Texas Instruments HPL-D SLLU064A User Manual

4x4 Crosspoint Switch EVM

User's G uide

User's Guide

January 2004 HPL-D

SLLU064A

IMPORTANT NOTICE

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Copyright  2003 - 2004, Texas Instruments Incorporated

Applications

EVM IMPORTANT NOTICE

Texas Instruments (TI) provides the enclosed product(s) under the following conditions:

This evaluation kit being sold by TI is intended for use for ENGINEERING DEVELOPMENT OR
EVALUATION PURPOSES ONLY and is not considered by TI to be fit for commercial use. As such, the
goods being provided may not be complete in terms of required design–, marketing–, and/or manufacturing–
related protective considerations, including product safety measures typically found in the end product
incorporating the goods. As a prototype, this product does not fall within the scope of the European Union
directive on electromagnetic compatibility and therefore may not meet the technical requirements of the
directive.

Should this evaluation kit not meet the specifications indicated in the EVM User’s Guide, the kit may be
returned within 30 days from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE
EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES,
EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR
FITNESS FOR ANY PARTICULAR PURPOSE.

The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user
indemnifies TI from all claims arising from the handling or use of the goods. Please be aware that the
products received may not be regulatory compliant or agency certified (FCC, UL, CE, etc.). Due to the open
construction of the product, it is the user’s responsibility to take any and all appropriate precautions with
regard to electrostatic discharge.

EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE
LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL
DAMAGES.

TI currently deals with a variety of customers for products, and therefore our arrangement with the user is
not exclusive.

TI assumes no liability for applications assistance, customer product design, software performance,
or infringement of patents or services described herein.

Please read the EVM User’s Guide and, specifically, the EVM Warnings and Restrictions notice in the EVM
User’s Guide prior to handling the product. This notice contains important safety information about
temperatures and voltages. For further safety concerns, please contact the TI application engineer.

Persons handling the product must have electronics training and observe good laboratory practice standards.

No license is granted under any patent right or other intellectual property right of TI covering or relating to any
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Mailing Address:

Texas Instruments
Post Office Box 655303
Dallas, Texas 75265

Copyright  2003 - 2004, Texas Instruments Incorporated

www.ti.com

3

EVM WARNINGS AND RESTRICTIONS

It is important to operate this EVM within the input voltage range of -0.7 V to 4 V and the output voltage range
of -0.5 V to 4 V.

Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the
EVM. If there are questions concerning the input range, please contact a TI field representative prior to
connecting the input power.

Applying loads outside of the specified output range may result in unintended operation and/or possible
permanent damage to the EVM. Please consult the EVM User’s Guide prior to connecting any load to the
EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.

During normal operation, some circuit components may have case temperatures greater than 60°C. The
EVM is designed to operate properly with certain components above 60°C as long as the input and output
ranges are maintained. These components include but are not limited to linear regulators, switching
transistors, pass transistors, and current sense resistors. These types of devices can be identified using the
EVM schematic located in the EVM User’s Guide. When placing measurement probes near these devices
during operation, please be aware that these devices may be very warm to the touch.

Mailing Address:

Texas Instruments
Post Office Box 655303
Dallas, Texas 75265

Copyright  2003 - 2004, Texas Instruments Incorporated

About This Manual

This evaluation module (EVM) user’s guide describes the hardware, theory
of operation, and use
performance and functionality of either the SN65LVDS125A or
SN65LVDS250 4x4 crosspoint switches.

How to Use This Manual

Read This First

of

the EVM for evaluating the high-speed

Preface

Chapter 1 provides an overview of the functional configurations and signal
paths. Typical hardware setup and results are discussed in Chapter 2.
Chapter 3 provides schematics, the board layout, the board layers,
fabrication notes, and bill of materials

Related Documentation from Texas Instruments

SN65LVDS125A, 4x4 1.5 Gbps LVDS Crosspoint Switch Data Sheet
(SLLS595).

SN65LVDS250, 4x4 2.5 Gbps LVDS Crosspoint Switch Data Sheet
(SLLS594).

If You Need Assistance

www.ti.com

E-mail technical support http://www-

k.ext.ti.com/sc/technical_support/email_tech_support.asp

Product Information Centers:

Americas [phone]
Australia 1-800-999-084
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France [phone]
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Hong Kong 800-96-5941
Indonesia 001-803-8861-1006
Israel (English) 1800 949 0107 (free phone)
Italy 800 79 11 37 (free phone)
Japan 0120-81-0036

iii

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Singapore 800-886-1028
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United Kingdom [phone]

FCC Warning

This equipment is intended for use in a laboratory test environment only. It
generates, uses, and can radiate radio frequency energy and has not been
tested for compliance with the limits of computing devices pursuant to
subpart J of part 15 of FCC rules, which are designed to provide
reasonable protection against radio frequency interference. Operation of
this equipment in other environments may cause interference with radio
communications, in which case the user at his expense will be required to
take whatever measures may be required to correct this interference.

If your book does not discuss a product that creates radio frequency
interference, delete this section from your preface. If your book does
discuss a product that creates radio frequency interference, you must
include this warning as it appears above.

iv

Contents

Read This First ................................................................................................................iii

About This Manual..................................................................................................... iii

How to Use This Manual ........................................................................................... iii

Related Documentation from Texas Instruments ....................................................... iii

If You Need Assistance ............................................................................................. iii

FCC Warning............................................................................................................. iv

Contents ...........................................................................................................................v

Figures.............................................................................................................................. v

Tables .............................................................................................................................. vi

1 Overview ....................................................................................................................1-1

1.1 Sample Functional Configurations ...................................................................1-2

1.2 Signal Paths ....................................................................................................1-4

2 Setup and Required Equipment ...............................................................................2-1

2.1 Applying an Input.............................................................................................2-1

2.2 Observing an Output........................................................................................2-4

2.3 Typical Test Results ........................................................................................2-4

3 EVM Construction.....................................................................................................3-1

3.1 Schematic........................................................................................................3-2

3.2 Board Layout Patterns.....................................................................................3-3

3.3 PCB Fabrication Requirements and Stack Up .................................................3-8

3.4 Bill of Materials ................................................................................................3-9

Figures

Figure 1-1. Sample Functional Configurations of the 4x4 Crosspoint Switch..........1-2

Figure 1-2. 4x4 Crosspoint Switch EVM ......................................................................1-3

Figure 1-3. 4x4 Crosspoint Switch Signal Paths .........................................................1-4

Figure 2-1. EVM Power Connections for Either SN65LVDS125A or SN65LVDS250

Evaluation..............................................................................................................2-2

Figure 2-2. Termination for Interfacing LVDS, CML, or LVPECL Drivers ..................2-3

Figure 2-3. Typical Test Results...................................................................................2-5

Figure 3-1. 4x4 Crosspoint Switch EVM Schematic....................................................3-2

Figure 3-2. 4x4 Crosspoint Switch EVM Board Layout...............................................3-3

Figure 3-3. Layer 1–Signal Plane .................................................................................3-4

Figure 3-4. GND Plane...................................................................................................3-5

Figure 3-5. Layer 3–Vcc ................................................................................................3-5

v

Tables

Figure 3-6. Layer 4–Vcc01 Plane..................................................................................3-6

Figure 3-7. Layer 5–GND Plane ....................................................................................3-6

Figure 3-8. Layer 6–GND/Signal Plane.........................................................................3-7

Tables

Table 2-1 Crosspoint Function Table...........................................................................2-3

Table 3-2. Bill of Materials for the SN65LVDS125A / SN65LVDS250..........................3-9

vi

Chapter 1

1 Overview

This chapter provides a high-level description of the 4x4 crosspoint switch
EVM mounted with either a SN65LVDS125A, 4x4 1.5-Gbps or a
SN65LVDS250, 4x4 2.5-Gbps crosspoint switch.

Topic Page

1.1 Sample Functional Configurations 1-2

1.2 Signal Paths 1-4

1-1

1 Overview

1.1 Sample Functional Configurations

The 4x4 crosspoint switch is a fully non-blocking switch that provides
flexibility in switch configuration for the desired application.

A sample of various functions for which the EVMs can be configured is
shown in Figure 1-1.

Configuration Exa mples

S10 S11 S20 S21

0001

S30 S31 S40 S41

1011 0000

1A

1B

2A

2B

3A

3B

4A

4B

S10 S11 S20 S21

00

S30 S31 S40 S41

10

1A

1B

3A

3B

0

1

0

0

1Y

1Z

2Y

2Z

3Y

3Z

4Y

4Z

1Y

1Z

2Y

2Z

3Y

3Z

4Y

4Z

S10 S11 S20 S21

00

S30 S31 S40 S41

1A

1B

S10 S11 S20 S21

11

S30 S31 S40 S41

00

1A

1B

4A

4B

0

0

1Y

1Z

2Y

2Z

3Y

3Z

4Y

4Z

1

0

1

0

1Y

1Z

2Y

2Z

3Y

3Z

4Y

4Z

Figure 1-1. Sample Functional Configurations of the 4x4 Crosspoint Switch

1-2

1 Overview

Figure 1-2 shows the 4x4 crosspoint switch EVM (part number
SN65LVDS125A or SN65LVDS250). The EVM comes with either the
SN65LVDS125A or SN65LVDS250 installed and a copy of the data sheet.
The latest version of the data sheet is also available from www.ti.com

.

A/W # 6456526

Figure 1-2. 4x4 Crosspoint Switch EVM

SN65LVDS125A
SN65LVDS250

4X4 Crosspoint Switch EVM

1-3

1 Overview

1.2 Signal Paths

The signal paths on this EVM (see Figure 1-3) include:

❏❏❏❏ Sixteen edge-launch SMA connectors (J1–J16) for high-speed data transmission

❏❏❏❏ Eight jumpers (W1– W8) for active switch logic control

❏❏❏❏ Four jumpers (W9–W12) for enabling and disabling the outputs

❏❏❏❏ Three banana jacks (J17, J18, J19) for power and ground connections. Banana jack J20 is

used for non-LVDS type configurations.

J14 J13

VCC

J15

1DE

W12

J16

J18 J20

J1

VCC

S10

W3

VCC VCC

S20

J2

VCC

4DE

J6J5

W10

J11

VCC

J10

3DE

J9

W9

VCC

S41

J8

W6W5

VCC

J7

J12

VCC
2DE

W11

VTERMGND

W2W1

VCC

S11

W4

S21

J19

VCC01

U1

1

W7 W8

VCC

J17

VCC

J4J3

`

S40

VCC

S30 S31

Figure 1-3. 4x4 Crosspoint Switch Signal Paths

1-4

Chapter 2

2 Setup and Required Equipment

Both the SN65LVDS125A and the SN65LVDS250 LVDS driver output
characteristics are compliant with the requirements of the TIA/EIA-644
standard. LVDS drivers nominally provide a 350-mV differential signal, with
a 1.2-V offset from ground. These levels are attained when driving a 100-Ω
differential line-termination test load. This requirement includes the effects
of up to 32 standard receivers with their ground references offset up to ±1 V
from that of the driver. This common-mode loading limitation of LVDS
drivers affects how the driver’s characteristics are observed with this EVM,
and the test setup that follows in this manual.

By using three power jacks (J17, J18, and J19) and by optionally installing
termination resistors, different methods of probing can be used to evaluate
the device output characteristics. The typical setup for the 4x4 crosspoint
switch EVM is shown in Figure 2-1.

2.1 Applying an Input

While the use of a split power plane allows the EVM to be terminated within
the oscilloscope, offsetting the EVM ground requires the inputs to the
device to also be offset. Figure 2-1 shows how to offset the EVM and the
inputs to the device. Setting power supply 1 to 3.3 V and power supply 2 to

1.2 V causes the voltage swing of the LVDS outputs to be within the limits
of -200 mV to 200 mV instead of the typical 1 V to 1.4 V. This requires the
inputs of the 4x4 crosspoint switch EVM to also be offset by 1.2 V, resulting
in a voltage swing of -200 mV to 200 mV. VTERM, banana jack J20, is
provided for non-LVDS input terminations such as LVPECL, which requires
a termination voltage. When applying an LVDS input, VTERM can be left
open or connected to GND, which is the common-mode voltage when using
the aforementioned –200-mV to 200-mV input swing.

2-1

2 Setup and Required Equipment

DATA, DATA

Amplitude: 400 mV

Offset: 0.0 V

+

Power Supply #1

3.3V

-

+

Power Supply #2

1.2V

-

Ampl itude: 400 m V

DA TA , DA TA

Offset: 0.0 V

SCOPE

(internally

terminated

50 to GND)

ΩΩΩΩ

J2

J1

GND

S20

J3

GND

S21

J4

`

VCC

GND

VCC VC C

S10 S1 1

W2W1

W4W3

GND

VCC

VCC

J17

J16

J18

VTE RMGND

J20

U1

1

VCC0 1

J15

VCC

1DE

GND

J14 J13

W12

W11

GND

2DE

VCC

J19

J12

VCC

GND

3D E

W10

J11

J10

DATA, DATA

Amplitude: 400 mV

Offset: 0.0 V

GND

S30 S31

J6J5

GND

J7

VCC

VCC

S40

W7 W8

W6W5

GNDGND

VCC

S41

VCC

J8

Offset: 0.0 V

DATA, DAT A

4DE

VCC

GND

W9

J9

Ampl itude: 400 mV

Figure 2-1. EVM Power Connections for Either SN65LVDS125A or SN65LVDS250
Evaluation.

Many possible configurations for the 4x4 crosspoint switches are made
available. Table 2-1 provides a description of the different functions and
the required selector settings.

2-2

2 Setup and Required Equipment

Table 2-1 Crosspoint Function Table

Output Channel 1 Output Channel 2 Output Channel 3 Output Channel 4
Control

Pins

S10 S11 1Y/1Z S20 S21 2Y/2Z S30 S31 3Y/3Z S40 S41 4Y/4Z

0 0 1A/1B 0 0 1A/1B 0 0 1A/1B 0 0 1A/1B
0 1 2A/2B 0 1 2A/2B 0 1 2A/2B 0 1 2A/2B
1 0 3A/3B 1 0 3A/3B 1 0 3A/3B 1 0 3A/3B
1 1 4A/4B 1 1 4A/4B 1 1 4A/4B 1 1 4A/4B

Input
Selected

Control
Pins

Input
Selected

Control
Pins

Input
Selected

Control
Pins

Input
Selected

Apply inputs to the SMA connectors J1–J8. The EVM comes with 50-Ω
resistors installed to VTERM, providing a termination scheme easily
adjusted to accommodate LVDS, LVPECL, or CML output structures. (See
Figure 2-2).

Vterm

50 Ω

LVDS,

LVPECL,

or CML

50 Ω

Vterm

A

SN65LVDS125 Input

Channels 1-4

B

Figure 2-2. Termination for Interfacing LVDS, CML, or LVPECL Drivers

2-3

2 Setup and Required Equipment

2.2 Observing an Output

In order to minimize the parasitic capacitance in high-speed measurements
(probe capacitance), the 4x4 crosspoint switch EVM provides an offset
power plane (layer 5). This power plane allows the user to offset the device
so that the common-mode output is compatible with the 50 ohms to ground
termination within the scope. Terminating the EVM within the scope
eliminates any bandwidth limitations introduced by a probe.

Direct connection to an oscilloscope with 50-Ω internal terminations to
ground is accomplished without requiring installation of resistors R5 – R16
on the EVM. The outputs are available at J9–J16 for direct connection to
oscilloscope inputs. All cabling used to source and measure signals must
be electrically matched in length to prevent any skew between conductors
of the differential inputs.

Referring back to 2-1, power supply 1 is used to provide the required 3.3 V
to the EVM. Power supply 2 is used to offset the EVM ground relative to the
device under test (DUT) ground. With this power scheme, the common­mode voltage seen by either the SN65LVDS125A or the SN65LVDS250 is
approximately equal to that of the oscilloscope, thus preventing significant
common-mode current flow. Using dual supplies and offsetting the EVM
ground relative to the DUT ground are simply steps required for the test and
evaluation of devices. Actual designs include high-impedance receivers,
which do not require the setup steps outlined above. If the EVM outputs are
to be evaluated with a high-impedance probe, direct probing on the EVM is
supported via installation of a 100-Ω resistor across the solder pads (R5,
R8, R11, and R14).

Note: Power Supply 2

.Power supply 2 must be able to sink current.

2.3 Typical Test Results

Figure 2-3 is a typical result obtained with the EVM setup shown in Figure
2-1. The inputs (J1–J8) were stimulated with a 2

1.5 Gbps. The input levels for both clock and data were a differential
voltage of 400 mV, with a common-mode voltage of 0 V (referenced to the
ground of the pattern generator).

23

–1 PRBS signal at

2-4

2 Setup and Required Equipment

Figure 2-3. Typical Test Results.

2-5

2 Setup and Required Equipment

2-6

EVM Construction

Chapter 3

3 EVM Construction

This chapter presents the schematics, board layouts, fabrication
information, and the bill of materials.

Topic Page

3.1 Schematic 3-2

3.2 Board Layout Patterns 3-3

3.3 PCB Fabrication Requirements and Stack Up 3-8

3.4 Bill of Materials 3-9

3-1

3.1 Schematic

SN65LVDS125A

or

SN65LVDS250

U1

Figure 3-1. 4x4 Crosspoint Switch EVM Schematic

3-2

3.2 Board Layout Patterns

A/W # 6456526

3 EVM Construction

SN65LVDS125A

SN65LVDS250

4X4 Crosspoint Switch EVM

Figure 3-2. 4x4 Crosspoint Switch EVM Board Layout

3-3

Figure 3-3. Layer 1–Signal Plane

3-4

3 EVM Construction

Figure 3-4. GND Plane

Figure 3-5. Layer 3–Vcc

3-5

Figure 3-6. Layer 4–Vcc01 Plane

Figure 3-7. Layer 5–GND Plane

3-6

3 EVM Construction

Figure 3-8. Layer 6–GND/Signal Plane

3-7

3.3 PCB Fabrication Requirements and Stack Up

Notes:

1. PWB TO BE FABRICATED TO MEET OR EXCEED IPC-6012,
CLASS 3 STANDARDS AND WORKMANSHIP SHALL
CONFORM TO IPC-A-600, CLASS 3 CURRENT REVISIONS

2. BOARD MATERIAL AND CONSTRUCTION TO BE UL
APPROVED AND MARKED ON THE FINISHED BOARD.

3. LAMINATE MATERIAL:COPPER-CLAD NELCO N4000-13 (DO NOT USE -13SI)

4. COPPER W EIGHT: 1oz FINISHED

5. FINISHED THICKNESS: 0.062" +/- 0.010"

6. MIN PLATING THICKNESS IN THROUGH HOLES: .001"

7. SMOBC / HASL

8. LPI SOLDERMASK BOTH SIDES USING APPROPRIATE
LAYER ARTWORK: COLOR = GREEN

9. LPI SILKSCREEN AS REQUIRED: COLOR = WHITE

10. VENDOR INFORMATION TO BE INCORPORATED ON BACK SIDE
WHENEVER POSSIBLE

11. MINIMUM COPPER CONDUCTOR WIDTH IS: 0.009"
MINIMUM CONDUCTOR SPACING IS: 0.006"

12. NUMBER OF FINISHED LAYERS: 6

13. ALL 8 MIL HOLES TO BE PLUGGED AND COPLANAR TO
SURFACE

14. SPACING BETW EEN LAYERS 1 AND 2 SHOULD BE 0.0075"
SPACING BETW EEN LAYERS 2 AND 3 SHOULD BE 0.0075"
SPACING BETW EEN LAYERS 4 AND 5 SHOULD BE 0.0075"
SPACING BETW EEN LAYERS 5 AND 6 SHOULD BE 0.0075"

Stackup

Signal: Layer 1

0.0075"

GND: Layer 2

0.0075"

VCC Power: Layer 3

0.062"

VCCO1 Power: Layer 4

0.0075"

GND: Layer 5

0.0075"

SIGNAL/GND: Layer 6

3-8

3.4 Bill of Materials

Table 3-2. Bill of Materials for SN65LVDS125A / SN65LVDS250 EVM

Item 6456526-1

Qty

6456526-2

Qty

6456526-3

Qty

Description Pattern Reference

3 EVM Construction

Designator

1 9 9 9 0.001 µF 402 C2, C3, C4, C5, C6,

2 2 2 2 0.01 µF 603 C13, C18

3 1 1 1 0.1 µF 603 C21

4 2 2 2 0.1 µF 1206 C14, C19

5 4 4 4 100 Ω (uninstalled) 402 R5, R8, R11, R14

6 2 2 2 10 µF 7343 C11, C16

7 1 1 1 1 µF 603 C22

8 2 2 2 1 µF 1206 C15, C20

9 12 12 12 3 pos jumper

10 8 8 8 49.9 Ω (uninstalled) 402 R6, R7, R9, R10,

11 8 8 8 49.9 Ω 402 R1, R2, R3, R4, R17,

12 2 2 2 68 µF Cap 592D R C12, C17

13 4 4 4 Banana jack J17, J18, J19, J20

14 16 16 16 SMA PCB MT MOD

W1, W2, W3, W4,

SMA END

50 Ω

C7, C8, C9, C10

W5, W6, W7, W8,
W9, W10, W11, W12

R12, R13, R15, R16

R18, R19, R20

J1, J2, J3, J4, J5, J6,
J7, J8, J9, J10, J11,
J12, J13, J14, J15,
J16

15 1 0 0 SN65LVDS125A 38-TSSOP

(DBT)

16 0 1 0 SN65LVDS250 38-TSSOP

(DBT)

17 0 0 1 Special 38-TSSOP

(DBT)

18 4 4 4 Rubber feet 3/8”

19 1 1 1 PWB 6456526 PWB

U1

U1

U1

3-9