Texas Instruments LMH2832EVM-50, LP8731-Q1 User Manual

User's Guide

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LMH2832EVM-50 Evaluation Module

The LMH2832EVM-50 evaluation module (EVM) is used to evaluate the dual LMH2832, digitally-controlled variable gain amplifier (DVGA) in a 40-pin VQFN package. The EVM is used to easily demonstrate the functionality and performance of LMH2832 across all the gain settings in a 50-Ω input environment. The EVM is ready to connect to power supplies, signal source, USB, and test instruments through the use of onboard connectors. By default, the LMH2832EVM powers up to the 10-dB gain setting with the board supporting only single-supply operation. A USB connector on the EVM facilitates programming of the DVGA gain registers using an FTDI USB-to-SPI bus translator chip.

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Contents

1 Features....................................................................................................................... 2

2 EVM Specifications.......................................................................................................... 3

3 Evaluation Board Setup Block Diagram .................................................................................. 3

4 Setup Procedure............................................................................................................. 4

4.1 Connect EVM to a 5-V Bench Power Supply ................................................................... 4

4.2 Connect EVM to the External Signal Source at the Input ..................................................... 4

4.3 Connect EVM to the External Test Equipment at the Output................................................. 4

4.4 PD (Power Down) Input............................................................................................ 4

4.5 Connect EVM to the PC and LMH2832 EVM GUI Installation................................................ 5

5 Amplifier Device Register Configuration .................................................................................. 5

5.1 LMH2832 EVM GUI ................................................................................................ 6

5.2 Low Level View ..................................................................................................... 7

6 Evaluation Troubleshooting................................................................................................. 8

7 LMH2832 EVM Schematic, Layer Prints, and Bill of Materials ........................................................ 9

7.1 Schematic............................................................................................................ 9

7.2 Layer Prints ........................................................................................................ 11

7.3 Bill of Materials .................................................................................................... 19

1 LMH2832EVM Board........................................................................................................ 2

2 LMH2832 Evaluation Board Setup Block Diagram...................................................................... 3

3 LMH2832 EVM GUI Front Page ........................................................................................... 6

4 Low Level View Tab......................................................................................................... 7

5 Schematic - Analog.......................................................................................................... 9

6 Schematic - Digital ......................................................................................................... 10

7 Top Layer ................................................................................................................... 11

8 Layer 2 Ground Plane ..................................................................................................... 12

9 Layer 3 GND Plane ........................................................................................................ 13

10 Layer 4 GND Plane ........................................................................................................ 14

11 Layer 5 V+ Plane........................................................................................................... 15

12 Layer 6 Ground Plane ..................................................................................................... 16

13 Layer 7 GND Plane ........................................................................................................ 17

14 Bottom Layer................................................................................................................ 18

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List of Figures

List of Tables

LMH2832EVM-50 Evaluation Module

Features

1 EVM Specifications.......................................................................................................... 3

2 LMH2832 Default SPI Register Map ...................................................................................... 5

3 LMH2832 GUI Tab Descriptions........................................................................................... 6

4 Low Level View Controls ................................................................................................... 7

5 LMH2832EVM Bill of Materials........................................................................................... 19

1 Features

The key features of this EVM include:

• Configured for 5-V single-supply operation

• Designed for AC-coupled, single-ended, 50-Ω input, and output connection

• Interface to the inputs and outputs using SMA connectors

• USB connector and FTDI USB-to-SPI bus translator chip to successfully program the DVGA gain

registers

Figure 1 shows the LMH2832EVM board.

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LMH2832EVM-50 Evaluation Module

Figure 1. LMH2832EVM Board

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USB

½ LMH2832

5-V Bench

Power Supply

5 V GND

40 Q

SPI

LMH2832 EVM

Low-Noise

Signal Generator

Spectrum Analyzer

(V+)

Band-Pass

Filter

0.1 µF

ETC1-1-13T

(1:1, Zo = 50 Ÿ)

MABA011038

(1:3, Zo = 50 Ÿ)

0.1 µF

SMA

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2 EVM Specifications

Table 1 lists the EVM specifications.

Table 1. EVM Specifications

Parameter Value

Single-supply voltage range (V– = Ground) 4.5 V to 5.25 V

GND Ground reference pins Tied to GND or 0 V PDA

Power down (PD) input voltage GND to V

PDB I

Supply current with both channels enabled approximately 204 mA

Input voltage Vs±, Max

3 Evaluation Board Setup Block Diagram

The following sections help in setting up the LMH2832 evaluation board hardware and software required to program the internal registers of the LMH2832.

Figure 2 illustrates the LMH2832 evaluation board setup block diagram.

EVM Specifications

Figure 2. LMH2832 Evaluation Board Setup Block Diagram

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Setup Procedure

4 Setup Procedure

This section describes the hardware setup procedure and the installation of the software to program the LMH2832 registers.

4.1 Connect EVM to a 5-V Bench Power Supply

1. Before making connections from the bench power supply to the evaluation board supply pin connector,

set the bench power supply to 5 V, and switch the bench power supply OFF.

2. While the supplies are turned OFF, connect the evaluation board power supply pins (V+ and GND) to

the bench power supply of 5 V and GND, as shown in Figure 2, using a low-noise bench power supply.

3. Turn ON the bench supplies after the power supply connections have been made. The LMH2832

evaluation board should read an approximate DC current of 204 mA for 5-V single supply with both the LMH2832 channels enabled. Input and output pins should be biased to the mid-supplies as specified in the LMH2832 data sheet (SBOS709) for proper operation.

4.2 Connect EVM to the External Signal Source at the Input

1. The LMH2832EVM-50 evaluation board provides the customer flexibility in testing at different input

frequencies using on-board input and output baluns as shown in Figure 2.

2. It is recommended to use 6-dB attenuator pads at the input while connecting a 50-Ω signal source to

the LMH2832EVM-50 evaluation board SMA inputs.

3. TI recommends using a low pass or band pass filter in-between the signal source and the evaluation

board while measuring the harmonic distortion or inter-modulation distortion products.

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4.3 Connect EVM to the External Test Equipment at the Output

1. The LMH2832EVM-50 evaluation board has SMA connectors at the output and can be directly

connected to 50-Ω test equipment as shown in Figure 2.

2. While connecting the evaluation board output to an oscilloscope, make sure the oscilloscope is set in a

50-Ω termination for the correct voltage reading on the oscilloscope.

4.4 PD (Power Down) Input

1. The LMH2832EVM has jumpers (J6 and J8) that allow the individual channels of the amplifier to be

manually disabled. The LMH2832 EVM consumes less than 9 mA of supply current with both the LMH2832 channels disabled.

2. The PDA and PDB SMA input connector facilitates driving the LMH2832 PDA and PDB pins with a

high-speed signal source. Note that the PD SMA input connector should to be terminated on-board with 50 Ω to GND (R11 and R12) so as to provide high-frequency termination for signals from a 50-Ω pulse generator.

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4.5 Connect EVM to the PC and LMH2832 EVM GUI Installation

The LMH2832 EVM GUI is used to control the LMH2832 EVM. It must be used to properly configure the LMH2832 device.

1. Download the LMH2832 EVM GUI (SLOC338) from the TI website.

2. Extract the files from the zip file.

3. Run setup.exe and follow the installation prompts.

4. Connect the LMH2832EVM to the PC using a mini-USB cable.

5. Open the LMH2832 EVM GUI by going to Start Menu → All Programs → Texas Instruments →

LMH2832 EVM GUI.

6. Verify that the green USB Status indicator is lit in the top right corner of the GUI. If it is not lit, click the

Reconnect USB button and check the USB Status indicator again. If it is still not lit, then verify the EVM is connected to the computer through the included mini-USB cable.

7. Follow the instructions in Section 5: Amplifier Device Register Configuration to correctly use the GUI to

program the LMH2832 device registers.

8. The DVGA register address and configuration values are found in the LMH2832 device data sheet

(SBOS709).

5 Amplifier Device Register Configuration

The LMH2832 channels are programmable via the serial programming interface (SPI) bus accessible through the FTDI USB-to-SPI converter chip located on the EVM. A GUI is provided to write instructions on the bus and program the registers of the LMH2832.

The LMH2832 individual channel gain can be controlled from –9 dB to 30 dB in 1-dB steps using register address 5h and 7h for channels A and B, respectively. The amplifier is programmed to the maximum gain (30 dB) when a value 0h is written to the gain control registers 5h and 7h, whereas a value 27h written to the gain control registers programs the device to the minimum gain (–9 dB) setting. Table 2 shows the default LMH2832 SPI register map on power up. For more information about the registers in the LMH2832, see the LMH2832 data sheet (SBOS709).

Setup Procedure

Table 2. LMH2832 Default SPI Register Map

Address (A[6:0], Hex) R/W Register Default

0 R Revision ID B3h 1 R Product ID 23h 2 R/W Software Reset 00h 3 R/W Power-down 00h 4 R/W Channel A Bias Control 20h 5 R/W Channel A Gain Control 14h 6 R/W Channel B Bias Control 20h 7 R/W Channel B Gain Control 14h

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Amplifier Device Register Configuration

5.1 LMH2832 EVM GUI

The software GUI allows for full register programming control of the LMH2832. Figure 3 shows the front page of the LMH2832 EVM GUI as it should be seen upon opening the GUI. Descriptions for each of the tabs of the GUI are shown in Table 3.

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Tab Description

High Level View

Low Level View

LMH2832EVM-50 Evaluation Module

Enables control of the LMH2832 features. None of these controls need to be touched for basic operation. Instead, use the Low Level View tab to load configuration files.

Allows write and read access to all device registers. Also allows loading and saving of configuration files. The device configurations can be saved from this tab for use in the user’s system. See Figure 4 for more information.

Figure 3. LMH2832 EVM GUI Front Page

Table 3. LMH2832 GUI Tab Descriptions

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Descriptions

Generic

Read/Write

Configuration buttons

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5.2 Low Level View

The Low Level View tab, shown in Figure 4, allows configuration of the devices at the bit and field level. At any time, the controls described in Table 4 may be used to configure or read from the device.

Amplifier Device Register Configuration

Control Description

Write Register button Read Register button Read from the register highlighted in the Register Map and display the results in the Value column. Read All button Load Config button Load a configuration file from disk and write the registers in the file.

Save Config button Save a configuration file to disk that contains the current register configuration. Register Data Cluster Manipulate individual accessible bits of the register highlighted in the Register Map. Generic Read/Write

Displays the devices on the EVM, registers for those devices, and the states of the registers:

• Selecting a register field allows bit manipulation in the Register Data section.

• The Value column shows the value of the register at the time the GUI was last updated due to a

Write to the register highlighted in the Register Map with the value in the Write Data field. This button must be clicked after changing bits in the register data section.

Read from all registers in the Register Map and display the current state of hardware. Also updates the controls in the other tabs.

Perform a generic read or write command to the device shown in the Block drop-down box using the Address and Write Data information.

read or write event.

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Figure 4. Low Level View Tab

Table 4. Low Level View Controls

LMH2832EVM-50 Evaluation Module

Evaluation Troubleshooting

6 Evaluation Troubleshooting

Issue Troubleshoot

Problem reading or writing the LMH2832 device using the LMH2832 EVM GUI:

Low supply current: See if one of the device channels is disabled by the PDA or

No supply current: See if the power supply cable connections are connected

High supply current: The reverse supply protection diodes may be conducting.

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Verify that the green USB Status indicator is lit in the top right corner of the GUI. If it is not lit, click the Reconnect USB button and check the USB Status indicator again. If it is still not lit, then verify the EVM is connected to the computer through the included mini-USB cable.

Check to see whether the connectors to power supply pins of the LMH2832 EVM are connected properly and turned ON. The nominal supply current for the LMH2832EVM for 5-V supply is approx 204-mA with both the channels enabled.

PDB jumper. Also, check to see if the power supply is set to the right voltage.

and the power switch of the source is turned ON.

Turn off the power switch and make sure the positive supply is connected to the proper pin. Turn the power back on to see if the correct supply current is recorded.

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GND

234

INA+

GND

234

INA-

DNP

PDA

1000pF

C32

1000pF

C34

1000pF

C33

1000pF

C35

PDA

GND GND

+VA

GND

+VB

GND

+VA

GND

+VA

GND

+VB

GND

+VB

GND

+VA

GND

+VB

GND

0603

C11

DNP

0603

C13

DNP

0603

C14

DNP

0402

C41

DNP

0402

C43

DNP

0402

C45

DNP

0402

C47

DNP

0402

C42

DNP

0402

C44

DNP

0402

C46

DNP

0402

C48

DNP

0603

R33

DNP

0603

R34

DNP

0603

DNP

0603

R13

DNP

0603

R30

DNP

0603

R29

DNP

0603

R31

DNP

0.01µF 0603

0.01µF

0603

DNP

0 0603

GND

49.9

0603

R12

DNP

GND

0.01µF 0603

49.9 0603

R37

DNP 49.9

0603

R38

DNP

49.9 0603

R39

DNP 49.9

0603

R40

DNP

0 0603

R16

0 0603

R14

0603

R15

0603

R18

0 0603

R27

40.2 0603

3 2

ETC1-1-13TR

3 2

ETC1-1-13TR

MABA-011038

VCC

INMA

INMB

SCLK

SDI

SDO

INPB

PDB

PDA

INPA

OUTPB

OUTMB

OUTMA

OUTPA

GND

LMH2832IRHAR

GND

+VA+VB

1000pF 0402

C17

0.01µF 0402

C16

+VA

GND

+VA

GND

1000pF 0402

C28

0.01µF 0402

C29

+VA

GND

+VA

GND

1000pF 0402

C21

0.01µF 0402

C20

+VA

GND

+VA

GND

1000pF 0402

C25

0.01µF 0402

C24

+VA

GND

+VA

GND

1000pF 0402

C18

0.01µF 0402

C19

GND GND

+VB +VB

1000pF 0402

C22

0.01µF 0402

C23

GND GND

+VB +VB

1000pF 0402

C26

0.01µF 0402

C27

GND GND

+VB +VB

1000pF 0402

C30

0.01µF 0402

C31

GND GND

+VB +VB

0603

R32

DNP

0 0603

DNP

0 0603

0.01µF 0603

0.01µF

0603

DNP

49.9

0603

R11

DNP

GND

SCS

SCLK

SDO

SDI

SCLK

ADC_SDI

ADC_SDO

SCS

0 0603

R28

PDB

+VB

GND

40.2 0603

R10

0.01µF 0603

C10

0.01µF 0603

0603

C12

DNP

0603

R35

DNP

0603

R36

DNP

0603

R17

DNP

234

INB+

234

INB-

DNP

234

PDA

234

PDB

234

OUTA+

234

J10

OUTA-

DNP

234

J11

OUTB+

234

J12

OUTB-

DNP

SH-J6_1-OPEN SH-J8_1-OPEN

GND

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LMH2832 EVM Schematic, Layer Prints, and Bill of Materials

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7 LMH2832 EVM Schematic, Layer Prints, and Bill of Materials

This section contains the EVM schematic, PCB layouts, and the bill of materials (BOM).

7.1 Schematic

Figure 5 and Figure 6 illustrate the LMH2832EVM schematic

Figure 5. Schematic - Analog

1902C

FID2

DNP

FID1

DNP

FID3

DNP

10µF

C15

GND

TP2 TP3

GND GND

+VA +VB

HSP010 A

PCB Number:

PCB Rev:

VCCIO

GND

PWREN#

RD#

USBDP

USBDM

3V3OUT

GND

RESET#

VCC

GND

TXE#

RXF

AGND

TEST

OSCI

OSCO

FT245RL

1 2 3 4 5

J13 USB

47pF

C36

47pF

C37

0.1µF

C38

R20

IN6OUT

GND

DAP

U3 LP5900SD-1.8/NOPB

0.01µF

C39

10µF 16V

C40

R19

10µF 16V

C49

0.1µF

0.01µF

10.0k

R21

22.1R23

22.1

R24

22.1

R25

22.1

R26

SCLK

SDI

SDO

SCS

ADC_SDO

ADC_SDI

SCLK

GND2GND

330 ohm

GND2

GND2GND2

GND2

GND2GND2GND2

GND2 GND2

10.0k

R22

40V

D1 10BQ040TRPBF

TP1

V+

LOGO

PCB

Texas Instruments

NY PMS 440 0025 PHH2NY PMS 440 0025 PH

NY PMS 440 0025 PHH4NY PMS 440 0025 PH

NFM41PC204F1H3L

Assembly Note

ZZ2

These assemblies are ESD sensitive, ESD precautions shall be observed.

Assembly Note

ZZ3

These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.

Assembly Note

ZZ4

These assemblies must comply with workmanship standards IPC-A-610 Class 2., unless otherwise specified.

LOGO

PCB

Pb-Free Symbol

LOGO

PCB

FCC disclaimer

Label Assembly Note

ZZ1

This Assembly Note is for PC B labels only

PCB Label

LBL1

Size: 0.65" x 0.20 "

Label Table

Variant Label Text

001 LMH2832EVM-50

002 ChangeMe!

LMH2832 EVM Schematic, Layer Prints, and Bill of Materials

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Figure 6. Schematic - Digital

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7.2 Layer Prints

Figure 7 through Figure 14 illustrate the LMH2832EVM layer prints.

LMH2832 EVM Schematic, Layer Prints, and Bill of Materials

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Figure 7. Top Layer

LMH2832EVM-50 Evaluation Module

LMH2832 EVM Schematic, Layer Prints, and Bill of Materials

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LMH2832EVM-50 Evaluation Module

Figure 8. Layer 2 Ground Plane

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LMH2832 EVM Schematic, Layer Prints, and Bill of Materials

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Figure 9. Layer 3 GND Plane

LMH2832EVM-50 Evaluation Module

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LMH2832EVM-50 Evaluation Module

Figure 10. Layer 4 GND Plane

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LMH2832 EVM Schematic, Layer Prints, and Bill of Materials

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Figure 11. Layer 5 V+ Plane

LMH2832EVM-50 Evaluation Module

LMH2832 EVM Schematic, Layer Prints, and Bill of Materials

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Figure 12. Layer 6 Ground Plane

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Figure 13. Layer 7 GND Plane

LMH2832EVM-50 Evaluation Module

LMH2832 EVM Schematic, Layer Prints, and Bill of Materials

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LMH2832EVM-50 Evaluation Module

Figure 14. Bottom Layer

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7.3 Bill of Materials

Table 5 lists the EVM bill of materials.

Table 5. LMH2832EVM Bill of Materials

Designator Qty Value Description PackageReference PartNumber Manufacturer Alternate Part

Number

Alternate Manufacturer

!PCB 1 Printed Circuit Board HSP010 Any - C2, C3, C7, C8, C9,

C10

6 0.01uF CAP, CERM, 0.01uF, 25V, +/-5%, C0G/NP0, 0603 0603 C1608C0G1E103J TDK

C5, C38 2 0.1uF CAP, CERM, 0.1uF, 10V, +/-10%, X5R, 0402 0402 C1005X5R1A104K TDK - C6, C39 2 0.01uF CAP, CERM, 0.01uF, 16V, +/-10%, X7R, 0402 0402 C1005X7R1C103K TDK C15 1 10uF CAP, TANT, 10uF, 10V, +/-10%, 0.9 ohm, 3216-18 SMD 3216-18 TPSA106K010R0900 AVX C16, C19, C20, C23,

C24, C27, C29, C31

8 0.01uF CAP, CERM, 0.01uF, 25V, +/-10%, X7R, 0402 0402 C1005X7R1E103K TDK

C17, C18, C21, C22, C25, C26, C28, C30

8 1000pF CAP, CERM, 1000pF, 25V, +/-5%, C0G/NP0, 0402 0402 C1005C0G1E102J TDK

C32, C33, C34, C35 4 1000pF CAP, CERM, 1000pF, 50V, +/-10%, X7R, 0603 0603 C0603C102K5RACTU Kemet C36, C37 2 47pF CAP, CERM, 47 pF, 50 V, +/- 5%, C0G/NP0, 0402 0402 GRM1555C1H470JA01D MuRata C40, C49 2 10uF CAP, CERM, 10uF, 16V, +/-10%, X5R, 0805 0805 EMK212BJ106KG-T Taiyo Yuden D1 1 40V Diode, Schottky, 40V, 1A, SMB SMB 10BQ040TRPBF International Rectifier H1, H2, H3, H4 4 Machine Screw, Round, #4-40 x 1/4, Nylon, Philips panhead Screw NY PMS 440 0025 PH B&F Fastener Supply H5, H6, H7, H8 4 Standoff, Hex, 0.5"L #4-40 Nylon Standoff 1902C Keystone - J1, J3, J5, J7, J9, J11 6 Connector, SMT, End launch SMA 50 ohm SMA End Launch 142-0701-851 Emerson Network Power - J6, J8 2 Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator TSW-102-07-G-S TSW-102-07-G-S Samtec, Inc. - J13 1 MINI USB 2.0 SMT TYPE AB 5 CONTACTS R/A, SMD 9.2x9.9x4 mm 651305142821 Wurth Elektronik eiSos L1 1 330 ohm 1.5A Ferrite Bead, 330 ohm @ 100MHz, SMD 0603 BLM18SG331TN1D MuRata LBL1 1 Thermal Transfer Printable Labels, 0.650" W x 0.200" H - 10,000 per roll PCB Label 0.650"H

x 0.200"W

THT-14-423-10 Brady - -

R1, R4, R5, R6, R14, R15, R16, R18, R19, R20, R27, R28

12 0 RES, 0 ohm, 5%, 0.1W, 0603 0603 CRCW06030000Z0EA Vishay-Dale

R7, R8, R9, R10 4 40.2 RES, 40.2, 1%, 0.1 W, 0603 0603 CRCW060340R2FKEA Vishay-Dale R21, R22 2 10.0k RES, 10.0k ohm, 1%, 0.063W, 0402 0402 CRCW040210K0FKED Vishay-Dale R23, R24, R25, R26 4 22.1 RES, 22.1 ohm, 1%, 0.063W, 0402 0402 CRCW040222R1FKED Vishay-Dale SH-J6_1-OPEN, SH-

J8_1-OPEN

2 1x2 Shunt, 100mil, Gold plated, Black 382811-6 AMP

T1, T2 2 Transformer, SMT 4.26x3.8mm MABA-011038 MACOM T3, T4 2 Transformer, SMT 3.94x3.83mm ETC1-1-13TR MACOM TP1 1 Red Test Point, TH, Multipurpose, Red 5010 Keystone Electronics TP2, TP3 2 Black Test Point, TH, Multipurpose, Black 5011 Keystone Electronics U1 1 Fully-Differential, Dual DVGA, DOCSIS 3.x Return Path ADC Driver,

RHA0040A

RHA0040A LMH2832IRHAR Texas Instruments LMH2832IRHAT Texas Instruments

U2 1 USB FIFO IC, 28SSOP SSOP28 FT245RL FTDI U3 1 Ultra Low Noise, 150mA Linear Regulator for RF/Analog Circuits Requires No

Bypass Capacitor, 6-pin LLP, Pb-Free

SDB06A LP5900SD-1.8/NOPB Texas Instruments

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Table 5. LMH2832EVM Bill of Materials (continued)

Designator Qty Value Description PackageReference PartNumber Manufacturer Alternate Part

Number

Alternate Manufacturer

Z1, Z2 2 0.2uF Filter, LC, 0.2uF, 1806, SMT 1806 NFM41PC204F1H3L MuRata C1, C4 0 0.01uF CAP, CERM, 0.01uF, 25V, +/-5%, C0G/NP0, 0603 0603 C1608C0G1E103J TDK C11, C12, C13, C14 0 CAP, CERM, xxxF, xxV, [TempCo], xx%, [PackageReference] 0603 Used in BOM report Used in BOM report - C41, C42, C43, C44,

C45, C46, C47, C48

0 CAP, CERM, xxxF, xxV, [TempCo], xx%, [PackageReference] 0402 Used in BOM report Used in BOM report - -

FID1, FID2, FID3 0 Fiducial mark. There is nothing to buy or mount. Fiducial N/A N/A J2, J4, J10, J12 0 Connector, SMT, End launch SMA 50 ohm SMA End Launch 142-0701-851 Emerson Network Power - R2, R13, R17, R29,

R30, R31, R32, R33, R34, R35, R36

0 RES, xxx ohm, x%, xW, [PackageReference] 0603 Used in BOM report Used in BOM report - -

R3 0 0 RES, 0 ohm, 5%, 0.1W, 0603 0603 CRCW06030000Z0EA Vishay-Dale R11, R12, R37, R38,

R39, R40

0 49.9 RES, 49.9 ohm, 1%, 0.1W, 0603 0603 CRCW060349R9FKEA Vishay-Dale

Notes: Unless otherwise noted in the Alternate PartNumber and/or Alternate Manufacturer columns, all parts may be substituted with equivalents.

STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES

1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions.

1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software

1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system.

2 Limited Warranty and Related Remedies/Disclaimers:

2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement.

2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as mandated by government requirements. TI does not test all parameters of each EVM.

2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period.

3 Regulatory Notices:

3.1 United States

3.1.1 Notice applicable to EVMs not FCC-Approved:

This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.

3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTION

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.

FCC Interference Statement for Class A EVM devices

NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.

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FCC Interference Statement for Class B EVM devices

NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada

3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210

Concerning EVMs Including Radio Transmitters:

This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

Concernant les EVMs avec appareils radio:

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concerning EVMs Including Detachable Antennas:

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Concernant les EVMs avec antennes détachables

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur

3.3 Japan

3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に

輸入される評価用キット、ボードについては、次のところをご覧ください。

http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan.

If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs:

1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan,

2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or

3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】開発キットの中には技術基準適合証明を受けていないものがあります。技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。

1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。

2. 実験局の免許を取得後ご使用いただく。

3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。

上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。日本テキサス・インスツルメンツ株式会社東京都新宿区西新宿６丁目２４番１号西新宿三井ビル

3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ

い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

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4 EVM Use Restrictions and Warnings:

4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.

4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages.

4.3 Safety-Related Warnings and Restrictions:

4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm.

4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees.

4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements.

5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free.

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6. Disclaimers:

6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.

6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF THE EVM.

7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

8. Limitations on Damages and Liability:

8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.

8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

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IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

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Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Texas Instruments LMH2832EVM-50, LP8731-Q1 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual