TEXAS INSTRUMENTS CDC2510C Technical data

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CDC2510C
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS621 – DECEMBER 1998
D
Designed to Meet PC SDRAM Registered DIMM Design Support Document Rev. 1.2
D
Spread Spectrum Clock Compatible
D
Operating Frequency 25 MHz to 125 MHz
D
Static tPhase Error Distribution at 66 MHz to 100 MHz is ±150 ps
D
Drop-In Replacement for TI CDC2510A With Enhanced Performance
D
Jitter (cyc – cyc) at 66 MHz to 100 MHz is |100 ps|
D
Available in Plastic 24-Pin TSSOP
D
Phase-Lock Loop Clock Distribution for Synchronous DRAM Applications
D
Distributes One Clock Input to One Bank of Ten Outputs
D
External Feedback (FBIN) Terminal Is Used to Synchronize the Outputs to the Clock Input
D
On-Chip Series Damping Resistors
D
No External RC Network Required
D
Operates at 3.3 V
AGND
V
CC
1Y0 1Y1
1Y2 GND GND
1Y3
1Y4
V
CC
FBOUT
PW PACKAGE
(TOP VIEW)
1 2 3 4 5 6 7 8 9 10
G
11 12
24 23 22 21 20 19 18 17 16 15 14 13
CLK AV
CC
V
CC
1Y9 1Y8 GND GND 1Y7 1Y6 1Y5 V
CC
FBIN
description
The CDC2510C is a high-performance, low-skew, low-jitter, phase-lock loop (PLL) clock driver. It uses a PLL to precisely align, in both frequency and phase, the feedback (FBOUT) output to the clock (CLK) input signal. It is specifically designed for use with synchronous DRAMs. The CDC2510C operates at V provides integrated series-damping resistors that make it ideal for driving point-to-point loads.
One bank of ten outputs provides ten low-skew, low-jitter copies of CLK. Output signal duty cycles are adjusted to 50 percent, independent of the duty cycle at CLK. All outputs can be enabled or disabled via a single output enable input. When the G input is high, the outputs switch in phase and frequency with CLK; when the G input is low, the outputs are disabled to the logic-low state.
Unlike many products containing PLLs, the CDC2510C does not require external RC networks. The loop filter for the PLL is included on-chip, minimizing component count, board space, and cost.
Because it is based on PLL circuitry , the CDC2510C requires a stabilization time to achieve phase lock of the feedback signal to the reference signal. This stabilization time is required, following power up and application of a fixed-frequency, fixed-phase signal at CLK, and following any changes to the PLL reference or feedback signals. The PLL can be bypassed for test purposes by strapping AV
to ground.
CC
The CDC2510C is characterized for operation from 0°C to 85°C. For application information refer to application reports
CDC509/516/2509/2510/2516 Spectrum Clocking (SSC)
(literature number SLMA003) and
(literature number SCAA039).
High Speed Distribution Design Techniques for
Using CDC2509A/2510A PLL with Spread
= 3.3 V . It also
CC
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright 1998, Texas Instruments Incorporated
1
CDC2510C
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS621 – DECEMBER 1998
FUNCTION TABLE
INPUTS
G CLK
X L L L
L HLH
HHHH
functional block diagram
11
G
OUTPUTS
1Y
(0:9)
FBOUT
3
1Y0
4
1Y1
5
1Y2
CLK
FBIN
AV
CC
24
13
23
PLL
AVAILABLE OPTIONS
PACKAGE
T
A
0°C to 85°C CDC2510CPWR
SMALL OUTLINE
(PW)
15
16
17
20
21
12
8
9
1Y3
1Y4
1Y5
1Y6
1Y7
1Y8
1Y9
FBOUT
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TYPE
DESCRIPTION
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
Terminal Functions
TERMINAL
NAME NO.
Clock input. CLK provides the clock signal to be distributed by the CDC2510C clock driver. CLK is used to provide the reference signal to the integrated PLL that generates the clock output signals. CLK
CLK 24 I
FBIN 13 I
G 11 I
FBOUT 12 O
3, 4, 5, 8, 9
CC
15, 16, 17, 20,
21
23 Power
2, 10, 14, 22 Power Power supply
1Y (0:9)
AV
AGND 1 Ground Analog ground. AGND provides the ground reference for the analog circuitry.
V
CC
GND 6, 7, 18, 19 Ground Ground
must have a fixed frequency and fixed phase for the PLL to obtain phase lock. Once the circuit is powered up and a valid CLK signal is applied, a stabilization time is required for the PLL to phase lock the feedback signal to its reference signal.
Feedback input. FBIN provides the feedback signal to the internal PLL. FBIN must be hardwired to FBOUT to complete the PLL. The integrated PLL synchronizes CLK and FBIN so that there is nominally zero phase error between CLK and FBIN.
Output bank enable. G is the output enable for outputs 1Y(0:9). When G is low, outputs 1Y(0:9) are disabled to a logic-low state. When G is high, all outputs 1Y(0:9) are enabled and switch at the same frequency as CLK.
Feedback output. FBOUT is dedicated for external feedback. It switches at the same frequency as CLK. When externally wired to FBIN, FBOUT completes the feedback loop of the PLL. FBOUT has an integrated 25- series-damping resistor.
Clock outputs. These outputs provide low-skew copies of CLK. Output bank 1Y(0:9) is enabled via the G input. These outputs can be disabled to a logic-low state by deasserting the G control input.
O
Each output has an integrated 25- series-damping resistor. Analog power supply . A VCC provides the power reference for the analog circuitry. In addition, A V
can be used to bypass the PLL for test purposes. When AVCC is strapped to ground, PLL is bypassed and CLK is buffered directly to the device outputs.
CDC2510C
SCAS621 – DECEMBER 1998
CC
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
3
CDC2510C
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS621 – DECEMBER 1998
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, AV Supply voltage range, V Input voltage range, V Voltage range applied to any output in the high or low state, V
O
Input clamp current, I Output clamp current, I Continuous output current, I Continuous current through each V Maximum power dissipation at T Storage temperature range, T
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. AVCC must not exceed VCC.
2. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
3. This value is limited to 4.6 V maximum.
4. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils. For more information, refer to the
Book
, literature number SCBD002.
(see Note 1) AVCC < VCC +0.7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CC
, AVCC –0.5 V to 4.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CC
(see Note 2) –0.5 V to 6.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I
(see Notes 2 and 3) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(V
< 0) –50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
IK
I
(V
< 0 or VO > VCC) ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OK
O
(V
= 0 to VCC) ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
O
O
or GND ±100 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CC
= 55°C (in still air) (see Note 4) 0.7 W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
A
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
stg
Package Thermal Considerations
application note in the
ABT Advanced BiCMOS T echnology Data
recommended operating conditions (see Note 5)
MIN MAX UNIT
VCC, AVCCSupply voltage 3 3.6 V V
IH
V
IL
V
I
I
OH
I
OL
T
A
NOTE 5: Unused inputs must be held high or low to prevent them from floating.
High-level input voltage 2 V Low-level input voltage 0.8 V Input voltage 0 V High-level output current –12 mA Low-level output current 12 mA Operating free-air temperature 0 85 °C
CC
V
timing requirements over recommended ranges of supply voltage and operating free-air temperature
MIN MAX UNIT
f
clk
Time required for the integrated PLL circuit to obtain phase lock of its feedback signal to its reference signal. For phase lock to be obtained, a fixed-frequency , fixed-phase reference signal must be present at CLK. Until phase lock is obtained, the specifications for propagation delay, skew , and jitter parameters given in the switching characteristics table are not applicable. This parameter does not apply for input modulation under SSC application.
4
Clock frequency 25 125 MHz Input clock duty cycle 40% 60% Stabilization time
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
1 ms
(INPUT)/CONDITION
(OUTPUT)
CDC2510C
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS621 – DECEMBER 1998
electrical characteristics over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS AVCC, V
V
IK
V
OH
V
OL
I
OH
I
OL
I
I
I
CC
I C
C
For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
§
For ICC of AVCC and ICC vs Frequency (see Figures 11 and 12).
Input clamp voltage II = –18 mA 3 V –1.2 V
IOH = –100 µA MIN to MAX VCC–0.2
High-level output voltage
Low-level output voltage
High-level output current
Low-level output current
Input current VI = VCC or GND 3.6 V ±5 µA
§
Supply current
Change in supply current
CC
Input capacitance VI = VCC or GND 3.3 V 4 pF
i
Output capacitance VO = VCC or GND 3.3 V 6 pF
o
IOH = –12 mA 3 V 2.1 IOH = –6 mA 3 V 2.4 IOL = 100 µA MIN to MAX 0.2 IOL = 12 mA 3 V 0.8 IOL = 6 mA 3 V 0.55 VO = 1 V 3.135 V –32 VO = 1.65 V 3.3 V –36 VO = 3.135 V 3.465 V –12 VO = 1.95 V 3.135 V 34 VO = 1.65 V 3.3 V 40 VO = 0.4 V 3.465 V 14
VI = VCC or GND, Outputs: low or high
One input at VCC – 0.6 V, Other inputs at VCC or GND
IO = 0,
3.3 V to 3.6 V 500 µA
CC
3.6 V 10 µA
MIN TYP‡MAX UNIT
V
V
mA
mA
switching characteristics over recommended ranges of supply voltage and operating free-air temperature, C
Phase error time – static (normalized) (See Figures 3 – 8)
t
sk(o)
t
r
t
f
These parameters are not production tested.
§
The t
NOTES: 6. The specifications for parameters in this table are applicable only after any appropriate stabilization time has elapsed.
Intel is a trademark of Intel Corporation. PC SDRAM Register DIMM Design Support Document is published by Intel Corporation.
Output skew time Phase error time – jitter (see Note 7) Clkin = 66 MHz to 100 MHz Any Y or FBOUT –50 50 ps Jitter Duty cycle F(clkin > 60 MHz) Any Y or FBOUT 45% 55%
Rise time (See Notes 8 and 9)
Fall time (See Notes 8 and 9)
specification is only valid for equal loading of all outputs.
sk(o)
7. Calculated per PC DRAM SPEC (t
8. This is equivalent to 0.8 ns/2.5 ns and 0.8 ns/2.7 ns into standard 500 / 30 pf load for output swing of 04. V to 2 V.
9. 64 MB DIMM configuration according to PC SDRAM Registered DIMM Design Support Document, Figure 20 and Table 13.
= 30 pF (see Note 6 and Figures 1 and 2)
L
PARAMETER
CLKIN = 66 MHz to 100 MHz FBIN –150 150 ps
(cycle-cycle)
§
(See Figures 9 and 10) Clkin = 66 MHz to 100 MHz Any Y or FBOUT |100| ps
phase error
Any Y or FBOUT Any Y or FBOUT 200 ps
VO = 1.2 V to 1.8 V,
IBIS simulation
VO = 1.2 V to 1.8 V,
IBIS simulation
, static – jitter
FROM
(cycle-to-cycle)
TO
Any Y or FBOUT 2.5 1 V/ns
Any Y or FBOUT 2.5 1 V/ns
).
VCC, AVCC = 3.3 V
± 0.165 V
MIN TYP MAX
UNIT
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
5
CDC2510C
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS621 – DECEMBER 1998
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
500
30 pF
W
Input
Output
3 V
50% V
CC
t
pd
t
r
0.4 V
2 V
50% V
CC
2 V
t
f
0.4 V
0 V
V
V
OH
OL
LOAD CIRCUIT FOR OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR 100 MHz, ZO = 50 , tr 1.2 ns, tf≤ 1.2 ns.
C. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
CLKIN
FBIN
t
phase error
FBOUT
Any Y
t
sk(o)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
Any Y
Any Y
t
sk(o)
Figure 2. Phase Error and Skew Calculations
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
CDC2510C
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS621 – DECEMBER 1998
TYPICAL CHARACTERISTICS
CDC2510C
PHASE ADJUSTMENT SLOPE AND PHASE ERROR
vs
LOAD CAPACITANCE
20
10
0
Phase Error
VCC = 3.3 V fc = 100 MHz C
= 30pF
(LY)
TA = 25°C See Notes A and B
200
100
0
–10
–20
Phase Adjustment Slope – ps/pF
–30
Phase Adjustment Slope
–40
0 5 10 15 20 25 30 35 40
C
– Lumped Feedback Capacitance at FBIN – pF
(LF)
45 50
Figure 3
CDC2510A
PHASE ADJUSTMENT SLOPE AND PHASE ERROR
vs
LOAD CAPACITANCE
10
0
–10
Phase Error
VCC = 3.3 V fc = 100 MHz C
= 30pF
(LY)
TA = 25°C See Notes A and B
–100
–200
–300
–400
100
0
–100
Phase Error – ps
–20
–30
Phase Adjustment Slope – ps/pF
–40
–50
Phase Adjustment Slope
0 5 10 15 20 25 30 35 40
C
– Lumped Feedback Capacitance at FBIN – pF
(LF)
–200
–300
–400
–500
45 50
Figure 4
NOTES: A. Trace feedback length FBOUT to FBIN = 5 mm, ZO = 50 Phase error measured from CLK to Y
B. CLF = Lumped feedback capacitance at FBIN
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Phase Error – ps
7
CDC2510C
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS621 – DECEMBER 1998
TYPICAL CHARACTERISTICS
PHASE ERROR
vs
CLOCK FREQUENCY
0
VCC = 3.3 V
–50
C
= 30 pF
(LY)
C
= 0
–100
–150
–200
–250
–300
Phase Error – ps
–350 –400
–450
–500
(LF)
TA = 25°C See Note A
20 40 60 80 100 120 140 160
fc – Clock Frequency – MHz
Figure 5
CDC2510C
STATIC PHASE ERROR
vs
CLOCK FREQUENCY
–200
VCC = 3.3 V C
= C
(LF)
= 30 pF
–300
(LY)
TA = 25°C See Notes B to D
PHASE ERROR
vs
SUPPLY VOLTAGE
0
fc = 100 MHz
–50
C
= 30 pF
(LY)
C
= 0
–100
–150
–200
–250
–300
Phase Error – ps
–350 –400
–450
–500
(LF)
TA = 25°C See Note A
3.1 3.2 3.3 3.4 3.5 VCC – Supply Voltage – V
Figure 6
CDC2510A
STATIC PHASE ERROR
vs
CLOCK FREQUENCY
–200
VCC = 3.3 V C
= C
(LF)
= 30 pF
–300
(LY)
See Notes B to D
–400
–500
Static Phase Error – ps
–600
–700
35 45 55 65 75 85 95 105 115 125
fc – Clock Frequency – MHz
Figure 7
NOTES: A. Trace feedback length FBOUT to FBIN = 5 mm, ZO = 50
8
B. Phase error measured from CLK to FBIN C. CLY = Lumped capacitive load at Y D. CLF = Lumped feedback capacitance at FBIN
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
–400
–500
Static Phase Error – ps
–600
–700
35 45 55 65 75 85 95 105 115 125
fc – Clock Frequency – MHz
Figure 8
CDC2510C
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS621 – DECEMBER 1998
TYPICAL CHARACTERISTICS
CDC2510C
JITTER
vs
CLOCK FREQUENCY
400
350
300
250
200
Jitter – ps
150
100
Cycle to Cycle
50
0
35 45 55 65 75 85 95 105 115 125
fc – Clock Frequency – MHz
VCC = 3.3 V C
= C
(LY)
TA = 25°C See Notes A and B
Peak to Peak
(LF)
Figure 9
= 30 pF
CDC2510A
JITTER
vs
CLOCK FREQUENCY
700
VCC = 3.3 V C
= C
600
500
400
Jitter – ps
300
200
Cycle to Cycle
100
0
35 45 55 65 75 85 95 105 115 125
fc – Clock Frequency – MHz
(LY)
TA = 25°C See Notes A and B
Peak to Peak
Figure 10
(LF)
= 30 pF
ANALOG SUPPLY CURRENT
CLOCK FREQUENCY
16
AVCC = VCC = 3.465 V
14
Bias = 0/3 V C
= 30 pf
(LY)
C
= 0
(LF)
12
TA = 25°C See Notes A and B
10
8
6
– Analog Supply Current – mA
4
CC
AI
2
0
10 30 50 70 90 110 130 150
fc – Clock Frequency – MHz
NOTES: A. C
B. C
= Lumped capacitive load at Y
(LY)
= Lumped feedback capacitance at FBIN
(LF)
vs
Figure 11
SUPPLY CURRENT
vs
CLOCK FREQUENCY
300
AVCC = VCC = 3.465 V Bias = 0/3 V C
250
200
150
– Supply Current – mA
100
CC
I
50
0
10 30 50 70 90 110 130 150
= 30 pf
(LY)
C
= 0
(LF)
TA = 25°C See Notes A and B
fc – Clock Frequency – MHz
Figure 12
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
9
CDC2510C
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS621 – DECEMBER 1998
TYPICAL CHARACTERISTICS
TI SILICON-BASED
PLL PULLDOWN IBIS I/V
120
VCC = 3.465 V
max
High IDS TA = 0°C
(Intel)
I
min
100
80
60
40
– Low-Level Output Current – mA
OL
20
I
0
0 0.5 1 1.5 2 2.5 3 3.5
I
VCC = 3.3 V Nom IDS TA = 25°C
VO – Output Voltage – V
Figure 13
(Intel)
VCC = 3.135 V Low IDS TA = 85°C
TI SILICON-BASED
PLL PULLUP IBIS I/V
0
VCC = 3.135 V Low IDS
–20
–40
–60
– High-Level Output Current – mA
–80
OH
I
–100
TA = 85°C
I
(Intel)
min
VCC = 3.3 V Nom IDS TA = 25°C
VCC = 3.465 V High IDS TA = 0°C
I
(Intel)
max
0 0.5 1 1.5 2 2.5 3 3.5
VO – Output Voltage – V
Figure 14
10
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
CDC2510C
3.3-V PHASE-LOCK LOOP CLOCK DRIVER
SCAS621 – DECEMBER 1998
MECHANICAL INFORMATION
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PIN SHOWN
0,65
14
1
1,20 MAX
A
7
0,05 MIN
0,30 0,19
8
6,60
4,50 4,30
6,20
M
0,10
Seating Plane
0,10
0,15 NOM
Gage Plane
0,25
0°–8°
0,75 0,50
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153
8
3,10
2,90
14
5,10
4,90
16
5,10
20
6,60
6,404,90
24
7,90
7,70
28
9,80
9,60
4040064/E 08/96
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
11
IMPORTANT NOTICE
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TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO BE FULLY AT THE CUSTOMER’S RISK.
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Copyright 1998, Texas Instruments Incorporated
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