Texas Instruments CD74HCT597M96, CD74HCT597M, CD74HCT597E, CD74HC597M96, CD74HC597M Datasheet

...
CD74HC597,
/ j
[ /Title (CD74 HC597 , CD74 HCT59
7) Sub­ect
(High Speed CMOS
Data sheet acquired from Harris Semiconductor SCHS191
January 1998
Features
• Buffered Inputs
• Asynchronous Parallel Load
• Typical f
• Fanout (Over Temperature Range)
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
• Wide Operating Temperature Range . . . -55
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: N
at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
V
= 0.8V (Max), VIH = 2V (Min)
IL
- CMOS Input Compatibility, I
= 60MHz at VCC=5V,CL= 15pF, TA=25oC
MAX
o
= 30%, NIH = 30% of V
IL
1µA at VOL, V
l
C to 125oC
CC
OH
CD74HCT597
High Speed CMOS Logic
8-Bit Shift Register with Input Storage
Description
The Harris CD74HC597 and CD74HCT597 are high-speed silicon gate CMOS devices that are pin-compatible with the LSTTL 597 devices. Each device consists of an 8-flip-flop input register and an 8-bit parallel-in/serial-in, serial-out shift register.Each register is controlled by its own clock. A “low”on the parallel load input ( chronously into the shift register. A “low” master input ( clears the shift register. Serial input data can also be synchro­nously shifted through the shift register when
Ordering Information
PART NUMBER TEMP. RANGE (oC) PACKAGE
CD74HC597E -55 to 125 16 Ld PDIP E16.3 CD74HCT597E -55 to 125 16 Ld PDIP E16.3 CD74HC597M -55 to 125 16 Ld SOIC M16.15 CD74HCT597M -55 to 125 16 Ld SOIC M16.15
NOTES:
1. When ordering, use the entire part number.Add the suffix 96 to obtain the variant in the tape and reel.
2. Wafer and die is available which meets all electrical specifications. Please contact your local sales office or Harris customer service for ordering information.
PL) shifts parallel stored data asyn-
MR)
PL is high.
PKG.
NO.
Pinout
CD74HC597, CD74HCT597
(PDIP, SOIC)
TOP VIEW
V
1
D1 D2
2
D3
3
D4
4 5
D5 D6
6 7
D7
GND
8
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright
© Harris Corporation 1998
1
16
CC
15
D0
14
D
S
13
PL
12
ST
CP
11
SH
CP
10
MR
9
Q7
File Number 1915.1
Functional Diagram
CD74HC597, CD74HCT597
PARALLEL
DAT A
INPUTS
ST
SH
DS
D0 D1
D2 D3 D4 D5 D6 D7
CP
CP
PL
MR
15
1 2 3 4
STORAGE
5 6
7 12 11
13 10
8 F/F REG.
8-BIT
SHIFT
REG.
14
9
Q7
FUNCTION TABLE
ST
CP
SH
CP
PL MR FUNCTION
X X X Data Loaded to Input Flip-Flops X L H Data Loaded from Inputs to Shift Register
No Clock Edge X L H Data Transferred from Input Flip-Flops to Shift Register
X X L L InvalidLogic, State of Shift Register Indeterminate when
Signals Removed X X H L Shift Register Cleared X H H Shift Register Clocked Qn = Qn-1, Q0 = D
S
NOTE: H = High Voltage Level, L = Low Voltage Level, X = Don’t Care, = Transition from Low to High CP Level
2
CD74HC597, CD74HCT597
Absolute Maximum Ratings Thermal Information
DC Supply Voltage, VCC. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, I
IK
For VI < -0.5V or VI > VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, I
OK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Drain Current, per Output, I
O
For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA
DC Output Source or Sink Current per Output Pin, I
O
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, V
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to V
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3. θJA is measured with the component mounted on an evaluation PC board in free air.
CC
Thermal Resistance (Typical, Note 3) θJA (oC/W)
PDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
Maximum Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
CC
DC Electrical Specifications
PARAMETER SYMBOL
HC TYPES
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage CMOS Loads
High Level Output Voltage TTL Loads
Low Level Output Voltage CMOS Loads
Low Level Output Voltage TTL Loads
Input Leakage Current
V
IH
V
IL
V
OH
V
OL
I
I
TEST
CONDITIONS
V
CC
(V)
25oC -40oC TO 85oC -55oCTO125oC
UNITSVI(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
- - 2 1.5 - - 1.5 - 1.5 - V
4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V
- - 2 - - 0.5 - 0.5 - 0.5 V
4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V
VIHor VIL-0.02 2 1.9 - - 1.9 - 1.9 - V
-0.02 4.5 4.4 - - 4.4 - 4.4 - V
-0.02 6 5.9 - - 5.9 - 5.9 - V
- - ---- - - -V
-4 4.5 3.98 - - 3.84 - 3.7 - V
-5.2 6 5.48 - - 5.34 - 5.2 - V
VIHor VIL0.02 2 - - 0.1 - 0.1 - 0.1 V
0.02 4.5 - - 0.1 - 0.1 - 0.1 V
0.02 6 - - 0.1 - 0.1 - 0.1 V
- - ---- - - -V 4 4.5 - - 0.26 - 0.33 - 0.4 V
5.2 6 - - 0.26 - 0.33 - 0.4 V
VCC or
-6--±0.1 - ±1-±1µA
GND
3
CD74HC597, CD74HCT597
DC Electrical Specifications (Continued)
TEST
CONDITIONS
PARAMETER SYMBOL
Quiescent Device Current
HCT TYPES
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage CMOS Loads
High Level Output Voltage TTL Loads
Low Level Output Voltage CMOS Loads
Low Level Output Voltage TTL Loads
Input Leakage Current
Quiescent Device Current
Additional Quiescent Device Current Per Input Pin: 1 Unit Load
I
CC
V
IH
V
IL
V
OH
V
OL
I
I
CC
I
CC
VCC or
GND
- - 4.5 to
- - 4.5 to
VIHor VIL-0.02 4.5 4.4 - - 4.4 - 4.4 - V
VIHor VIL0.02 4.5 - - 0.1 - 0.1 - 0.1 V
VCCand
I
GND
VCC or
GND
V
CC
-2.1
V
CC
(V)
0 6 - - 8 - 80 - 160 µA
5.5
5.5
-4 4.5 3.98 - - 3.84 - 3.7 - V
4 4.5 - - 0.26 - 0.33 - 0.4 V
0 5.5 - ±0.1 - ±1-±1µA
0 5.5 - - 8 - 80 - 160 µA
- 4.5 to
5.5
25oC -40oC TO 85oC -55oCTO125oC
UNITSVI(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
2--2 - 2 - V
- - 0.8 - 0.8 - 0.8 V
- 100 360 - 450 - 490 µA
HCT Input Loading Table
INPUT UNIT LOADS
D
S
D
n
PL, MR 1.5
STCP, SH
NOTE: Unitload is ICClimit specified in DC Electrical Specifications Table, e.g., 360µA max. at 25oC.
CP
0.2
0.3
1.5
Prerequisite for Switching Specifications
25oC -40oC TO 85oC -55oC TO 125oC
PARAMETER SYMBOL VCC(V)
HC TYPES
SHCP Frequency f
MAX
2 6 - - 5 - - 4 - - MHz
4.5 30 - - 25 - - 20 - - MHz 6 35 - - 29 - - 23 - - MHz
UNITSMIN TYP MAX MIN TYP MAX MIN TYP MAX
4
CD74HC597, CD74HCT597
Prerequisite for Switching Specifications (Continued)
25oC -40oC TO 85oC -55oC TO 125oC
PARAMETER SYMBOL V
SHCP Pulse Width t
STCP Pulse Width t
MR Pulse Width t
PL Pulse Width t
STCP to SHCP Setup Time
D
to SHCP Setup Time
S
Dn to STCP Setup Time
(V)
CC
W
2 80 - - 100 - - 120 - - ns
UNITSMIN TYP MAX MIN TYP MAX MIN TYP MAX
4.5 16 - - 20 - - 24 - - ns 614--17- -20--ns
W
260--75- -90--ns
4.5 12 - - 15 - - 18 - - ns 610--13- -15--ns
W
2 80 - - 100 - - 120 - - ns
4.5 16 - - 20 - - 24 - - ns 614--17- -20--ns
W
2 70 - - 90 - - 105 - - ns
4.5 14 - - 18 - - 21 - - ns 612--15- -18--ns
t
SU
2 100 - - 125 - - 150 - - ns
4.5 20 - - 25 - - 30 - - ns 617--21- -26--ns
t
SU
250--65- -75--ns
4.5 10 - - 13 - - 15 - - ns
STCP to SHCP Setup Time
D
to SHCP Hold Time
S
Dn to STCP Hold Time
MR to SHCP Removal Time
HCT TYPES
SHCP Frequency f SHCP Pulse Width t STCP Pulse Width t MR Pulse Width t PL Pulse Width t STCP to SHCP Setup
Time
t
REM
MAX
t
t
H
t
H
W
W
W
W
SU
6 9 - - 11 - - 13 - - ns 20--0--0--ns
4.5 0 - - 0 - - 0 - - ns 60--0--0--ns 23--3--3--ns
4.5 3 - - 3 - - 3 - - ns 63--3--3--ns 23--3--3--ns
4.5 3 - - 3 - - 3 - - ns 63--3--3--ns
4.5 25 - - 20 - - 16 - - MHz
4.5 20 - - 25 - - 30 - - ns
4.5 13 - - 16 - - 20 - - ns
4.5 18 - - 23 - - 27 - - ns
4.5 16 - - 20 - - 24 - - ns
4.5 24 - - 30 - - 36 - - ns
5
CD74HC597, CD74HCT597
Prerequisite for Switching Specifications (Continued)
25oC -40oC TO 85oC -55oC TO 125oC
PARAMETER SYMBOL V
DS to SHCP Setup Time
t
H
(V)
CC
4.5 10 - - 13 - - 15 - - ns
Dn to STCP Setup Time STCPto SHCPHold Time t DS to SHCP Hold Time
H
t
H
4.5 0 - - 0 - - 0 - - ns
4.5 3 - - 3 - - 3 - - ns
Dn to STCP Hold Time MR to SHCP Removal
t
REM
4.5 10 - - 13 - - 15 - - ns
Time
Switching Specifications Input t
PARAMETER SYMBOL
, tf = 6ns
r
CONDITIONS V
TEST
CC
25oC -40oCto85oC -55oC to 125oC
(V)
HC TYPES
Propagation Delay t
PLH,tPHL
CL= 50pF 2 - - 175 - 220 - 265 ns
SHCP to Q7 4.5 - - 35 - 44 - 53 ns
CL=15pF 5 - 14 - - - - - ns
CL= 50pF 6 - - 30 - 37 - 45 ns
PL to Q7 t
PLH,tPHL
CL= 50pF 2 - - 200 - 250 - 300 ns
4.5 - - 40 - 50 - 60 ns
CL=15pF 5 - 17 - - - - - ns
CL= 50pF 6 - - 34 - 43 - 51 ns
STCP to Q7 t
PLH,tPHL
CL= 50pF 2 - - 240 - 300 - 360 ns
4.5 - - 48 - 60 - 72 ns
CL=15pF 5 - 20 - - - - - ns
CL= 50pF 6 - - 41 - 51 - 61 ns
MR to Q7 t
PLH,tPHL
CL= 50pF 2 - - 175 - 220 - 265 ns
4.5 - - 35 - 44 - 53 ns
CL=15pF 5 - 14 - - - - - ns
CL= 50pF 6 - - 30 - 37 - 45 ns
Output Transition Time t
TLH
, t
CL= 50pF 2 - - 75 - 95 - 110 ns
THL
4.5 - - 15 - 19 - 22 ns 6 - - 13 - 16 - 19 ns
Input Capacitance C Power Dissipation
C
I
PD
CL= 50pF - - - 10 - 10 - 10 pF
- 5 - 13.5 - - - - - pF
Capacitance, (Notes 4, 5)
HCT
Propagation Delay t
PLH,tPHL
SHCP to Q7 CL= 50pF 4.5 - - 38 - 48 - 57 ns
CL= 15pF 5 - 16 - - - - - ns
PL to Q7 t
PLH,tPHL
CL= 50pF 4.5 - - 48 60 72 ns CL= 15pF 5 - 20 - - - - - ns
STCP to Q7 t
PLH,tPHL
CL= 50pF 4.5 - - 56 70 84 ns CL= 15pF 5 - 23 - - - - - ns
UNITSMIN TYP MAX MIN TYP MAX MIN TYP MAX
UNITSMIN TYP MAX MIN MAX MIN MAX
6
CD74HC597, CD74HCT597
Switching Specifications Input t
, tf = 6ns (Continued)
r
TEST
PARAMETER SYMBOL
MR to Q7 t
PLH,tPHL
CONDITIONS V
CC
(V)
CL= 50pF 4.5 - - 44 - 55 - 66 ns
CL= 15pF 5 - 18 - - - - - ns Output Transition Time t Input Capacitance C Power Dissipation
TLH
, t
I
C
PD
CL= 50pF 4.5 - - 15 - 19 - 22 ns
THL
CL= 50pF - - - 10 - 10 - 10 pF
- 5 - 18.5 - - - - - pF
Capacitance, (Notes 4, 5)
NOTES:
4. CPD is used to determine the dynamic power consumption, per package.
5. PD=CPDV
CC
2
fi+ Σ (CLV
2
fo) where: fi= Input Frequency, fo= Output Frequency, CL= Output Load Capacitance, VCC= Supply
CC
Voltage.
Test Circuits and Waveforms
trC
L
CLOCK
10%
90%
50%
10%
tfC
t
WL
L
tWL+ tWH=
50%
t
WH
fC
50%
I
L
V
CC
GND
25oC -40oCto85oC -55oC to 125oC
= 6ns
t
rCL
CLOCK
2.7V
0.3V
1.3V
0.3V
t
t
fCL
WL
= 6ns
1.3V
t
WH
t
WL
+ tWH=
1.3V
UNITSMIN TYP MAX MIN MAX MIN MAX
I
fC
L
3V
GND
NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. Forf
, input duty cycle = 50%.
MAX
FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
tr = 6ns tf = 6ns
V
t
CC
GND
TLH
INPUT
t
INVERTING
OUTPUT
THL
t
PHL
90% 50% 10%
t
90%
50%
10%
PLH
FIGURE 3. HC TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. Forf
, input duty cycle = 50%.
MAX
FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
= 6ns
t
PLH
t
f
1.3V
10%
90%
t
3V
GND
TLH
tr = 6ns
INPUT
t
INVERTING
OUTPUT
THL
t
PHL
2.7V
1.3V
0.3V
FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
7
CD74HC597, CD74HCT597
Test Circuits and Waveforms
90%
t
PLH
IC
t
TLH
tfC
L
50%
C 50pF
CLOCK
INPUT
DAT A
INPUT
t
SU(H)
OUTPUT
t
REM
V
CC
SET, RESET OR PRESET
trC
L
90%
10%
t
H(H)
50%
(Continued)
t
H(L)
t
SU(L)
t
THL
90%
50%
10% t
PHL
L
V
CC
GND
V
CC
50% GND
GND
CLOCK
INPUT
DAT A
INPUT
t
SU(H)
OUTPUT
t
REM
3V SET, RESET OR PRESET
trC
90%
t
PLH
IC
1.3V
t
TLH
tfC
L
1.3V
t
H(L)
1.3V
t
SU(L)
t
THL
90%
1.3V 10%
t
PHL
C
L
50pF
3V
GND
3V
GND
GND
L
2.7V
0.3V
t
H(H)
1.3V
1.3V
1.3V
FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS
FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVALTIME,
AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS
8
Timing Diagram
SHIFT CLOCK
SH
CP
CD74HC597, CD74HCT597
SERIAL DATE
MASTER RESET
PARALLEL LOAD
STORAGE CLOCK
PARALLEL
DAT A
INPUTS
ST
D
MR
PL
CP
S
D0
D1
D2
D3
D4
D5
D6
H
L
H
L
H
H
L
L
L
L
L
L
L
L
L
L
L
L
H
H
L
D7
Q7
RESET
SHIFT
REGISTER
FLIP-FLOPS
H
LL L L L L LLL L
SERIAL
SHIFT
LOAD
HHHH H H H HH
SERIAL
SHIFT
PARALLEL LOAD SHIFT REGISTER
H
LOAD
FLIP-FLOPS
SERIAL
SHIFT
PARALLEL LOAD SHIFT REGISTER
H
PARALLEL LOAD FLIP-FLOPS AND SHIFT REGISTER
SERIAL
SHIFT
9
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