• Significant Power Reduction Compared to LSTTL
Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: N
at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
V
= 0.8V (Max), VIH = 2V (Min)
IL
- CMOS Input Compatibility, I
= 30%, NIH = 30% of V
IL
≤ 1µA at VOL, V
l
o
C to 125oC
CC
OH
CD74HCT126
High Speed CMOS Logic
Quad Buffer, Three-State
Description
The Harris CD74HC126 and CD74HCT126 contain four
independent three-state buffers, each having its own output
enable input, which when “low” puts the output in the highimpedance state.
Ordering Information
TEMP.RANGE
PART NUMBER
CD74HC126E-55 to 12514 Ld PDIPE14.3
CD74HCT126E-55 to 12514 Ld PDIPE14.3
CD74HC126M-55 to 12514 Ld SOICM14.15
CD74HCT126M-55 to 12514 Ld SOICM14.15
NOTES:
1. When ordering, use the entire part number.Add thesuffix 96to
obtain the variant in the tape and reel.
2. Wafer and die for this part number is available which meets all
electrical specifications. Please contact yourlocal salesoffice or
Harris customer service for ordering information.
(oC)PACKAGE
PKG.
NO.
Pinout
CD74HC126, CD74HC126
(PDIP, SOIC)
TOP VIEW
1OE
1
2
1A
1Y
3
2OE
4
2A
5
2Y
6
GND
7
V
14
CC
4OE
13
4A
12
4Y
11
3OE
10
3A
9
3Y
8
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3. θJA is measured with the component mounted on an evaluation PC board in free air.
5. CPD is used to determine the dynamic power consumption, per multiplexer.
6. PD = V
2
fi(CPD + CL) where fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage.
CC
25oC-40oC TO 85oC -55oCTO125oC
UNITSTYPMAXMAXMAX
5
Test Circuits and Waveforms
tr = 6nstf = 6ns
INPUT
90%
50%
10%
CD74HC126, CD74HCT126
tr = 6ns
V
CC
GND
INPUT
2.7V
1.3V
0.3V
= 6ns
t
f
3V
GND
INVERTING
OUTPUT
t
THL
t
PHL
t
PLH
50%
10%
90%
t
TLH
FIGURE 6. HC TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
6ns6ns
OUTPUT
DISABLE
OUTPUT LOW
TO OFF
OUTPUT HIGH
TO OFF
50%
t
t
OUTPUTS
ENABLED
PLZ
PHZ
10%
90%
90%
10%
t
PZL
t
PZH
OUTPUTS
DISABLED
50%
50%
FIGURE 8. HC THREE-STATE PROPAGATION DELAY
WAVEFORM
V
CC
GND
OUTPUTS
ENABLED
t
INVERTING
OUTPUT
THL
t
PHL
t
PLH
1.3V
10%
90%
t
TLH
FIGURE 7. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
0.3
t
t
6ns
PZL
1.3V
PZH
1.3V
OUTPUTS
ENABLED
t
r
OUTPUT
DISABLE
OUTPUT LOW
TO OFF
OUTPUT HIGH
TO OFF
t
t
OUTPUTS
ENABLED
6nst
PLZ
PHZ
10%
90%
f
2.7
1.3
OUTPUTS
DISABLED
FIGURE 9. HCT THREE-STATE PROPAGATION DELAY
WAVEFORM
3V
GND
NOTE: Open drain waveforms t
VCC, CL = 50pF.
FIGURE 10. HC AND HCT THREE-STATE PROPAGATION DELAY TEST CIRCUIT
TIED HIGH
OR LOW
and t
PLZ
OTHER
INPUTS
OUTPUT
DISABLE
PZL
IC WITH
THREE-
STATE
OUTPUT
are the same as those for three-state shown on the left. The test circuit is Output RL=1kΩto
OUTPUT
= 1kΩ
R
L
C
L
50pF
VCC FOR t
GND FOR t
PLZ
PHZ
AND t
AND t
PZL
PZH
6
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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