Datasheet 73S8010C Datasheet (TERIDIAN Semiconductor)

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73S8010C

Smart Card Interface

Simplifying System Integration™

DATA SHEET

April 2009

DESCRIPTION

The Teridian 73S8010C is a single smart card interface IC. It provides full electrical compliance with ISO-7816-3 and EMV 4.0 specifications.

Interfacing with the host is done through the two-wire I2C bus. Data exchange with the card is managed from the system controller using the I/O line (and eventually the auxiliary I/O lines).

An on-chip oscillator using an external crystal, or connection to a clock signal coming from the system controller can generate the card clock signal.

The 73S8010C IC incorporates an ISO-7816-3 activation/deactivation sequencer that controls the card signals. Level shifters drive the card signals with the selected card voltage (3 V or 5 V), coming from an internal DC-DC converter.

With its high-efficiency DC-DC converter, the Teridian 73S8010C is a cost-effective solution for any smart card reader application to be powered from a single 2.7 V to 3.6 V power supply.

Hardware support for auxiliary I/O lines, C4 / C8 contacts, is provided.

Emergency card deactivation is initiated upon card extraction or upon any fault generated by the protection circuitry. The fault can be a VDD (digital power supply), a VCC (card power supply), a card over-current, or an over-heating fault.

ADVANTAGES

FEATURES  Card Interface:

 Complies with ISO-7816-3 and EMV 4.0  A DC-DC Converter provides 3V / 5V to the

card from an external power supply input

 High-efficiency converter: > 80% @ V

= 5 V and ICC = 65 mA

= 3.3 V,

 Up to 100 mA supplied to the card  ISO-7816-3 Activation / Deactivation sequencer

with emergency automated deactivation on card removal or fault detected by the protection circuitry

 Protection include 2 voltage supervisors that

detect voltage drops on card V

and VDD

power supplies

 The V

voltage supervisor threshold value

can be externally adjusted

 True over-current detection (150 mA max.)  1 card detection input  Auxiliary I/O lines, for C4 / C8 contact signals

 Host Interface:

 Fast mode, 400 kbps I

C slave bus

 8 possible devices in parallel

 One control register and one status register

 Interrupt output to the host for fault

detection

 Crystal oscillator or host clock, up to 27 MHz

 Power Supply:

: 2.7 V to 3.6 V

 V

 6 kV ESD Protection on the card interface  Package: SO28 or 32QFN

 Single smart card interface  The inductor-based DC-DC converter provides

higher current and efficiency than the usual charge-pump capacitor-based converters

 Ideal for battery-powered applications  Suitable for high current cards and

SAMs: (100 mA max)

APPLICATIONS

 Set-Top-Boxes, DVD / HDD Recorders:

Conditional Access and Pay-per-View slots

 Point of Sales and Transaction Terminals  EMV slots in cell phones and PDAs

 Power down mode: 2 A typical  Small Format (5x5mm) 32-QFN package option

73S8010C Data Sheet DS_8010C_024

FUNCTIONAL DIAGRAM

Figure 1: 73S8010C Block Diagram

Pin number reference to SO28 Package

[Pin number] reference to 32QFN Package

2 Rev. 1.5

DS_8010C_024 73S8010C Data Sheet

Table of Contents

1 Pin Description .................................................................................................................................... 5

1.1 Card Interface ............................................................................................................................... 5

1.2 Miscellaneous Inputs and Outputs ................................................................................................ 5

1.3 Power Supply and Ground ............................................................................................................ 5

1.4 Microcontroller Interface ............................................................................................................... 6

2 Host Interface (I2C Bus) ...................................................................................................................... 7

2.1 Host Interface Control ................................................................................................................... 7

2.2 Host Interface Status .................................................................................................................... 8

2.3 I2C-bus Timing .............................................................................................................................. 9

3 Oscillator ............................................................................................................................................ 10

4 DC-DC Converter – Card Power Supply ......................................................................................... 10

5 Voltage Supervision ......................................................................................................................... 11

6 Power Down ....................................................................................................................................... 11

7 Over-temperature Monitor ................................................................................................................ 12

8 Activation Sequence ......................................................................................................................... 12

9 Deactivation Sequence ..................................................................................................................... 13

10 Interrupt ............................................................................................................................................. 13

11 Warm Reset .................................................................................................................... ................... 14 

12 I/O Timing ........................................................................................................................................... 14

13 Typical Application Schematic ........................................................................................................ 15

14 Electrical Specification ..................................................................................................................... 16

14.1Absolute Maximum Ratings ........................................................................................................ 16

14.2Recommended Operating Conditions......................................................................................... 16

14.3DC Characteristics: Card Interface ............................................................................................. 17

14.4DC Characteristics: Digital Signals ............................................................................................. 20

14.5DC Characteristics: Supply ......................................................................................................... 20

14.6DC Characteristics: I2C Interface ................................................................................................ 21

14.7Voltage / Temperature Fault Detection Circuits .......................................................................... 21

15 Mechanical Drawings ....................................................................................................................... 22

15.132-pin QFN ................................................................................................................................. 22

15.228-pin SO .................................................................................................................................... 23

16 Package Pin Designation ................................................................................................................. 24

16.132-pin QFN ................................................................................................................................. 24

16.228-pin SO .................................................................................................................................... 25

17 Ordering Information ........................................................................................................................ 26

18 Related Documentation .................................................................................................................... 26

19 Contact Information .......................................................................................................................... 26

Revision History ........................................................................................................................................ 27

Rev. 1.5 3

73S8010C Data Sheet DS_8010C_024

Figures

Figure 1: 73S8010C Block Diagram ............................................................................................................. 2

Figure 2: I2C Bus Write Protocol ................................................................................................................... 8

Figure 3: I2C Bus Read Protocol ................................................................................................................... 9

Figure 4: I2C Bus Timing Diagram ................................................................................................................ 9

Figure 5: Power Down Mode Operation ...................................................................................................... 12

Figure 6: Activation Sequence .................................................................................................................... 12

Figure 7: Deactivation Sequence ................................................................................................................ 13

Figure 8: FAULT Functions, INT operation ................................................................................................. 13

Figure 9: Warm Reset operation ................................................................................................................. 14

Figure 10: I/O Timing .................................................................................................................................. 14

Figure 11: 73S8010C – Typical Application Schematic .............................................................................. 15

Figure 12: DC – DC Converter Efficiency (VCC = 5 V) ................................................................................ 18

Figure 13: DC – DC Converter Efficiency (VCC = 3 V) ................................................................................ 18

Figure 14: 32-pin QFN Package Drawing ................................................................................................... 22

Figure 15: 28-pin SO Package Drawing ..................................................................................................... 23

Tables

Table 1: Device Address Selections ............................................................................................................. 7

Table 2: Host Control Register ...................................................................................................................... 7

Table 3: Host Status Register ....................................................................................................................... 8

Table 4: Choice of Vcc Capacitor ............................................................................................................... 10

4 Rev. 1.5

DS_8010C_024 73S8010C Data Sheet

1 Pin Description

1.1 Card Interface

Name

(SO)

I/O 11 9 Card I/O: Data signal to/from card. Includes a pull-up resistor to V

(QFN)

Description

CC.

AUX1 13 11 AUX1: Auxiliary data signal to/from card. Includes a pull-up resistor to V

AUX2 12 10 AUX2: Auxiliary data signal to/from card. Includes a pull-up resistor to V

RST 16 14 Card reset: provides reset (RST) signal to card.

CLK 15 13

Card clock: provides clock (CLK) signal to card. The rate of this clock is determined by the crystal oscillator frequency and CLKSEL bits in the control register.

PRES 10 7

Card Presence switch: active high indicates card is present. Includes a pull-down resistor.

VCC 17 15

Card power supply: logically controlled by sequencer, output of DC-DC converter. Requires an external filter capacitor to the card GND.

GND 14 12 Card ground.

1.2 Miscellaneous Inputs and Outputs

Name

(SO)

XTALIN 24 23

XTALOUT 25 24

VDDF_ADJ 18 17

NC 7, 9

(QFN)

4, 6, 8, 16, 25,

Description

Crystal oscillator input: can either be connected to a crystal or driven as a source for the card clock.

Crystal oscillator output: connected to crystal. Left open if XTALIN is being used as an external clock input.

threshold adjustment input: this pin can be used to overwrite a

higher V

value (that controls deactivation of the card). Must be

DDF

left open if unused.

Non-connected pin.

1.3 Power Supply and Ground

CC.

Name

(SO)

VDD 6, 21 3, 20

(QFN)

Description

System controller interface supply voltage: supply voltage for internal circuitry and DC-DC converter power supply source.

GND 4 1 DC-DC converter ground.

GND 14 12 Smart Card I/O ground.

GND 22 21 Digital ground.

LIN 5 2

External inductor: Connect external inductor from pin 5 to V

. Keep the

inductor close to pin 5.

Rev. 1.5 5

73S8010C Data Sheet DS_8010C_024

1.4 Microcontroller Interface

Name

(SO)

INT 23 22

PWRDN 8 5

(QFN)

Description

Interrupt output (negative assertion): Interrupt output signal to the processor. A 20 kΩ pull up to V

Power Down control input: Active High. When Power Down (PD) mode is activated, all internal analog functions are disabled to place the 73S8010C in its lowest power consumption mode. Must be tied to ground when the power down function is not used.

SAD0 SAD1 SAD2

1 2 3

Serial device address bits: Digital inputs for address selection that allow

the connection of up to 8 devices in parallel. Address selections as follows:

30 31

SAD2 SAD1 SAD0 I

0 0 0 0x40 0 0 1 0x42 0 1 0 0x44 0 1 1 0x46 1 0 0 0x48 1 0 1 0x4A 1 1 0 0x4C 1 1 1 0x4E

Pins SAD0 and SAD1 are internally pulled-down and SAD2 is internally pulled-up.

The default address when left unconnected is 48h.

SCL 19 18 I2C clock signal input.

SDA 20 19 I2C bi-directional serial data signal.

I/OUC 26 26

AUX1UC 27 27

AUX2UC 28 28

System controller data I/O to/from the card. Includes internal pull-up resistor to V

DD.

System controller auxiliary data I/O to/from the card. Includes internal pullup resistor to V

DD.

System controller auxiliary data I/O to/from the card. Includes internal pullup resistor to V

DD.

is provided internally.

C Address (7 bits)

6 Rev. 1.5

DS_8010C_024 73S8010C Data Sheet

2 Host Interface (I2C Bus)

A fast-mode 400 kHz I2C bus slave interface is used for controlling the device and reading the status of the device via the data pin SDA and clock pin SCL. The bus has 3 address select pins, SAD0, SAD1, and SAD2. This allows up to 8 devices to be connected in parallel.

Table 1: Device Address Selections

SAD2 SAD1 SAD0 I

0 0 0 0x40 0 0 1 0x42 0 1 0 0x44 0 1 1 0x46 1 0 0 0x48 1 0 1 0x4A 1 1 0 0x4C 1 1 1 0x4E

Bit 0 of the I

C address is the R/W bit. Refer to Figure 2 and Figure 3 for usage.

2.1 Host Interface Control

C Address (7 bits)

Table 2 describes the Host Interface Control Register bits (power-on Reset = 0x00).

Table 2: Host Control Register

Name Bit Description

Start/Stop 0

When set, initiates an activation and a cold reset procedure; when reset, initiates a deactivation sequence.

Warm reset 1

When set, initiates a warm reset procedure; automatically reset by hardware when the card starts answering or when the card is declared mute.

5 V and 3 V 2 When set, VCC = 3 V; when reset, VCC = 5 V.

Clock Stop 3 When set, card clock is stopped. Bit 4 determines the card clock stop level.

Clock Stop

4 When set, card clock stops high; when reset card clock stops low.

Level

Clksel1 5

Bits 5 and 6 determine the clock rate to the card according to the following table.

CLKDIV1 CLKDIV2 Clock Rate

Clksel2 6

0 0 XTALIN/8 0 1 XTALIN/4 1 1 XTALIN/2 1 0 XTALIN

I/O enable 7

When set, data is transferred between I/O (AUX1, AUX2) and I/OUC (AUX1UC, AUX2UC); when reset, I/O (AUX1, AUX2) and I/OUC (AUX1UC, AUX2UC) are high impedance.

C-bus Write to the Control Register

The I

C-bus Write command to the control register follows the format shown in Figure 2.

After the START condition, the master sends a slave address. This address is seven bits long followed by an eighth bit, which is an opcode bit (R/W) – a ‘zero’ indicates the master will write data to the control register. After the R/W bit, the ’zero’ ACK bit is sent to the master by the device. The master now starts sending the 8 bits of data to the control register during the DATA bits time. After the DATA bits, the ‘zero’

Rev. 1.5 7

73S8010C Data Sheet DS_8010C_024

ACK bit is sent to the master by the device. The master should send the STOP condition after receiving the ACK bit.

Figure 2: I

C Bus Write Protocol

2.2 Host Interface Status

Table 3 describes the Host Interface Status Register bits (power-on Reset = 0x04).

Table 3: Host Status Register

Name Bit Description

PRES 0 Set when the card is present; reset when the card is not present.

PRESL 1

I/O 2 Set when I/O is high; reset when I/O is low.

SUPL 3

PROT 4

MUTE 5

EARLY 6

ACTIVE 7 Set when the card is active (VCC is on); reset when the card is inactive.

C-bus Read from the Status Register:

The I

C-bus Read Command from the Status Register follows the format shown in Figure 3.

After the START condition, the master sends a slave address. This address is seven bits long followed by an eighth bit, which is the opcode bit (R/W). A ‘one’ indicates the master will read data from the status register. After the R/W bit, the ’zero’ ACK bit is sent to the master by the device. The device now starts sending the 8-bit status register data to the control register during the DATA bits time. After the DATA bits, the ‘one’ ACK bit is sent to the device by the master. The master should send the STOP condition after receiving the ACK bit.

Set when the PRES pin changes state (rising/falling edge); reset when the status register is read. Generates an interrupt when set

Set when a voltage fault is detected; reset when the status register is read. Generates an interrupt when set.

Set when an over-current or over-heating fault has occurred during a card session; reset when the status register is read. Generates an interrupt when set.

Set during ATR when the card has not answered during the ISO 7816-3 time window (40000 card clock cycles); reset when the next session begins or this register is read.

Set during ATR when the card has answered before 400 card clock cycles; reset when the next session begins or this register is read.

8 Rev. 1.5

DS_8010C_024 73S8010C Data Sheet

Figure 3: I

C Bus Read Protocol

2.3 I2C-bus Timing

Symbol Parameter Conditions Min. Typ. Max. UNIT

Fsclk Clock frequency 400 kHz

Tlow Clock low 1.3

Thi Clock high 0.6

Thdsta Hold time START condition 0.6

Tsudat Data set up time 100 ns

Thddat Data hold time 5 900 ns

Tsusto Set up time STOP condition 0.6

Tbuf

Bus free time between a STOP and

1.3

START condition

SDA

Tbuf

s

SCL

Tlow

Thi

Thdsta

Tsudat Thddat Tsusto

Figure 4: I

C Bus Timing Diagram

Rev. 1.5 9

73S8010C Data Sheet DS_8010C_024

3 Oscillator

The Teridian 73S8010C device has an on-chip oscillator that can generate the smart card clock using an external crystal, connected between the XTALIN and XTALOUT pins, to set the oscillator frequency. When the card clock signal is available from another source, it can be connected to the pin XTALIN, and the pin XTALOUT should be left unconnected.

4 DC-DC Converter – Card Power Supply

An internal DC-DC converter provides the card power supply. This converter is able to provide either a 3 V or 5 V card voltage from the power supply applied on the V controls the converter. Bit 2 of the Control register selects the card voltage.

The circuit is an inductive step-up converter/regulator. The external components required are 2 filter capacitors on the power-supply input V filter capacitor on the card power supply V operation when V input supply V

3.6 V, V

= 3 V) the circuit operates as a linear regulator. Depending on the inductor values, the voltage

is below a set point of 5.0 or 3.0 volts minus a comparator hysteresis voltage and the

is less than the set point for VCC. When VDD is greater than the set point for VCC (VDD =

converter can provide current on V

(100 nF + 10 F, next to the LIN pin), an inductor, and an output

. The circuit performs regulation by activating the step-up

as high as 100 mA.

The circuit provides over-current protection and limits I

to 150 mA. When an over-current condition is

sensed, the circuit initiates a deactivation sequence from the control logic and reports back to the host controller a fault on the interrupt output INT.

Choice of the Inductor

The nominal inductor value is 10 H, rated for 400 mA. The inductor is connected between pin LIN (pin 5 in the SO package, pin 2 in the QFN package) and the V optimized to meet a particular configuration (I

CC_MAX

). The inductor should be located on the PCB as

close as possible to the LIN pin of the IC.

Choice of the V

Capacitor

Depending on the applications, the requirements in terms of both V currents that the interface must be able to provide to the card vary. Table 4 shows the recommended capacitors for each V

power supply configuration and applicable specification.

pin. The digital ISO-7816-3 sequencer

voltage. The value of the inductor can be

minimum voltage and transient

Table 4: Choice of Vcc Capacitor

Specification Requirement Application

Min V

Specification

Allowed During Transient Current

EMV 4.0 4.6V 30nA.s

ISO-7816-3 4.5V 20nA.s

Voltage

Max Transient Current Charge

Capacitor Type Capacitor Value

X5R/X7R w/

ESR < 100 m

3.3 F

1 F

10 Rev. 1.5

DS_8010C_024 73S8010C Data Sheet

5 Voltage Supervision

Two voltage supervisors constantly check the level of the VDD and V

voltages. A card deactivation

sequence is forced when a fault occurs for any of these voltage supervisors.

The digital circuitry is powered by the power supply applied on the VDD pin. V range to interface with the system controller. The V

voltage supervisor is also used to initialize the

also defines the voltage

ISO-7816-3 sequencer at power-on, and to deactivate the card at power-off or when a fault occurs. The voltage threshold of the V

voltage supervisor is internally set by default to 2.3 V nominal. However, it

may be desirable in some applications, to modify this threshold value. The pin VDDF_ADJ (pin 18 in the SO package, pin 17 in the QFN package) is used to connect an external resistor R the V

fault voltage to another value, V

= 180 kΩ / (V

EXT

- 2.33)

DDF

(refer to Figure 11). The resistor value is defined as follows:

DDF

to ground to raise

EXT1

An alternative (more accurate) method of adjusting the VDD fault voltage is to use a resistive network of R3 from the pin to supply and R4 from the pin to ground (see Figure 11). In order to set the new threshold voltage, the equivalent resistance must be determined. This resistance value will be designated Kx. Kx is defined as R4/(R4+R5). Kx is calculated as:

Kx = (2.649 / VTH) - 0.6042 where VTH is the desired new threshold voltage.

To determine the values of R4 and R5, use the following formulas.

R5 = 72000 / Kx R4 = R5*(Kx / (1 – Kx))

Taking the example above, where a VDD fault threshold voltage of 2.7 V is desired, solving for Kx gives:

 Kx = (2.649 / 2.7) - 0.6042 = 0.377.

Solving for R5 gives:  R5 = 72000 / 0.377 = 191 k. Solving for R4 gives:  R4 = 191000 *(0.377 / (1 – 0.377)) = 115.6 k.

Using standard 1% resistor values gives R5 = 191 kand R4 = 115 kThese values give an equivalent resistance of Kx = 0.376, a 0.3% error.

If the 2.3 V default threshold is used, the VDDF_ADJ pin must be left unconnected.

6 Power Down

A power down function is provided via the PWRDN pin (active high). When activated, the Power Down (PD) mode disables all the internal analog functions, including the card analog interface, the oscillators and the DC-DC converter, to put the 73S8010C in its lowest power consumption mode. PD mode is only allowed in the deactivated condition (out of a card session, when the Start/Stop bit is set to 0 from the I

host controller).

The host controller invokes the power down state when it is desirable to save power. The signal PRES remains functional in PD mode such that a card insertion sets INT high. The micro-controller must then set PWRDN low and wait for the internal stabilization time prior to starting any card session (prior to setting the Start/Stop bit to 1).

Resumption of the normal mode occurs approximately 10 ms (stabilization of the internal oscillators + reset of the circuitry) after PWRDN is set low. No card activation should be invoked during this 10 ms time period. If a card is present, INT can be used as an indication that the circuit has completed its recovery from power down state. INT will go high at the end of the stabilization period. Should the Start/Stop be set to 1 during PWRDN = 1, or within the 10 ms internal stabilization / reset time, it will not be taken into account and the card interface will remain inactive. Since Start/Stop is taken into account on its edges, it should be toggled low and high again after the 10 ms to activate a card.

Figure 5 illustrates the sequencing of the PD and Normal modes. PWRDN must be connected to GND if

the power down function is not used.

Rev. 1.5 11

73S8010C Data Sheet DS_8010C_024

PRES

INT

PWRDN during a card

PWRDN

OFF follows PRES regardless of PWRDN

session has no effect

PWRDN has effect when

the cardi s deactivated

Internal RC OSC

~10ms

Start/Stop bit

After setting PWRDN = 0, the controller must wait at

least 10ms before setting

Start/Stop = 1

EMV / ISO deactivation

time ~= 100 uS

Figure 5: Power Down Mode Operation

7 Over-temperature Monitor

A built-in detector monitors die temperature. When an over-temperature condition occurs (most likely resulting from a heavily loaded card interface, including short circuits), a card deactivation sequence is initiated, and a fault condition is reported to the system controller (bit 4 of the status register is set and generates an interrupt).

8 Activation Sequence

After Power on Reset, the INT signal is low until VDD is stable. When VDD has been stable for approximately 10 ms and the INT signal is high, the system controller may read the status register to see if the card is present. If all the status bits are satisfactory, the system controller can initiate the activation sequence by writing a ‘1’ to the Start/Stop bit (bit 0 of the Control register).

The following steps and Figure 6 show the activation sequence and the timing of the card control signals when the system controller initiates the Start/Stop bit (bit 0) of the control register:

1. Voltage VCC to the card should be valid by the end of t1. If VCC is not valid for any reason, then the session is aborted.

2. Turn I/O to reception mode at the end of t

3. CLK is applied to the card at the end of t

4. RST (to the card) is set high at the end of t

t1 = 0.510 ms (timing by 1.5 MHz internal Oscillator), I/O in reception mode

≥ 0.5 μs, CLK starts

≥ 42000 card clock cycles, RST set high

Figure 6: Activation Sequence

12 Rev. 1.5

DS_8010C_024 73S8010C Data Sheet

9 Deactivation Sequence

Deactivation is initiated either by the system controller resetting the Start/Stop bit, or automatically in the event of hardware faults. Hardware faults are over-current, over-temperature, V card extraction during the session.

The following steps and Figure 7 show the deactivation sequence and the timing of the card control signals when the system controller clears the Start/Stop bit:

1. RST goes low at the end of t

2. CLK goes low at the end of t

3. I/O goes low at the end of t

4. Shut down V

at the end of time t4.

. Out of reception mode.

fault, VCC fault, and

t1 ≥ 0.5 μs t3 ≥ 0.5 μs t

≥ 7.5 μs t4 ≥ 0.5 μs

Figure 7: Deactivation Sequence

10 Interrupt

The interrupt is an active low interrupt. It is set low if either a VCC fault or a VDD fault is detected. It is also set low if one of the following status bit conditions is detected:

 Early ATR  Mute ATR  Card insert or card extract  Protection status from Over-current or Over-heating

If the interrupt is set low by the detection of these status bits, then the interrupt is set high when these status bits are read. (READ STATUS DONE)

INT

ANY FAULT

STATUS BITS

READ STATUS DONE

Figure 8: FAULT Functions, INT operation

Rev. 1.5 13

73S8010C Data Sheet DS_8010C_024

A power-on-reset (POR) event will reset all of the control and status registers to their default states. A VDD fault event does not reset these registers, but it will signal an interrupt condition and by the action of the timer that creates interval “t considered valid for V

,” will not clear the interrupt until VDD is valid for at least the t1 time. The VDD fault can be

as low as 1.5 to 1.8 volts. At the lower range of the VDD fault, POR will be asserted.

11 Warm Reset

The 73S8010C automatically asserts a warm reset to the card when instructed through bit 1 of the I2C Control register (Warm Reset bit). The warm reset length is automatically defined as 42,000 card clock cycles. The bit Warm Reset is automatically reset when the card starts answering or when the card is declared mute.

Warm Reset

(bit 1)

RST

t1> 1.5 µs, Warm Reset Starts t2= 42000 card clock cycles, End of Warm Reset t3= Resets Warm Reset bit 1 when detected ATR or Mute

Figure 9: Warm Reset operation

12 I/O Timing

The states of the I/O, AUX1, and AUX2 pins are low after power on reset and they are high when the activation sequencer turns on the I/O reception state. See Section 8 Activation Sequence for more details on when the I/O reception is enabled.

The states of I/OUC, AUX1UC, and AUX2UC are high after power on reset. When the control I/O enable bit (bit 7 of the Control register) is set, the first I/O line on which a falling edge is detected becomes the input I/O line and the other becomes the output I/O line. When the input I/O line rising edge is detected then both I/O lines return to their neutral state. The delay between the I/O signals is shown in Figure 10.

Delay from I/O to I/OUC: t Delay from I/OUC to I/O: t

= 100 ns t

IO_HL

I/OUC_HL

= 100 ns t

= 25 ns

IO_LH

I/OUC_LH

= 25 ns

Figure 10: I/O Timing

14 Rev. 1.5

DS_8010C_024 73S8010C Data Sheet

13 Typical Application Schematic

SAD0 SAD1 SAD2 GND GND VPC NC NC NC PRES I/O AUX2 AUX1 GND

Card detection swit ch is normally closed.

VDD

AUX2UC AUX1UC

I/OUC

XTA L OU T

XTA L I N

VDD_AD J

SW-19SW-2

Smart C ard Connec tor

INT_ GND VDD SDA

SCL

VCC

RST CLK

SO28

Rext2

28 27 26 25 24 23 22 21 20 19 18 17 16 15

I/O

CLK

VPP

GND

Rext1

See note 6

ISO7816=1uF, EMV=3.3uF

Low ESR (< 1 0 0 mohms) C1 should be placed near the SC

connecter contact

CLK tra ck sho uld be route d far from RST, I/O, C4 and

C8.

RST

VCC

See NOTE 1

100nF

R3 2K

R2 2K

SAD0

SAD1

SAD2

Note 2

100nF

10uF

L1 10uH

See note 7

PWRD N_f rom_uC

See NOTE 5

1 2 3 4 5 6 7 8

9 10 11 12 13 14

73S8010C

NOTES:

1) VDD supply should be = 2.7V to 3.6V DC.

2) Hardwire to define address of device

3) Required if external clock from uP is used.

4) Required if crystal is used. Y1, C2 and C3 must be removed if external clock is used.

5) Pin can not float. Must be driven or connected to GND if power down function is not used.

6) Rext1 and Rext2 are external resistors to ground and VDD to modify the VDD fault voltage. Can be left open

7) Keep L1 cl ose to pi n 5

VDD

20K

AUX2UC_to/ from _uC

AUX1UC_to. from _uC

IOUC _to/f rom_uC

INT_interrupt _to_uC

SDA_f rom_uC

SCL_f rom_uC

Figure 11: 73S8010C – Typical Application Schematic

See NOTE 5

See NOTE 3

External_c lock _f rom uC

- OR -

CRYSTAL

See NOTE 4

22pF

Rev. 1.5 15

73S8010C Data Sheet DS_8010C_024

14 Electrical Specification

14.1 Absolute Maximum Ratings

Operation outside these rating limits may cause permanent damage to the device.

Parameter Rating

Supply Voltage VDD -0.5 to 4.0 VDC

Input Voltage for Digital Inputs -0.3 to (VDD +0.5) VDC

Storage Temperature -60 °C to 150 °C

Pin Voltage (except LIN and card interface) -0.3 to (VDD +0.5) VDC

Pin Voltage (LIN) -0.3 to 6.0 VDC

Pin Voltage (card interface) -0.3 to (VCC + 0.5) VDC

ESD Tolerance – Card interface pins +/- 6 kV

ESD Tolerance – Other pins +/- 2 kV

ESD testing on Card pins uses the HBM condition, 3 pulses, each polarity referenced to ground.

14.2 Recommended Operating Conditions

Parameter Rating

Supply Voltage VDD 2.7 to 3.6 VDC

Ambient Operating Temperature -40 °C to +85 °C

Input Voltage for Digital Inputs 0 V to VDD + 0.3 V

16 Rev. 1.5

DS_8010C_024 73S8010C Data Sheet

14.3 DC Characteristics: Card Interface

Symbol Parameter Condition Min. Typ. Max. Unit Card Power Supply (VCC) DC-DC Converter

General conditions, -40 C < T < 85 C, 2.7 V < V

Inactive mode -0.1 0.1 V Inactive mode

Active mode

single pulse of 100 mA

for 2 s; 5 V,

VCC

Card supply voltage including ripple and noise

fixed load = 25 mA

Active mode

single pulse of 100 mA

for 2 s; 3 V,

fixed load = 25 mA

Active mode

current pulses of 40 nAs

with peak |I

t < 400 ns; 5 V

Active mode

current pulses of 40 nAs

with peak |I

t < 400 ns; 3 V

Static load current,

> 4.6 or 2.7 V as

selected, L=10 H

on VCC = 1 µF 0.05 0.15 0.25

on VCC = 1 µF 0.1 0.3 0.5

CCmax

CCF

VSR

VSF

Maximum supply current to the card

fault current Short circuit, VCC to ground 100 125 180 mA

slew rate - Rise rate on

activate V

slew rate - Fall rate on

deactivate External filter capacitor

to GND)

L Inductor (LIN to VDD) 10

= 5 V, I

Limax Imax in inductor



Efficiency

= 5 V, I

< 3.6 V

= 1 mA

< 65 mA; 5 V

< 65 mA; 3 V

-0.1 0.4 V

4.75 5.25 V

2.8 3.2 V

4.6 5.25 V

2.76 3.2 V

| < 200 mA,

4.6 5.25 V

2.76 3.2 V

100

0.47 1 3.3

= 65 mA,

= 2.7 V

= 3.3 V

= 65 mA,

400 mA

87 %

V/s

F

H

Rev. 1.5 17

73S8010C Data Sheet DS_8010C_024

1011B01 Converter efficiency (VCC 5V)

Converter Efficiency (V

100

5 V)

Efficiency [%]

0 20406080100

2.7V

3.0V

3.3V

3.6V

Icc [mA]

Figure 12: DC – DC Converter Efficiency (V

Output current on Vcc at 5 V. Input voltage on V

1011B01 Converter efficiency (VCC 3V)

100

= 5 V)

at 2.7, 3.0, 3.3 and 3.6 volts.

Efficiency [%]

0 20 40 60 80 100

2.7V

3.0V

3.3V (Linear)

3.6V (Linear)

Icc [mA]

Figure 13: DC – DC Converter Efficiency (VCC = 3 V)

Output current on V

18 Rev. 1.5

at 3 V. Input voltage on VDD at 2.7, 3.0, 3.3 and 3.6 volts.

DS_8010C_024 73S8010C Data Sheet

Symbol Parameter Condition Min. Typ. Max. Unit Interface Requirements – Data Signals: I/O, AUX1, AUX2, and host interfaces: I/OUC, AUX1UC,

AUX2UC. I

SHORTL

, I

SHORTH

, and V

requirements do not pertain to I/OUC, AUX1UC, and AUX2UC. IIL

INACT

requirements only pertain to I//OUC, AUX1UC, and AUX2UC.

= 0 0.9 VCC VCC+ 0.1 V

VOH

Output level, high (I/O, AUX1, AUX2)

Output level, high (I/OUC, AUX1UC, AUX2UC)

IOH = -40 A

= 0 0.9 VDD VDD+ 0.1 V

IOH = -40 A

0.75 V

VCC + 0.1 V

VDD + 0.1 V

VOL Output level, low IOL=1 mA 0.3 V

VIH

Input level, high (I/O, AUX1, AUX2)

Input level, high (I/OUC, AUX1UC, AUX2UC)

1.8 V

+ 0.30 V

1.8 VDD + 0.30 V

VIL Input level, low -0.3 0.8 V

= 0 0.1 V

LEAK

INACT

Output voltage when outside of session

Input leakage VIH = VCC 10

IIL Input current, low

Short circuit output current

SHORTL

Short circuit output current

SHORTH

For output low, shorted

to V

For output high, shorted

to ground through 33 

IOL = 1 mA 0.3 V

A

= 0, CS = 1 0.65 mA

VIL = 0, CS = 0 5 μA

through 33 

15 mA

For I/O, AUX1, AUX2,

= 80 pF, 10% to 90%

tR, tF Output rise time, fall times

For I/OUC, AUX1UC,

100 ns

AUX2UC,

CL=50 pF, 10% to 90%

tIR, tIF Input rise, fall times

RPU Internal pull-up resistor Output stable for >200 ns 8 11 14

Maximum data rate 1

MAX

FDIO

Delay, I/O to I/OUC, I/OUC to I/O

s

k

MHz

20 ns

CIN Input capacitance 10 pF

Rev. 1.5 19

73S8010C Data Sheet DS_8010C_024

Symbol Parameter Condition Min. Typ. Max. Unit Reset and Clock for card interface, RST, CLK

VOH Output level, high

VOL Output level, low

INACT

RST_LIM

CLK_LIM

Output voltage when outside of a session

Output current limit, RST 30 mA

Output current limit, CLK 70 mA

tR, tF Output rise time, fall time

= -200 A

= 200 A

= 0 0.1 V

IOL = 1 mA 0.3 V

= 35 pF for CLK,

10% to 90%

CL = 200 pF for RST,

0.9 V

10% to 90%



Duty cycle for CLK, except for f=f

XTAL

=35 pF,

20 MHz

CLK

VCC V

0 0.3 V

8 ns

100 ns

45 55 %

14.4 DC Characteristics: Digital Signals

Symbol Parameter Condition Min. Typ. Max. Unit Digital I/O except for OSC I/O

VIL Input Low Voltage -0.3 0.8 V

VIH Input High Voltage 1.8 VDD + 0.3 V

VOL Output Low Voltage IOL = 2 mA 0.45 V

VOH Output High Voltage IOH = -1 mA VDD - 0.45 V

Pull-up resistor, INT 20

OUT

| Input Leakage Current GND < VIN < VDD -5 5 μA

IL1

Oscillator (XTALIN) I/O Parameters

Input Low Voltage - XTALIN -0.3 0.3 VDD V

ILXTAL

Input High Voltage - XTALIN 0.7 VDD VDD+0.3 V

IHXTAL

Input Current - XTALIN GND < VIN < VDD -30 30 μA

ILXTAL

Max freq. Osc or external clock 27 MHz

MAX

in

External input duty cycle limit

R/F < 10% fIN,

45% <



CLK

< 55%

48 52 %

k

14.5 DC Characteristics: Supply

Symbol Parameter Condition Min. Typ. Max. Unit

Linear mode, ICC=0

IDD Supply Current on VDD

I/O, AUX1, AUX2=high

Step up mode, ICC=0

I/O, AUX1, AUX2=high

PWRDN=1, Start/stop bit = 0

All digital inputs driven with a

true logical 0 or 1

DD_PD

Supply Current on V in Power Down mode

20 Rev. 1.5

4.9 mA

4.7 mA

0.11 2.5

A

DS_8010C_024 73S8010C Data Sheet

14.6 DC Characteristics: I2C Interface

Symbol Parameter Condition Min. Typ. Max. Unit SDA, SCL

VIL Input Low Voltage -0.3 0.3* VDD V

VIH Input High Voltage 0.7*VDD VDD + 0.3 V

VOL Output Low Voltage IOL = 3 mA 0.40 V

CIN Pin capacitance 10 pF

IIN Output High Voltage IOH = -1 mA VDD - 0.45 V

TF Output fall time CL = 0 to 400 pF

TSP

Pulse width of spikes that are suppressed

Transition from valid logic

level to opposite level

20 + 0.1*C

250 ns

50 ns

14.7 Voltage / Temperature Fault Detection Circuits

Symbol Parameter Condition Min. Typ. Max. Unit

fault – VDD Voltage

DDF

CCF

supervisor threshold

fault – VCC Voltage

supervisor threshold

TF Die over temperature fault 115 145

No external resistor on

VDDF_ADJ pin

= 5 V 4.20 4.6 V

VCC= 3 V 2.5 2.7 V

2.15 2.4 V

C

Rev. 1.5 21

73S8010C Data Sheet DS_8010C_024

15 Mechanical Drawings

15.1 32-pin QFN

0.85 NOM ./ 0.9MAX.

2.5

TOP VIEW

0.35 / 0.45

2.5

0.18 / 0.3

3.0 / 3.75

1.5 / 1.875

SIDE VIEW

CHAMFERED

0.30

0.00 / 0.005

0.20 REF.

SEATING

PLANE

0.25

0.5

0.2 MIN.

0.35 / 0.45

0.25

0.5

3.0 / 3.75

1.5 / 1.875

BOTTOM VIEW

Figure 14: 32-pin QFN Package Drawing

22 Rev. 1.5

DS_8010C_024 73S8010C Data Sheet

15.2 28-pin SO

Figure 15: 28-pin SO Package Drawing

Rev. 1.5 23

73S8010C Data Sheet DS_8010C_024

16 Package Pin Designation

Use handling procedures necessary for a static sensitive component.

16.1 32-pin QFN

GND

LIN

VDD

PRDWN

PRES

SAD2

I/O

73S8010C

AUX2

SAD0

SAD1 30

AUX2UC 28

TERIDIAN

CLK

GND

AUX1

AUX1UC 27

RST

I/OUC

VCC

NC 25

Figure 13: 73S8010C 32-pin QFN Pin Out

(Top View)

XTALOUT

XTALIN

INT

GND

VDD

SDA

SCL

VDDF_ADJNC

24 Rev. 1.5

DS_8010C_024 73S8010C Data Sheet

16.2 28-pin SO

SAD0

SAD1 SAD2

GND

LIN

VDD

PWRDN

PRES

I/O

73S8010C

AUX2

AUX1

GND

Figure 15: 73S8010C 28-pin SO Pin Out

(Top View)

AUX2UC AUX1UC I/OU C XTALOUT

XTALIN INT GND VDD SDA SCL VDDF_ADJ VCC RST

CLK

Rev. 1.5 25

73S8010C Data Sheet DS_8010C_024

17 Ordering Information

Part Description Order Number Packaging Mark

73S8010C-SO 28-pin Lead-Free SO 73S8010C-IL/F 73S8010C-IL

73S8010C-SO 28-pin Lead-Free SO Tape / Reel 73S8010C-ILR/F 73S8010C-IL

73S8010C-QFN 32-pin Lead-Free QFN 73S8010C-IM/F 73S8010C

73S8010C-QFN 32-pin Lead-Free QFN Tape / Reel 73S8010C-IMR/F 73S8010C

18 Related Documentation

The following 73S8010C documents are available from Teridian Semiconductor Corporation:

73S8010C Data Sheet (this document) 73S8010C 28SO Demo Board User’s Guide 73S8010C QFN Demo Board User’s Guide

19 Contact Information

For more information about Teridian Semiconductor products or to check the availability of the 73S8010C, contact us at:

6440 Oak Canyon Road Suite 100 Irvine, CA 92618-5201

Telephone: (714) 508-8800 FAX: (714) 508-8878 Email: scr.support@teridian.com

For a complete list of worldwide sales offices, go to http://www.teridian.com.

26 Rev. 1.5

DS_8010C_024 73S8010C Data Sheet

Revision History

Revision Date Description

1.0 6/13/2005 First publication.

1.2 9/21/2005 Changed SDATA hold time.

1.3 12/5/2007

1.4 1/17/2008 Changed dimension of bottom exposed pad on 32QFN mechanical package

1.5 4/3/2009 Removed all references to VPC as VPC must be tied to VDD.

© 2009 Teridian Semiconductor Corporation. All rights reserved. Teridian Semiconductor Corporation is a registered trademark of Teridian Semiconductor Corporation. Simplifying System Integration is a trademark of Teridian Semiconductor Corporation. All other trademarks are the property of their respective owners.

Teridian Semiconductor Corporation makes no warranty for the use of its products, other than expressly contained in the Company’s warranty detailed in the Teridian Semiconductor Corporation standard Terms and Conditions. The company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice and does not make any commitment to update the information contained herein. Accordingly, the reader is cautioned to verify that this document is current by comparing it to the latest version on http://www.teridian.com or by checking with your sales representative.

Teridian Semiconductor Corp., 6440 Oak Canyon Rd., Suite 100, Irvine, CA 92618

TEL (714) 508-8800, FAX (714) 508-8877, http://www.Teridian.com

Added ISO and ENV logo, remove leaded package options, replace 32QFN punched with SAWN, update 28SO dimension.

figure.

Rev. 1.5 27

Datasheet 73S8010C Datasheet (TERIDIAN Semiconductor)

Specifications and Main Features

Frequently Asked Questions

User Manual