533-MHz Differential Clock Source for
Direct Rambus
1066-MHz Data Transfer Rate
D
Synchronizes the Clock Domains of the
Rambus Channel With an External System
or Processor Clock
D
Three Power Operating Modes to Minimize
Power for Mobile and Other
Power-Sensitive Applications
D
Operates From a Single 3.3-V Supply and
120 mW at 300 MHz (Typ)
D
Packaged in a Shrink Small-Outline
Package (DBQ)
D
Supports Frequency Multipliers: 4, 6, 8,
16/3
D
No External Components Required for PLL
D
Supports Independent Channel Clocking
D
Spread Spectrum Clocking Tracking
Capability to Reduce EMI
D
Designed for Use With TI’s 133-MHz Clock
Synthesizers CDC924 and CDC921
description
The Direct Rambus clock generator (DRCG) provides the necessary clock signals to support a Direct Rambus
memory subsystem. It includes signals to synchronize the Direct Rambus channel clock to an external system
or processor clock. It is designed to support Direct Rambus memory on a desktop, workstation, server, and
mobile PC motherboards. DRCG also provides an off-the-shelf solution for a broad range of Direct Rambus
memory applications.
The DRCG provides clock multiplication and phase alignment for a Direct Rambus memory subsystem to
enable synchronous communication between the Rambus channel and ASIC clock domains. In a Direct
Rambus memory subsystem, a system clock source provides the REFCLK and PCLK clock references to the
DRCG and memory controller, respectively. The DRCG multiplies REFCLK and drives a high-speed BUSCLK
to RDRAMs and the memory controller. Gear ratio logic in the memory controller divides the PCLK and BUSCLK
frequencies by ratios M and N such that PCLKM = SYNCLKN, where SYNCLK = BUSCLK/4. The DRCG detects
the phase difference between PCLKM and SYNCLKN and adjusts the phase of BUSCLK such that the skew
between PCLKM and SYNCLKN is minimized. This allows data to be transferred across the SYNCLK/PCLK
boundary without incurring additional latency.
User control is provided by multiply and mode selection terminals. The multiply terminals provide selection of
one of four clock frequency multiply ratios, generating BUSCLK frequencies ranging from 267 MHz to 533 MHz
with clock references ranging from 33 MHz to 100 MHz. The mode select terminals can be used to select a
bypass mode where the frequency multiplied reference clock is directly output to the Rambus channel for
systems where synchronization between the Rambus clock and a system clock is not required. T est modes are
provided to bypass the PLL and output REFCLK on the Rambus channel and to place the outputs in a
high-impedance state for board testing.
Memory Systems for an
CDCFR83
DIRECT RAMBUS CLOCK GENERATOR
SCAS665A – APRIL 2001 REVISED MARCH 2002
D
Cycle-Cycle Jitter Is Less Than 40 ps at
533 MHz
D
Certified by Gigatest Labs to Exceed the
Rambus DRCG Validation Requirement
D
Supports Industrial Temperature Range of
°
–40
C to 85°C
DBQ PACKAGE
(TOP VIEW)
VDDIR
REFCLK
V
GNDP
GNDI
PCLKM
SYNCLKN
GNDC
V
V
DD
STOPB
PWRDNB
NC – No internal connection
DD
DD
IPD
1
2
P
3
4
5
6
7
8
C
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
S0
S1
V
O
DD
GNDO
CLK
NC
CLKB
GNDO
V
O
DD
MULT0
MULT1
S2
The CDCFR83 is characterized for operation over free-air temperatures of –40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Direct Rambus and Rambus are trademarks of Rambus Inc.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 2002, Texas Instruments Incorporated
1
CDCFR83
DIRECT RAMBUS CLOCK GENERATOR
SCAS665A – APRIL 2001 REVISED MARCH 2002
functional block diagram
PWRDWNBS0S1S2STOPB
Test MUX
PLLCLK
REFCLK
PLL
B
Phase
Aligner
Bypass MUX
ByPCLK
CLK
CLKB
A
φ
2
MULT0
MULT1
FUNCTION TABLE
MODE
Normal000Phase aligned clockPhase aligned clock B
Bypass100PLLCLKPLLCLKB
Test110REFCLKREFCLKB
Output test (OE)01XHi-ZHi-Z
Reserved001——
Reserved101——
Reserved111Hi-ZHi-Z
†
X = don’t care, Hi-Z = high impedance
S0S1S2CLKCLKB
PACLK
D
SYNCLKNPCLKM
†
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DIRECT RAMBUS CLOCK GENERATOR
I/O
DESCRIPTION
Terminal Functions
TERMINAL
NAMENO.
CLK20OOutput clock
CLKB18OOutput clock (complement)
GNDC8GND for phase aligner
GNDI5GND for control inputs
GNDO17, 21GND for clock outputs
GNDP4GND for PLL
MULT015IPLL multiplier select
MULT114IPLL multiplier select
NC19Not used
PCLKM6IPhase detector input
PWRDNB12IActive low power down
REFCLK2IReference clock
S024IMode control
S123IMode control
S213IMode control
STOPB11IActive low output disable
SYNCLKN7IPhase detector input
VDDC9VDD for phase aligner
VDDIPD10Reference voltage for phase detector inputs and STOPB
VDDIR1Reference voltage for REFCLK
VDDO16, 22VDD for clock outputs
VDDP3VDD for PLL
CDCFR83
SCAS665A – APRIL 2001 REVISED MARCH 2002
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
CDCFR83
DIRECT RAMBUS CLOCK GENERATOR
SCAS665A – APRIL 2001 REVISED MARCH 2002
PLL divider selection
Table 1 lists the supported REFCLK and BUSCLK frequencies. Other REFCLK frequencies are permitted,
provided that (267 MHz < BUSCLK < 533 MHz) and (33 MHz < REFCLK < 100 MHz).
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values are with respect to the GND terminals.
DISSIPATION RATING TABLE
PACKAGE
DBQ1400 mW11 mW/°C905 mW740 mW
‡
This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
4
TA ≤ 25°C
POWER RATING
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DERATING FACTOR
ABOVE TA = 25°C
‡
POWER RATING
TA = 70°C
TA = 85°C
POWER RATING
CDCFR83
DIRECT RAMBUS CLOCK GENERATOR
SCAS665A – APRIL 2001 REVISED MARCH 2002
recommended operating conditions
MINNOMMAXUNIT
Supply voltage, V
High-level input voltage, VIH (CMOS)0.7 ×V
Low-level input voltage, VIL (CMOS)0.3 × V
Initial phase error at phase detector inputs (required range for phase aligner)–0.5 × t
REFCLK low-level input voltage, V
REFCLK high-level input voltage, V
Input signal low voltage, VIL (STOPB)0.3 × VDDIPDV
Input signal high voltage, VIH (STOPB)0.7 × VDDIPDV
Input reference voltage for (REFCLK) (VDDIR)1.2353.465V
Input reference voltage for (PCLKM and SYSCLKN) (VDDIPD)1.2353.465V
High-level output current, I
Low-level output current, I
Operating free-air temperature, T
DD
IL
IH
OH
OL
A
timing requirements
Input cycle time, t
Input cycle-to-cycle jitter250ps
Input duty cycle over 10,000 cycles40%60%
Input frequency modulation, f
Modulation index, nonlinear maximum 0.5%0.6%
Phase detector input cycle time (PCLKM and SYNCLKN)30100ns
Input slew rate, SR14V/ns
Input duty cycle (PCLKM and SYNCLKN)25%75%
c(in)
mod
3.1353.33.465V
DD
DD
c(PD)
0.7 × VDDIRV
–4085°C
0.5 × t
c(PD)
0.3 × VDDIRV
–16mA
16mA
MINMAXUNIT
1040ns
3033kHz
V
V
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
CDCFR83
I
g
A
I
A
Z
Ω
VDDIR, VDDIPD
V
3.465 V
DIRECT RAMBUS CLOCK GENERATOR
SCAS665A – APRIL 2001 REVISED MARCH 2002
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETERTEST CONDITIONS
V
O(STOP)
V
O(X)
V
O
V
IK
V
OH
V
OL
I
OH
I
OL
I
OZ
I
OZ(STOP)
I
OZ(PD)
IH
IL
O
C
I
C
O
I
DD(PD)
I
DD(CLKSTOP)
I
DD(NORMAL)
†
VDD refers to any of the following; VDD, VDDIPD, VDDIR, VDDO, VDDC, and VDDP
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETERTEST CONDITIONSMIN TYP†MAXUNIT
t
c(out)
t
itter
t
(phase)
t
(phase, SSC)
t
(DC)
t
DC, err
tr, t
f
∆t
†
All typical values are at VDD = 3.3 V, TA = 25°C.
‡
Assured by design
§
Jitter measurement according to Rambus validation specification
Clock output cycle time
Total cycle jitter over 1, 2,
3, 4, 5, or 6
Phase detector phase error for distributed loopStatic phase error
PLL output phase error when tracking SSCDynamic phase error
Output duty cycle over 10,000 cyclesSee Figure 445%55%
Output cycle-to-cycle
Output rise and fall times (measured at 20%–80% of
output voltage)
Difference between rise and fall times on a single device
(20%–80%) |tf – tr|
stopped phase
alignment
stopped phase
alignment
267 MHz80
300 MHz70
356 MHz
400 MHz50
533 MHz
267 MHz80
300 MHz70
356 MHz
400 MHz50
533 MHz50
See Figure 3
§
}
}
See Figure 5
See Figure 7160400ps
See Figure 7100ps
1.873.75ns
ps
60
40
–100100ps
–100100ps
ps
60
state transition latency specifications
PARAMETERFROMTO
Delay time, PWRDNB↑ to CLK/CLKB output
(powerup)
(VDDpowerup)
t
(MULT)
t
(CLKON)
t
(CLKSETL)
t
(CLKOFF)
†
All typical values are at VDD = 3.3 V, TA = 25°C.
settled (excluding t
Delay time, PWRDNB↑ to internal PLL and
clock are on and settled
Delay time, power up to CLK/CLKB output
settled
Delay time, power up to internal PLL and
clock are on and settled
MULT0 and MULT1 change to CLK/CLKB
output resettled (excluding t
STOPB↑ to CLK/CLKB glitch-free clock
edges
STOPB↑ to CLK/CLKB output settled to
within 50 ps of the phase before STOPB was
disabled
STOPB↓ to CLK/CLKB output disabledNormal
(DISTLOCK)
)
(DISTLOCK)
TEST
CONDITIONS
See Figure 83
See Figure 83
)
NormalNormalSee Figure 91ms
CLK StopNormalSee Figure 1010ns
CLK StopNormalSee Figure 1020 cycles
CLK
Stop
See Figure 105ns
MINTYP†MAXUNIT
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
7
CDCFR83
(1)
(2)
DIRECT RAMBUS CLOCK GENERATOR
SCAS665A – APRIL 2001 REVISED MARCH 2002
state transition latency specifications (continued)
PARAMETERFROMTO
t
(powerdown)
t
(STOP)
t
(ON)
t
(DISTLOCK)
†
All typical values are at VDD = 3.3 V, TA = 25°C.
Delay time, PWRDNB↓ to the device in the
power-down mode
Maximum time in CLKSTOP (STOPB = 0)
before reentering normal mode
(STOPB = 1)
Minimum time in normal mode (STOPB = 1)
before reentering CLKSTOP (STOPB = 0)
Time from when CLK/CLKB output is
settled to when the phase error between
SYNCLKN and PCLKM falls within t
PARAMETER MEASUREMENT INFORMATION
68 Ω, ±5%
68 Ω, ±5%
(phase)
10 pF
TEST
CONDITIONS
NormalPowerdown See Figure 81ms
STOPBNormalSee Figure 10100µs
NormalCLK stopSee Figure 10100ms
Unlocked Locked5ms
39 Ω, ±5%
39 Ω, ±5%
100 pF
MINTYP†MAXUNIT
RT = 28 Ω
RT = 28 Ω
10 pF
Figure 1. Test Load and Voltage Definitions (V
CLK
CLKB
t
c(1)
Cycle-to-cycle jitter = | t
– t
c
c
t
c(2)
| over 10000 consecutive cycles
Figure 2. Cycle-to-Cycle Jitter
O(STOP)
, V
, VO, VOH, VOL)
O(X)
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CLK
(3)
(4)
CLKB
DIRECT RAMBUS CLOCK GENERATOR
SCAS665A – APRIL 2001 REVISED MARCH 2002
PARAMETER MEASUREMENT INFORMATION
t
c(3)
t
c(4)
CDCFR83
Cycle-to-cycle jitter = | t
– t
c
| over 10000 consecutive cycles
c
Figure 3. Short Term Cycle-to-Cycle Jitter Over Four Cycles
CLK
CLKB
t
pd(1)
t
c(5)
Duty cycle = (t
pd(1)/tc(5)
)
Figure 4. Output Duty Cycle
CLK
CLKB
t
pd(2)
Duty cycle error = t
pd(2)
– t
pd(3)
t
c(6)
t
c(7)
Figure 5. Duty Cycle Error (Cycle-to-Cycle)
t
pd(3)
CLK
CLKB
Figure 6. Crossing-Point Voltage
80%
20%
t
r
t
Figure 7. Voltage Waveforms
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
V
O(X)+
V
O(X), nom
V
O(X)–
V
OH
V
OL
f
9
CDCFR83
DIRECT RAMBUS CLOCK GENERATOR
SCAS665A – APRIL 2001 REVISED MARCH 2002
PARAMETER MEASUREMENT INFORMATION
PWRDNB
CLK/CLKB
MULT0 and/or
MULT1
CLK/CLKB
STOPB
CLK/CLKB
t
(CLKON)
(see Note A)
t
(power up)
Figure 8. PWRDNB Transition Timings
t
(MULT)
Figure 9. MULT Transition Timings
t
(ON)
t
(CLKSETL)
t
(STOP)
t
(CLKOFF)
(see Note A)
t
(power down)
NOTE A: V
10
= VO ±200 mV
ref
Output clock
not specified
glitches ok
Clock output settled
Clock enabled
and glitch free
within 50 ps of the
phase before disabled
Figure 10. STOPB Transition Timings
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CDCFR83
DIRECT RAMBUS CLOCK GENERATOR
SCAS665A – APRIL 2001 REVISED MARCH 2002
MECHANICAL DATA
DBQ (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
24-PIN SHOWN
0.025 (0,64)
24
1
0.069 (1,75) MAX
0.012 (0,30)
0.008 (0,20)
13
0.157 (3,99)
0.150 (3,81)
12
A
0.010 (0,25)
0.004 (0,10)
0.005 (0,13)
0.244 (6,20)
0.228 (5,80)
Seating Plane
0.004 (0,10)
M
0.008 (0,20) NOM
0°–8°
Gage Plane
0.010 (0,25)
0.035 (0,89)
0.016 (0,40)
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-137
16
0.197
(5,00)
0.188
(4,78)
2420
0.3440.344
(8,74)
(8,56)
(8,74)
0.3370.337
(8,56)
4073301/C 02/97
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
11
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
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and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty . Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty . Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. T o minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
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Use of such information may require a license from a third party under the patents or other intellectual property
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Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
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Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Copyright 2002, Texas Instruments Incorporated
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