TEXAS INSTRUMENTS 56GQL Technical data
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Design Summary for
56GQL (48- and 56-pin functions)
MicroStar Junior
PCB Design Guidelines
Package Via to Board Land Area Configuration
Package
ball via
0.2±0.05mm
(Not to scale)
Ratio A/B should equal 1.0 for optimum reliability
Overall Height
< 1.0 mm
MicroStar Junior Package
Land on PCB
PCB
A = Via diameter on package = 0.33 mm (for 0.65-mm pitch)
B = Land diameter on PCB
Solder Ball Collapse
PCB
(Not to scale)
VFBGA Recommended Land Pad Design
TM
BGA
Near-Sn/Pb
eutectic solder
with liquidus
temperature of
178°C to 210°C
A
B
0.2 mm
typical
Trace Width/Spacing Dimensions (mm [in.])
Non-Solder Mask Defined Pad
0.65 [.0256]
0.30 [.0118]
Solder Pad
0.117 [.0046] Trace
0.117 [.0046] min. space
0.65 [.0256]
Trace width/spacing for non-solder mask defined = 0.1167 [.0046]
Trace width/spacing for solder mask defined with 0.33 solder pad = 0.0733 [.0029]
Recommended Board Routing
V
CC
Recommended Routing
for VFBGA-48
GND
V
CC
Solder Mask Defined Pad
A
B
B
A
A = 0.43 mm
B = 0.33 mm
Non Solder M ask Defined Pad
A = 0.30 mm
B = 0.45 mm
B
A
B
A
0.117 MAX
[.0042]
Recommended Routing
for VFBGA-56
GND
V
CC
Note: Typical for most devices.
Refer to data sheet for
specific applications.
GND
0.320 MAX
[.0126]
Note: Typical for most devices.
Refer to data sheet for
specific applications.
0.117 MAX
[.0042]
GND
V
CC
0.320 MAX
[.0126]
Geometric Dimensional Tolerances
Coplanarity
This geometric dimensioning and tolerancing (GD & T) term
means that this package meets a coplanarity of 0.08 mm
0,08 mm
as shown below. Coplanarity is defined as a unilateral tolerance zone
measured upward from the seating plane. (Reference ASME Y14.5-
1994).
Position Tolerance
0.08 mm
This GD & T term is described below:
0,05
This is the symbol for true position.
True position is defined as the theoretically exact centerline location of the solder ball(s).
This symbol/number represents how much the centerline of the solder ball(s) is allowed to vary from it's true position.
0,05
This symbol/letter is defined as the maximum material condition of the solder ball(s) which is 0.45 mm DIA.
The graphic representation is shown below for the top, left solder ball of this package.
Package End
*0.575 mm
Pattern locating boundary for the
centerline of the solder ball.
Package Side
* These two dimensions are calculated
based on a package with nominal
body width and length dimensions.
*0.625 mm
Pattern locating boundary containing the collective dimensions of the maximum size of
the solder ball (0.45 mm) and the maximum variance of the centerline of the solder
ball (0.05 mm) for a total boundary of 0.50 mm DIA.
I.E., the solder ball, regardless of size, must fall within this boundary. (Defined as
virtual condition per ASME standard Y14.5 - 1994).
Please note that a smaller diameter solder ball will have more tolerance in this
boundary than the maximum diameter solder ball.
(0.05 mm DIA.)
True position of the solder ball.
IR Reflow Profile
Ideal (1st and 2nd) Reflow Profile
Room Temp to 140°C: 60 - 90 sec.
140°C to 160°C: 90 - 120 sec.
Time above 200°C: 30 - 60 sec.
Peak Temp: 235°C ±5°C
Time within 5°C Peak Temp: 10-20 sec.
Ramp down rate: 1 - 3°C/sec. max.
250
200
150
100
50
Temperature (°C)
0
0 50 100 150 200 250 300
Time (seconds)
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