Texas Instruments bq51020EVM User Manual

User's Guide

SLUUB03–April 2014

bq51020EVM (5-W WPC) Integrated Wireless Receiver

Power Supply

The bq51020EVM-520 (PWR520-002) wireless power receiver evaluation kit (EVM) from TI is a high
performance, easy-to-use development kit for the design of wireless power solutions. It helps designers to
evaluate the operation and performance of the bq51020 IC, a secondary-side receiver device for wireless
power transfer in portable applications. The bq51020 device is a fully-contained, wireless power receiver
capable of operating in WPC v1.1 protocol which allows a wireless power system to deliver up to 5 W to
the system when used with a Qi inductive transmitter. The bq51020 device provides a single device power
conversion (rectification and regulation) as well as the digital control and communication for WPC
specification. The kit enables designers to speed up the development of their end-applications.

Contents

1 Introduction ................................................................................................................... 2

2 Considerations with this EVM.............................................................................................. 2

3 Modifications.................................................................................................................. 3

4 Recommended Operation Condition ...................................................................................... 3

5 Equipment and EVM Setup................................................................................................. 4

5.1 Schematic............................................................................................................ 4

5.2 Connector Descriptions ............................................................................................ 5

5.3 Jumpers and Switches............................................................................................. 5

5.4 Test Point Descriptions ............................................................................................ 5

5.5 Pin Description of the IC .......................................................................................... 6

6 Test Procedure............................................................................................................... 6

6.1 Definition............................................................................................................. 6

6.2 Recommended Test Equipment .................................................................................. 7

6.3 Equipment Setup.................................................................................................... 7

6.4 Procedure............................................................................................................ 8

7 Test Results................................................................................................................. 11

7.1 Steady-State Operation with bq2425x Charger .............................................................. 11

7.2 Load Step .......................................................................................................... 12

7.3 Start Up............................................................................................................. 12

7.4 Efficiency Data..................................................................................................... 13

7.5 AD Insertion and Removal ...................................................................................... 13

7.6 Thermal Performance............................................................................................. 14

8 Layout and Bill of Material ................................................................................................ 15

8.1 bq51020 Traces .................................................................................................. 15

8.2 Layout Guidelines ................................................................................................. 15

8.3 Printed-Circuit Board Layout Example ......................................................................... 15

8.4 bq51020EVM-520 Layout ........................................................................................ 17

8.5 Bill of Materials (BOM)............................................................................................ 20

List of Figures

1 bq51020EVM-520 Schematic .............................................................................................. 4

2 bq51020 in Steady State Operation with bq24250 .................................................................... 11

3 Load Step ................................................................................................................... 12

4 Start Up With 500 mA ..................................................................................................... 13

5 System Efficiency Versus Output Power ............................................................................... 13

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Introduction

6 Adapter Insertion and Removal .......................................................................................... 14

7 Thermal Image (1000-mA Load) ........................................................................................ 14

8 bq51020EVM-520 Layout Example ..................................................................................... 16

9 bq51020EVM-520 Top Assembly ....................................................................................... 17

10 bq51020EVM-520 Layer 1 ................................................................................................ 17

11 bq51020EVM-520 Layer 2 ................................................................................................ 18

12 bq51020EVM-520 Layer 3 ................................................................................................ 18

13 bq51020EVM-520 Layer 4 ................................................................................................ 19

1 bq51020EVM-520 Electrical Performance Specifications.............................................................. 3

2 Pin Description............................................................................................................... 6

3 bq51020EVM-520 Bill of Materials ...................................................................................... 20

1 Introduction

The bq51020 is an advanced, flexible, secondary-side device for wireless power transfer in portable
applications. The bq51020 device integrates an ultra-low-impedance synchronous rectifier, a very-high­efficiency post regulator, digital control, and accurate voltage and current loops. The bq51020 devices
provide the AC/DC power conversion while integrating the digital control required. The IC complies with
the WPC v1.1 communication protocol.

Together with the bq500xxx primary-side controller transmitter, the bq51020 enables a complete
contactless power transfer system for a wireless power supply solution. By utilizing near-field inductive
power transfer, the secondary coil embedded in the mobile device can pick up the power transmitted by
the primary coil. The voltage from the secondary coil is then rectified and regulated to be used as a power
supply for down-system electronics. Global feedback is established from the secondary to the primary in
order to control the power transfer process.

A WPC system communication is digital -– packets are transferred from the secondary to the primary.
Differential bi-phase encoding is used for the packets. The bit rate is 2Kbps. Various types of
communication packets have been defined. These include identification and authentication packets, error
packets, control packets, power usage packets and efficiency packets, among others.

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List of Tables

2 Considerations with this EVM

The bq51020EVM-520 evaluation module (PWR520-002) demonstrates the receiver portion of the
wireless power system. This receiver EVM is a complete receiver-side solution that produces 5-W output
power at up to 1-A load with adjustable output voltage.

• The receiver can be used in any number of low-power battery portable devices as a power supply for a
battery charger. With contact-free charging capability, no connections to the device are needed.

• Highly-integrated wireless power receiver solution
– Ultra-efficient synchronous rectifier
– Very-high efficiency post regulator
– WPC v1.1-compliant communication and control
– Only one IC required between RX coil and DC output

• Programmable output voltage to optimize performance for application

• Adaptive Communication current limit (CM_ ILIM) for robust communication.

• Supports 20-V max input

• Low-power dissipative overvoltage clamp

• Overvoltage, overcurrent, overtemperature protection

• Low-profile, external pick-up coil

• Frame is configured to provide correct receiver to transmitter spacing

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• Room above coil for testing with battery, key for Foreign Object Detection (FOD) tuning

• Options to adjust the input current limit and output voltage using resistors

• Flexibility for Foreign Object Detection (FOD) tuning

• Adjustable resistor that can be used to set RFOD

• Temperature sensing can be adjusted using external resistors

• Micro-USB connector for adapter testing configuration

• WPG LED indicator (turns on as V

OUT

• PD_DET LED indicator --turns on as the RX is on TX pad

3 Modifications

See the data sheet (SLUSBX1) when changing components. To aid in such customization of the EVM, the
board was designed with devices having 0402 and 0603 or larger footprints. A real implementation likely
occupies less total board space.

Note that changing components can improve or degrade EVM performance.

4 Recommended Operation Condition

Table 1 provides a summary of the bq51020EVM-520 performance specifications. All specifications are

given for an ambient temperature of 25°C.

Table 1. bq51020EVM-520 Electrical Performance Specifications

Modifications

goes high)

PARAMETER TEST CONDITION MIN TYP MAX UNIT

V

IN

I

AD_EN_sink

I

IN

I

OUT

V

OUT(REG)

f

s

T

J

(1)

The output voltage can be adjusted using V
operation of the EVM.

RECT input voltage range 4.0 10.0 V
Sink current 1 mA
Input current range 1.5 A
Output current range Current limit programming range 1.5 A
Programmable output voltage
Switching frequency WPC 110 205 kHz
Junction temperature 125 °C

(1)

P

= 5 W 4.5 8 V

OUT

resistors. Also the coil needs to change for different voltage for optimal

OUT(REG)

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GND

1800pF

C4

0.068µF

C2

0.068µF

C1

BOOT1

RECTBOOT2

BOOT2

OUT

BOOT1

CLMP1

AD

FOD

VTSB/VIREG

CLMP2

COMM1

AD_EN

/WPG

COMM2

VO_REG

CM_ILIM

TS

CLMP1

0.47µF

C9

0.47µF

C12

CLMP2

COMM2

COMM1

GND

GND

VO_REG

1

2

J5

GND

0.1µF

C19

GND

TS

GND

VTSB/VIREG

TP1

DNP

TP2

DNP

2.00k

R13

DNP

GND

1.50k

R7

RECT

/WPG

GND

GND

0.1µF

C18

150

R2

FOD

TP5

1
2
3

JP1

110

R4

TP4

ADJ

TS

GND

ILIM

FIX

RECT

56.2k

R1

1
2

J3

1
2

J4

1

2

3

JP2

GND

CM_ILIM

High

Low

CM_ILIM

GND

GND

0.1µF

C16

TP3

GND

GND

0.1µF

C6

OUT

GNDGND

AD_EN

Rect

1µF

C17

GND

GND

GND

Out

ILIM

FOD

AC1

AC2

Orange

D2

Green

D1

1

2

3

4

5

6
7
8

9
10
11

J1

1 2
3 4
5 6
7 8
9 10

J2

GND

Q1

CSD75301W1015

OUT

AD

GND

20k

R15

10.0k

R11

5.11k

R16

0.047uF

C3

100pF

C5

10µF

C14

10µF

C15

1µF

C20

0

R3

OUT

0.015µF

C10

0.015µF

C11

0.022µF

C8

0.022µF

C13

3.3µF

C7

1.50k

R20

DNP

Green

D3

DNP

GND

102k

R17

DNP

102k

R14

11.3k

R18

DNP

11.3k

R10

102k

R19

DNP

5.6Meg

R12

27k

R21

DNP

100pF

C22

DNP

GND

PGND

A1

PGND

A2

PGND

A3

PGND

A4

PGND

A5

PGND

A6

AC1

B1

AC1

B2

AC1

B3

AC2

B4

AC2

B5

AC2

B6

BOOT1

C1

RECT

C2

RECT

C3

RECT

C4

RECT

C5

BOOT2

C6

OUT

D1

OUT

D2

OUT

D3

OUT

D4

OUT

D5

OUT

D6

CLAMP1

E1

AD

E2

AD_EN

E3

EN1/SCL

E4

VIREG

E5

CLAMP2

E6

COMM1

F1

FOD

F2

LPRBEN and TERM

F3

EN2/SDA

F4

LPRB1 and WPG

F5

COMM2

F6

VO_REG

G1

ILIM

G2

CM_ILIM

G3

TS

G4

TMEM

G5

LPRB2 and PD_DET

G6

U1

bq51020

2.2µF

C21

200

R9

200

R8

5 K

R5

DNP

500 Ohm

R6

1
2
3

JP3

1
2
3

JP4

TP6

Ext

GND

GND

Hi

Low

Hi

Low

EN1

EN2

102k

R22

5.1V

D4
BZT52C5V1T-7

GND

Equipment and EVM Setup

5 Equipment and EVM Setup

5.1 Schematic

Figure 1 shows the bq51020 schematic.

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Figure 1. bq51020EVM-520 Schematic

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5.2 Connector Descriptions

The connections points are described in the following paragraphs.

5.2.1 J1 – AD External Adapter Input

Power can be provided to simulate an external adapter applied to the receiver in this bq51020EVM-520
(PWR520-002).

5.2.2 J2 – Programming Connector

This connector is populated and is for factory use only

5.2.3 J3 – Output Voltage

Output voltage in wireless power mode up to 1 A; the adapter option is also supported in this PWR520-

002.

5.2.4 J4 –GND

Ground return

5.2.5 J5 – TS/CTRL and Return Connector

External connection for temperature sense resistor, see data sheet for additional information. Not
populated in this spin.

Equipment and EVM Setup

5.3 Jumpers and Switches

The control jumpers are described in the following paragraphs.

5.3.1 JP1– ILIM (FIX or ADJ)

Maximum output current is set by the ILIM pin. In the FIX position, the current is set to a fixed value of R4
plus RFOD. In the ADJ position, current is set by R5. Note that R5 is not populated in this EVM.

5.3.2 JP2 – CM_ILIM

Enables CM_ILIM feature when pulled low and disable when pulled up.

5.3.3 JP3 – EN1 (Low and High)

EN1 pin, set High using external power supply connected to TP6 .

5.3.4 JP4 – EN2 (Low and High)

EN2 pin, set High using external power supply connected to TP6.

5.4 Test Point Descriptions

The test points are described in the following paragraphs.

5.4.1 TP1 and TP2 – AC1 and AC2 Inputs

This are not populated, they can be used for measuring AC voltage applied to the EVM from the receiver
coil.

5.4.2 TP3– Rectified Voltage

The input AC voltage is rectified into unregulated DC voltage (V

); additional capacitance is used to

RECT

filter the voltage before the regulator.

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Equipment and EVM Setup

5.4.3 TP4– ILIM

Programming pin for overcurrent limit protection, pin G2 of the IC.

5.4.4 TP5 – FOD

Input for rectified power measurement for FOD feature in WPC, pin F2 of the IC. TP5 is the FOD pin for
the bq51020.

5.4.5 TP6 – Ext

Connect to 5-V external power supply. Used to pull EN1 and EN2 high. Any voltage level above 7 V may
damage the IC.

5.5 Pin Description of the IC

A1, A2, A3, A4, A5, A6 PGND

D1, D2, D3, D4, D5, D6 OUT

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Table 2. Pin Description

PIN Number (WCSP) bq51020

B1, B2, B3 AC1
B4, B5, B6 AC2

C1 BOOT1

C2, C3, C4, C5 RECT

C6 BOOT2

E1 CLAMP1
E2 AD
E3 AD_EN
E4 EN1
E5 VTSB
E6 CLAMP2
F1 COMM1
F2 FOD
F3 TERM
F4 EN2
F5 WPG
F6 COMM2
G1 VO_REG
G2 ILIM
G3 CM_ILIM
G4 TS/CTRL
G5 TMEM
G6 PD_DET

6 Test Procedure

This procedure describes test configuration of the bq51020EVM-520 evaluation board (PWR520-002) for
bench evaluation.

6.1 Definition

The following naming conventions are followed.

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Test Procedure

VXXX : External voltage supply name (VADP, VTS, V
LOADW: External load name (LOADR, LOADI)
V(TPyy): Voltage at internal test point TPyy. For example, V(TP02) means the voltage at TP02.
V(Jxx): Voltage at header Jxx
V(TP(XXX)): Voltage at test point XXX. For example, V(ACDET) means the voltage at the test

point which is marked as ACDET.

V(XXX, YYY): Voltage across point XXX and YYY.
I(JXX(YYY)): Current going out from the YYY terminal of header XX.
Jxx(BBB): Terminal or pin BBB of header xx.
JPx ON : Internal jumper Jxx terminals are shorted.
JPx OFF: Internal jumper Jxx terminals are open.
JPx (-YY-) ON: Internal jumper Jxx adjacent terminals marked as YY are shorted.

Assembly drawings have locations for jumpers, test points, and individual components.

6.2 Recommended Test Equipment

The following equipment is needed to complete this test procedure:

Power Supplies

• Power Supply #1 (PS #1) capable of supplying 19 V at 1 A is required

• Power Supply #2 (PS #2) capable of supplying 5 V at 1 A is required

• Power Supply #3 (PS #3) capable of supplying 5 V at 1 A is required

Loads

• A resistive load or electronic load that can be set to 5 Ω/1000 mA, 10 Ω/500 mA, and 5 kΩ/1 mA. The
power rating should be 5 W.

Meters

• Two DC voltmeters and two DC ammeters

Oscilloscopes

• Not required

bqTesla Transmitter

• The HPA689 transmitter or equivalent is used for the final test.

Recommended Wire Gauge

• For proper operation, TI recommends 22-AWG wire.

OUT

)

6.3 Equipment Setup

The following items ensure proper equipment setup:

Test Set Up

• The final assembly will be tested using a bqTesla transmitter – provided (HPA689). Input voltage to the
transmitter is set to 19 VDC ±200 mV, with a current limit of 1.0 A.

• Connect power supply to J1 and J2 of the transmitter, HPA689

• Set power supply to OFF

• Place unit under test (UUT) on the transmitter coil

• UUT will be placed in the center of the HPA689 TX coil. Other bqTesla transmitter base units are also
acceptable for this test (ensure the correct input voltage is applied).

Load

• The load is connected between J3-OUT and J4-GND of the UUT

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Test Procedure

• A DC ammeter is connected between UUT and load

• Set the load for 5 Ω/1000 mA

Jumper Settings

• JP1 → ILIM and FIX are shorted

• JP2 → CM_ILM and High are shorted

• JP3 → EN1 and Low are shorted

• JP4 → EN2 and Low are shorted

Voltage and Current Meters

• Connect the ammeter to measure 19-V input current to the transmitter. Connect the voltmeter to
monitor the input voltage at J1 and J2 of TX unit. On UUT a voltmeter is used to measure output
voltage at J3 with ground at J4. Connect the ammeter to measure load current.

RFOD: R6 Set Up

• Connect the ohmmeter between JP5 (FOD) and J4 (GND). Adjust R6 to a 495 Ω reading on the
ohmmeter.

• NOTE: Sometimes the multimeter cannot read the more than 430 Ω from the FOD resistor due to
charged up capacitors in the board. If that happens, use a twizer and short C15 for few seconds, then
measure again.

6.4 Procedure

The following operating procedures are provided at a variety of operating loads:

Turn ON Operation and Operation at 1000-mA Load

• Turn ON transmitter power supply (19 V)

• Transmitter – Verify LED D2 is ON

• UUT – Adjust load current to 1000 mA ±50 mA

• Put the receiver EVM on the transmitter coil and align them correctly

• After 5 seconds verify that:
– Transmitter – Status LED D5 should be green, flashing approximately every 1 second
– The transmitter should beep
– Transmitter – LED D2 still ON
– Receiver – LED D1 is ON
– UUT – Verify that V
– UUT – Verify that the rectified voltage is 5 V to 5.4 V (between TP3 and GND) NOTE: a modulation

signal is present on this voltage every 250 ms and may cause fluctuation in the reading: use lower
value or baseline.

Efficiency Test (1000-mA Load)

• Verify that input current to the TX is less than 500 mA with input voltage at 19 VDC

• Turn OFF the transmitter power supply (19 V)

Turn ON Operation and Operation at 500-mA Load

• Turn ON the transmitter power supply (19 V)

• Transmitter – Verify LED D2 is ON

• UUT – Adjust load current to 500 mA ±50 mA

• Put the receiver EVM on the transmitter coil and align them correctly

• After 5 seconds verify that:
– Transmitter – Status LED D5 should be green, flashing approximately every 1 second.
– The transmitter should beep
– Transmitter – LED D2 still ON

is 4.9 V to 5.15 V (between J3 and J4)

OUT

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Efficiency Test (500-mA Load)

• Verify that input current to the TX is less than 260 mA with an input voltage at 19 VDC

• Turn OFF the transmitter power supply (19 V)

Operation (1-mA Load)

• Turn ON the transmitter power supply (19 V)

• Transmitter – Verify LED D2 is ON

• UUT – Adjust load current to 1 mA ±200 µA

• Put the receiver EVM on the transmitter coil and align them correctly

• After 5 seconds verify that:

Efficiency Test (1-mA Load)

• Verify that input current to the TX is less than 80 mA with input voltage at 19 VDC

• Turn OFF the transmitter power supply (19 V)

• Remove UUT from transmitter

Adapter Test (500-mA Load)

• Connect 5 V ±250 mV adapter on J1 on the bq51020EVM-520 receiver

• Adjust the load current to 500 mA ±50 mA (J3 OUT and J4 GND)

• Verify that:

Test Procedure

– Receiver – LED D1 is ON
– UUT – Verify that V

is 4.9 V to 5.2 V (between J3 or TP7 and J4)

OUT

– UUT – Verify that the rectified voltage is 5 V to 5.4 V (between TP3 and GND) NOTE: a modulation

signal is present on this voltage every 250 ms and may cause fluctuation in the reading: use lower
value or baseline.

– Transmitter – Status LED D5 should be green, flashing approximately every 1 second.
– The transmitter should beep
– Transmitter – LED D2 still ON
– Receiver – LED D1 is ON
– UUT – Verify that V

is 4.9 V to 5.2 V (between J3 and J4)

OUT

– UUT – Verify that the rectified voltage is 6.9 V to 8.6 V (between TP3 and GND) NOTE: a

modulation signal is present on this voltage every 250 ms and may cause fluctuation in the reading:
use lower value or baseline.

1. UUT – LED D1 is OFF

2. UUT – V

is 5.0 V ±600 mV (J3)

OUT

3. Transmitter – Status LED D5 is OFF

4. Put external +5 V power supply to TP6 (Ext) and GND (J4)

5. Set the EN1 and EN2 jumper as follows:

• JP3: EN1 and Low are shorted

• JP4: EN2 and High are shorted

6. Put the receiver EVM on the transmitter coil and align them correctly while still having the adapter

connected to J1 and the external +5 V on TP6.

• After 5 seconds verify that:
– Transmitter – Status LED D5 should be green, flashing approximately every 1 second.
– The transmitter should beep
– Transmitter – LED D2 is still ON
– Receiver – LED D1 is ON
– UUT – Verify that V

is 4.9 V to 5.2 V (between J3 and J4)

OUT

– UUT – Verify that the rectified voltage is 5V to 5.6V (between TP3 and GND). NOTE: a

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Test Procedure

7. Set the EN1 and EN2 jumper as follows:

8. Put the receiver EVM on the transmitter coil and align them correctly while still having the adapter

9. Verify that:

modulation signal is present on this voltage every 250 ms and may cause fluctuation in the
reading: use lower value or baseline.

– This disables wired power and prioritizes wireless power

• JP3: EN1 and High are shorted

• JP4: EN2 and High are shorted

connected to J1 and the external 5 V on TP6.

• UUT – LED D1 is OFF

• UUT – V

is 0 V ±600 mV (J3)

OUT

• Transmitter – Status LED D5 is ON

• This means both wired and wireless power are disabled

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7 Test Results

7.1 Steady-State Operation with bq2425x Charger

With the power supply off, connect the supply to the bqTESLA transmitter.

• Set up the test bench as described in Section 6.

• Power TX with 19 V.

• Connect the output of RX to a battery charger (bq24250) to charge a battery.

• Set the VBAT to 3.8 V.

• Set the charger current to 1.2 A.

• Set input current limit on the charger to 1 A.

• Monitor the I
them correctly.

• Figure 2 shows the V

OUT

and V

from the RX after putting the receiver EVM on the transmitter coil and align

OUT

OUT

and I

from the RX as the battery charges.

OUT

Test Results

Figure 2. bq51020 in Steady State Operation with bq24250

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Test Results

7.2 Load Step

The procedure for load step is as follows:

• Set up the test bench as described in Section 6.

• Power WPC TX (bq500210) with 19 V.

• Provide a load step from no-load (high impedance) to 1000 mA (if using current source load).

• Monitor on side RX: load current, rectifier voltage, and output voltage as shown in Figure 3.

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7.3 Start Up

The procedure for start-up test with load:

• Set up the test bench as described in Section 6.

• Power the WPC TX

• Apply 10 Ω across J3 and J4, put the receiver EVM on the transmitter coil, and align them correctly

• Monitor the RECT pin, I

Figure 3. Load Step

, and output voltage, as shown in Figure 4.

OUT

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20

30

40

50

60

70

80

90

100

0 1000 2000 3000 4000 5000

Efficiency (%)

Power (mW)

TX-bq500211A

TX-bq500212A

C001

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Test Results

Figure 4. Start Up With 500 mA

7.4 Efficiency Data

7.4.1 Efficiency Versus Output Power (AC-DC)

Figure 5 illustrates the system (DC-DC) efficiency of the bq51020EVM-520 under different transmitters.

Figure 5. System Efficiency Versus Output Power

7.5 AD Insertion and Removal

Figure 6 illustrates the behavior of the bq51020EVM-520 when the AD is inserted while the EVM is on the

transmitter pad. There is some off time during the transition between wireless power and wired power
modes.

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Test Results

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Figure 6. Adapter Insertion and Removal

7.6 Thermal Performance

This section shows a thermal image of the bq51020EVM-520. A 1-A load is used and the output voltage is
set to 5 V. There is no air flow and the ambient temperature is 25°C. The peak temperature of the device
(39°C in WPC) is well below the maximum recommended operating condition listed in the data sheet.

Figure 7. Thermal Image (1000-mA Load)

14

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8 Layout and Bill of Material

8.1 bq51020 Traces

The bq51020 device pins can be classified as follows:

• Signal/Sensing Traces
– TS/CTRL, EN1, EN2, PD_DET, WPG, COMM, ILIM, AD, ADEN, FOD, TMEM, CM_ILIM, VO_REG,

VTSB, Term.

– Make sure these traces are not interfered by the noisy traces

• Noisy Traces
– AC1, AC2, BOOT, COMM
– Make sure these traces are isolated from other traces, use ground plan

• Power Traces
– AC1, AC2, OUT, CLAMP, PGND
– Make sure to use the correct width for the right current rating.

8.2 Layout Guidelines

Use the following layout guidelines:

• The traces from the input connector to the inputs of the bq51020 IC pin should be as wide as possible
to minimize the impedance in the lines. Otherwise, this causes a voltage drop and thermal issue.

• Keep the trace resistance as low as possible on AC1, AC2, OUT, and PGND.

• Use the appropriate current rating traces (width) the AC, OUT and PGND.

• The PCB should have a ground plane (return) connected directly to the return of all components
through vias (At least two vias per capacitor for power-stage capacitors, one via per capacitor for
small-signal components).

• The dissipation of heat path is important. Adding internal layers increases the thermal performance.
Multiple vias in the PGND pins of the IC is recommended to decrease the thermal resistance in the
board and allow much easier thermal dissipation through inner layer and power ground layers.

• The via interconnect is important and must be optimized near the power pad of the IC and the GND.

• 2-oz copper, or greater, is recommended

• For high-current applications, the balls for the power paths should be connected to as much copper in
the board as possible. This allows better thermal performance because the board conducts heat away
from the IC.

• It is always good practice to place high frequency bypass capacitors next to RECT and OUT.

Layout and Bill of Material

8.3 Printed-Circuit Board Layout Example

The primary concerns when laying a custom receiver PCB are as follows:

• AC1 and AC2, GND return trace resistance

• OUT trace resistance

• GND connection

• Copper weight ≥ 2 oz

For a 1-A fast charge current application, the current rating for each net is as follows:

• AC1 = AC2 = 1.2 A

• BOOT1 = BOOT2 = 1 A

• RECT = 50 mA

• OUT = 1 A

• COMM1 = COMM2 = 300 mA

• CLAMP1 = CLAMP2 = 500 mA

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Layout and Bill of Material

• ILIM = 10 mA

• AD = AD_EN = TS/CTRL = EN1 = EN2 = TERM = FOD = 1 mA

• PWR = 10 mA

TI also recommends having the following capacitance on RECT and OUT:

• RECT ≥ 10 μF

• OUT ≥ 1 μF

It is always good practice to place high-frequency bypass capacitors next to RECT and OUT of 0.1 μF.

Figure 8 illustrates an example of a WCSP layout:

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16

Figure 8. bq51020EVM-520 Layout Example

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8.4 bq51020EVM-520 Layout

Figure 9 through Figure 13 show the bq51020EVM-520 PCB layout.

Layout and Bill of Material

Figure 9. bq51020EVM-520 Top Assembly

Figure 10. bq51020EVM-520 Layer 1

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Layout and Bill of Material

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Figure 11. bq51020EVM-520 Layer 2

18

Figure 12. bq51020EVM-520 Layer 3

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Layout and Bill of Material

Figure 13. bq51020EVM-520 Layer 4

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Layout and Bill of Material

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8.5 Bill of Materials (BOM)

Table 3 lists the BOM for the EVM.

Table 3. bq51020EVM-520 Bill of Materials

Designator Qty Value Description Package Part Number Manufacturer

!PCB 1 Printed Circuit Board PWR520 Any
C1, C2 2 0.068µF CAP CER 0.068UF 50V 10% X7R 0603 0603 GRM188R71H683KA93D MuRata
C3 1 0.047uF CAP CER 0.047UF 50V 10% X7R 0603 0603 GRM188R71H473KA61D MuRata
C4 1 1800pF CAP CER 1800PF 50V 10% X7R 0603 0603 GRM188R71H182KA01D MuRata
C5 1 100pF CAP, CERM, 100pF, 50V, +/-10%, X7R, 0402 0402 CC0402KRX7R9BB101 Yageo America
C6 1 0.1uF CAP, CERM, 0.1uF, 50V, +/-10%, X7R, 0402 0402 C1005X7R1H104K050BB TDK
C7 1 3.3uF CAP, CERM, 3.3uF, 25V, +/-10%, X5R, 0603 0603 C1608X5R1E335K080AC TDK
C8, C13 2 0.022uF CAP CER 0.022UF 25V 10% X7R 0603 0603 C0603C223K3RACTU Kemet
C9, C12 2 0.47uF CAP, CERM, 0.47uF, 25V, +/-10%, X5R, 0603 0603 GRM188R61E474KA12D MuRata
C10, C11 2 0.015uF CAP, CERM, 0.015uF, 50V, +/-10%, X7R, 0402 0402 GRM155R71H153KA12D MuRata
C14, C15 2 10uF CAP, CERM, 10uF, 25V, +/-10%, X5R, 0805 0805 C2012X5R1E106K125AB TDK
C16, C19 2 0.1uF CAP, CERM, 0.1uF, 50V, +/-10%, X7R, 0603 0603 GCM188R71H104KA57B MuRata
C17 1 1uF CAP, CERM, 1uF, 50V, +/-10%, X7R, 0805 0805 GRM21BR71H105KA12L MuRata
C18 1 0.1uF CAP, CERM, 0.1uF, 16V, +/-10%, X7R, 0402 0402 GRM155R71C104KA88D MuRata
C20 1 1uF CAP, CERM, 1uF, 25V, +/-10%, X7R, 0603 0603 GRM188R71E105KA12D MuRata
C21 1 2.2uF CAP, CERM, 2.2uF, 16V, +/-10%, X5R, 0603 0603 GRM188R61C225KE15D MuRata
D1 1 Green LED, Green, SMD 1.6x0.8x0.8mm LTST-C190GKT Lite-On
D2 1 Orange LED, Orange, SMD 1.6x0.8x0.8mm LTST-C190KFKT Lite-On
D4 1 5.1V Diode, Zener, 5.1V, 300mW, SOD-523 SOD-523 BZT52C5V1T-7 Diodes Inc.
H1 1 Tape segment, Low Static Polyimide Film. Cut tape section from 36 yard roll 1.5" x 2.3" 5419-1 1/2" 3M
H2 1 Case Modified Polycase LP-11B with 4 screws J-6838A Polycase
H3 1 Coil, RX with Attractor IWAS4832FFEB9R7J50 Vishay
H4, H5, H6, H7 4 #4 x 3/8" pan head phillips screw #4 x 3/8" PSMS 004 0038 PH BandFFastener
H8, H9, H10, H11 4 Spacer, 0.100" Thk x 0.25" OD x 0.147" ID 0.1" THK 905-100 Bivar
J1 1 Receptacle, Micro-USB-B, Right Angle, SMD Micro USB receptacle 105017-0001 Molex
J2 1 Connector, 100mil Shrouded, High-Temperature, Gold, TH 5x2 Shrouded header N2510-6002-RB 3M
J3, J4, J5 3 Header, 100mil, 2x1, Tin plated, TH Header, 2 PIN, 100mil, PEC02SAAN Sullins Connector

JP1, JP2, JP3, JP4 4 Header, 100mil, 3x1, Tin plated, TH Header, 3 PIN, 100mil, PEC03SAAN Sullins Connector

LBL1, LBL2 2 Thermal Transfer Printable Labels, 0.650" W x 0.200" H - 10,000 per roll PCB Label 0.650"H x THT-14-423-10 Brady

Q1 1 -20V MOSFET, P-CH, -20V, -1.2A, 2x3 DSBGA 2x3 DSBGA CSD75301W1015 Texas Instruments
R1 1 56.2k RES, 56.2k ohm, 1%, 0.063W, 0402 0402 CRCW040256K2FKED Vishay-Dale
R2 1 150 RES, 150 ohm, 5%, 0.063W, 0402 0402 CRCW0402150RJNED Vishay-Dale
R3 1 0 RES, 0 ohm, 5%, 0.063W, 0402 0402 CRCW04020000Z0ED Vishay-Dale
R4 1 110 RES, 110 ohm, 1%, 0.063W, 0402 0402 CRCW0402110RFKED Vishay-Dale

Reference

Tin Solutions

Tin Solutions

0.200"W

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Layout and Bill of Material

Table 3. bq51020EVM-520 Bill of Materials (continued)

Designator Qty Value Description Package Part Number Manufacturer

R6 1 500 Ohm Trimmer, 500 ohm, 0.25W, TH 4.5x8x6.7mm 3266W-1-501LF Bourns
R7 1 1.50k RES, 1.50k ohm, 1%, 0.1W, 0603 0603 CRCW06031K50FKEA Vishay-Dale
R8, R9 2 200 RES, 200 ohm, 1%, 0.1W, 0603 0603 CRCW0603200RFKEA Vishay-Dale
R10 1 11.3k RES, 11.3k ohm, 1%, 0.05W, 0201 0201 ERJ-1GEF1132C Panasonic
R11 1 10.0k RES, 10.0k ohm, 1%, 0.063W, 0402 0402 CRCW040210K0FKED Vishay-Dale
R12 1 5.6Meg RES, 5.6Meg ohm, 5%, 0.05W, 0201 0201 MCR006YRTJ565 Rohm
R14 1 102k RES, 102k ohm, 1%, 0.05W, 0201 0201 ERJ-1GEF1023C Panasonic
R15 1 20k RES, 20k ohm, 5%, 0.063W, 0402 0402 CRCW040220K0JNED Vishay-Dale
R16 1 5.11k RES, 5.11k ohm, 1%, 0.1W, 0603 0603 CRCW06035K11FKEA Vishay-Dale
R22 1 102k RES, 102k ohm, 1%, 0.063W, 0402 0402 CRCW0402102KFKED Vishay-Dale
SH-JP1, SH-JP2, SH-JP3, SH- 4 1x2 Shunt, 100mil, Gold plated, Black Shunt 969102-0000-DA 3M

JP4
TP3, TP4, TP5 3 White Test Point, TH, Miniature, White Keystone5002 5002 Keystone
TP6 1 White Test Point, Miniature, White, TH White Miniature Testpoint 5002 Keystone
U1 1 WPC MODE (Qi) INTEGRATED WIRELESS RECEIVER POWER SUPPLY, YFP0042AWCG YFP0042AWCG bq51020YFP Texas Instruments
C22 0 100pF CAP, CERM, 100pF, 50V, +/-10%, X7R, 0402 0402 CC0402KRX7R9BB101 Yageo America
D3 0 Green LED, Green, SMD 1.6x0.8x0.8mm LTST-C190GKT Lite-On
FID1, FID2, FID3 0 Fiducialmark. There is nothing to buy or mount. Fiducial N/A N/A
R5 0 5 K Trimmer, 5k ohm, 0.25W, TH 4.5x8x6.7mm 3266W-1-502LF Bourns
R13 0 2.00k RES, 2.00k ohm, 1%, 0.1W, 0603 0603 RC0603FR-072KL Yageo America
R17, R19 0 102k RES, 102k ohm, 1%, 0.05W, 0201 0201 ERJ-1GEF1023C Panasonic
R18 0 11.3k RES, 11.3k ohm, 1%, 0.05W, 0201 0201 ERJ-1GEF1132C Panasonic
R20 0 1.50k RES, 1.50k ohm, 1%, 0.1W, 0603 0603 CRCW06031K50FKEA Vishay-Dale
R21 0 27k RES, 27k ohm, 5%, 0.1W, 0603 0603 CRCW060327K0JNEA Vishay-Dale
TP1, TP2 0 Black Test Point, Miniature, Black, TH Black Miniature Testpoint 5001 Keystone

Reference

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Canada Industry Canada Compliance (French)

Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products Applications

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Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
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Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity

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