Texas Instruments LMZ10500 User Manual
10 mV/Div
500 MHz BW
1 µs/Div
COUT = 10 F 10V 0805 X5R
VOUT RIPPLE
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
20
30
40
50
60
70
80
90
100
EFFICIENCY (%)
LOAD CURRENT (A)
VOUT = 1.2V
VOUT = 1.8V
VOUT = 2.5V
VOUT = 3.3V
LMZ10500
www.ti.com
SNVS723C –OCTOBER 2011–REVISED MARCH 2013
LMZ10500 650mA SIMPLE SWITCHER® Nano Module with 5.5V Maximum Input Voltage
Check for Samples: LMZ10500
1
FEATURES
2
• Integrated Inductor
• Miniature Form Factor (3.0mm x 2.5mm x
1.425mm)
• 8-pin LLP Footprint
• –40°C to 125°C Junction Temperature Range
• Adjustable Output Voltage
• 2.0MHz Fixed PWM Switching Frequency
• Integrated Compensation
• Soft Start Function
• Current Limit Protection
• Thermal Shutdown Protection
• Input Voltage UVLO for Power-up, Powerdown, and Brown-out Conditions
• Only 5 External Components — Resistor
Divider and 3 Ceramic Capacitors
DESCRIPTION
The LMZ10500 SIMPLE SWITCHER® nano module
is an easy-to-use step-down DC-DC solution capable
of driving up to 650mA load in space-constrained
applications. Only an input capacitor, an output
capacitor, a small V
resistors are required for basic operation. The nano
module comes in 8-pin POS footprint package with
an integrated inductor. Internal current limit based
softstart function, current overload protection, and
thermal shutdown are also provided.
System Performance
(Quick Overview Links: V
3.3V)
Typical Efficiency at VIN= 3.6V
filter capacitor, and two
CON
= 1.2V, 1.8V, 2.5V,
OUT
APPLICATIONS
• Point of Load Conversions from 3.3V and 5V
Rails
• Space Constrained Applications
• Low Output Noise Applications
ELECTRICAL SPECIFICATIONS
• Up to 650mA Output Current
• Input Voltage Range 2.7V to 5.5V
• Output Voltage Range 0.6V to 3.6V
• Efficiency up to 95%
PERFORMANCE BENEFITS
• Small Solution Size
• Low output Voltage Ripple
• Easy Component Selection and Simple PCB
Layout
• High Efficiency Reduces System Heat
Generation
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Output Voltage Ripple
VIN= 5.0V, V
Copyright © 2011–2013, Texas Instruments Incorporated
OUT
= 1.8V, I
OUT
= 650mA
PAD
PAD
PAD
0 200 400 600 800 1000
0
10
20
30
40
50
60
70
80
RADIATED EMISSIONS (dBV/m)
FREQUENCY (MHz)
Emissions
CISPR 22 Class B Limit
CISPR 22 Class A Limit
LMZ10500
SNVS723C –OCTOBER 2011–REVISED MARCH 2013
VIN= 5.0V, V
Connection Diagram
Radiated EMI (CISPR22)
OUT
= 1.8V, I
= 650mA
OUT
www.ti.com
Pin # Name Description
1 EN Enable Input. Set this digital input higher than 1.2V for normal operation. For shutdown, set low. Pin is
internally pulled up to VIN and can be left floating for always-on operation.
2 VCON Output voltage control pin. Connect to analog voltage from resisitve divider or DAC/controller to set the VOUT
voltage. V
filtering.
OUT
3 FB Feedback of the error amplifier. Connect directly to output capacitor to sense V
4 SGND Ground for analog and control circuitry. Connect to PGND at a single point.
5 VOUT Output Voltage. Connected to one terminal of the integrated inductor. Connect output filter capacitor between
VOUT and PGND.
6 PGND Power ground for the power MOSFETs and gate-drive circuitry.
7 VIN Voltage supply input. Connect ceramic capacitor between VIN and PGND as close as possible to these two
pins. Typical capacitor values are between 4.7µF and 22µF.
8 VREF 2.35V voltage reference output. Typically connected to VCON pin through a resistive divider to set the output
voltage.
PAD The 3 pads underneath the module are not internally connected to any node. These pads should be
connected to the ground plane for improved thermal performance.
2 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Figure 1. Package Number NQB0008A
Pin Descriptions
= 2.5 x V
. Connect a small (470pF) capacitor from this pin to SGND to provide noise
CON
Product Folder Links: LMZ10500
OUT
.
LMZ10500
www.ti.com
Absolute Maximum Ratings
(1)(2)
SNVS723C –OCTOBER 2011–REVISED MARCH 2013
VIN, VREF to SGND −0.2V to +6.0V
PGND to SGND −0.2V to +0.2V
EN, FB, VCON (SGND −0.2V)
to (VIN +0.2V)
w/6.0V max
VOUT (PGND −0.2V)
to (VIN +0.2V)
w/6.0V max
Junction Temperature (T
) +150°C
J-MAX
Storage Temperature Range −65°C to +150°C
Maximum Lead Temperature +260°C
ESD Susceptibility
(3)
±2kV
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) The human body model is a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin. Test method is per JESD-22-114.
Operating Ratings
(1)
Input Voltage Range 2.7V to 5.5V
Recommended Load Current 0 mA to 650mA
Junction Temperature (TJ) Range −40°C to +125°C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Thermal Properties
Junction-to-Ambient Thermal 120°C/W
Resistance (θJA), NQB0008A Package
(1)
(1) Junction-to-ambient thermal resistance (θJA) is based on 4 layer board thermal measurements, performed under the conditions and
guidelines set forth in the JEDEC standards JESD51-1 to JESD51-11. θJAvaries with PCB copper area, power dissipation, and airflow.
Electrical Characteristics
Specifications with standard typeface are for TJ= 25°C only; Limits in bold face type apply over the operating junction
temperature range TJof -40°C to 125°C. Minimum and maximum limits are guaranteed through test, design, or statistical
correlation. Typical values represent the most likely parametric norm at TJ= 25°C, and are provided for reference purposes
only. Unless otherwise stated the following conditions apply: VIN= 3.6V, VEN= 1.2V.
Symbol Parameter Conditions Units
SYSTEM PARAMETERS
V
x GAIN Reference voltage x VCON to VIN= VEN= 5.5V, V
REF
GAIN VCON to FB Gain VIN= 5.5V, V
VIN
UVLO
VIN
UVLO
I
SHDN
I
q
R
DROPOUT
FB Gain
VIN rising threshold 2.4 V
VIN falling theshold 2.25 V
Shutdown supply current VIN= 3.6V, VEN= 0.5V
DC bias current into VIN VIN= 5.5V, V
VINto V
(1)
resistance I
OUT
Min Typ Max
(1) (2) (1)
= 1.44V
CON
= 1.44V 2.4375 2.5 2.5750 V/V
CON
(3)
= 1.6V, I
0A
OUT
CON
= 200 mA 285 425 mΩ
OUT
5.7575 5.875 5.9925 V
11 18 µA
=
6.5 8.5 mA
(1) Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlation
using Statistical Quality Control (SQC) methods. Limits are used to calculate the Average Outgoing Quality Level (AOQL).
(2) Typical numbers are at 25°C and represent the most likely parametric norm.
(3) Shutdown current includes leakage current of the high side PFET.
Copyright © 2011–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LMZ10500
LMZ10500
SNVS723C –OCTOBER 2011–REVISED MARCH 2013
Electrical Characteristics
(1)
(continued)
www.ti.com
Specifications with standard typeface are for TJ= 25°C only; Limits in bold face type apply over the operating junction
temperature range TJof -40°C to 125°C. Minimum and maximum limits are guaranteed through test, design, or statistical
correlation. Typical values represent the most likely parametric norm at TJ= 25°C, and are provided for reference purposes
only. Unless otherwise stated the following conditions apply: VIN= 3.6V, VEN= 1.2V.
Symbol Parameter Conditions Units
SYSTEM PARAMETERS
I
LIM
F
OSC
V
IH,ENABLE
V
IL,ENABLE
T
SD
T
SD-HYST
D
MAX
T
ON-MIN
θ
JA
DC Output Current Limit VCON = 0.24V
(4)
Internal oscillator frequency 1.75 2.0 2.25 MHz
Enable logic HIGH voltage 1.2 V
Enable logic LOW voltage 0.5 V
Thermal shutdown Rising Threshold 150 °C
Thermal shutdown hysteresis 20 °C
Maximum duty cycle 100 %
Minimum on-time 50 ns
Package Thermal Resistance 20mm x 20mm board
2 layers, 2 oz copper, 0.5W, no 118
airlow
15mm x 15mm board
2 layers, 2 oz copper, 0.5W, no 132 °C/W
airlow
10mm x 10mm board
2 layers, 2 oz copper, 0.5W, no 157
airlow
(4) Current limit is built-in, fixed, and not adjustable.
Min Typ Max
(1) (2) (1)
800 1000 mA
System Characteristics
The following specifications are guaranteed by design providing the component values in the Typical Application Circuit are
used (CIN= C
testing. Unless otherwise stated the following conditions apply: TA= 25°C.
Symbol Parameter Conditions Min Typ Max Units
ΔV
OUT/VOUT
ΔV
OUT/VOUT
ΔV
OUT/VOUT
VREF T
RISE
η %
V
Ripple Output voltage ripple VIN= 5.0V, V
OUT
Line
Transient
= 10 µF, 6.3V, 0603, TDK C1608X5R0J106K). These parameters are not guaranteed by production
OUT
Output Voltage Regulation Over V
Line Voltage and Load Current ΔVIN=2.7V to 4.2V ±1.23 %
Output Voltage Regulation Over V
Line Voltage and Load Current ΔVIN= 2.7V to 5.5V ±0.56 %
Output Voltage Regulation Over V
Line Voltage and Load Current ΔVIN= 4.0V to 5.5V ±0.24 %
Rise time of reference voltage EN = Low to High, VIN= 4.2V
Peak Efficiency 95
Full Load Efficiency VIN= 5.0V, V
= 0.6V
OUT
ΔI
= 0A to 650mA
OUT
= 1.5V
OUT
ΔI
= 0A to 650mA
OUT
= 3.6V
OUT
ΔI
= 0A to 650 mA
OUT
V
= 2.7V, I
OUT
VIN= 5.0V, V
I
= 200 mA
OUT
I
= 650 mA
OUT
I
= 650 mA
OUT
OUT
OUT
OUT
OUT
(1)
= 650 mA
= 3.3V
= 3.6V
= 1.8V
10 µs
93
8 mV pk-pk
VIN = 2.7V to 5.5V,
Line transient response TR= TF= 10 µs, 25 mV pk-pk
VOUT = 1.8V, I
OUT
= 650 mA
(1) Ripple voltage should be measured across C
4 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated
on a well-designed PC board using the suggested capacitors.
OUT
Product Folder Links: LMZ10500
LMZ10500
www.ti.com
SNVS723C –OCTOBER 2011–REVISED MARCH 2013
System Characteristics (continued)
The following specifications are guaranteed by design providing the component values in the Typical Application Circuit are
used (CIN= C
testing. Unless otherwise stated the following conditions apply: TA= 25°C.
Symbol Parameter Conditions Min Typ Max Units
Load TR= TF= 40 µs,
Transient V
= 10 µF, 6.3V, 0603, TDK C1608X5R0J106K). These parameters are not guaranteed by production
OUT
VIN = 5.0V
Load transient response 25 mV pk-pk
= 1.8V
OUT
I
= 65mA to 650mA
OUT
Copyright © 2011–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LMZ10500
60 70 80 90 100 110 120 130
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
OUTPUT CURRENT (A)
AMBIENT TEMPERATURE (°C)
VIN = 4.0V
VIN = 4.5V
VIN = 5.0V
VIN = 5.5V
0 200 400 600 800 1000
0
10
20
30
40
50
60
70
80
RADIATED EMISSIONS (dBV/m)
FREQUENCY (MHz)
Emissions
CISPR 22 Class B Limit
CISPR 22 Class A Limit
60 70 80 90 100 110 120 130
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
OUTPUT CURRENT (A)
AMBIENT TEMPERATURE (°C)
VIN = 3.3V
VIN = 3.6V
VIN = 5.0V
VIN = 5.5V
60 70 80 90 100 110 120 130
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
OUTPUT CURRENT (A)
AMBIENT TEMPERATURE (°C)
VIN = 3.3V
VIN = 3.6V
VIN = 5.0V
VIN = 5.5V
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
DROPOUT VOLTAGE (V)
LOAD CURRENT (A)
VIN = 2.7V
VIN = 3.3V
VIN = 3.6V
VIN = 4.0V
60 70 80 90 100 110 120 130
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
OUTPUT CURRENT (A)
AMBIENT TEMPERATURE (°C)
VIN = 3.3V
VIN = 3.6V
VIN = 5.0V
VIN = 5.5V
LMZ10500
SNVS723C –OCTOBER 2011–REVISED MARCH 2013
Typical Performance Characteristics
Unless otherwise specified the following conditions apply: VIN= 3.6V, TA= 25°C
Dropout Voltage
Load Current and Input Voltage Thermal Derating V
Thermal Derating V
vs
Figure 2. Figure 3.
= 1.8V, θJA= 120°C/W Thermal Derating V
OUT
= 1.2V, θJA= 120°C/W
OUT
= 2.5V, θJA= 120°C/W
OUT
www.ti.com
Figure 4. Figure 5.
Thermal Derating V
6 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated
= 3.3V, θJA= 120°C/W Default evaluation board BOM
OUT
Figure 6. Figure 7.
Product Folder Links: LMZ10500
Radiated EMI (CISPR22)
VIN= 5.0V, V
OUT
= 1.8V, I
OUT
= 650mA
100m 1 10 100
0
10
20
30
40
50
60
70
80
CONDUCTED EMISSIONS (dBV)
FREQUENCY (MHz)
Conducted Emissions
CISPR 22 Quasi Peak
CISPR 22 Average
10 µs/Div
500 mV/Div
500 mV/Div
200 mA/Div
200 mA/Div
VCON
IL
IOUT
VOUT
LMZ10500
www.ti.com
Typical Performance Characteristics (continued)
Unless otherwise specified the following conditions apply: VIN= 3.6V, TA= 25°C
Default evaluation board BOM with additional 1µH 1µF LC
VIN= 5.0V, V
Conducted EMI
OUT
= 1.8V, I
OUT
= 650mA
input filter Startup
Figure 8. Figure 9.
SNVS723C –OCTOBER 2011–REVISED MARCH 2013
Copyright © 2011–2013, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: LMZ10500
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
1.20
1.21
1.22
1.23
1.24
OUTPUT VOLTAGE (V)
LOAD CURRENT (A)
VIN = 2.7V
VIN = 3.3V
VIN = 3.6V
VIN = 5.0V
VIN = 5.5V
2.5 3.0 3.5 4.0 4.5 5.0 5.5
0.6
0.7
0.8
0.9
1.0
1.1
DC CURRENT LIMIT (A)
INPUT VOLTAGE (V)
TA= 85°C
10 mV/Div
500 MHz BW 1 µs/Div
COUT = 10 F 10V 0805 X5R
VOUT RIPPLE
30 mV/Div
250 MHz BW 500 µs/Div
COUT = 10 F 10V 0805 X5R
LOAD CURRENT
OUTPUT VOLTAGE
500 mA/Div
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
20
30
40
50
60
70
80
90
100
EFFICIENCY (%)
LOAD CURRENT (A)
VIN = 2.7V
VIN = 3.3V
VIN = 3.6V
VIN = 5.0V
VIN = 5.5V
FB
EN
V
REF
SGND
PGND
1.2V
V
OUT
V
IN
C
OUT
C
IN
V
OUT
V
CON
V
IN
C
VC
R
B
R
T
C
IN
C
OUT
C
VC
R
T
R
B
243 k: 1% 0603
63.4 k: 1% 0603
10 P)86.3V 0805 X7R or X5R
10 PF 86.3V 0805 X7R or X5R
470 pF 86.3V 0603 X7R or X5R
LMZ10500
SNVS723C –OCTOBER 2011–REVISED MARCH 2013
Schematic V
= 1.2V Efficiency V
OUT
Figure 10. Figure 11.
Output Ripple V
= 1.2V Load Transient V
OUT
1.2V
OUT
= 1.2V
OUT
www.ti.com
= 1.2V
Figure 12. Figure 13.
Line and Load Regulation V
8 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated
Figure 14. Figure 15.
= 1.2V DC Current Limit V
OUT
Product Folder Links: LMZ10500
OUT
= 1.2V
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
1.77
1.78
1.79
1.80
1.81
OUTPUT VOLTAGE (V)
LOAD CURRENT (A)
VIN = 2.7V
VIN = 3.3V
VIN = 3.6V
VIN = 5.0V
VIN = 5.5V
2.5 3.0 3.5 4.0 4.5 5.0 5.5
0.7
0.8
0.9
1.0
1.1
1.2
1.3
DC CURRENT LIMIT (A)
INPUT VOLTAGE (V)
TA= 85°C
30 mV/Div
250 MHz BW 500 µs/Div
COUT = 10 F 10V 0805 X5R
LOAD CURRENT
OUTPUT VOLTAGE
500mA/Div
10 mV/Div
500 MHz BW
1 µs/Div
COUT = 10 F 10V 0805 X5R
VOUT RIPPLE
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
20
30
40
50
60
70
80
90
100
EFFICIENCY (%)
LOAD CURRENT (A)
VIN = 2.7V
VIN = 3.3V
VIN = 3.6V
VIN = 5.0V
VIN = 5.5V
FB
EN
V
REF
SGND
PGND
1.8V
V
OUT
V
IN
C
OUT
C
IN
V
OUT
V
CON
V
IN
C
VC
R
B
R
T
C
IN
C
OUT
C
VC
R
T
R
B
187 k: 1% 0603
82.5 k: 1% 0603
10 P)86.3V 0805 X7R or X5R
10 PF 86.3V 0805 X7R or X5R
470 pF 86.3V 0603 X7R or X5R
LMZ10500
www.ti.com
SNVS723C –OCTOBER 2011–REVISED MARCH 2013
1.8V
Schematic V
Figure 16. Figure 17.
Output Ripple V
= 1.8V Efficiency V
OUT
= 1.8V Load Transient V
OUT
OUT
= 1.8V
OUT
= 1.8V
Figure 18. Figure 19.
Line and Load Regulation V
Copyright © 2011–2013, Texas Instruments Incorporated Submit Documentation Feedback 9
Figure 20. Figure 21.
= 1.8V DC Current Limit V
OUT
Product Folder Links: LMZ10500
OUT
= 1.8V
Loading...