Texas Instruments CC3235MODSF SimpleLink User Manual

CC3235MODSF SimpleLink™ Wi-Fi®and IoT Solution With MCU LaunchPad™ Hardware
User's Guide
Literature Number: SWRU548
February 2019
Contents
1 CC3235MODSF LaunchPad™ Development Kit (LAUNCHCC3235MOD)...................................... 3
1.1 Introduction ................................................................................................................... 5
1.1.1 CC3235MODSF LaunchPad™ ................................................................................... 5
1.1.2 LAUNCHCC3235MOD Key Features ............................................................................ 6
1.1.3 What's Included ..................................................................................................... 6
1.1.4 Regulatory Compliance ........................................................................................... 6
1.1.5 First Steps: Out-of-Box Experience .............................................................................. 7
1.1.6 Next Steps: Looking into the Provided Code ................................................................... 7
1.2 Hardware ..................................................................................................................... 8
1.2.1 Block Diagram....................................................................................................... 9
1.2.2 Hardware Features................................................................................................ 11
1.2.3 BoosterPack Header Pin Assignment ......................................................................... 25
1.2.4 Electrical Characteristics ........................................................................................ 26
1.2.5 Antenna Characteristics ......................................................................................... 26
1.3 Layout Guidelines .......................................................................................................... 27
1.3.1 LAUNCHCC3235MOD Board Layout........................................................................... 27
1.3.2 General Layout Recommendations ............................................................................. 31
1.3.3 RF Layout Recommendations .................................................................................. 31
1.3.4 Antenna Placement and Routing ............................................................................... 33
1.3.5 Transmission Line Considerations ............................................................................. 33
1.4 Operational Setup and Testing .......................................................................................... 35
1.4.1 Measuring the CC3235MOD Current Draw ................................................................... 35
1.4.2 RF Connections ................................................................................................... 36
1.4.3 Design Files ....................................................................................................... 37
1.4.4 Software ........................................................................................................... 37
1.5 Development Environment Requirements .............................................................................. 37
1.5.1 CCS................................................................................................................. 37
1.5.2 IAR .................................................................................................................. 37
1.6 Additional Resources ..................................................................................................... 38
1.6.1 CC3235MODx Product Page ................................................................................... 38
1.6.2 Download CCS, IAR ............................................................................................. 38
1.6.3 SimpleLink™ Academy for CC3235 SDK ..................................................................... 38
1.6.4 TI E2E Community ............................................................................................... 38
1.7 Assembly Drawing and Schematics .................................................................................... 39
1.7.1 Assembly Drawing ................................................................................................ 39
1.7.2 Schematics ........................................................................................................ 40
2
Contents
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Chapter 1
SWRU548–February 2019
CC3235MODSF LaunchPad™ Development Kit
(LAUNCHCC3235MOD)
Start your design with the industry's first programmable FCC, IC/ISED, ETSI/CE, and MIC Certified wireless microcontroller (MCU) module with built-in Dual-Band (2.4 GHz and 5 GHz) Wi-Fi®connectivity. Created for the Internet-of-Things (IoT), the SimpleLink™ CC3235MODx family of devices from Texas Instruments™ are wireless modules that integrate two physically separated, on-chip MCUs:
An application processor – ARM®Cortex®-M4 MCU with a user-dedicated 256KB of RAM and an optional 1MB of Serial Flash.
A network processor MCU to run all Wi-Fi and Internet logic layers. This ROM based subsystem includes an 802.11 a/b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secure internet connections with 256-bit encryption.
The LAUNCHCC3235MODis a low-cost evaluation platform for MCUs based on ARM Cortex-M4 devices. The LaunchPad™ design highlights the CC3235MODSF fully-integrated industrial module solution and Dual-Band Wi-Fi capabilities. The LAUNCHCC3235MOD also features temperature and accelerometer sensors, programmable user buttons, an RBG LED for custom applications, and onboard emulation for debugging. The stackable headers interface demonstrates how easy it is to expand the functionality of the LaunchPad when interfacing with other peripherals on existing BoosterPack™ add-on boards, such as graphical displays, audio codec, antenna selection, environmental sensing, and more.
Figure 1-1 shows the CC3235MODSF LaunchPad development kit.
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CC3235MODSF LaunchPad™ Development Kit (LAUNCHCC3235MOD)

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Figure 1-1. CC3235MODSF SimpleLinkTMWi-Fi® LaunchPad Development Kit
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1.1 Introduction

1.1.1 CC3235MODSF LaunchPad™

Created for the Internet of Things (IoT), the SimpleLink CC3235MODx is a wireless module with built-in Dual-Band Wi-Fi connectivity for the LaunchPad ecosystem, which integrates a high-performance ARM Cortex-M4 MCU and lets customers develop an entire application with one device. With on-chip Wi-Fi, Internet, and robust security protocols, no prior Wi-Fi experience is required for fast development.
The CC3235MODSF LaunchPad, referred to by its part number LAUNCHCC3235MOD, is a low-cost evaluation platform for ARM Cortex-M4-based MCUs. The LaunchPad design highlights the CC3235MODSF Internet-on-a chip solution and Dual-Band Wi-Fi capabilities. The CC3235MODSF LaunchPad also features temperature and accelerometer sensors, programmable user buttons, an RGB LED for custom applications, and onboard emulation for debugging. The stackable headers of the CC3235MODSF LaunchPad XL interface demonstrate how easy it is to expand the functionality of the LaunchPad when interfacing with other peripherals on many existing BoosterPack add-on boards, such as graphical displays, audio codecs, antenna selection, environmental sensing, and more. Figure 1-1 shows the CC3235MOD LaunchPad.
Multiple development environment tools are also available, including TI’s Eclipse-based Code Composer
Studio™ (CCS) integrated development environment (IDE) and IAR Embedded Workbench®. More
information about the LaunchPad, the supported BoosterPack modules, and the available resources can be found at TI’s LaunchPad portal.
NOTE: The maximum RF power transmitted in each WLAN 2.4 GHz band is 22 dBm (EIRP power).
The maximum RF power transmitted in each WLAN 5 GHz band is 23 dBm (EIRP power).
Introduction
NOTE: The antennas used for this transmitter must be installed to provide a separation distance of
at least 20 cm from all persons, and must not be colocated or operating in conjunction with any other antenna or transmitter.
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Introduction

1.1.2 LAUNCHCC3235MOD Key Features

The LAUNCHCC3235MOD SimpleLink LaunchPad includes the following features:
CC3235MODSF, SimpleLinkTMDual-Band Wi-Fi®module solution – Integrated MCU – 40.0-MHz Crystal – 32.768-kHz Crystal (RTC) – 32-Mbit SPI Serial Flash – RF and Full Power-Management Components
40-pin LaunchPad standard that leverages the BoosterPack ecosystem
TI standard, XDS110-based JTAG emulation with serial port for flash programming
Supports 4-wire JTAG and 2-wire SWD
Two buttons and one RGB LED for user interaction
Back-channel universal asynchronous receiver/transmitter (UART) through USB to PC
Onboard chip antenna with U.FL for conducted testing selectable using 0-Ω resistors
Onboard accelerometer and temperature sensor for out-of-box demo with option to isolate the sensors from the inter-integrated circuit (I2C) bus
Micro-USB connector for power and debug connections
Headers for current measurement and external JTAG connection (option to use the onboard XDS110 to debug customer platforms)
Bus-powered device with no external power required for Wi-Fi
Long-range transmission with highly optimized antenna (200 m typical in open air using an access point with 6-dBi antenna AP)
Can be powered externally, with two AA or two AAA alkaline batteries working down to 2.3-V typical
Dimensions: 106.1 mm (L) × 58.42 mm (W)
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1.1.3 What's Included

1.1.3.1 Kit Contents
CC3235MODSF LaunchPad development tool (LAUNCHCC3235MOD)
Micro USB cable
Quick start guide
1.1.3.2 Software Examples
Out-of-Box Experience (OOBE) Software

1.1.4 Regulatory Compliance

Certifications in Process Indoor Usage Restrictions: The device is restricted to indoor use only when operating in the 5150 to 5350 MHz frequency range.
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1.1.5 First Steps: Out-of-Box Experience

An easy way to get started with the EVM is by using its preprogrammed out-of-box experience code. It demonstrates some key features of the EVM.
1.1.5.1 Connecting to the Computer
Connect the LaunchPad development kit by connecting the included USB cable to a computer. A red power LED should illuminate. For proper operation, the SimpleLink drivers and Service Pack from the CC3235 Software Development Kit (SDK) are needed. The SDK is available at
http://www.ti.com/tool/simplelink-cc32xx-sdk.
1.1.5.2 Running the Out-of-Box Experience
The CC3235MODSF LaunchPad development kit's Out-of-Box Experience (OOBE) demonstrates and highlights the following features:
Easy connection to the CC3235MODSF LaunchPad: – Using the SimpleLinkTMWi-Fi® Starter Pro application (available on iOS and Android™), users can
use Access Point (AP) provisioning or SmartConfig™ provisioning for a fast CC3235MOD connection.
– Configuring the device in AP mode gives users a direct connection to the CC3235MODSF
LaunchPad.
Once the device is provisioned and connected to an AP in station mode, the profile is stored on the local file system so that any reset to the CC3235MODSF automatically connects it to the AP.
Easy access to the CC3235MODSF through its internal web server, using either: – The SimpleLinkTMWi-Fi® Starter Pro application – Any browser; web pages stored on the serial flash are loaded on the browser, to provide ease of
use.
This feature demonstrates configuring and reading onboard sensors.
Over-The-Air (OTA) updates that demonstrate an update of a full image. OTA service enables in­system updates of the MCU application, CC3235 firmware releases (Service Pack) made available by TI, and other vendor files. An update procedure executed in a full-system integrity fashion, such as failure to upgrade any image components, results in rolling back to the previous valid version.
Introduction

1.1.6 Next Steps: Looking into the Provided Code

After the EVM features have been explored, the user can open an integrated development environment and start editing the code examples from the SDK. See Section 1.6.2 for available IDEs and where to download them. The Out-of-Box source code and more code examples are provided in the CC3235 SDK. Code is licensed under BSD, and TI encourages reuse and modifications to fit specific needs.
With the onboard XDS110 debug probe, debugging and downloading new code is simple. A USB connection between the EVM and a PC through the provided USB cable is all that is needed.
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Hardware

1.2 Hardware

Figure 1-2 shows the CC3235MODSF LaunchPad EVM.
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Figure 1-2. CC3235MODSF LaunchPad™ EVM Overview
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CC3235
MAC/PHY
WRF_BGN F
BGN
RF_ANT1
32-Mbit
SFlash
External SPI
Programming
40 MHz
32.768 kHz
UART
SPI
nReset
PM
2.3 V to 3.6 V VBAT
User GPIOx
Aband
F
D
5 GHz SPDT
WRF_A
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1.2.1 Block Diagram

Figure 1-3 shows a functional block diagram of the CC3235MODx module.
Hardware
Figure 1-3. CC3235MODx Functional Block Diagram
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CC3235MODSF12MOBR
Acc
BMA280
Temperature
Sensor
TMP116
Two 20-pin LaunchPad headers (compatible with TI MCU standard)
INT (GPIO13)
I2C
FTDI
FT2232D
and
SWD Circuit
USB
Connector
LDO
3.3 V
VCC
Two AA
Battery
Connectors
Reverse
Protection
Push buttons
GPIO13, GPIO22
RGB LED GPIO9, GPIO10, GPIO11
JTAG and SWD
UART (Flashing)
Hardware
Figure 1-4 shows a functional block diagram of the LAUNCHCC3235MOD SimpleLink LaunchPad.
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Figure 1-4. LAUNCHCC3235MOD Functional Block Diagram
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1.2.2 Hardware Features

CC3235MODSF, SimpleLinkTMDual-Band Wi-Fi®module solution with integrated MCU
40-pin LaunchPad™ standard that leverages the BoosterPack™ ecosystem
TI Standard XDS110-based JTAG emulation with serial port for flash programming
Supports both 4-wire JTAG and 2-wire SWD
Two buttons and a RGB LED for user interaction
Virtual COM port UART through USB on PC
Onboard chip antenna with U.FL or SMA for conducted testing, selectable using 0-Ω resistors
Onboard accelerometer and temperature sensor for out-of-box demo, with the option to isolate them from the inter-integrated circuit (I2C) bus
Micro USB connector for power and debug connections
Headers for current measurement and external JTAG connection, with an option to use the onboard XDS110 to debug customer platforms
Bus-powered device, with no external power required for Wi-Fi
Long-range transmission with a highly optimized antenna (200-meter typical in open air with a 6-dBi antenna AP)
Can be powered externally, working down to 2.3 V
1.2.2.1 Key Benefits
The CC3235MODx modules offer the following benefits:
Fully Integrated and Green/RoHS Modules Includes All Required Clocks, SPI Flash, and Passives
802.11 a/b/g/n: 2.4 GHz and 5 GHz
FCC, IC/ISED, ETSI/CE, and MIC Certified
FIPS 140-2 Level 1 Validated IC Inside
Multilayered security features, help developers protect identities, data, and software IP
Low-Power Modes for battery powered application
Coexistence with 2.4 GHz Radios
Industrial Temperature: –40°C to +85°C
CC3235MODx Multiple-core architecture, system-on-chip (SoC)
1.27-mm Pitch QFM Package for Easy Assembly and Low-Cost PCB Design
Transferrable Wi-Fi Alliance®Certification
Application microcontroller subsystem: – Arm®Cortex®-M4 core at 80 MHz – User-dedicated memory
256 KB RAM
Optional 1 MB executable Flash – Rich set of peripherals and timers – 26 I/O pins with flexible multiplexing options
UART, I2S, I2C, SPI, SD, ADC, and 8-bit parallel interface
8-bit Synchronous Image Interface
Timers and PWM – Debug Interfaces: JTAG, cJTAG, and SWD
Wi-Fi network processor subsystem: – Wi-Fi®core:
802.11 a/b/g/n 2.4 GHz and 5 GHz
Modes:
Hardware
®
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Hardware
Multilayered security features:
Application Throughput
Power-Management Subsystem:
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Access Point (AP)
Station (STA)
Wi-Fi Direct®(only supported on 2.4 GHz)
Security:
WEP
WPA™/WPA2™ PSK
WPA2 Enterprise
– Internet and application protocols:
HTTPs server, mDNS, DNS-SD, DHCP
IPv4 and IPv6 TCP/IP stack
16 BSD sockets (fully secured TLS v1.2 and SSL 3.0)
– Built-in power management subsystem:
Configurable low-power profiles (always, intermittent, tag)
Advanced low-power modes
Integrated DC/DC regulators
– Separate execution environments – Networking security – Device identity and key – Hardware accelerator cryptographic engines (AES, DES, SHA/MD5, CRC) – Application-level security (encryption, authentication, access control) – Initial secure programming – Software tamper detection – Secure boot – Certificate signing request (CSR) – Unique per device key pair
– UDP: 16 Mbps – TCP: 13 Mbps
– Integrated DC/DC converters support a wide range of supply voltage:
VBAT wide-voltage mode: 2.3 V to 3.6 V
VIO is always tied with VBAT
– Advanced low-power modes:
Shutdown: 1 µA, hibernate: 5 µA
Low-power deep sleep (LPDS): 120 µA
Idle connected (MCU in LPDS): 710 µA
RX traffic (MCU active): 59 mA
TX traffic (MCU active): 223 mA
– Wi-Fi TX Power
2.4 GHz: 16.5 dBm at 1 DSSS
5 GHz: 14.5 dBm at 6 OFDM
– Wi-Fi RX Sensitivity
2.4 GHz: –94.5 dBm at 1 DSSS
5 GHz: –89 dBm at 6 OFDM
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Additional Integrated Components
Footprint Compatible QFM Package
Module Supports SimpleLink Developer's Ecosystem
Hardware
– 40.0 MHz Crystal – 32.768 kHz Crystal (RTC) – 32 Mbit SPI Serial Flash – RF Filters, Diplexer and Passive Components
– CC3235MODx: 1.27-mm Pitch,
63-Pin, 20.5-mm × 17.5-mm
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Hardware
1.2.2.2 XDS110-Based Onboard Debug Probe
To keep development easy and cost effective, TI's LaunchPad development kits integrate an onboard debug probe, which eliminates the need for expensive programmers. The CC3235MODSF LaunchPad has the XDS-110-based debug probe (see Figure 1-5), which is a simple and low-cost debugger that supports nearly all TI Arm device derivatives.
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Figure 1-5. XDS-110 Debug Probe
The dotted line through J101 shown in Figure 1-5 divides the XDS110 debug probe from the target area. The signals that cross this line can be disconnected by jumpers on J101, the isolation jumper block. More details on the isolation jumper block are in Section 1.2.2.3.
The XDS110 debug probe also provides a "backchannel" UART-over-USB connection with the host, which can be very useful during debugging and for easy communication with a PC. More details can be found in
Section 1.2.2.4.
The XDS110 debug probe hardware can be found in the schematics in Section 1.7.2 and in the hardware
design files.
1.2.2.3 Debug Probe Connection: Isolation Jumper Block
The isolation jumper block at jumper J101 allows the user to connect or disconnect signals that cross from the XDS110 domain into the CC3235MOD target domain. This includes JTAG signals, application UART signals, and 3.3-V and 5-V power.
Reasons to open these connections:
To remove any and all influence from the XDS110 debug probe for high accuracy target power measurements
To control 3-V and 5-V power flow between the XDS110 and target domains
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