Texas Instruments AN-1870 LM26420 User Manual

1 Introduction
User's Guide
SNVA353B–February 2009–Revised April 2013
AN-1870 LM26420 Evaluation Board
The LM26420 evaluation board was designed to provide two 2A outputs, V either the HTSSOP package option of the LM26420 for easier probing or the WQFN version for evaluating the smaller package. The design emphasizes on the compactness of the LM26420 PCB layout and is thermally optimized. The total solution size is less than 35mm by 40mm. The board supports the conversion from an input voltage ranging from 3V to 5.5V down to output voltages of 0.8V for each channel. V
OUT1
and V
are set to 1.2V and 2.5V respectively. The feedback resistor can be changed to
OUT2
support output voltages as low as 0.8V or as high at 4.5V, assuming VINis high enough to support it. The EN pins are pulled up to VINby jumpers for easy evaluation but can also be easily controlled by external logic.
The board’s specifications are:
Input Voltage: 3V to 5.5V
Output Voltages: 1.2V
OUT1
Maximum load current: 2A/output
Minimum load current: 0A
Size: 1.35 in. × 1.6 in.
Peak Current Limit: 3.2A at 25°C
Nominal Switching Frequency: 550 kHz or 2.2MHz
2 Powering Up the Board
Since the EN pins are directly tied to the input voltage via jumpers J1and J2, starting up the board is as simple as connecting a voltage supply from 3V to 5.5V between the VINand GND terminals. There should be 1.2V on V care should be taken in powering up the supplies such that the input voltage, VIN, does not exceed the Absolute Maximum Rating of 7V. If the part experiences voltages greater than 7V for a prolonged period of time, then damage to the part can occur and then the evaluation board may cease working.
The linear soft-start ramps for the two output voltages and should last about 600 µs. Load can be applied prior to power-up. If an output is shorted either before or after start-up, removal of the short-circuit condition should bring the corresponding output back to normal voltage.
and 2.5V on V
OUT1
and V
OUT1
and 2.5V
OUT2
OUT2
, assuming the jumpers connect VINto EN for each channel. Great
OUT2
. It is available in
All trademarks are the property of their respective owners.
SNVA353B–February 2009–Revised April 2013 AN-1870 LM26420 Evaluation Board
Submit Documentation Feedback
1
Copyright © 2009–2013, Texas Instruments Incorporated
Typical Application Circuit
3 Typical Application Circuit
www.ti.com
Figure 1. LM26420 Demo Board Schematic
2
AN-1870 LM26420 Evaluation Board SNVA353B–February 2009–Revised April 2013
Copyright © 2009–2013, Texas Instruments Incorporated
Submit Documentation Feedback
www.ti.com
4 16-Pin WQFN Pin Out
Pin Name Function
1,2 VIND
11, 12 VIND
15 VINC Power Input supply for control circuitry.
4 PGND 9 PGND
14 AGND Signal ground pin. Place the bottom resistor of the feedback network as close as possible to pin.
6 PG
7 PG
5 FB 8 FB
3 SW 10 SW 16 EN
13 EN
DAP Die Attach Pad Connect to system ground for low thermal impedance and as a primary electrical GND
1
2
1
2
1
2
1
2
1
2
1
2
16-Pin WQFN Pin Out
Figure 2. 16-Pin WQFN (top view)
Table 1. Pin Descriptions 16-Pin WQFN
Power Input supply for Buck1. Power Input supply for Buck2.
Power ground pin for Buck 1. Power ground pin for Buck 2.
Power Good Indicator for Buck 1. Pin is connected through a resistor to an external supply (open collector output).
Power Good Indicator for Buck 2. Pin is connected through a resistor to an external supply (open collector output).
Feedback pin for Buck 1. Connect to external resistor divider to set output voltage. Feedback pin for Buck 2. Connect to external resistor divider to set output voltage. Output switch for Buck 1. Connect to the inductor. Output switch for Buck 2. Connect to the inductor. Enable control input. Logic high enable operation for Buck 1. Do not allow this pin to float or be
greater than VIN + 0.3V. Enable control input. Logic high enable operation for Buck 2. Do not allow this pin to float or be
greater than VIN + 0.3V.
connection.
SNVA353B–February 2009–Revised April 2013 AN-1870 LM26420 Evaluation Board
Submit Documentation Feedback
3
Copyright © 2009–2013, Texas Instruments Incorporated
20-Pin HTSSOP Pin Out
5 20-Pin HTSSOP Pin Out
www.ti.com
Figure 3. 20-Pin HTSSOP (top view)
Table 2. Pin Descriptions 20-Pin HTSSOP
Pin Name Function
3, 4 VIND
17, 18 VIND
1 VINC Power Input supply for control circuitry.
6,7 PGND
14, 15 PGND
20 AGND Signal ground pin. Place the bottom resistor of the feedback network as close as possible to pin.
9 PG
12 PG
8 FB 13 FB
5 SW 16 SW
2 EN
19 EN
10,11 NC No Connect.
DAP Die Attach Pad Connect to system ground for low thermal impedance, but it cannot be used as a primary GND
Power Input supply for Buck1.
1
Power Input supply for Buck2.
2
Power ground pin for Buck 1.
1
Power ground pin for Buck 2.
2
Power Good Indicator for Buck 1. Pin is connected through a resistor to an external supply (open
1
drain output). Power Good Indicator for Buck 2. Pin is connected through a resistor to an external supply (open
2
drain output). Feedback pin for Buck 1. Connect to external resistor divider to set output voltage.
1
Feedback pin for Buck 2. Connect to external resistor divider to set output voltage.
2
Output switch for Buck 1. Connect to the inductor.
1
Output switch for Buck 2. Connect to the inductor.
2
Enable control input. Logic high enable operation for Buck 1. Do not allow this pin to float or be
1
greater than VIN + 0.3V. Enable control input. Logic high enable operation for Buck 2. Do not allow this pin to float or be
2
greater than VIN + 0.3V.
connection.
4
AN-1870 LM26420 Evaluation Board SNVA353B–February 2009–Revised April 2013
Copyright © 2009–2013, Texas Instruments Incorporated
Submit Documentation Feedback
www.ti.com
6 Schematic - X Version
Schematic - X Version
Figure 4. Schematic - X Version
Table 3. Bill of Materials - X Version
Item Designator Description Manufacturer Part No. Qty.
1 22µF, 6.3V, X5R, 1206 TDK C3216X5R0J226(M or K) 6 2 C5 0.47µF, 16V, X7R, 0603 TDK C2012X7R1C474K 1 3 L1, L2 1µH, 6.4A TDK 2 4 R1 5.1k, 1%, 603 Vishay CRCW06035K10F 1
5 R2 21.3k, 1%, 603 Vishay CRCW060321K3F 1 6 R7, R8 49.9k, 1%, 603 Vishay CRCW060349K9F 2
7 10k, 1%, 603 Vishay CRCW060310K0F 4 8 R9 5.1 Ohm, 1%, 805 Vishay CRCW06035R10F 1
9 J1, J2 Jumper for Enables Sullins Connector Solutions STC02SYAN 2
10 TP1-TP8 Keystone Electronics 5011 8
11 U1 Switcher, HTSSOP-20 or Texas Instruments LM26420 or LM26420 1
C1, C2, C3, C4, C6, C7
SPM6530T-1R0M120 or RLF7030T-1R0N6R4
R3, R4, R5, R6
0.094" Diameter Solder Terminal
Dual 2A, 2.2MHz PWM WQFN-16
SNVA353B–February 2009–Revised April 2013 AN-1870 LM26420 Evaluation Board
Submit Documentation Feedback
5
Copyright © 2009–2013, Texas Instruments Incorporated
Schematic - Y Version
7 Schematic - Y Version
www.ti.com
Figure 5. Schematic - Y Version
Table 4. Bill of Materials - Y Version
Item Designator Description Manufacturer Part No. Qty.
1 22µF, 6.3V, X5R, 1206 TDK C3216X5R0J226(M or K) 6 2 C5 0.47µF, 16V, X7R, 0603 TDK TMK105BJ104KV-F 1 3 L1, L2 3.3µH, 6.4A TDK or Coilcraft 2 4 R1 5.1k, 1%, 603 Vishay CRCW06035K10F 1
5 R2 21.3k, 1%, 603 Vishay CRCW060321K3F 1 6 R7, R8 49.9k, 1%, 603 Vishay CRCW060349K9F 2
7 10k, 1%, 603 Vishay CRCW060310K0F 4 8 R9 5.1 Ohm, 1%, 805 Vishay CRCW06035R10F 1
9 J1, J2 Jumper for Enables Sullins Connector Solutions STC02SYAN 2
10 TP1-TP8 Keystone Electronics 5011 8
11 U1 Switcher, HTSSOP-20 or Texas Instruments 1
C1, C2, C3, C4, C6, C7
R3, R4, R5, R6
0.094" Diameter Solder Terminal
Dual 2A, 550kHz PWM WQFN-16
RLF7030T-3R3M4R1 or MSS7341-332NL_
LM26420YMH or LM26420YSQ
6
AN-1870 LM26420 Evaluation Board SNVA353B–February 2009–Revised April 2013
Submit Documentation Feedback
Copyright © 2009–2013, Texas Instruments Incorporated
www.ti.com
8 HTSSOP-20 PCB Layout
HTSSOP - Top Layer HTSSOP - Layer 2
HTSSOP-20 PCB Layout
HTSSOP - Layer 3 HTSSOP - Bottom Layer
SNVA353B–February 2009–Revised April 2013 AN-1870 LM26420 Evaluation Board
Submit Documentation Feedback
7
Copyright © 2009–2013, Texas Instruments Incorporated
WQFN-16 PCB Layout
9 WQFN-16 PCB Layout
WQFN - Top Layer WQFN - Layer 2
www.ti.com
WQFN - Layer 3 WQFN - Bottom Layer
8
AN-1870 LM26420 Evaluation Board SNVA353B–February 2009–Revised April 2013
Copyright © 2009–2013, Texas Instruments Incorporated
Submit Documentation Feedback
www.ti.com
10 Typical Performance Characteristics
Typical Performance Characteristics
Efficiency - 1.2V
Efficiency - 1.2V
- X Version Efficiency - 2.5V
OUT
- Y Version Efficiency - 2.5V
OUT
- X Version
OUT
- Y Version
OUT
Load Step Response - X Version Load Step Response - Y Version
SNVA353B–February 2009–Revised April 2013 AN-1870 LM26420 Evaluation Board
Submit Documentation Feedback
9
Copyright © 2009–2013, Texas Instruments Incorporated
Typical Performance Characteristics
Steady State Operation - Y Version Enable
www.ti.com
Start-up - VINApplied
10
AN-1870 LM26420 Evaluation Board SNVA353B–February 2009–Revised April 2013
Copyright © 2009–2013, Texas Instruments Incorporated
Submit Documentation Feedback
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
Loading...