55°C to 125°C
SOIC
M
AC32M
CD54AC32, CD74AC32
QUADRUPLE 2-INPUT POSITIVE-OR GATES
SCHS343 – MARCH 2003
D
AC Types Feature 1.5-V to 5.5-V Operation
and Balanced Noise Immunity at 30% of the
Supply
D
Buffered Inputs
D
Speed of Bipolar F, AS, and S, With
Significantly Reduced Power Consumption
D
Balanced Propagation Delays
D
±24-mA Output Drive Current
– Fanout to 15 F Devices
D
SCR-Latchup-Resistant CMOS Process and
CD54AC32 ...F PACKAGE
CD74AC32 ...E OR M PACKAGE
1A
1B
1Y
2A
2B
2Y
GND
(TOP VIEW)
1
14
2
13
3
12
4
11
5
10
6
7
9
8
V
4B
4A
4Y
3B
3A
3Y
CC
Circuit Design
D
Exceeds 2-kV ESD Protection Per
MIL-STD-883, Method 3015
description/ordering information
The ’AC32 devices are quadruple 2-input positive-OR gates. These devices perform the Boolean function
Y+A
• B or Y+A)B in positive logic.
ORDERING INFORMA TION
T
A
PDIP – E Tube CD74AC32E CD74AC32E
–
CDIP – F Tube CD54AC32F3A CD54AC32F3A
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
PACKAGE
–
†
Tube CD74AC32M
Tape and reel CD74AC32M96
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
FUNCTION TABLE
(each gate)
INPUTS
A B
H X H
X HH
L L L
OUTPUT
Y
Copyright 2003, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
CD54AC32, CD74AC32
∆t/∆v
Input transition rise or fall rate
ns/V
QUADRUPLE 2-INPUT POSITIVE-OR GATES
SCHS343 – MARCH 2003
logic diagram (positive logic)
A
B
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
Input clamp current, I
Output clamp current, I
Continuous output current, I
Continuous current through V
Package thermal impedance, θ
–0.5 V to 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CC
IK
(V
OK
< 0 or V
I
(V
O
O
> VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I
< 0 or V
(V
O
or GND ±100 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CC
JA
> VCC) (see Note 1) ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
O
= 0 to VCC) ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): E package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Y
†
M package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
stg
recommended operating conditions (see Note 3)
TA = 25°C
MIN MAX MIN MAX MIN MAX
V
V
V
V
V
I
OH
I
OL
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Supply voltage 1.5 5.5 1.5 5.5 1.5 5.5 V
CC
VCC = 1.5 V 1.2 1.2 1.2
High-level input voltage
IH
Low-level input voltage
IL
Input voltage 0 V
I
Output voltage 0 V
O
High-level output current VCC = 4.5 V to 5.5 V –24 –24 –24 mA
Low-level output current VCC = 4.5 V to 5.5 V 24 24 24 mA
p
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
VCC = 3 V
VCC = 5.5 V 3.85 3.85 3.85
VCC = 1.5 V 0.3 0.3 0.3
VCC = 3 V
VCC = 5.5 V 1.65 1.65 1.65
VCC = 1.5 V to 3 V 50 50 50
VCC = 3.6 V to 5.5 V 20 20 20
2.1 2.1 2.1
–55°C to
125°C
0.9 0.9 0.9
CC
CC
0 V
0 V
CC
CC
–40°C to
85°C
0 V
0 V
CC
CC
UNIT
V
V
V
V
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CC
(INPUT)
(OUTPUT)
A or B
Y
ns
(INPUT)
(OUTPUT)
A or B
Y
ns
CD54AC32, CD74AC32
QUADRUPLE 2-INPUT POSITIVE-OR GATES
SCHS343 – MARCH 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER TEST CONDITIONS V
1.5 V 1.4 1.4 1.4
IOH = –50 µA
V
OH
V
OL
I
I
I
CC
C
†
i
T est one output at a time, not exceeding 1-second duration. Measurement is made by forcing indicated current and measuring voltage to minimize
power dissipation. T est verifies a minimum 50-Ω transmission-line drive capability at 85°C and 75-Ω transmission-line drive capability at 125°C.
VI = VIH or V
VI = VIH or V
VI = VCC or GND 5.5 V ±0.1 ±1 ±1 µA
VI = VCC or GND, IO = 0 5.5 V 4 80 40 µA
IL
IL
IOH = –4 mA 3 V 2.58 2.4 2.48
IOH = –24 mA 4.5 V 3.94 3.7 3.8
IOH = –50 mA
IOH = –75 mA
IOL = 50 µA
IOL = 12 mA 3 V 0.36 0.5 0.44
IOL = 24 mA 4.5 V 0.36 0.5 0.44
IOL = 50 mA
IOL = 75 mA
†
†
†
†
3 V 2.9 2.9 2.9
4.5 V 4.4 4.4 4.4
5.5 V 3.85
5.5 V 3.85
1.5 V 0.1 0.1 0.1
3 V 0.1 0.1 0.1
4.5 V 0.1 0.1 0.1
5.5 V 1.65
5.5 V 1.65
TA = 25°C
MIN MAX MIN MAX MIN MAX
–55°C to
125°C
10 10 10 pF
–40°C to
85°C
UNIT
V
V
switching characteristics over recommended operating free-air temperature range,
V
= 1.5 V, CL = 50 pF (unless otherwise noted) (see Figure 1)
CC
PARAMETER
t
PLH
t
PHL
FROM
TO
–55°C to
125°C
MIN MAX MIN MAX
119 108
119 108
–40°C to
85°C
switching characteristics over recommended operating free-air temperature range,
= 3.3 V ± 0.3 V, CL = 50 pF (unless otherwise noted) (see Figure 1)
V
CC
PARAMETER
t
PLH
t
PHL
FROM
TO
–55°C to
125°C
MIN MAX MIN MAX
3.3 13.3 3.4 12.1
3.3 13.3 3.4 12.1
–40°C to
85°C
UNIT
UNIT
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
CD54AC32, CD74AC32
(INPUT)
(OUTPUT)
A or B
Y
ns
QUADRUPLE 2-INPUT POSITIVE-OR GATES
SCHS343 – MARCH 2003
switching characteristics over recommended operating free-air temperature range,
V
= 5 V ± 0.5 V, CL = 50 pF (unless otherwise noted) (see Figure 1)
CC
PARAMETER
t
PLH
t
PHL
FROM
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER TYP UNIT
C
pd
Power dissipation capacitance 47 pF
TO
–55°C to
125°C
MIN MAX MIN MAX
2.4 9.5 2.4 8.6
2.4 9.5 2.4 8.6
–40°C to
85°C
UNIT
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CD54AC32, CD74AC32
QUADRUPLE 2-INPUT POSITIVE-OR GATES
SCHS343 – MARCH 2003
PARAMETER MEASUREMENT INFORMATION
S1
50% V
t
r
CC
t
f
†
†
CC
t
rec
50% V
50% V
t
PHL
t
PLH
.
dis
CC
CC
50%
From Output
Under Test
CL = 50 pF
(see Note A)
†
When VCC = 1.5 V, R1 = R2 = 1 kΩ
CLR
Input
CLK
VOLTAGE WAVEFORMS
Input
In-Phase
Output
Out-of-Phase
Output
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
NOTES: A. CL includes probe and test-fixture capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns.
D. For clock inputs, f
E. The outputs are measured one at a time with one input transition per measurement.
F. t
G. t
H. t
I. All parameters and waveforms are not applicable to all devices.
50% V
CC
t
PLH
50%
t
PHL
VOLTAGE WAVEFORMS
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
Phase relationships between waveforms are arbitrary.
and t
PLH
PZL
PLZ
and t
and t
PHL
PZH
PHZ
R1 = 500 Ω
R2 = 500 Ω
LOAD CIRCUIT
RECOVERY TIME
90% 90%
50% V
10% 10%
is measured with the input duty cycle at 50%.
max
are the same as tpd.
are the same as ten.
are the same as t
2 × V
Open
GND
50% V
10%10%
90%90%
V
0 V
V
0 V
CC
CC
CC
t
t
TEST S1
t
w
50% V
50% V
50% V
Open
2 × V
GND
CC
50% V
CC
t
h
CC
CC
CC
50% V
50% V
20% V
80% V
CC
50% V
10%10%
t
CC
t
PLZ
t
PHZ
V
0 V
f
CC
CC
CC
V
0 V
V
CC
0 V
V
0 V
≈V
V
V
≈0 V
CC
CC
CC
CC
OL
OH
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
Input
Reference
Input
Data
Input
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
V
CC
0 V
V
OH
CC
V
OL
f
V
OH
V
OL
r
Waveform 1
S1 at 2 × V
(see Note B)
Waveform 2
(see Note B)
50%
Output
Control
Output
Output
S1 at GND
OUTPUT ENABLE AND DISABLE TIMES
50% V
CC
VOLTAGE WAVEFORMS
PULSE DURATION
t
su
90% 90%
t
r
VOLTAGE WAVEFORMS
t
PZL
CC
t
PZH
VOLTAGE WAVEFORMS
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband
Interface interface.ti.com Digital Control www.ti.com/digitalcontrol
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Security www.ti.com/security
Low Power www.ti.com/lpw Telephony www.ti.com/telephony
Wireless
Video & Imaging www.ti.com/video
Wireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
CD54AC32F3A ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
CD74AC32E ACTIVE PDIP N 14 25 Pb-Free
CD74AC32EE4 ACTIVE PDIP N 14 25 Pb-Free
CD74AC32M ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br)
CD74AC32M96 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br)
CD74AC32M96E4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br)
CD74AC32M96G4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br)
CD74AC32ME4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br)
CD74AC32MG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
(3)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
TAPE AND REEL INFORMATION
11-Mar-2008
*All dimensions are nominal
Device Package
CD74AC32M96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD74AC32M96 SOIC D 14 2500 346.0 346.0 33.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband
Clocks and Timers www.ti.com/clocks Digital Control www.ti.com/digitalcontrol
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Security www.ti.com/security
RFID www.ti-rfid.com Telephony www.ti.com/telephony
RF/IF and ZigBee® Solutions www.ti.com/lprf Video & Imaging www.ti.com/video
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated
Wireless www.ti.com/wireless
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