• Significant Power Reduction Compared to LSTTL
Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: N
at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
V
= 0.8V (Max), VIH = 2V (Min)
IL
- CMOS Input Compatibility, I
= 50MHz at VCC = 5V, CL = 15pF,
MAX
= 30%, NIH = 30% of V
IL
≤ 1µA at VOL, V
l
o
C to 125oC
OH
CC
Description
The Harris CD54HC74, CD74HC74 and CD74HCT74 utilize
silicon gate CMOS technology to achieve operating speeds
equivalent to LSTTL parts. They exhibit the low power
consumption of standard CMOS integrated circuits, together
with the ability to drive 10 LSTTL loads.
This flip-flop has independent DATA,
CLOCK inputs and Q and
Q outputs. The logic level present
SET, RESET and
at the data input is transferred to the output during the
positive-going transition of the clock pulse.
SET and RESET
are independent of the clock and are accomplished by a low
level at the appropriate input.
The 74HCT logic family is functionally as well as pin
compatible with the standard 74LS logic family.
Ordering Information
TEMP. RANGE
PART NUMBER
CD54HC74F-55 to 12514 Ld CERDIPF14.3
CD74HC74E-55 to 12514 Ld PDIPE14.3
CD74HCT74E-55 to 12514 Ld PDIPE14.3
CD74HC74M-55 to 12514 Ld SOICM14.15
CD74HCT74M-55 to 12514 Ld SOICM14.15
NOTES:
1. When ordering, use the entire part number. Add the suffix 96 to
obtain the variant in the tape and reel.
2. Die is available which meets all electrical specifications. Please
contact your local sales office or Harris customer service for
ordering information.
(oC)PACKAGE
PKG.
NO.
Pinout
CD54HC74, CD74HC74, CD74HCT74
(PDIP, SOIC, CERDIP)
TOP VIEW
1R
1
2
1D
1CP
3
1
S
4
1Q
5
1
Q
6
7
GND
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
4. θJA is measured with the component mounted on an evaluation PC board in free air.
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table.For f
, input duty cycle = 50%.
MAX
FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
tr = 6nstf = 6ns
V
t
CC
GND
TLH
INPUT
t
INVERTING
OUTPUT
THL
t
PHL
90%
50%
10%
t
90%
50%
10%
PLH
FIGURE 3. HC AND HCU TRANSITION TIMES AND PROPAGA-
TION DELAY TIMES, COMBINATION LOGIC
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table.For f
, input duty cycle = 50%.
MAX
FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
= 6ns
t
PLH
t
f
1.3V
10%
90%
t
TLH
3V
GND
tr = 6ns
INPUT
t
INVERTING
OUTPUT
THL
t
PHL
2.7V
1.3V
0.3V
FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
6
CD54HC74, CD74HC74, CD74HCT74
Test Circuits and Waveforms
90%
t
PLH
IC
t
TLH
tfC
L
50%
C
50pF
CLOCK
INPUT
DAT A
INPUT
t
SU(H)
OUTPUT
t
REM
V
CC
SET, RESET
OR PRESET
trC
L
90%
10%
t
H(H)
50%
(Continued)
t
H(L)
t
SU(L)
t
THL
90%
50%
10%
t
PHL
L
V
CC
GND
V
CC
50%
GND
GND
CLOCK
INPUT
DAT A
INPUT
t
SU(H)
OUTPUT
t
REM
3V
SET, RESET
OR PRESET
trC
90%
t
PLH
IC
1.3V
t
TLH
tfC
L
1.3V
t
H(L)
1.3V
t
SU(L)
t
THL
90%
1.3V
10%
t
PHL
C
L
50pF
3V
GND
3V
GND
GND
L
2.7V
0.3V
t
H(H)
1.3V
1.3V
1.3V
FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVALTIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
7
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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