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CC2650MODA SimpleLink™ Bluetooth®low energy Wireless MCU Module

1 Device Overview

1.1 Features

• Microcontroller – Powerful ARM®Cortex®-M3 – EEMBC CoreMark®Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultra-Low-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air (OTA) Upgrade

• Ultra-Low-Power Sensor Controller – Can Run Autonomous From the Rest of the

System – 16-Bit Architecture – 2KB of Ultra-Low-Leakage SRAM for

Code and Data

• Efficient Code Size Architecture, Placing Drivers,

Bluetooth®low energy Controller, IEEE®802.15.4

Medium Access Control (MAC), and Bootloader in ROM

• Integrated Antenna

• Peripherals – All Digital Peripheral Pins Can Be Routed to

Any GPIO

– Four General-Purpose Timer Modules

(8 × 16-Bit or 4 × 32-Bit Timer, PWM Each)

– 12-Bit ADC, 200-ksamples/s, 8-Channel

Analog MUX – Continuous Time Comparator – Ultra-Low-Power Analog Comparator – Programmable Current Source – UART – 2 × SSI (SPI, MICROWIRE, TI) – I2C – I2S – Real-Time Clock (RTC) – AES-128 Security Module – True Random Number Generator (TRNG) – 15 GPIOs – Support for Eight Capacitive Sensing Buttons – Integrated Temperature Sensor

• External System – On-Chip Internal DC-DC Converter – No External Components Needed, Only Supply

Voltage

CC2650MODA

SWRS187D –AUGUST 2016–REVISED JULY 2019

• Low Power – Wide Supply Voltage Range

– Operation from 1.8 to 3.8 V – Active-Mode RX: 6.2 mA – Active-Mode TX at 0 dBm: 6.8 mA – Active-Mode TX at +5 dBm: 9.4 mA – Active-Mode MCU: 61 µA/MHz – Active-Mode MCU: 48.5 CoreMark/mA – Active-Mode Sensor Controller:

0.4 mA + 8.2 µA/MHz

– Standby: 1 µA (RTC Running and RAM/CPU

Retention) – Shutdown: 100 nA (Wake Up on External

Events)

• RF Section – 2.4-GHz RF Transceiver Compatible With

Bluetooth low energy (BLE) 5.1 Specification and IEEE 802.15.4 PHY and MAC

– CC2650MODA RF-PHY Qualified (QDID:

88415)

– Excellent Receiver Sensitivity (–97 dBm for

Bluetooth low energy and –100 dBm for

802.15.4), Selectivity, and Blocking

Performance – Programmable Output Power up to +5 dBm – Pre-certified for Compliance With Worldwide

Radio Frequency Regulations

– ETSI RED (Europe)

– IC (Canada)

– FCC (USA)

– ARIB STD-T66 (Japan)

– JATE (Japan)

• Tools and Development Environment – Full-Feature and Low-Cost Development Kits – Multiple Reference Designs for Different RF

Configurations – Packet Sniffer PC Software – Sensor Controller Studio – SmartRF™ Studio – SmartRF Flash Programmer 2 – IAR Embedded Workbench®for ARM – Code Composer Studio™

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

CC2650MODA

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1.2 Applications

• Building Automation

• Medical and Health

• Appliances

• Industrial

• Consumer Electronics

1.3 Description

The SimpleLink™ CC2650MODA device is a wireless microcontroller (MCU) module that targets

Bluetooth®low energy applications. The CC2650MODA device can also run ZigBee®and 6LoWPAN and

ZigBee RF4CE™ remote control applications. The module is based on the SimpleLink CC2650 wireless MCU, a member of the CC26xx family of cost-

effective, ultra-low-power, 2.4-GHz RF devices. Very-low active RF and MCU current and low-power mode current consumption provide excellent battery lifetime and allow for operation on small coin-cell batteries and in energy-harvesting applications.

The CC2650MODA module contains a 32-bit ARM Cortex-M3 processor that runs at 48 MHz as the main processor and a rich peripheral feature set that includes a unique ultra-low-power sensor controller. This sensor controller is good for interfacing with external sensors or for collecting analog and digital data autonomously while the rest of the system is in sleep mode. Thus, the CC2650MODA device is good for applications within a wide range of products including industrial, consumer electronics, and medical devices.

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• Proximity Tags

• Alarm and Security

• Remote Controls

• Wireless Sensor Networks

The CC2650MODA module is pre-certified for operation under the regulations of the FCC, IC, ETSI, and ARIB. These certifications save significant cost and effort for customers when integrating the module into their products.

The Bluetooth low energy controller and the IEEE 802.15.4 MAC are embedded in the ROM and are partly running on a separate ARM®Cortex®-M0 processor. This architecture improves overall system performance and power consumption and makes more flash memory available.

The Bluetooth low energy software stack (BLE-Stack) and the ZigBee software stack ( Z-Stack™) are available free of charge.

Device Information

PART NUMBER PACKAGE BODY SIZE

CC2650MODAMOH MOH (Module) 16.90 mm × 11.00 mm

(1) For more information, see Section 10.

(1)

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Main CPU

128-KB

Flash

Sensor Controller

cJTAG

20-KB SRAM

ROM

ARM

Cortex-M3

DC-DC Converter

RF core

ARM

Cortex-M0

DSP Modem

4-KB

SRAM

ROM

Sensor Controller Engine

2× Analog Comparators

12-bit ADC, 200 ks/s

Constant Current Source

SPI / I2C Digital Sensor IF

2-KB SRAM

Time-to-Digital Converter

General Peripherals / Modules

4× 32-bit Timers

2× SSI (SPI, µWire, TI)

Watchdog Timer

Temp. / Batt. Monitor

RTC

I2C

UART

I2S

15 GPIOs

AES

32 ch. µDMA

ADC ADC

Digital PLL

SimpleLink CC2650MODA Wireless MCU Module

TRNG

8-KB

Cache

24-MHz Crystal

Oscillator

32.768-kHz Crystal

Oscillator

RF Balun

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1.4 Functional Block Diagram

Figure 1-1 is a block diagram for the CC2650MODA device.

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Figure 1-1. CC2650MODA Block Diagram

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1 Device Overview ......................................... 1

1.1 Features .............................................. 1

1.2 Applications........................................... 2

1.3 Description............................................ 2

1.4 Functional Block Diagram ............................ 3

2 Revision History ......................................... 5

3 Device Comparison ..................................... 6

3.1 Related Products ..................................... 6

4 Terminal Configuration and Functions.............. 7

4.1 Module Pin Diagram.................................. 7

4.2 Pin Functions ......................................... 8

5 Specifications ............................................ 9

5.1 Absolute Maximum Ratings .......................... 9

5.2 ESD Ratings.......................................... 9

5.3 Recommended Operating Conditions ................ 9

5.4 Power Consumption Summary...................... 10

5.5 General Characteristics ............................. 10

5.6 Antenna ............................................. 11

5.7 1-Mbps GFSK (Bluetooth low energy) – RX ........ 11

5.8 1-Mbps GFSK (Bluetooth low energy) – TX ........ 12

5.9 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) –

RX ................................................... 12

5.10 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) –

TX ................................................... 13

5.11 24-MHz Crystal Oscillator (XOSC_HF) ............. 13

5.12 32.768-kHz Crystal Oscillator (XOSC_LF).......... 13

5.13 48-MHz RC Oscillator (RCOSC_HF) ............... 13

5.14 32-kHz RC Oscillator (RCOSC_LF)................. 13

5.15 ADC Characteristics................................. 14

5.16 Temperature Sensor ................................ 15

5.17 Battery Monitor...................................... 15

5.18 Continuous Time Comparator....................... 15

5.19 Low-Power Clocked Comparator ................... 15

5.20 Programmable Current Source ..................... 16

5.21 DC Characteristics .................................. 16

5.22 Thermal Resistance Characteristics for MOH

Package ............................................. 17

5.23 Timing Requirements ............................... 17

5.24 Switching Characteristics ........................... 17

5.25 Typical Characteristics .............................. 20

6 Detailed Description ................................... 24

6.1 Overview ............................................ 24

6.2 Functional Block Diagram........................... 24

6.3 Main CPU ........................................... 25

6.4 RF Core ............................................. 25

6.5 Sensor Controller ................................... 26

6.6 Memory.............................................. 27

6.7 Debug ............................................... 27

6.8 Power Management................................. 28

6.9 Clock Systems ...................................... 29

6.10 General Peripherals and Modules .................. 29

6.11 System Architecture................................. 30

6.12 Certification.......................................... 30

6.13 End Product Labeling ............................... 32

6.14 Manual Information to the End User ................ 32

6.15 Module Marking ..................................... 33

7 Application, Implementation, and Layout ......... 34

7.1 Application Information.............................. 34

7.2 Layout ............................................... 35

8 Environmental Requirements and

Specifications........................................... 36

8.1 PCB Bending........................................ 36

8.2 Handling Environment .............................. 36

8.3 Storage Condition ................................... 36

8.4 Baking Conditions................................... 36

8.5 Soldering and Reflow Condition .................... 37

9 Device and Documentation Support ............... 38

9.1 Device Nomenclature ............................... 38

9.2 Tools and Software ................................. 39

9.3 Documentation Support ............................. 40

9.4 Texas Instruments Low-Power RF Website ........ 40

9.5 Low-Power RF eNewsletter ......................... 40

9.6 Community Resources .............................. 41

9.7 Additional Information ............................... 41

9.8 Trademarks.......................................... 41

9.9 Electrostatic Discharge Caution..................... 42

9.10 Export Control Notice ............................... 42

9.11 Glossary............................................. 42

10 Mechanical, Packaging, and Orderable

Information .............................................. 42

10.1 Packaging Information .............................. 42

10.2 PACKAGE OPTION ADDENDUM .................. 43

10.3 PACKAGE MATERIALS INFORMATION........... 44

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2 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from July 1, 2017 to July 31, 2019 Page

• Added Module Marking section. .................................................................................................. 33

• Added Environmental Requirements and Specifications section. ............................................................ 36

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3 Device Comparison

Table 3-1. Device Family Overview

DEVICE PHY SUPPORT FLASH (KB) RAM (KB) GPIO PACKAGE

CC2650MODAMOH Multiprotocol

(1) The CC2650 device supports all PHYs and can be reflashed to run all the supported standards.

3.1 Related Products

TI's Wireless Connectivity The wireless connectivity portfolio offers a wide selection of low-power RF

solutions suitable for a broad range of applications. The offerings range from fully customized solutions to turn key offerings with pre-certified hardware and software (protocol).

TI's SimpleLink™ Sub-1 GHz Wireless MCUs Long-range, low-power wireless connectivity solutions

are offered in a wide range of Sub-1 GHz ISM bands.

Companion Products Review products that are frequently purchased or used in conjunction with this

product.

SimpleLink™ CC2650 Wireless MCU LaunchPad™ Development Kit The CC2650 LaunchPad™

development kit brings easy Bluetooth®low energy connectivity to the LaunchPad kit ecosystem with the SimpleLink ultra-low power CC26xx family of devices. This LaunchPad kit also supports development for multi-protocol support for the SimpleLink multi-standard CC2650 wireless MCU and the rest of CC26xx family of products: CC2630 wireless MCU for ZigBee®/6LoWPAN and CC2640 wireless MCU for Bluetooth low energy.

Reference Designs for CC2650MODA TI Designs Reference Design Library is a robust reference design

library spanning analog, embedded processor and connectivity. Created by TI experts to help you jump-start your system design, all TI Designs include schematic or block diagrams, BOMs, and design files to speed your time to market. Search and download designs at

ti.com/tidesigns.

(1)

128 20 15 MOH

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(Exposed GND Pads)

1 2

4 5 6 7 19

21 20

18 17

23 22

10 11 12 13 14 15 16

Antenna

GND DIO 0 DIO 1

DIO 2 DIO 3 DIO 4

JTAG_TMS

VDD VDD

DIO 14 DIO 13 DIO 12 DIO 11 DIO 10

JTAG_TCK

DIO 5/JTAG_TDO

DIO 6/JTAG_TDI

nRESET

DIO 7

DIO 8

DIO 9

8 9

25 24

GND GND

G1 G2

G3 G4

NC NC

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4 Terminal Configuration and Functions

Section 4.1 shows pin assignments for the CC2650MODA device.

4.1 Module Pin Diagram

CC2650MODA

SWRS187D –AUGUST 2016–REVISED JULY 2019

(1) The following I/O pins marked in bold in the pinout have high-drive capabilities:

• DIO 2

• DIO 3

• DIO 4

• JTAG_TMS

• DIO 5/JTAG_TDO

• DIO 6/JTAG_TDI

(2) The following I/O pins marked in italics in the pinout have analog capabilities:

• DIO 7

• DIO 8

• DIO 9

• DIO 10

• DIO 11

• DIO 12

• DIO 13

• DIO 14

Figure 4-1. CC2650MODA MOH Package

(16.9-mm × 11-mm) Module Pinout

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4.2 Pin Functions

Table 4-1 describes the CC2650MODA pins.

Table 4-1. Signal Descriptions – MOH Package

PIN NAME PIN NO. PIN TYPE DESCRIPTION

DIO_0 4 Digital I/O GPIO, Sensor Controller DIO_1 5 Digital I/O GPIO, Sensor Controller DIO_2 6 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_3 7 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_4 8 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_5/JTAG_TDO 11 Digital I/O GPIO, high-drive capability, JTAG_TDO DIO_6/JTAG_TDI 12 Digital I/O GPIO, high-drive capability, JTAG_TDI DIO_7 14 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_8 15 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_9 16 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_10 17 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_11 18 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_12 19 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_13 20 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_14 21 Digital I/O, Analog I/O GPIO, Sensor Controller, analog EGP G1, G2, G3, G4 Power Ground – Exposed ground pad GND 1, 3, 25 — Ground JTAG_TCK 10 Digital I/O JTAG TCKC JTAG_TMS 9 Digital I/O JTAG TMSC, high-drive capability NC 2, 24 NC Not Connected—TI recommends leaving these pins floating nRESET 13 Digital input Reset, active low. No internal pullup VDD 22, 23 Power 1.8-V to 3.8-V main chip supply

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5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

VDD Supply voltage –0.3 4.1 V

Voltage on any digital pin

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

(2) All voltage values are with respect to ground, unless otherwise noted. (3) Including analog capable DIO.

Voltage on ADC input

Input RF level 5 dBm Storage temperature –40 85 °C

stg

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(3)

Voltage scaling enabled –0.3 VDD

Voltage scaling disabled, VDD as reference –0.3 VDD / 2.9

5.2 ESD Ratings

Human body model (HBM), per ANSI/ESDA/JEDEC

(1)

ESD

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

Electrostatic discharge

JS001

Charged device model (CDM), per JESD22-C101

(1)(2)

MIN MAX UNIT

–0.3 VDD + 0.3, max 4.1 V

VALUE UNIT

All pins ±1000

(2)

RF pins ±500 Non-RF pins ±500

VVoltage scaling disabled, internal reference –0.3 1.49

5.3 Recommended Operating Conditions

MIN MAX UNIT

Ambient temperature –40 85 °C

Operating supply voltage (VDD)

For operation in battery-powered and 3.3-V systems (internal DC-DC can be used to minimize power consumption)

1.8 3.8 V

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5.4 Power Consumption Summary

Tc= 25°C, VDD= 3.0 V with internal DC-DC converter, unless otherwise noted

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Reset. RESET_N pin asserted or VDD below Power-onReset threshold

Shutdown. No clocks running, no retention 150 Standby. With RTC, CPU, RAM and (partial) register

retention. RCOSC_LF Standby. With RTC, CPU, RAM and (partial) register

retention. XOSC_LF

core

Core current consumption

Peripheral Current Consumption (Adds to core current I

Peripheral power domain

Serial power domain Delta current with domain enabled 13 RF core

peri

µDMA Delta current with clock enabled, module idle 130 Timers Delta current with clock enabled, module idle 113 I2C Delta current with clock enabled, module idle 12 I2S Delta current with clock enabled, module idle 36 SSI Delta current with clock enabled, module idle 93 UART Delta current with clock enabled, module idle 164

(1) I

is not supported in Standby or Shutdown.

peri

Standby. With Cache, RTC, CPU, RAM and (partial) register retention. RCOSC_LF

Standby. With Cache, RTC, CPU, RAM and (partial) register retention. XOSC_LF

Idle. Supply systems and RAM powered. 550 Active. Core running CoreMark Radio RX 6.2

Radio TX, 5-dBm output power 9.4

for each peripheral unit activated)

core

Delta current with domain enabled 20

Delta current with power domain enabled, clock enabled, RF Core Idle

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100

1.2

2.5

µA

2.7

1.45 mA +

31 µA/MHz

mARadio TX, 0-dBm output power 6.8

(1)

237

µA

5.5 General Characteristics

Tc= 25°C, VDD= 3.0 V, unless otherwise noted

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

FLASH MEMORY

Supported flash erase cycles before failure

Flash page/sector erase current Average delta current 12.6 mA Flash page/sector erase time

(1)

Flash page/sector size 4 KB Flash write current Average delta current, 4 bytes at a time 8.15 mA Flash write time

(1)

4 bytes at a time 8 µs

(1) This number is dependent on flash aging and will increase over time and erase cycles.

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100 k Cycles

8 ms

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5.6 Antenna

Tc= 25°C, VDD= 3.0 V, unless otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Polarization Linear Peak Gain 2450 MHz 1.26 dBi Efficiency 2450 MHz 57%

5.7 1-Mbps GFSK (Bluetooth low energy) – RX

RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc= 25°C, VDD= 3.0 V, fRF= 2440 MHz, unless otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Receiver sensitivity BER = 10 Receiver saturation BER = 10

Frequency error tolerance

Difference between center frequency of the received RF signal and local oscillator frequency.

Data rate error tolerance –750 750 ppm Co-channel rejection

Selectivity, ±1 MHz

Selectivity, ±2 MHz

Selectivity, ±3 MHz

Selectivity, ±4 MHz

(1)

Selectivity, ±5 MHz or more

Selectivity, Image frequency Selectivity,

Image frequency ±1 MHz Out-of-band blocking

(3)

Wanted signal at –67 dBm, modulated interferer in channel, BER = 10

Wanted signal at –67 dBm, modulated interferer at ±1 MHz, BER = 10

Wanted signal at –67 dBm, modulated interferer at ±2 MHz, BER = 10

Wanted signal at –67 dBm, modulated interferer at ±3 MHz, BER = 10

Wanted signal at –67 dBm, modulated interferer at ±4 MHz, BER = 10

Wanted signal at –67 dBm, modulated interferer at ≥ ±5 MHz,

(1)

BER = 10 Wanted signal at –67 dBm, modulated interferer at image

(1)

frequency, BER = 10 Wanted signal at –67 dBm, modulated interferer at ±1 MHz from

(1)

image frequency, BER = 10

30 MHz to 2000 MHz –20 dBm Out-of-band blocking 2003 MHz to 2399 MHz –5 dBm Out-of-band blocking 2484 MHz to 2997 MHz –8 dBm Out-of-band blocking 3000 MHz to 12.75 GHz –8 dBm

Intermodulation

Spurious emissions, 30 MHz to 1000 MHz

Spurious emissions, 1 GHz to 12.75 GHz

Wanted signal at 2402 MHz, –64 dBm. Two interferers at 2405

and 2408 MHz respectively, at the given power level

Conducted measurement in a 50-Ω single-ended load. Suitable

for systems targeting compliance with EN 300 328, EN 300 440

class 2, FCC CFR47, Part 15 and ARIB STD-T-66

Conducted measurement in a 50-Ω single-ended load. Suitable

for systems targeting compliance with EN 300 328, EN 300 440

class 2, FCC CFR47, Part 15 and ARIB STD-T-66 RSSI dynamic range 70 dB RSSI accuracy ±4 dB

(1) Numbers given as I/C dB (2) X / Y, where X is +N MHz and Y is –N MHz (3) Excluding one exception at F

wanted

–3 –3

–3

/ 2, per Bluetooth Specification

–97 dBm

4 dBm

–350 350 kHz

–6 dB

(2)

7 / 3

(2)

29 / 23

(2)

38 / 26

(2)

42 / 29

32 dB

23 dB

(2)

3 / 26

–34 dBm

–71 dBm

–62 dBm

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5.8 1-Mbps GFSK (Bluetooth low energy) – TX

RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc= 25°C, VDD= 3.0 V, fRF= 2440 MHz, unless otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Output power, highest setting 5 dBm Output power, lowest setting –21 dBm

f < 1 GHz, outside restricted bands –43

Spurious emission conducted measurement

(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2

(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan)

(1)

f < 1 GHz, restricted bands ETSI –58 f < 1 GHz, restricted bands FCC –57 f > 1 GHz, including harmonics –45

dBm

5.9 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX

RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc= 25°C, VDD= 3.0 V, unless otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Receiver sensitivity PER = 1% –100 dBm Receiver saturation PER = 1% –7 dBm

Adjacent channel rejection

Alternate channel rejection

Channel rejection, ±15 MHz or more

Blocking and desensitization, 5 MHz from upper band edge

Blocking and desensitization, 10 MHz from upper band edge

Blocking and desensitization, 20 MHz from upper band edge

Blocking and desensitization, 50 MHz from upper band edge

Blocking and desensitization, –5 MHz from lower band edge

Blocking and desensitization, –10 MHz from lower band edge

Blocking and desensitization, –20 MHz from lower band edge

Blocking and desensitization, –50 MHz from lower band edge

Spurious emissions, 30 MHz to 1000 MHz

Spurious emissions, 1 GHz to 12.75 GHz

Frequency error tolerance RSSI dynamic range 100 dB

RSSI accuracy ±4 dB

Wanted signal at –82 dBm, modulated interferer at ±5 MHz, PER = 1%

Wanted signal at –82 dBm, modulated interferer at ±10 MHz, PER = 1%

Wanted signal at –82 dBm, undesired signal is IEEE 802.15.4 modulated channel, stepped through all channels 2405 to 2480 MHz, PER = 1%

Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1%

Conducted measurement in a 50-Ω single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T66

Difference between center frequency of the received RF signal and local oscillator frequency

35 dB

52 dB

57 dB

64 dB

65 dB

68 dB

63 dB

65 dB

67 dB

–71 dBm

–62 dBm

>200 ppm

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5.10 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – TX

RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc= 25°C, VDD= 3.0 V, unless otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Output power, highest setting 5 dBm Output power, lowest setting –21 dBm Error vector magnitude At maximum output power 2%

f < 1 GHz, outside restricted bands –43

Spurious emission conducted measurement

(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2

(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan)

(1)

f < 1 GHz, restricted bands ETSI –58 f < 1 GHz, restricted bands FCC –57 f > 1 GHz, including harmonics –45

dBm

5.11 24-MHz Crystal Oscillator (XOSC_HF)

(1)

over operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Crystal frequency 24 MHz Crystal frequency tolerance Start-up time

(1) Probing or otherwise stopping the XTAL while the DC-DC converter is enabled may cause permanent damage to the device. (2) Includes initial tolerance of the crystal, drift over temperature, aging and frequency pulling due to incorrect load capacitance. As per

Bluetooth and IEEE 802.15.4 specification

(3) Kick-started based on a temperature and aging compensated RCOSC_HF using precharge injection

(3)

(2)

–40 40 ppm

150 µs

5.12 32.768-kHz Crystal Oscillator (XOSC_LF)

over operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Crystal frequency 32.768 kHz Initial crystal frequency tolerance, Bluetooth

low energy applications Crystal aging -3 3 ppm/year

Tc= 25°C

–20 20 ppm

5.13 48-MHz RC Oscillator (RCOSC_HF)

Tc= 25°C, VDD= 3.0 V, unless otherwise noted

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Frequency 48 MHz Uncalibrated frequency accuracy ±1% Calibrated frequency accuracy Start-up time 5 µs

(1) Accuracy relatively to the calibration source (XOSC_HF).

(1)

±0.25%

5.14 32-kHz RC Oscillator (RCOSC_LF)

Tc= 25°C, VDD= 3.0 V, unless otherwise noted

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Calibrated frequency 32.8 kHz Temperature coefficient 50 ppm/°C

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5.15 ADC Characteristics

Tc= 25°C, VDD= 3.0 V and voltage scaling enabled, unless otherwise noted

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Input voltage range 0 V Resolution 12 Bits Sample rate 200 ksps Offset Internal 4.3-V equivalent reference Gain error Internal 4.3-V equivalent reference

(3)

DNL INL

(4)

Differential nonlinearity >–1 LSB Integral nonlinearity ±3 LSB

Internal 4.3-V equivalent reference

9.6-kHz input tone

ENOB Effective number of bits

Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone

Internal 4.3-V equivalent reference

9.6-kHz input tone

THD

Total harmonic distortion

Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone

Internal 4.3-V equivalent reference

9.6-kHz input tone SINAD and SNDR

Signal-to-noise and distortion ratio

Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone

Internal 4.3-V equivalent reference

9.6-kHz input tone SFDR

Spurious-free dynamic range

Internal 1.44-V reference, voltage scaling disabled, 32

samples average, 200 ksps, 300-Hz input tone Conversion time Serial conversion, time-to-output, 24-MHz clock 50 Current consumption Internal 4.3-V equivalent reference

Current consumption VDD as reference 0.75 mA

Equivalent fixed internal reference (input voltage

scaling enabled). For best accuracy, the ADC Reference voltage

conversion should be initiated through the TI-RTOS™

API to include the gain or offset compensation factors

stored in FCFG1.

Fixed internal reference (input voltage scaling

disabled). For best accuracy, the ADC conversion Reference voltage

should be initiated through the TI-RTOS API to include

the gain or offset compensation factors stored in

FCFG1. This value is derived from the scaled value

Reference voltage

(4.3 V) as follows: V

VDD as reference (Also known as RELATIVE) (input

voltage scaling enabled)

VDD as reference (Also known as RELATIVE) (input

voltage scaling disabled)

= 4.3 V × 1408 / 4095

ref

200 ksps, voltage scaling enabled. Capacitive input, Input Impedance

input impedance depends on sampling frequency and

sampling time

(1) Using IEEE Std 1241™-2010 for terminology and test methods. (2) Input signal scaled down internally before conversion, as if voltage range was 0 to 4.3 V. (3) No missing codes. Positive DNL typically varies from +0.3 to +3.5 depending on device, see Figure 5-24. (4) For a typical example, see Figure 5-25. (5) Applied voltage must be within absolute maximum ratings (see Section 5.1) at all times.

(2) (2)

(2)

, 200 ksps,

(2)

, 200 ksps,

(2)

, 200 ksps,

(2)

, 200 ksps,

(2)

(1)

4.3

VDD V

VDD / 2.82

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2 LSB

2.4 LSB

9.8 BitsVDD as reference, 200 ksps, 9.6-kHz input tone 10

11.1

–65

dBVDD as reference, 200 ksps, 9.6-kHz input tone –69

–71

dBVDD as reference, 200 ksps, 9.6-kHz input tone 63

dBVDD as reference, 200 ksps, 9.6-kHz input tone 72

clockcycles

0.66 mA

(2)(5)

1.48 V

(5)

>1 MΩ

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SWRS187D –AUGUST 2016–REVISED JULY 2019

5.16 Temperature Sensor

Tc= 25°C, VDD= 3.0 V, unless otherwise noted

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Resolution 4 °C Range –40 85 °C Accuracy ±5 °C Supply voltage coefficient

(1) Automatically compensated when using supplied driver libraries.

(1)

3.2 °C/V

5.17 Battery Monitor

Tc= 25°C, VDD= 3.0 V, unless otherwise noted

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Resolution 50 mV Range 1.8 3.8 V Accuracy 13 mV

5.18 Continuous Time Comparator

Tc= 25°C, VDD= 3.0 V, unless otherwise noted

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Input voltage range 0 V External reference voltage 0 V Internal reference voltage DCOUPL as reference 1.27 V Offset 3 mV Hysteresis <2 mV Decision time Step from –10 mV to +10 mV 0.72 µs Current consumption when enabled

(1) Additionally, the bias module must be enabled when running in standby mode.

(1)

8.6 µA

DD DD

V V

5.19 Low-Power Clocked Comparator

Tc= 25°C, VDD= 3.0 V, unless otherwise noted

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Input voltage range 0 VDD V Clock frequency 32 kHz Internal reference voltage, VDD / 2 1.49–1.51 V Internal reference voltage, VDD / 3 1.01–1.03 V Internal reference voltage, VDD / 4 0.78–0.79 V Internal reference voltage, DCOUPL / 1 1.25–1.28 V Internal reference voltage, DCOUPL / 2 0.63–0.65 V Internal reference voltage, DCOUPL / 3 0.42–0.44 V Internal reference voltage, DCOUPL / 4 0.33–0.34 V Offset <2 mV Hysteresis <5 mV Decision time Step from –50 mV to +50 mV <1 clock-cycle Current consumption when enabled 362 nA

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5.20 Programmable Current Source

Tc= 25°C, VDD= 3.0 V, unless otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Current source programmable output range 0.25–20 µA Resolution 0.25 µA

Current consumption

(1) Additionally, the bias module must be enabled when running in standby mode.

(1)

Including current source at maximum programmable output

23 µA

5.21 DC Characteristics

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

TA= 25°C, VDD= 1.8 V

GPIO VOH at 8-mA load IOCURR = 2, high-drive GPIOs only 1.32 1.54 V GPIO VOL at 8-mA load IOCURR = 2, high-drive GPIOs only 0.26 0.32 V GPIO VOH at 4-mA load IOCURR = 1 1.32 1.58 V GPIO VOL at 4-mA load IOCURR = 1 0.21 0.32 V GPIO pullup current Input mode, pullup enabled, Vpad = 0 V 71.7 µA GPIO pulldown current Input mode, pulldown enabled, Vpad = VDD 21.1 µA GPIO high/low input transition,

no hysteresis GPIO low-to-high input transition,

with hysteresis GPIO high-to-low input transition,

with hysteresis GPIO input hysteresis IH = 1, difference between 0 → 1 and 1 → 0 points 0.33 V

TA= 25°C, VDD= 3.0 V

GPIO VOH at 8-mA load IOCURR = 2, high-drive GPIOs only 2.68 V GPIO VOL at 8-mA load IOCURR = 2, high-drive GPIOs only 0.33 V GPIO VOH at 4-mA load IOCURR = 1 2.72 V GPIO VOL at 4-mA load IOCURR = 1 0.28 V

TA= 25°C, VDD= 3.8 V

GPIO pullup current Input mode, pullup enabled, Vpad = 0 V 277 µA GPIO pulldown current Input mode, pulldown enabled, Vpad = VDD 113 µA GPIO high/low input transition,

no hysteresis GPIO low-to-high input transition,

with hysteresis GPIO high-to-low input transition,

with hysteresis GPIO input hysteresis IH = 1, difference between 0 → 1 and 1 → 0 points 0.4 V

TA= 25°C

VIH

VIL

IH = 0, transition between reading 0 and reading 1 0.88 V

IH = 1, transition voltage for input read as 0 → 1 1.07 V

IH = 1, transition voltage for input read as 1 → 0 0.74 V

IH = 0, transition between reading 0 and reading 1 1.67 V

IH = 1, transition voltage for input read as 0 → 1 1.94 V

IH = 1, transition voltage for input read as 1 → 0 1.54 V

Lowest GPIO input voltage reliably interpreted as a «High»

Highest GPIO input voltage reliably interpreted as a «Low»

0.2 VDD

0.8 VDD

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+ 35 hidden pages

Texas Instruments CC2650MODA Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual

1 Device Overview

1.1 Features

1.2 Applications

1.3 Description

1.4 Functional Block Diagram

Table of Contents

2 Revision History

3 Device Comparison

3.1 Related Products

4 Terminal Configuration and Functions

4.1 Module Pin Diagram

4.2 Pin Functions

5 Specifications

5.1 Absolute Maximum Ratings

5.2 ESD Ratings

5.3 Recommended Operating Conditions

5.4 Power Consumption Summary

5.5 General Characteristics

5.6 Antenna

5.7 1-Mbps GFSK (Bluetooth low energy) – RX

5.8 1-Mbps GFSK (Bluetooth low energy) – TX

5.9 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX

5.10 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – TX

5.11 24-MHz Crystal Oscillator (XOSC_HF)

5.12 32.768-kHz Crystal Oscillator (XOSC_LF)

5.13 48-MHz RC Oscillator (RCOSC_HF)

5.14 32-kHz RC Oscillator (RCOSC_LF)

5.15 ADC Characteristics

5.16 Temperature Sensor

5.17 Battery Monitor

5.18 Continuous Time Comparator

5.19 Low-Power Clocked Comparator

5.20 Programmable Current Source

5.21 DC Characteristics