LMV321 . . . 130 µA Typ
LMV358 . . . 210 µA Typ
LMV324 . . . 410 µA Typ
LMV324S . . . 410 µA Typ
D
Rail-to-Rail Output Swing
D
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 1000-V Charged-Device Model (C101)
description/ordering information
The LMV321, LMV358, and LMV324/LMV324S
are single, dual, and quad low-voltage (2.7 V to
5.5 V), operational amplifiers with rail-to-rail
output swing. The LMV324S is a variation of the
standard LMV324 that includes a power-saving
shutdown feature that reduces supply current to a
maximum of 5 µA per channel when the amplifiers
are not needed.
The LMV321, LMV358, LMV324, and LMV324S
are the most cost-effective solutions for
applications where low-voltage operation, space
saving, and low price are needed. These
amplifiers were designed specifically for
low-voltage (2.7 V to 5 V) operation, with
performance specifications meeting or exceeding
the venerable LM358 and LM324 devices that
operate from 5 V to 30 V . Additional features of the
LMV3xx devices are a common-mode input
voltage range that includes ground, 1-MHz
unity-gain bandwidth, and 1-V/µs slew rate.
The LMV321 is available in the ultra-small DCK
(SC-70) package, which is approximately
one-half the size of the DBV (SOT-23) package.
This package saves space on printed circuit
boards and enables the design of small portable
electronic devices. It also allows the designer to
place the device closer to the signal source to
reduce noise pickup and increase signal integrity .
LMV324 ...D OR PW PACKAGE
1OUT
V
2OUT
LMV324S ...D OR PW PACKAGE
1OUT
1IN–
1IN+
2IN+
2IN–
2OUT
1/2 SHDN
LMV358 .. . D, DGK, OR PW PACKAGE
1OUT
LMV321 . . . DBV OR DCK PACKAGE
1IN–
1IN+
CC+
2IN+
2IN–
V
CC
1IN–
1IN+
GND
1IN+
GND
IN–
(TOP VIEW)
1
14
2
13
3
12
4
11
5
10
6
7
(TOP VIEW)
1
2
3
4
5
6
7
8
(TOP VIEW)
1
2
3
4
(TOP VIEW)
1
2
3
9
8
16
15
14
13
12
11
10
8
7
6
5
9
5
4
4OUT
4IN–
4IN+
GND
3IN+
3IN–
3OUT
V
OUT
4OUT
4IN–
4IN+
GND
3IN+
3IN–
3OUT
3/4 SHDN
V
CC+
2OUT
2IN–
2IN+
CC+
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 2003, Texas Instruments Incorporated
1
LMV321 SINGLE, LMV358 DUAL, LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
PACKAGE
†
Reel of 3000LMV321IDCKR
Reel of 250LMV321IDCKT
Reel of 3000LMV321IDBVR
Reel of 250LMV321IDBVT
Tube of 75LMV358ID
Reel of 2500LMV358IDR
Tube of 150LMV358IPW
Reel of 2000LMV358IPWR
Tube of 50LMV324ID
Reel of 2500LMV324IDR
Tube of 40LMV324SID
Reel of 2500LMV324SIDR
ORDERABLE
PART NUMBER
LMV324IPWRMV324I
LMV324SIPWRMV324SI
TOP-SIDE
MARKING
_
_
‡
symbol (each amplifier)
IN–
IN+
–
OUT
+
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
V
Amplifi
(LMV324S)
‡
V
VILAmplifier turn-off voltage level (LMV324S)
V
LMV321 SINGLE, LMV358 DUAL, LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
Operating virtual junction temperature, T
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.
2. Differential voltages are at IN+ with respect to IN–.
3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
4. Maximum power dissipation is a function of TJ(max),
ambient temperature is PD = (TJ(max) – TA)/
5. The package thermal impedance is calculated in accordance with JESD 51-7.
LMV321 SINGLE, LMV358 DUAL, LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
SLOS263K – AUGUST 1999 – REVISED JUNE 2003
TYPICAL CHARACTERISTICS
10.000
1.000
0.100
THD – %
0.010
0.001
10.000
1.000
VCC = 2.7 V
RL = 10 kΩ
AV = 1
VO = 1 V
10
VCC = 5 V
RL = 10 kΩ
AV = 1
VO = 1 V
PP
100
PP
THD + N
vs
FREQUENCY
1000
Frequency – Hz
Figure 42
THD + N
vs
FREQUENCY
LMV3xx
LMV324S
10000100000
10.000
1.000
0.100
THD – %
0.010
0.001
10.000
1.000
VCC = 2.7 V
RL = 10 kΩ
AV = 10
VO = 1 V
10100
PP
VCC = 5 V
RL = 10 kΩ
AV = 10
VO = 2.5 V
THD + N
vs
FREQUENCY
100010000
Frequency – Hz
Figure 43
THD + N
vs
FREQUENCY
PP
LMV324S
LMV3xx
100000
LMV324S
18
THD – %
0.100
0.010
0.001
10
100
1000
Frequency – Hz
Figure 44
LMV324S
LMV3xx
10000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
100000
0.100
THD – %
0.010
0.001
10100
LMV3xx
100010000100000
Frequency – Hz
Figure 45
MECHANICAL DATA
MPDS018E – FEBRUARY 1996 – REVISED FEBRUARY 2002
DBV (R-PDSO-G5)PLASTIC SMALL-OUTLINE
0,95
1,45
0,95
3,00
2,80
45
31
0,05 MIN
5X
0,50
0,30
1,70
1,50
0,20
3,00
2,60
Seating Plane
M
0,15 NOM
Gage Plane
0,25
0°–8°
0,10
0,55
0,35
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC MO-178
4073253-4/G 01/02
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
MECHANICAL DATA
MPDS025C – FEBRUARY 1997 – REVISED FEBRUARY 2002
DCK (R-PDSO-G5)PLASTIC SMALL-OUTLINE P ACKAGE
0,65
1,10
0,80
13
2,15
1,85
45
0,10
0,00
0,30
0,15
1,40
1,10
0,10
2,40
1,80
Seating Plane
M
0,13 NOM
Gage Plane
0,15
0°–8°
0,10
0,46
0,26
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC MO-203
4093553-2/D 01/02
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
MECHANICAL DATA
MPDS028B – JUNE 1997 – REVISED SEPTEMBER 2001
DGK (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE
0,65
8
1
1,07 MAX
3,05
2,95
0,38
0,25
5
3,05
2,95
4
Seating Plane
0,15
0,05
0,08
4,98
4,78
M
0,10
0,15 NOM
Gage Plane
0°–6°
0,25
0,69
0,41
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC MO-187
4073329/C 08/01
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
MECHANICAL DATA
MSOI002B – JANUARY 1995 – REVISED SEPTEMBER 2001
D (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
8 PINS SHOWN
85
14
A
0.069 (1,75) MAX
0.020 (0,51)
0.014 (0,35)
0.157 (4,00)
0.150 (3,81)
0.010 (0,25)
0.004 (0,10)
0.244 (6,20)
0.228 (5,80)
0.010 (0,25)0.050 (1,27)
0.008 (0,20) NOM
Gage Plane
0.010 (0,25)
0°– 8°
0.044 (1,12)
0.016 (0,40)
Seating Plane
0.004 (0,10)
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-012
8
0.197
(5,00)
0.189
(4,80)
14
0.344
(8,75)
0.337
(8,55)
16
0.394
(10,00)
0.386
(9,80)
4040047/E 09/01
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
1,20 MAX
14
0,30
0,19
8
4,50
4,30
PINS **
7
Seating Plane
0,15
0,05
8
1
A
DIM
14
0,10
6,60
6,20
M
0,10
0,15 NOM
0°–8°
2016
Gage Plane
24
0,25
0,75
0,50
28
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty . Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty . Except where mandated by government requirements, testing of all
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Copyright 2003, Texas Instruments Incorporated
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