Texas Instruments CD74HCT74M96, CD74HCT74M, CD74HCT74E, CD74HC74M96, CD74HC74M Datasheet

...
Data sheet acquired from Harris Semiconductor
/
SCHS124
January 1998
CD54HC74, CD74HC74,
CD74HCT74
Dual D Flip-Flop with Set and Reset
Positive-Edge Trigger
[ /Title (CD54H C74, CD74H C74, CD74H CT74)
Subject (Dual D Flip­Flop with Set
Features
• Hysteresis on Clock Inputs for Improved Noise Immu­nity and Increased Input Rise and Fall Times
• Asynchronous Set and Reset
• Complementary Outputs
• Typical f T
= 25oC
A
• Fanout (Over Temperature Range)
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
• Wide Operating Temperature Range . . . -55
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: N
at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
V
= 0.8V (Max), VIH = 2V (Min)
IL
- CMOS Input Compatibility, I
= 50MHz at VCC = 5V, CL = 15pF,
MAX
= 30%, NIH = 30% of V
IL
1µA at VOL, V
l
o
C to 125oC
OH
CC
Description
The Harris CD54HC74, CD74HC74 and CD74HCT74 utilize silicon gate CMOS technology to achieve operating speeds equivalent to LSTTL parts. They exhibit the low power consumption of standard CMOS integrated circuits, together with the ability to drive 10 LSTTL loads.
This flip-flop has independent DATA, CLOCK inputs and Q and
Q outputs. The logic level present
SET, RESET and
at the data input is transferred to the output during the positive-going transition of the clock pulse.
SET and RESET are independent of the clock and are accomplished by a low level at the appropriate input.
The 74HCT logic family is functionally as well as pin compatible with the standard 74LS logic family.
Ordering Information
TEMP. RANGE
PART NUMBER
CD54HC74F -55 to 125 14 Ld CERDIP F14.3 CD74HC74E -55 to 125 14 Ld PDIP E14.3 CD74HCT74E -55 to 125 14 Ld PDIP E14.3 CD74HC74M -55 to 125 14 Ld SOIC M14.15 CD74HCT74M -55 to 125 14 Ld SOIC M14.15
NOTES:
1. When ordering, use the entire part number. Add the suffix 96 to obtain the variant in the tape and reel.
2. Die is available which meets all electrical specifications. Please contact your local sales office or Harris customer service for ordering information.
(oC) PACKAGE
PKG.
NO.
Pinout
CD54HC74, CD74HC74, CD74HCT74
(PDIP, SOIC, CERDIP)
TOP VIEW
1R
1 2
1D
1CP
3
1
S
4
1Q
5
1
Q
6 7
GND
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright
© Harris Corporation 1998
14
V
CC
2R
13
2D
12
2CP
11
2
S
10
9
2Q
Q
8
2
1
File Number 1476.1
CD54HC74, CD74HC74, CD74HCT74
Functional Diagram
RESET
CLOCK
RESET
CLOCK
INPUTS OUTPUTS
SET RESET CP D Q Q
LHXXHL
H
L H H
L L H H
HHLXQ0Q0
NOTE: H = High Level (Steady State) L = Low Level (Steady State) X = Don’t Care
= Low-to-High Transition
Q0 = the level of Q before the indicated input conditions were established.
3. This configuration is nonstable, that is, it will not persist when set and reset inputs return to their inactive (high) level.
1
R
D
F/F 1
CP
S
R
D
F/F 2
CP
S
5
Q
6
Q
9
Q
8
Q
GND = PIN 7 V
= PIN 14
CC
DAT A
SET
DAT A
SET
2
3
4
13
12
11
10
TRUTH TABLE
XXLH X X H (Note 3) H (Note 3)
HHLLLH
2
CD54HC74, CD74HC74, CD74HCT74
Absolute Maximum Ratings Thermal Information
DC Supply Voltage, VCC. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, I
IK
For VI < -0.5V or VI > VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
DC Drain Current, per Output, I
O
For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA
DC Output Diode Current, I
OK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, I
O
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA
Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, V
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to V
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
4. θJA is measured with the component mounted on an evaluation PC board in free air.
CC
Thermal Resistance (Typical, Note 4) θJA (oC/W) θJC (oC/W)
PDIP Package. . . . . . . . . . . . . . . . . . . 90 -
SOIC Package. . . . . . . . . . . . . . . . . . . 120 -
CERDIP Package . . . . . . . . . . . . . . . . 130 55
Maximum Junction Temperature (Hermetic Package or Die) . . . 175oC
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
CC
DC Electrical Specifications
PARAMETER SYMBOL
HC TYPES
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage CMOS Loads
High Level Output Voltage TTL Loads
Low Level Output Voltage CMOS Loads
Low Level Output Voltage TTL Loads
Input Leakage Current
V
IH
V
IL
V
OH
V
OL
I
I
TEST
CONDITIONS
(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
I
VCC (V)
o
25
C -40oC TO 85oC -55oC TO 125oC
- - 2 1.5 - - 1.5 - 1.5 - V
4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V
- - 2 - - 0.5 - 0.5 - 0.5 V
4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V
VIH or
V
-0.02 2 1.9 - - 1.9 - 1.9 - V
IL
4.5 4.4 - - 4.4 - 4.4 - V 6 5.9 - - 5.9 - 5.9 - V
---------V
-4 4.5 3.98 - - 3.84 - 3.7 - V
-5.2 6 5.48 - - 5.34 - 5.2 - V
VIH or
V
0.02 2 - - 0.1 - 0.1 - 0.1 V
IL
4.5 - - 0.1 - 0.1 - 0.1 V 6 - - 0.1 - 0.1 - 0.1 V
---------V
4 4.5 - - 0.26 - 0.33 - 0.4 V
5.2 6 - - 0.26 - 0.33 - 0.4 V
VCC or
-6--±0.1 - ±1-±1µA
GND
UNITSV
3
CD54HC74, CD74HC74, CD74HCT74
DC Electrical Specifications (Continued)
TEST
CONDITIONS
PARAMETER SYMBOL
Quiescent Device Current
I
CC
(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
I
VCC or
GND
HCT TYPES
High Level Input
V
IH
- - 4.5 to
Voltage Low Level Input
V
IL
- - 4.5 to
Voltage High Level Output
Voltage
V
OH
VIH or
V
IL
CMOS Loads High Level Output
-0.02 4.5 3.98 - - 3.84 - 3.7 - V Voltage TTL Loads
Low Level Output Voltage CMOS Loads
V
OL
VIH or
V
IL
Low Level Output Voltage TTL Loads
Input Leakage Current
I
I
V
CC
and
GND
Quiescent Device Current
Additional Quiescent Device Current Per
I
CC
I
CC
(Note 5)
VCC or
GND
V
CC
- 2.1
Input Pin: 1 Unit Load
NOTE:
5. For dual-supply systems theoretical worst case (V
o
25
C -40oC TO 85oC -55oC TO 125oC
V
CC
(V)
UNITSV
0 6 - - 4 - 40 - 80 µA
2-- 2 - 2 - V
5.5
- - 0.8 - 0.8 - 0.8 V
5.5
- 4.5 4.4 - - 4.4 - 4.4 - V
-4 4.5 - - 0.1 - 0.1 - 0.1 V
0.02 4.5 - - 0.26 - 0.33 - 0.4 V
4 5.5 - ±0.1 - ±1-±1µA
0 5.5 - - 4 - 40 - 80 µA
- 4.5 to
- 100 360 - 450 - 490 µA
5.5
= 2.4V, VCC = 5.5V) specification is 1.8mA.
I
HCT Input Loading Table
INPUT UNIT LOADS
D 0.5 R 0.5
CP 0.7
S 0.75
NOTE: Unit Load is I
limit specified in DC Electrical Specifica-
CC
tions table, e.g., 360µA max at 25oC.
Prerequisite For Switching Specifications
TEST
PARAMETER SYMBOL
HC TYPES
Data to CP Setup Time (Figure 5)
t
SU
CONDITIONS
o
25
V
CC
(V)
C -40oC TO 85oC -55oCTO125oC
UNITSMIN TYP MAX MIN MAX MIN MAX
- 2 60 - - 75 - 90 - ns
4.5 12 - - 15 - 18 - ns 6 10 - - 13 - 15 - ns
4
CD54HC74, CD74HC74, CD74HCT74
Prerequisite For Switching Specifications (Continued)
PARAMETER SYMBOL
Hold Time (Figure 5) t
Removal Time
R, S, to CP
t
(Figure 5)
Pulse Width
R, S (Figure 1) t
Pulse Width CP (Figure 1) t
CP Frequency f
HCT TYPES
Data to CP Setup Time (Figure 6)
Hold Time (Figure 6) t Removal Time
R, S, to CP
t
(Figure 6) Pulse Width
R, S (Figure 2) t Pulse Width CP (Figure 2) t CP Frequency f
H
REM
W
W
MAX
t
SU
H
REM
W W
MAX
TEST
CONDITIONS
-23--3-3-ns
- 2 30 - - 40 - 45 - ns
- 2 80 - - 100 - 120 - ns
- 2 80 - - 100 - 120 - ns
- 2 6 - - 5 - 4 - MHz
- 4.5 12 - - 15 - 18 - ns
- 4.5 3 - - 3 - 3 - ns
- 4.5 6 - - 8 - 9 - ns
- 4.5 16 - - 20 - 24 - ns
- 4.5 18 - - 23 - 27 - ns
- 4.5 25 - - 20 - 16 - MHz
V
CC
(V)
4.5 3 - - 3 - 3 - ns 63--3-3-ns
4.5 6 - - 8 - 9 - ns 65--7-8-ns
4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns
4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns
4.5 30 - - 25 - 20 - MHz 6 35 - - 29 - 23 - MHz
o
25
C -40oC TO 85oC -55oCTO125oC
UNITSMIN TYP MAX MIN MAX MIN MAX
Switching Specifications Input t
PARAMETER SYMBOL
HC TYPES
Propagation Delay, CP to Q,
Q (Figure 3)
Propagation Delay, R, S to Q, Q (Figure 3)
Transition Time (Figure 3) t
Input Capacitance C
t
PLH
t
PLH
TLH
, tf = 6ns
r
, t
PHLCL
, t
PHLCL
, t
THLCL
I
o
C -40oC TO 85oC -55oCTO125oC
TEST
CONDITIONS
V
CC
(V)
25
UNITSMIN TYP MAX MIN MAX MIN MAX
= 50pF 2 - - 175 - 220 - 265 ns = 50pF 4.5 - - 35 - 44 - 53 ns
C
L
= 15pF 5 - 14 - ----ns
C
L
= 50pF 6 - - 30 - 37 - 45 ns
C
L
= 50pF 2 - - 200 - 250 - 300 ns = 50pF 4.5 - - 40 - 50 - 60 ns
C
L
C
= 15pF 5 - 17 - ----ns
L
= 50pF 6 - - 34 - 43 - 51 ns
C
L
= 50pF 2 - - 75 - 95 - 110 ns = 50pF 4.5 - - 15 - 19 - 22 ns
C
L
= 50pF 6 - - 13 - 16 - 19 ns
C
L
- - - - 10 - 10 - 10 pF
5
CD54HC74, CD74HC74, CD74HCT74
Switching Specifications Input t
, tf = 6ns (Continued)
r
PARAMETER SYMBOL
CP Frequency f Power Dissipation Capacitance
MAX
C
PD
(Notes 6, 7)
HCT TYPES
t
Propagation Delay, CP to Q,
Q (Figure 4)
Propagation Delay,
PLH
t
PHL
, t
PHLCL
, t
PLH
R, S to Q, Q (Figure 4) Transition Time (Figure 4) t Input Capacitance C CP Frequency f Power Dissipation Capacitance
TLH
, t
MAX
C
PD
I
THLCL
(Notes 6, 7)
NOTES:
6. C
is used to determine the dynamic power consumption, per flip-flop.
PD
7. PD=CPDV
2
fi+ Σ (CLV
CC
2
fo) where fi= input frequency, fo= output frequency, CL= output load capacitance, VCC= supply voltage.
CC
Test Circuits and Waveforms
trC
L
CLOCK
10%
90%
50%
10%
tfC
t
L
WL
tWL+ tWH=
50%
t
o
25
TEST
CONDITIONS
V
CC
(V)
C -40oC TO 85oC -55oCTO125oC
CL = 15pF 5 - 50 - ----MHz
- 5-25-----pF
= 50pF 4.5 - - 35 - 44 - 53 ns
CL = 50pF 4.5 - - 40 - 50 - 60 ns
= 50pF 4.5 - - 15 - 19 - 22 ns
- - - - 10 - 10 - 10 pF
CL = 15pF 5 - 50 - ----MHz
- 5-30-----pF
+ tWH=
t
WH
f
CL
50%
I
V
CC
GND
t
rCL
CLOCK
= 6ns
0.3V
2.7V
1.3V
0.3V
t
t
fCL
WL
= 6ns
1.3V
t
WL
1.3V
WH
UNITSMIN TYP MAX MIN MAX MIN MAX
I
fC
L
3V
GND
NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table.For f
, input duty cycle = 50%.
MAX
FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
tr = 6ns tf = 6ns
V
t
CC
GND
TLH
INPUT
t
INVERTING
OUTPUT
THL
t
PHL
90% 50% 10%
t
90%
50%
10%
PLH
FIGURE 3. HC AND HCU TRANSITION TIMES AND PROPAGA-
TION DELAY TIMES, COMBINATION LOGIC
NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table.For f
, input duty cycle = 50%.
MAX
FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
= 6ns
t
PLH
t
f
1.3V
10%
90%
t
TLH
3V
GND
tr = 6ns
INPUT
t
INVERTING
OUTPUT
THL
t
PHL
2.7V
1.3V
0.3V
FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
6
CD54HC74, CD74HC74, CD74HCT74
Test Circuits and Waveforms
90%
t
PLH
IC
t
TLH
tfC
L
50%
C 50pF
CLOCK
INPUT
DAT A
INPUT
t
SU(H)
OUTPUT
t
REM
V
CC
SET, RESET OR PRESET
trC
L
90%
10%
t
H(H)
50%
(Continued)
t
H(L)
t
SU(L)
t
THL
90%
50%
10% t
PHL
L
V
CC
GND
V
CC
50% GND
GND
CLOCK
INPUT
DAT A
INPUT
t
SU(H)
OUTPUT
t
REM
3V SET, RESET OR PRESET
trC
90%
t
PLH
IC
1.3V
t
TLH
tfC
L
1.3V
t
H(L)
1.3V
t
SU(L)
t
THL
90%
1.3V 10%
t
PHL
C
L
50pF
3V
GND
3V
GND
GND
L
2.7V
0.3V
t
H(H)
1.3V
1.3V
1.3V
FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS
FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVALTIME,
AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS
7
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