Data sheet acquired from Harris Semiconductor
SCHS056D – Revised August 2003
CD4071B Quad 2-Input OR Gate
CD4072B Dual 4-Input OR Gate
CD4075B Triple 3-Input OR Gate
H
OR gates provide the system designer with
direct implementation of the positive-logic OR
function and supplement the existing family of
CMOS gates.
The CD4071B, CD4072B, and CD4075B types
are supplied in 14-lead hermetic dual-in-line
ceramic packages (F3A suffix), 14-lead
dual-in-line plastic packages (E suffix), 14-lead
small-outline packages (M, MT, M96, and NSR
suffixes), and 14-lead thin shrink small-outline
packages (PW and PWR suffixes).
CD4071B, CD4072B, and CD4075B
Copyright 2003, Texas Instruments Incorporated
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Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable Device Status
7706002CA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
CD4071BE ACTIVE PDIP N 14 25 Pb-Free
CD4071BEE4 ACTIVE PDIP N 14 25 Pb-Free
CD4071BF ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
CD4071BF3A ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
CD4071BM ACTIVE SOIC D 14 50 Green (RoHS &
CD4071BM96 ACTIVE SOIC D 14 2500 Green (RoHS &
CD4071BM96E4 ACTIVE SOIC D 14 2500 Green (RoHS &
CD4071BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS &
CD4071BME4 ACTIVE SOIC D 14 50 Green (RoHS &
CD4071BMG4 ACTIVE SOIC D 14 50 Green (RoHS &
CD4071BMT ACTIVE SOIC D 14 250 Green (RoHS &
CD4071BMTE4 ACTIVE SOIC D 14 250 Green (RoHS &
CD4071BMTG4 ACTIVE SOIC D 14 250 Green (RoHS &
CD4071BNSR ACTIVE SO NS 14 2000 Green (RoHS &
CD4071BNSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
CD4071BNSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
CD4071BPW ACTIVE TSSOP PW 14 90 Green (RoHS &
CD4071BPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
CD4071BPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
CD4071BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
CD4071BPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
CD4071BPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
CD4072BE ACTIVE PDIP N 14 25 Pb-Free
CD4072BEE4 ACTIVE PDIP N 14 25 Pb-Free
CD4072BF ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
CD4072BF3A ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
9-Oct-2007
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
CD4072BM ACTIVE SOIC D 14 50 Green (RoHS &
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
9-Oct-2007
no Sb/Br)
CD4072BM96 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4072BM96E4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4072BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4072BME4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4072BMG4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4072BMT ACTIVE SOIC D 14 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4072BMTE4 ACTIVE SOIC D 14 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4072BMTG4 ACTIVE SOIC D 14 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4072BNSR ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4072BNSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4072BNSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4072BPW ACTIVE TSSOP PW 14 90 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4072BPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4072BPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4072BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4072BPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4072BPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4075BE ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
CD4075BEE4 ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
CD4075BF ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
CD4075BF3A ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
CD4075BM ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4075BM96 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4075BM96E4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4075BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4075BME4 ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
(3)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
9-Oct-2007
(3)
no Sb/Br)
CD4075BMG4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4075BMT ACTIVE SOIC D 14 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4075BMTE4 ACTIVE SOIC D 14 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4075BMTG4 ACTIVE SOIC D 14 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4075BNSR ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4075BNSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4075BNSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4075BPW ACTIVE TSSOP PW 14 90 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4075BPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4075BPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4075BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4075BPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4075BPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
JM38510/17101BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/17103BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
9-Oct-2007
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
TAPE AND REEL INFORMATION
11-Mar-2008
*All dimensions are nominal
Device Package
CD4071BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4071BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4071BPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
CD4072BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4072BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4072BPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
CD4075BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4075BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4075BPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4071BM96 SOIC D 14 2500 346.0 346.0 33.0
CD4071BNSR SO NS 14 2000 346.0 346.0 33.0
CD4071BPWR TSSOP PW 14 2000 346.0 346.0 29.0
CD4072BM96 SOIC D 14 2500 346.0 346.0 33.0
CD4072BNSR SO NS 14 2000 346.0 346.0 33.0
CD4072BPWR TSSOP PW 14 2000 346.0 346.0 29.0
CD4075BM96 SOIC D 14 2500 346.0 346.0 33.0
CD4075BNSR SO NS 14 2000 346.0 346.0 33.0
CD4075BPWR TSSOP PW 14 2000 346.0 346.0 29.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
1,20 MAX
14
0,30
0,19
8
4,50
4,30
PINS **
7
Seating Plane
0,15
0,05
8
1
A
DIM
14
0,10
6,60
6,20
M
0,10
0,15 NOM
0°–8°
2016
Gage Plane
24
0,25
0,75
0,50
28
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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