Phase-Lock Loop Clock Driver for Double
Data-Rate Synchronous DRAM
Applications
D
Spread Spectrum Clock Compatible
D
Operating Frequency: 60 to 180 MHz
D
Low Jitter (cyc–cyc): ±50 ps
D
Distributes One Differential Clock Input to
Ten Differential Outputs
description
The CDCV857A is a high-performance, low-skew, low-jitter zero delay buf fer that distributes a differential clock
input pair (CLK, CLK
clock output (FBOUT, FBOUT
clocks (FBIN, FBIN
and frequency with CLK. When PWRDWN
and the PLL is shut down (low power mode). The device also enters this low power mode when the input
frequency falls below a suggested detection frequency that is below 20 MHz (typical 10 MHz). An input
frequency detection circuit will detect the low frequency condition and after applying a >20 MHz input signal this
detection circuit turns on the PLL again and enables the outputs.
CDCV857A
2.5-V PHASE LOCK LOOP CLOCK DRIVER
SCAS667A – APRIL 2001 – REVISED AUGUST 2002
D
Three-State Outputs When the Input
Differential Clocks Are <20 MHz
D
Operates From Dual 2.5-V Supplies
D
Available in a 48-Pin TSSOP Package or
56-Ball MicroStar Junior BGA Package
D
Consumes < 200-µA Quiescent Current
D
External Feedback PIN (FBIN, FBIN) Are
Used to Synchronize the Outputs to the
Input Clocks
) to ten differential pairs of clock outputs (Y[0:9], Y[0:9]) and one differential pair of feedback
). The clock outputs are controlled by the clock inputs (CLK, CLK), the feedback
), and the analog power input (A VDD). When PWRDWN is high, the outputs switch in phase
is low, all outputs are disabled to high impedance state (3-state),
When A V
is strapped low, the PLL is turned of f and bypassed for test purposes. The CDCV857A is also able
DD
to track spread spectrum clocking for reduced EMI.
Since the CDCV857A is based on PLL circuitry , it requires a stabilization time to achieve phase-lock of the PLL.
This stabilization time is required following power up. The CDCV857A is characterized for operation from 0°C
to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MicroStar Junior is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This value is limited to 3.6 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51.
Output differential cross-voltage, VOX (see Note 7)V
Input differential pair cross-voltage, VIX (see Note 7)V
High-level output current, I
Low-level output current, I
Input slew rate, SR14V/ns
Operating free-air temperature, T
NOTES: 4. Unused inputs must be held high or low to prevent them from floating.
5. DC input signal voltage specifies the allowable dc execution of differential input.
6. Differential input signal voltage specifies the differential voltage |VTR – VCP| required for switching, where VTR is the true input level
and VCP is the complementary input level.
7. Differential cross-point voltage is expected to track variations of VCC and is the voltage at which the differential signals must be
crossing.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETERTEST CONDITIONSMINTYP
V
IK
I
OH
I
OL
V
O
V
OX
I
I
I
OZ
I
DDPD
C
I
C
O
†
All typical values are at respective nominal V
‡
The value of VOC is expected to be |VTR + VCP|/2. In case of each clock directly terminated by a 120-Ω resistor, where VTR is the true input
signal voltage and VCP is the complementary input signal voltage.
§
Differential cross-point voltage is expected to track variations of VDDQ and is the voltage at which the differential signals must be crossing.
timing requirements over recomme nd ed ran ge s of supply voltage and operating free-air
temperature
CLK
¶
Time required for the integrated PLL circuit to obtain phase lock of its feedback signal to its reference signal. For phase lock to be obtained, a
fixed-frequency , fixed-phase reference signal must be present at CLK. Until phase lock is obtained, the specifications for propagation delay, skew ,
and jitter parameters given in the switching characteristics table are not applicable. This parameter does not apply for input modulation under
SSC application.
6
Operating clock frequency
Application clock frequency
Input clock duty cycle40%60%
StabilizationtimeW (PLL mode)10µs
StabilizationtimeW (Bypass mode)30ns
MINMAXUNIT
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
t
w
Jitter (period), See Figure 6
t
w
Jitter (cycle-to-cycle), See Figure 3
ps
t
w
Half-period jitter, See Figure 7
ps
t
w
y(j),
ps
t
Static phase offset, See Figure 4(a)
ps
CDCV857A
2.5-V PHASE LOCK LOOP CLOCK DRIVER
SCAS667A – APRIL 2001 – REVISED AUGUST 2002
switching characteristics
PARAMETERTEST CONDITIONSMIN
}
t
PLH
}
t
PHL
jit(per)
jit(cc)
jit(hper)
t
slr(i)
t
slr(o)
d(Ø)
(Ø)
tsk
(o)
tr, tfOutput rise and fall times (20% – 80%)Load: 120 Ω/14 pF650900ps
†
All typical values are at a respective nominal V
‡
Refers to transition of noninverting output.
§
This parameter is assured by design but can not be 100% production tested.
¶
All differential output pins are terminated with 120 Ω/14 pF.
Low to high level propagation delay timeTest mode/CLK to any output4.5ns
High-to low level propagation delay timeTest mode/CLK to any output4.5ns
p
p
Input clock slew rate, See Figure 814V/ns
Output clock slew rate, See Figure 812V/ns
Dynamic phase offset (this includes jitter), See
Figure 4(b)
Figure 1. IBIS Model Output Load (used for slew rate measurement)
VDD/2
CDCV857A
Z = 60 Ω
Z = 60 Ω
C = 14 pF
R = 10 Ω
C = 14 pF
–VDD/2
Z = 50 ΩR = 10 Ω
Z = 50 Ω
SCOPE
V
(TT)
V
(TT)
R = 50 Ω
R = 50 Ω
–VDD/2
–VDD/2
NOTE: V
(TT)
= GND
Figure 2. Output Load Test Circuit
Yx, FBOUT
Yx, FBOUT
t
c(n)
t
jit(cc)
= t
c(n)
– t
c(n+1)
t
c(n+1)
Figure 3. Cycle-to-Cycle Jitter
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CDCV857A
2.5-V PHASE LOCK LOOP CLOCK DRIVER
SCAS667A – APRIL 2001 – REVISED AUGUST 2002
PARAMETER MEASUREMENT INFORMATION
CLK
CLK
FBIN
FBIN
CLK
CLK
FBIN
FBIN
t
( ) n
t
( )
(N is a large number of samples)
(a) Static Phase Offset
t
( )
t
d
( )
t
d
( )
(b)
Dynamic Phase Offset
n = N
∑
=
t
1
( ) n
N
t
d
( )
t
( ) n+1
t
( )
t
d
( )
Figure 4. Phase Offset
Yx
Yx
Yx, FBOUT
Yx, FBOUT
t
sk(o)
Figure 5. Output Skew
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
9
CDCV857A
2.5-V PHASE LOCK LOOP CLOCK DRIVER
SCAS667A – APRIL 2001 – REVISED AUGUST 2002
PARAMETER MEASUREMENT INFORMATION
Yx, FBOUT
Yx, FBOUT
Yx, FBOUT
Yx, FBOUT
t
Figure 6. Period Jitter
Yx
, FBOUT
jit(per)
t
c(n)
1
f
o
= tcn –
1
f
o
Yx, FBOUT
Clock Inputs
and Outputs
t
(hper_n)
t
jit(hper)
= t
t
1
f
o
(hper_n) –
(hper_n+1)
2xf
Figure 7. Half-Period Jitter
80%
20%
t
slrr(i)
, t
slrr(o)
t
slrf(i)
Figure 8. Input and Output Slew Rates
1
o
80%
VID, V
OD
20%
, t
slrf(o)
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CDCV857A
2.5-V PHASE LOCK LOOP CLOCK DRIVER
SCAS667A – APRIL 2001 – REVISED AUGUST 2002
MECHANICAL DATA
DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,50
48
1
1,20 MAX
0,27
0,17
25
24
A
0,15
0,05
0,08
M
8,30
6,20
7,90
6,00
Seating Plane
0,10
0,15 NOM
Gage Plane
0,25
0°–8°
0,75
0,50
DIM
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
PINS **
A MAX
A MIN
48
12,60
12,40
56
14,10
13,90
64
17,10
16,90
4040078/F 12/97
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
11
CDCV857A
2.5-V PHASE LOCK LOOP CLOCK DRIVER
SCAS667A – APRIL 2001 – REVISED AUGUST 2002
MECHANICAL DATA
GQL (R-PBGA-N56) PLASTIC BALL GRID ARRAY
7,10
6,90
4,60
4,40
A1 Corner
3X Via Hole
Without
Ball
Missing Via
Hole Indicates
Pin A1
Quadrant
0,65
K
J
H
G
F
E
D
C
B
A
123645
Bottom View
3,25
0,325
0,65
5,85
0,325
1,00 MAX
0,45
56×∅
0,35
M
0,05
NOTES: A. All linear dimensions are in millimeters.
MicroStar Junior is a trademark of Texas Instruments.
B. This drawing is subject to change without notice.
C. MicroStar Junior BGA configuration
D. Falls within JEDEC MO-225 variation BA.
E. This package is tin-lead (SnPb). Refer to the 56 ZQL package (drawing 4204437) for lead-free.
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAULevel-1-250C-UNLIM
CU NIPDAULevel-1-250C-UNLIM
(3)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
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accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
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incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
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