMP4 CLOSED Ties ANALOG and DIGITAL grounds together
JMP5 Pins 1-2 Controls External Ref. Source (default is +2.5V from U2)
JMP6 Pins 1-2 Controls REFERENCE Source to ADC (default is onboard reference/buffer

circuit)

5-2

Chapter 6

EVM BOM and Schematic

The following table contains a complete bill of materials for the modular
MSOP8 EVM bill of materials.

Table 6-1.Bill of Materials

Designators Description Manufacturer Mfg. Part Number

C2 C3 C4 C13 Not Installed
R11 Not Installed
C1 0.47 µF, 0805, ceramic, X7R, 25 V, 10% Panasonic ECJ-2YB1C474K
C11 C12 C14 0.1 µF, 0805, ceramic, X7R, 50 V, 10% Panasonic ECJ-2YB1H104K
C6 C8 C10 10 µF, 1206, ceramic, Y5V, 10 V, 10% Panasonic ECJ-3YF1A106Z
C5 C14 C15 10 µF, A case, tantalum, 10 V Panasonic ECS-T1AY106R
L1 L2 L3 15 µH inductor, SMT, 1608 Series Inductors, Inc. CTDS1608C-153
J1 J2 (top side) 10 Pin, dual row, SMT header (20 [postive) Samtec TSM-110-01-T-DV-P
J1B J2B (bottom side) 10 Pin, dual row, SMT socket (20 positive) Samtec SSW-110-22-F-D-VS-K
J3 (bottom side) 5 Pin, dual row, SMT socket (10 posotove) Samtec SSW-105-22-F-D-VS-K
R9 R10 R12 33 Ω, 0805, 5%, .1W Resistor Yageo America 9C08052A33R0JLHFT
R1 R2 R3 R4 R6 0 Ω, 0805, 0.1 W resistor Yageo America 9C08052A0R00JLHFT
TP1 TP2 TP3 TP5 TP7 Red test point loop Keystone 5001
TP4 TP6 Black test point loop Keystone 5000
U1 Varies (see Note)
U2 REF3025 TI REF3025AIDBZT
U3 U5 U6 SN74LVC1G125 TI SN74LVC1G125DBVT
U4 OPA353N TI OPA353NA/250
JMP1 JMP2 JMP5

JMP6
JMP3 4 Pin, dual row, TH header (8 positive) Samtec TSW-104-07-L-D

Note: The device installed at location U1 is dependent on the EVM ordered. This device is soldered to the board for best perfor-

mance. U1 may be replaced with any device listed in the EVM compatible device data sheets table found at the beginning
of this document.

3 Pin , 2 mm header Samtec TMMH-103-C-S-T

Topic Page

6.1 EVM Schematic 6-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

EVM BOM and Schematic

6-1

EVM Schematic

6.1 EVM Schematic

The schematic diagram is provided as a reference.

6-2

1 2 3 4

A

B

C

D

4

321

D

C

B

A

ti

12500 TI Blvd. Dallas, Texas 75243

Title:

SHEET: OF:FILE:

SIZE:

DATE: REV:

31-Jul-2003

Revision History

REV ECN Number Approved

Drawn By:

Engineer:

SDO

C8
10uF

+5Va

JMP5

JMP6

SCLK

/CS

C11

0.1uF

C12

0.1uF

R11
NI

+V(i/o)

JMP4

TP2

+5Va

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

J1

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

J2

R9 33

R10 33

1

2

3

4

5

6

7

8

9

10

J3

+5Va

SCLK

/CS SDO

REF+

REF-

/CS(SHDN)

5

REF

1

GND

4

IN+

2

IN-

3

+Vcc

8

DCLOCK

7

SDO

6

U1

3

4

1

5

2

U4

OPA353N

R12

33

C6
10uF

VIN

1

GND

3

OUT

2

U2

REF3025

C1

0.47uF

+5Va

R4

0 ohm

R6
0 ohm

C10
10uF

VREF

AD_IN+
AD_IN-

5

3

U5

SN74LVC1G125

5

3

U6

SN74LVC1G125

TP3

TP1

TP5

TP7

TP4

TP6

R1

0 ohm

C4
NI

C2
NI

C3
NI

L1

15uF

JMP1

+V(i/o)

+V(i/o)

+V(i/o)

+V(adc)

JMP2

+LVa

+V(i/o)

+5Vd
+3.3Vd

1

2

3

4

5

6

7

8

JMP3

+1.8Vd

+VD1

AGNDDGND

C13
NI

5

3

U3

SN74LVC1G125

R2

0 ohm

R3

0 ohm

Tom Hendrick

Tom Hendrick B

ADSMSOP8 Evaluation Module

Schematic

B

11EDGE #6450847

B Initial Release

TH

L2

15uF

+

C5
10uF

+

C14
10uF

L3

15uF

+

C15
10uF

+LVa