Designed to Meet and Exceed PC133
SDRAM Registered DIMM Specification
Rev. 1.1
D
Spread Spectrum Clock Compatible
D
Operating Frequency 50 MHz to 175 MHz
D
Static Phase Error Distribution at 66MHz to
166 MHz is ±125 ps
D
Jitter (cyc – cyc) at 66 MHz to 166 MHz is
|70| ps
D
Advanced Deep Sub-Micron Process
Results in More Than 40% Lower Power
Consumption Versus Current Generation
PC133 Devices
D
Available in Plastic 24-Pin TSSOP
D
Phase-Lock Loop Clock Distribution for
Synchronous DRAM Applications
D
Distributes One Clock Input to One Bank of
Five and One Bank of Four Outputs
D
Separate Output Enable for Each Output
Bank
D
External Feedback (FBIN) Terminal Is Used
to Synchronize the Outputs to the Clock
Input
D
25-Ω On-Chip Series Damping Resistors
D
No External RC Network Required
D
Operates at 3.3 V
AGND
V
CC
1Y0
1Y1
1Y2
GND
GND
1Y3
1Y4
V
CC
1G
FBOUT
PW PACKAGE
(TOP VIEW)
1
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
CLK
AV
CC
V
CC
2Y0
2Y1
GND
GND
2Y2
2Y3
V
CC
2G
FBIN
description
The CDCVF2509 is a high-performance, low-skew, low-jitter, phase-lock loop (PLL) clock driver . It uses a PLL
to precisely align, in both frequency and phase, the feedback (FBOUT) output to the clock (CLK) input signal.
It is specifically designed for use with synchronous DRAMs. The CDCVF2509 operates at 3.3 V V
provides integrated series-damping resistors that make it ideal for driving point-to-point loads.
One bank of five outputs and one bank of four outputs provide nine low-skew , low-jitter copies of CLK. Output
signal duty cycles are adjusted to 50%, independent of the duty cycle at CLK. Each bank of outputs is enabled
or disabled separately via the control (1G and 2G) inputs. When the G inputs are high, the outputs switch in
phase and frequency with CLK; when the G inputs are low, the outputs are disabled to the logic-low state.
Unlike many products containing PLLs, the CDCVF2509 does not require external RC networks. The loop filter
for the PLL is included on-chip, minimizing component count, board space, and cost.
Because it is based on PLL circuitry , the CDCVF2509 requires a stabilization time to achieve phase lock of the
feedback signal to the reference signal. This stabilization time is required, following power up and application
of a fixed-frequency, fixed-phase signal at CLK, and following any changes to the PLL reference or feedback
signals. The PLL can be bypassed for test purposes by strapping AVCC to ground.
The CDCVF2509 is characterized for operation from 0°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright 1999, Texas Instruments Incorporated
CC
. It also
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
CDCVF2509
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS637 – DECEMBER 1999
description (continued)
For application information refer to application reports
CDC509/516/2509/2510/2516
Spectrum Clocking (SSC)
(literature number SLMA003) and
(literature number SCAA039).
FUNCTION TABLE
INPUTS
1G2GCLK
XXLLLL
LLHLLH
LHHLHH
HLHHLH
HHHHHH
functional block diagram
11
1G
High Speed Distribution Design Techniques for
Using CDC2509A/2510A PLL with Spread
OUTPUTS
1Y
(0:4)2Y(0:3)
FBOUT
3
1Y0
4
1Y1
CLK
FBIN
AV
2G
CC
14
24
13
23
PLL
21
20
17
16
12
5
8
9
1Y2
1Y3
1Y4
2Y0
2Y1
2Y2
2Y3
FBOUT
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPE
DESCRIPTION
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
AVAILABLE OPTIONS
PACKAGE
T
A
0°C to 85°CCDCVF2509PWR
Terminal Functions
TERMINAL
NAMENO.
Clock input. CLK provides the clock signal to be distributed by the CDCVF2509 clock driver. CLK is used
to provide the reference signal to the integrated PLL that generates the clock output signals. CLK must
CLK24I
FBIN13I
1G11I
2G14I
FBOUT12O
1Y (0:4)3, 4, 5, 8, 9O
2Y (0:3)21, 20, 17, 16O
AV
CC
AGND1Ground Analog ground. AGND provides the ground reference for the analog circuitry.
V
CC
GND6, 7, 18, 19Ground Ground
23Power
2, 10, 15, 22PowerPower supply
have a fixed frequency and fixed phase for the PLL to obtain phase lock. Once the circuit is powered
up and a valid CLK signal is applied, a stabilization time is required for the PLL to phase lock the
feedback signal to its reference signal.
Feedback input. FBIN provides the feedback signal to the internal PLL. FBIN must be hard-wired to
FBOUT to complete the PLL. The integrated PLL synchronizes CLK and FBIN so that there is nominally
zero phase error between CLK and FBIN.
Output bank enable. 1G is the output enable for outputs 1Y(0:4). When 1G is low, outputs 1Y(0:4) are
disabled to a logic-low state. When 1G is high, all outputs 1Y(0:4) are enabled and switch at the same
frequency as CLK.
Output bank enable. 2G is the output enable for outputs 2Y(0:3). When 2G is low, outputs 2Y(0:3) are
disabled to a logic low state. When 2G is high, all outputs 2Y(0:3) are enabled and switch at the same
frequency as CLK.
Feedback output. FBOUT is dedicated for external feedback. It switches at the same frequency as CLK.
When externally wired to FBIN, FBOUT completes the feedback loop of the PLL. FBOUT has an
integrated 25-Ω series-damping resistor .
Clock outputs. These outputs provide low-skew copies of CLK. Output bank 1Y(0:4) is enabled via the
1G input. These outputs can be disabled to a logic-low state by deasserting the 1G control input. Each
output has an integrated 25-Ω series-damping resistor.
Clock outputs. These outputs provide low-skew copies of CLK. Output bank 2Y(0:3) is enabled via the
2G input. These outputs can be disabled to a logic-low state by deasserting the 2G control input. Each
output has an integrated 25-Ω series-damping resistor.
Analog power supply . AVCC provides the power reference for the analog circuitry. In addition, A VCC can
be used to bypass the PLL for test purposes. When AVCC is strapped to ground, PLL is bypassed and
CLK is buffered directly to the device outputs.
SMALL OUTLINE
(PW)
CDCVF2509
SCAS637 – DECEMBER 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
CDCVF2509
‡
PACKAGE
R
A
A
PW
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS637 – DECEMBER 1999
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Maximum power dissipation at TA = 55°C (in still air) (see Note 4)0.7 W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. AVCC must not exceed VCC+ 0.7 V
†
JECEC high-K board has better thermal performance due to multiple internal copper planes.
‡
This is the inverse of the traditional junction-to-ambient thermal resistance (R
2. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
3. This value is limited to 4.6 V maximum.
4. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils.
For more information, refer to the
timing requirements over recommended ranges of supply voltage and operating free-air
temperature
MINMAXUNIT
f
clk
†
Time required for the integrated PLL circuit to obtain phase lock of its feedback signal to its reference signal. For phase lock to be obtained, a
fixed-frequency , fixed-phase reference signal must be present at CLK. Until phase lock is obtained, the specifications for propagation delay, skew ,
and jitter parameters given in the switching characteristics table are not applicable. This parameter does not apply for input modulation under
SSC application.
Clock frequency50175MHz
Input clock duty cycle40%60%
Stabilization time
†
1ms
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CDCVF2509
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS637 – DECEMBER 1999
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETERTEST CONDITIONSVCC, AV
V
IK
V
OH
V
OL
I
OH
I
OL
I
I
I
CC
∆I
C
C
‡
For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
§
For dynamic ICC vs Frequency, refer to Figures 8 and 9.
Input clamp voltageII = –18 mA3 V–1.2V
IOH = –100 µAMIN to MAXVCC–0.2
High-level output voltage
Low-level output voltage
High-level output current
Low-level output current
Input currentVI = VCC or GND3.6 V±5µA
Supply current
§
(static, output not switching)
Change in supply current
CC
Input capacitanceVI = VCC or GND3.3 V2.5pF
i
Output capacitanceVO = VCC or GND3.3 V2.8pF
o
IOH = –12 mA3 V2.1
IOH = –6 mA3 V2.4
IOL = 100 µAMIN to MAX0.2
IOL = 12 mA3 V0.8
IOL = 6 mA3 V0.55
VO = 1 V3 V–28
VO = 1.65 V3.3 V–36
VO = 3.135 V3.6 V–8
VO = 1.95 V3 V30
VO = 1.65 V3.3 V40
VO = 0.4 V3.6 V10
VI = VCC or GND,
Outputs: low or high
One input at VCC – 0.6 V,
Other inputs at VCC or GND
IO = 0,
3.3 V to 3.6 V500µA
CC
0 V, 3.6 V40µA
MINTYP‡MAXUNIT
V
V
mA
mA
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
CDCVF2509
(INPUT)/CONDITION
(OUTPUT)
(cycle cycle)
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS637 – DECEMBER 1999
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, C
t
sk(o)
t
r
t
f
t
PLH(bypass mode)
t
PHL(bypass mode)
‡
These parameters are not production tested.
§
The t
NOTES: 6. The specifications for parameters in this table are applicable only after any appropriate stabilization time has elapsed.
specification is only valid for equal loading of all outputs.
sk(o)
7. Calculated per PC DRAM SPEC (t
= 25 pF (see Note 6 and Figures 1 and 2)
L
PARAMETER
Phase error time – static
(normalized)
(see Figures 3 – 6)
Output skew time
Phase error time – jitter
(see Note 7)
Jitter
(see Figure 7)
Duty cyclef
Rise timeVO = 0.4 V to 2 VAny Y or FBOUT0.52.5ns/V
Fall timeVO = 0.4 V to 2 VAny Y or FBOUT0.52.5ns/V
Low-to-high propagation
delay time, bypass mode
High-to-low propagation
delay time, bypass mode
§
-
CLK↑ = 66 MHz to166 MHzFBIN↑–125125ps
CLK = 66 MHz to 166 MHz
CLK = 100 MHz to 166 MHz
phase error
FROM
Any YAny Y100ps
> 60 MHzAny Y or FBOUT45%55%
(CLK)
CLKAny Y or FBOUT0.42.3ns
CLKAny Y or FBOUT0.42.3ns
, static – jitter
(cycle-to-cycle)
‡
TO
Any Y or FBOUT–5050
Any Y or FBOUT|70|
Any Y or FBOUT|65|
).
VCC, AVCC = 3.3 V
± 0.3 V
MINTYPMAX
UNIT
ps
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
From Output
Under Test
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
PARAMETER MEASUREMENT INFORMATION
25 pF
500
Input
W
Output
50% V
CC
t
pd
t
r
2 V
0.4 V
50% V
CDCVF2509
SCAS637 – DECEMBER 1999
2 V
CC
t
f
0.4 V
3 V
0 V
V
V
OH
OL
LOAD CIRCUIT FOR OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 133 MHz, ZO = 50 Ω, tr ≤ 1.2 ns, tf≤ 1.2 ns.
C. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
CLKIN
FBIN
t
phase error
FBOUT
Any Y
t
sk(o)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
Any Y
Any Y
t
sk(o)
Figure 2. Phase Error and Skew Calculations
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
7
CDCVF2509
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS637 – DECEMBER 1999
TYPICAL CHARACTERISTICS
600
400
200
0
–200
Static Phase Error – ps
CLK to FBOUT
–400
–600
381318232833
C
– Lumped Feedback Capacitance at FBIN – pF
(LF)
SUPPLY VOLTAGE AT FBOUT
0
fc = 133 MHz
C
= 25 pF || 500 Ω
–50
–100
(LY)
C
= 12 pF || 500 Ω
(LF)
TA = 25°C
See Notes A, B, and C
STATIC PHASE ERROR
vs
LOAD CAPACITANCE
VCC = 3.3 V
fc = 100 MHz
C
TA = 25°C
See Notes A, B, and C
CLK to Y1–n
(LY1–n)
= 25 pF || 500 Ω
Figure 3
STATIC PHASE ERROR
vs
38
STATIC PHASE ERROR
600
400
200
0
–200
Static Phase Error – ps
CLK to FBOUT
–400
–600
381318232833
C
– Lumped Feedback Capacitance at FBIN – pF
(LF)
STATIC PHASE ERROR
0
VCC = 3.3 V
C
= 25 pF || 500 Ω
–50
–100
(LY)
C
= 12 pF || 500 Ω
(LF)
TA = 25°C
See Notes A, B, and C
vs
LOAD CAPACITANCE
VCC = 3.3 V
fc = 133 MHz
C
TA = 25°C
See Notes A, B, and C
(LY1–n)
CLK to Y1–n
= 25 pF || 500 Ω
Figure 4
vs
CLOCK FREQUENCY
38
–150
–200
–250
Static Phase Error – ps
–300
–350
–400
3.13.23.33.43.5
CLK to FBOUT
VCC – Supply Voltage – V
Figure 5
NOTES: A. Trace length FBOUT to FBIN = 5 mm, ZO = 50 Ω
8
B. C
C. C
= Lumped capacitive load Y
(LY)
= Lumped feedback capacitance at FBOUT = FBIN
(LFx)
1–n
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
–150
–200
–250
Static Phase Error – ps
–300
–350
3.63
–400
5075100125150175200
fc – Clock Frequency – MHz
CLK to FBOUT
Figure 6
CDCVF2509
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS637 – DECEMBER 1999
TYPICAL CHARACTERISTICS
JITTER
vs
CLOCK FREQUENCY AT FBOUT
140
120
100
80
Jitter – ps
60
40
20
0
5075100125150175200
fc – Clock Frequency – MHz
VCC = 3.3 V
C
= 25 pF || 500 Ω
(LY)
C
= 12 pF || 500 Ω
(LF)
TA = 25°C
See Notes C and D
Cycle to Cycle
Figure 7
250
200
SUPPLY CURRENT
CLOCK FREQUENCY
AVCC = VCC = 3.6 V
Bias = 0/3 V
C
= 25 pF || 500 Ω
(LY)
C
= 12 pF || 500 Ω
(LF)
TA = 25°C
See Notes A and B
ANALOG SUPPLY CURRENT
CLOCK FREQUENCY
25
AVCC = VCC = 3.6 V
Bias = 0/3 V
C
= 25 pF || 500 Ω
(LY)
20
C
= 12 pF || 500 Ω
(LF)
TA = 25°C
See Notes A and B
15
10
– Analog Supply Current – mA
CC
5
AI
0
0255075100125 150175
fc – Clock Frequency – MHz
Figure 8
vs
vs
200
150
100
– Supply Current – mA
CC
I
50
0
0255075100125 150175 200
fc – Clock Frequency – MHz
NOTES: A. Trace length FBOUT to FBIN = 5 mm, ZO = 50 Ω
B. Total current = ICC + AI
C. C
D. C
= Lumped capacitive load Y
(LY)
= Lumped feedback capacitance at FBOUT = FBIN
(LFx)
CC
1–n
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Figure 9
9
CDCVF2509
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS637 – DECEMBER 1999
MECHANICAL INFORMATION
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PIN SHOWN
0,65
14
1
1,20 MAX
A
7
0,05 MIN
0,30
0,19
8
4,50
4,30
6,60
6,20
M
0,10
Seating Plane
0,10
0,15 NOM
Gage Plane
0,25
0°–8°
0,75
0,50
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
8
3,10
2,90
14
5,10
4,90
16
5,10
20
6,60
6,404,90
24
7,90
7,70
28
9,80
9,60
4040064/E 08/96
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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