maximum voltage, maximum
temperature, and maximum
time
Internal band-gap voltage ref
➤
erence
Optional top-off charge
➤
Selectable pulse trickle charge
➤
rates
➤
Low-power mode
➤
8-pin 300-mil DIP or 150-mil
SOIC
Pin Connections
TM
LED
BAT
V
SS
1
2
3
4
8
7
6
5
CC
INH
V
TS
CC
General Description
The bq2002E a n d bq2002G FastCharge ICs are low-cost CMOS bat
tery-charge controllers providing reli
able charge termination for both NiCd
and NiMH battery applications. Co n
trolling a current-limited or con
stant-current supply allows th e
bq2002E/G to be the basis for a costeffective stand-alone or system-inte
grated charger. The bq2002E/G inte
grates fast charge with optional top-off
and pulsed- trickle control in a single
IC for charging one or more NiCd or
NiMH battery cells.
Fast charge is initiated on application
of the charging supply or battery re
placement. Fo r safety, fast charge is
inhibited if the battery temperature
and voltage are outside configured
limits.
Pin Names
TMTimer mode select input
LED
BATBattery voltage input
V
SS
Charging status output
System ground
Fast charge is terminated by any of
the following:
Peak voltage detection(PVD)
n
-
Negative delta voltage(-∆V)
n
-
Maximum voltage
n
Maximum temperature
n
Maximum time
n
-
-
After fast charge, the bq2002E/G op
tionally tops-off and pulse-trickles the
battery per the pre-configured limits.
Fast charge may be inhibited using
the INH pin. The bq2002E/G may
also be placed in low-standby-power
mode to reduce system power con-
-
sumption.
The bq2002E differs from the
bq2002G only in that a slightly different se t of fast-charge and top-off
time limits is available. All differences between the two ICs are illustrated in Table 1.
TSTemperature senseinput
V
CC
Supply voltage input
INHCharge inhibit input
CCCharge control output
-
8-Pin DIP or
Narrow SOIC
PN-200201.eps
bq2002E/G Selection Guide
Part No.LBATTCOHTFLTF
bq2002E
bq2002G
SLUS132 - FEBRUARY 1999
0.175
V
0.175
V
∗
0.5
∗
0.6
V
CC
CC
CC
∗
0.5
∗
V
CC
V
0.6
V
∗
CC
∗
CC
None
None
PVDFast Charget
-∆V
✔
✔
✔
✔
✔
✔
1
MTO
Top-OffMaintenance
C/2200NoneC/32
1C80C/16C/32
2C40NoneC/32
C/2160NoneC/32
1C80C/16C/32
2C40NoneC/32
bq2002E/G
Pin Descriptions
TM
LED
BAT
V
SS
TS
V
CC
INH
T ime rmodeinput
A three-level input that controls the settings
for the fast charge safety timer, voltage ter
mination mode, top-off, pulse-trickle, and
voltage hold-off time.
Charging output status
Open-drain output that indicates the charging
status.
Battery input voltage
Thebattery voltage sense input. The input to
this pin is created by a high-impedance re
sistor divider network connected between
the positive and negative terminals of the
battery.
System ground
Temperature sense input
Input for an external battery temperature
monitoring thermistor.
Supply voltage input
5.0V±20%power input.
Charge inhibit input
When high, INH suspends the fast charge in
progress. When returned low, the IC re-
sumes operation at the point where initially
suspended.
CC
-
Charge control output
An open-drain output used to control the
charging current to the battery. CC switch
ing to high impedance (Z) enables charging
current to flow, and low to inhibit charging
current. CC is modulated to provide top-off,
ifenabled,and pulse trickle.
Functional Description
Figure 2 shows a state diagram and Figure 3 shows a
block diagram ofth e bq2002E/G.
-
Battery Voltageand Temperature
Measurements
Battery voltage and temperature are monitored for
maximum allowable values. The voltage presented on
the battery sense input, BAT, should represent a
single-cell potential for the battery under charge. A
resistor-dividerratio of
RB1
= N - 1
RB2
is recommended to maintain the battery voltage within
the valid range, where N is th e number of cells, RB1 is
the resistor connected to the positive battery terminal,
and RB2 is the resistor connected to the negative battery terminal. SeeFigure 1.
Note:
This resistor-divider network input impedance to
end-to-end should be at least 200k
Ω
and less than 1MΩ.
-
V
CC
RT
BAT
bq2002E/G
V
BAT pin connectionThermistor connection
RB1
RB2
SS
NTC = negative temperature coefficient thermistor.
R3
R4
Mid-level
setting for TM
V
CC
TM
bq2002E/G
V
T
S
SS
PACK +
N
T
C
Fg2002E/G01.eps
Figure 1. Voltage and Temperature Monitoring and TM Pin Configuration
2
bq2002E/G
V or
(PVD or Maximum Time Out)
and TM = Low
Top-off
LED = Z
V
2V or
BAT
V
VCC/2 or
TS
Maximum Time Out
OSC
V
CC
Chip on
4.0V
V
TS
Battery Voltage
too High?
< 2V
V
BAT
Battery Voltage
too Low?
V
0.175
> 0.6
< V
CC
V
CC
Fast
LED =
Low
V
> 2V or
BAT
VTS < VCC/2 or
((PVD or - V or
Maximum Time Out)
and TM
BAT
Battery
Temperature?
Low)
Figure 2. State Diagram
Clock
Phase
Generator
V
V
V
BAT
BAT
TS
V
BAT
V
BAT
V
TS
> 0.175
< 2V, and
> V
CC
2V
>
< 0.175
< 0.6
/2
VCC,
V
V
CC
CC
Trickle
LED =
Flash
Trickle
LED = Z
Charge
Pending
V
BAT
V
> 2V
BAT
2V
2
SD
s
p
.e
2C
00
TM
INH
Charge-Control
State Machine
Power-On
Reset
Timing
Control
Sample
History
PVD, - V
ALU
HTF
Check
CC
LED
Figure 3. Block Diagram
3
TCO
Check
TS
Power
Down
Voltage
Reference
A to D
Converter
LBAT
Check
MCV
Check
V
CC
V
SS
Bd2002CEG.eps
BAT
bq2002E/G
Fast ChargingVCC = 0Fast Charging
(optional)
CC Output
73ms
1.17s1.17s
Charge initiated by application of power
LED
Figure 4. Charge Cycle Phases
Aground-referenced negative temperature coefficient thermistor placed near the battery may be used as a low-cost
temperature-to-voltage transducer. The temperature
sense voltage input at TS is developed using a resistorthermistor network between V
and VSS. See Figure 1.
CC
Starting A Charge Cycle
Either of twoevents starts a chargecycle(see Figure 4):
Pulse-TrickleTop-Off
See Table 1
Charge initiated by battery replacement
1.Application ofpower to V
or
CC
2. Voltage at th e BAT pin falling through the maximum
cell voltage V
MCV
where
V
MCV
= 2V±5%.
If the battery is within th e configured temperature and
voltage limits, the IC begins fast charge. The valid battery voltage range is V
Typical conditions = 25°C, VCC= 5.0V
Mid = 0.5*V
Tolerance on all timing is
V404075DisabledC/32189.4
∆
0.5V
±
CC
±
12%.
4
Pulse-
Trickle
Width
(ms)
Maximum
Synchro
nized
Sampling
Period
(seconds)
-
bq2002E/G
V
= 0.175∗VCC±
LBAT
The valid temperature range isV
= 0.6∗VCC±
V
HTF
20%
TS>VHTF
5%.
where
If the battery voltage or temperature is outside of these
limits, th e IC pulse-trickle charges until the next new
chargecyclebegins.
If V
MCV<VBAT<VPD
newbattery is inserted, a delay of0.35 to 0.9s is imposed
(see “Low-Power Mode”) when a
before the new charge cyclebegins.
Fast charge continues until termination by one or more of
the five possible termination conditions:
Peak voltage detection (PVD)
n
Negative delta voltage (-∆V)
n
Maximum voltage
n
Maximum temperature
n
Maximum time
n
PVD and -∆V Termination
There are two modes for voltage termination, depending
on the state ofTM. For than any previously measured value by 12mV
∆
V (TM = high), if V
is lower
BAT
±
3mV, fast
charge is terminated. For PVD (TM = low or mid), a decrease of 2.5mV
and -
∆
Vtests are valid in the range 1V<V
±
2.5mV terminates fast charge. The PVD
BAT
<2V.
Synchronized Voltage Sampling
Voltage sampling at the BAT pin for PVD and -∆Vtermi
nation may be synchronized to an external stimulus using the INH input. Low-high-low input pulses between
100ns a nd 3.5ms in width must be applied at the INH
pin with a frequency greater than the “maximum syn
chronized sampling period” set by the state of the TM
pin as shown in Table 1. Voltage is sampled on the fal
ling edgeofsuch pulses.
If the time between pulses is greater than the synchro
nizing period, voltage sampling “free-runs” at once every
17 seconds. A sample is taken by averaging together
voltage measurements taken 57
32 measurements in PVD mode and 16 measurements
in -
∆
V mode. The resulting sample periods (9.17 and
18.18ms, respectively) filter out harmonics centered
around 55 and 109Hz. This technique minimizes the ef
fect of any AC line ripple that may feed through the
power supply from either 50or60Hz ACsources.
If the INH input remains high for more than 12ms, the
voltage sample history kept by the IC a nd used for PVD
and -
∆
V termination decisions is erased and a new his
tory is started. Such a reset is required when transition
ing from free-running to synchronized voltage sampling.
µ
s apart. The IC takes
The response of the IC to pulses less than 100ns i n
width or between 3.5ms and 12ms is indeterminate. Tol
±
erance on all timing is
12%.
Voltage TerminationHold-off
A hold-off period occurs at the start of fast charging.
During the hold-off time, the PVD a n d -
∆
Vterminations
are disabled. This avoids premature termination on the
voltage spikes sometimes produced by older batteries
when fast-charge current is first applied. Maximum
voltage and temperature terminations are not affected
by the hold-off period.
Maximum Voltage, Temperature,and Time
Any time the voltage on the BA T pin exceeds the maxi
mum cell voltage,V
chargeis terminated.
Maximum temperature termination occurs anytime t h e
voltage on the TS pin falls below the temperature cut-off
threshold V
TCO
Maximum charge time is configured using the TM pin.
Time settings a re available for corresponding charge
rates of C/2, 1C, and 2C. Maximum time-out termination is enforced on the fast-charge phase, then reset, and
enforced again on the top-off phase, if selected. There is
notime limit onthe trickle-charge phase.
, fast charge or optional top-off
MCV
where
V
TCO
= 0.5∗VCC±
5%.
Top-off Charge
An optional top-off charge phase may be selected to
follow fast charge termination for 1C and C/2 rates.
This phase may be necessary on NiMH or other ba t-
tery chemistries that have a tendency to terminate
charge before reaching full capacity. With top-off en
abled, charging continues at a r educed ra te after
fast-charge termination for a period of time selected
by t h e TM pin. (See Table 1.) During top-off, the CC
pin is modulated at a duty cycle of 73ms active for
every 1097ms inactive. This modulation results in a n
-
average rate 1/16th that ofthe fast charge rate. Maxi
mum voltage, time, an d temperature are the only ter
mination methods enabled during top-off.
Pulse-Trickle Charge
Pulse-trickle is used to compensate for self-discharge
while the battery is idle in the charger. The battery is
pulse-trickle charged by driving the CC pin active once
every 1.17s for the period specified in Table 1. This re
sults in a trickle rate ofC/32.
TM Pin
The TM pin is a three-level pin used to select th e
chargetimer,top-off, voltage termination mode, trickle
-
-
-
-
-
-
5
bq2002E/G
rate, and voltage hold-off period options. Table 1 d e
scribes the states selected by t he TM pin. The midlevel selection input is developed by a resistor di
vider between V
on TM at V
CC
and ground that fixes the voltage
CC
/2±0.5V. See Figure 4.
Charge Status Indication
Afast charge in progress is uniquely indicated when the
LED
pin goes low. The LED pin is driven to the high-Z
state for all conditions other than fast charge. Figure 2
outlines the state of the LED
pinduring charge.
Charge Inhibit
Fast charge and top-off may be inhibited by using th e
INH pin. When high, INH suspends all fast charge and
top-off activity a n d the internal charge timer. INH
freezes the current state of LED
Temperature monitoring is not affected by the INH pin.
During charge inhibit, the bq2002E/G continues to
pulse-trickle charge the battery per the TM selection.
When INH returns low, charge control and the charge
timer resume from the point where INHbecame active.
until inhibit is removed.
-
Low-Power Mode
The IC enters a low-power state when V
above the power-down threshold (V
V
= VCC- (1V±0.5V)
PD
Both the CC pin and the LED
pin are driven to t he
PD
)where
BAT
high-Z state. The operating current is reduced to less
than 1
µ
A in this mode. When V
below V
newchargecyclebegins.
, t he IC pulse-trickle charges until the next
PD
returns to a value
BAT
is driven
6
bq2002E/G
Absolute Maximum Ratings
SymbolParameterMinimumMaximumUnitNotes
V
CC
V
T
T
OPR
T
STG
T
SOLDER
T
BIAS
Note:
VCCrelative to V
SS
DC voltage applied on any pin
excluding V
relative to V
CC
SS
-0.3+7.0V
-0.3+7.0V
Operating ambient temperature0+70°CCommercial
Storage temperature-40+85°C
Soldering temperature-+260° C10 sec max.
Temperature under bias-40+85°C
Permanent device damage may occur if
Absolute Maximum Ratings
are exceeded. Functional opera
tion should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Expo
sure to conditions beyond the operational limits for extended periods of time may affect device reliability.
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated
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