Datasheet 73M1922 Datasheet (TERIDIAN Semiconductor)

Simplifying System IntegrationTM

73M1922

Demo Board User Manual

June 24, 2010

Rev. 5.1

UM_1922_006

73M1922 Demo Board User M anual UM_1922_006

© 2010 Teridian S emic onduct or Corporation. All r ights reserv ed.
Terid i an Semic onductor Corporation is a r egistered trademark of Teridian Sem i conductor Corporation.
Simplifying System Integration is a trademark of Teridian Semiconductor Corp or ation.
MicroDAA is a regi stered trademark of Teridian Semi conductor Corporation.
Micros oft is a registered trademark of Microso ft Corp oration.
Windows is a registered trademark of Microsoft C or por ation .
All other trademarks are the property of their res pect ive own ers.

Terid i an Semic onductor Corporation makes no warranty for the use of it s products, other t han expressl y
contained in the Comp any’s warrant y detailed i n the Teridian Semiconduct or Corporation stan dard Terms
and C ondit ions. The company assumes no res ponsibility for an y errors which m ay appear in this
document, reserves the right to c hange devices or specific ations detailed herein at an y time without
notice and does not make any commitment to updat e the i nform ation contained herein . Accord in gly, the
reader is cau tioned to verify that this docum ent i s c urren t by comp ar i ng it to the latest vers ion on
http://www.teridian.com or by checking with your sal es representat i ve.

Terid i an Semic onductor Corp., 6440 Oak C anyon, Su ite 100 , Irvine, CA 92618

TEL [phone], FAX [phone], http://www.teridian.com

2 Rev. 5.1

UM_1922_006 73M1922 Demo Board User Manual

Table of Contents

1

Introduction ................................................................................................................................... 5

1.1 Pack age Conten ts.................................................................................................................... 6

1.2 Safety and ESD Not es ............................................................................................................. 6

1.3 Demo Board Options................................................................................................................ 6

2 Connectors .................................................................................................................................... 7

3 Demo Board Schematics, PCB Layouts and Bill of Materials ..................................................... 8

3.1 Schematic ................................................................................................................................ 8

3.2 73M1922 20-Pin TSSO P D emo B oar d Layout .......................................................................... 9

3.3 Demo Board Physical Dimens ion s ......................................................................................... 12

3.4 Bill of Materials ...................................................................................................................... 13

3.5 Pin Descriptions ..................................................................................................................... 14

3.5.1 731 922 Mic r oD AA Pinout ............................................................................................ 15

4 Related Documentation ............................................................................................................... 15

5 Contact Information ..................................................................................................................... 15

Rev. 5.1 3

73M1922 Demo Board User M anual UM_1922_006

Figures

Figure 1 : MicroDAA S ystem Block Di agram
Figure 2 : 73M1922 Micr oDAA 20-Pin TS SOP Dem o Board Schematic Di agram
Figure 3: 73M1922 20-Pin TSSOP Demo Boar d: Top Sign al Layer
Figure 4: 73M1922 20-Pin TSSOP Demo Boar d: Laye r 2, Ground Plane
Figure 5: 73M1922 20-Pin TSSOP Dem o Board: Layer 3, Supply Plane
Figure 6: 73M1922 20-Pin TSSOP Demo Boar d: Bottom Signal Layer
Figure 7: 73M1922 20-Pin TSSOP Demo Boar d: Silk Sc r een Top
Figure 8: 73M1922 20-Pin TSSOP Demo Board: Silk Screen Bottom
Figure 9: 73M1902/73M1912 20-Pin TSS OP Pac kages: Pinout (top view)

Tables

Table 1: 73M1922 Demo Board Connectors
Table 2: 73M1922 Demo Board Configuration Settings
Table 3: JS 1 Host Interface Con nect or
Table 4: 73M1922 20-Pin TSSO P D emo B oar d Bi ll of Materials
Table 5: 73M1902 HIC 20-Pin TSSOP Package Pin Definitions
Ta bl e 6: 73M1912 LIC 20-Pi n TSSOP Package Pin Definitions

............................................................................................. 5

...................................... 8

.......................................................... 9

................................................. 9

................................................ 10

................................................... 10

.......................................................... 11

..................................................... 11

............................................. 15

............................................................................................ 7

............................................................................ 7

..................................................................................................... 7

............................................................. 13

............................................................. 14

.............................................................. 14

4 Rev. 5.1

UM_1922_006 73M1922 Demo Board User Manual

73M

1902

73M

1912

L

I

N

E
I

N

T
E

R

F
A

C

E

H
O
S
T

I
N
T
E
R
F
A
C
E

73M1922

Host Interface

Chip (Circuitry)

Line Interface

Chip (Circuitry)

GPIO

FS

FSB

SCLK

SDIN

SDOUT

TYPE

M/S

INT/RGDT

OSCIN

OSCOUT

RGP
RGN
OFH

DCI

DCB
DCE
TXN
RXM
RXP

SRE
ACS
SRB

DCD

PULSE

TRANSFORMER

SCKM

AOUT

Shaded pins and names are optional depending on packages

1 Introduction

The 73M1922 MicroDAA Chipset D em o Board integrates sil icon D ata Access Ar r angem ent (DA A)
function along with Analog Fr o nt E nd functio ns chipsets for worldwide c omp lianc e.

The 73M1922 MicroDAA chipset co nsists of a 73M1902 and a 73M1912. The 73M1902 is the Host
Interface Chip ( HIC) providi ng a host microprocessor or DS P in terface by a synchronous serial port
(Modem Analog Front En d ( M AFE ) ) and the 73M1912 is the Line Interfac e C hip ( LIC) t o connect to a
telephone line.

The 73M1922 chipset is packaged in two 20-pin TSSOP or two 32-pin QFN pack ages for a v ery small
ph ysical dimension and offers l ow cost global DA A design.

The 73M1922 performs a modem codec funct i on that interfac es a Host/ D SP and the PSTN (Pu blic
Switc hed Telephone Network). The codec suppor ts data rat es up t o V.92 with cal l progress signal i ng. In
add i tion to the c odec functi o n, t he 73M192 2 Mic r oD AA ch ipset also performs other necessary DAA
functions, such as CI D (caller i dentification) , rin g detection, tip/ring polar ity reversal detecti on, on/off hook
switch contr ol, p ulse di al ing , regu l ation of loop current (DC-I V), l ine impedance matching, line in use and
parall el p ickup det ection.

All data and control inform ation between the LIC and the HIC is transferred across a low cost pulse
transformer barrier. Also all clock and synchronization information needed in LIC is embedded in this
data and control bit stream acros s the b ar r ier transfor mer rec eived from H IC an d recons tructed within
LIC. The LIC interface to tip/ring of the PSTN significantly lowers the number of external components and
their cost.

The DAA feature integrated in this chipset offers a configurable US, ETSI ES 203 021-2, or other World
Wide DAA capability to t he tel ephone line interface an d an auxiliary DAC with gain con trol for line
monitoring during the call pr ogress period.

Rev. 5.1 5

Figure 1: MicroDAA System Block Diagram

73M1922 Demo Board User M anual UM_1922_006

1.1 Package Contents

The 73M1922 Demo Board Kit includes:

• A 73 M 1922 D em o Board ( R ev. D1)

• The follo wing documents on CD:

• 73M1922 Demo Board User Manual (this document)

• 73M1822/73M1922 Data Sheet

• 73M1822/73M1922 Layout Guideline

• 73M 1x2 2 Wor ldwide Design Guide

1.2 Safety an d ES D Notes

Connecting live voltag es to the Demo Board syst em will result in potential l y hazard ous volt ages on the
boards.

Extreme caution should be taken when handling the Demo Boards after connection to
live voltages!

The Demo Boards are ESD sensitive! ESD precautions should be taken when handling
these boards!

1.3 Demo Board Options

The 73M1922 Demo Board has 20-pin right angle connect or s to plug on to a target DSP or CPU system.
Each has a 3 .3 V power recep tacle for powering on-b oar d cir cuits from target system or ext er nal p ower
supply, or power can be supplied through the 20-pin connector along with the other signals. The
73M1922 Demo Boar d allows the evaluat ion of the 73M1922 chipset for un iversal mod em , voice
app l icati on and inter fac e to a general DSP or C PU system use.

6 Rev. 5.1

UM_1922_006 73M1922 Demo Board User Manual

2 Connectors

Table 1 shows all the connectors and jumper s available on 73M192 2 M i croDAA Demo Board. JS1 is the
main connector for i nterfacing to a host proces sor or DSP b oar d. Li ne mon i tor/C al l progress mon it or
speaker and dri ver c ircu i ts are also on board. J1 is a mod ular connector for phone li ne connec tion and J4
is for power connection from the main board or an external power supply.

Table 1: 73M1922 Demo Board Connectors

Sche matic and PCB

Reference

JS1 3M CONN.

Name Description

20-pin connect or to interface 73M1922 Demo Boar d to a

10X2

HOS T controller m ai n boar d.
J1 RJ-11 Telephone l ine connector.
J2 3.3 V suppl y Plug for connectin g external 3.3 V DC power supply.

Table 2: 73M1922 Demo Board Configuration Settings

Sche matic and PCB

Reference

Name Description

R54 (20 TSSOP DB), TYPE Fram e Sync Type:

0 Ω population: Late FSB (Default for Samsung ARM9

Interface).

None: Early FSB.
R64 (32 QFN DB only) MODE SCLK mode:

0 Ω population: 32 Clock.

None: Continuous SCLK. (Default for Samsung ARM9

Interface)

* NOTE: Due to the packag e r estrictions, the MODE pin i s not available in a 20-pin TSSOP package.
And neither the Mode pin nor the TYP E pi n is avail able in 42-pin QFN package. User should choose the
right device opti on when or dering parts depending on th e clock m ode (32 clock or continuous ) and Frame
sync type (early or l ate frame sync) required. Refer to the ordering information section of the
73M1822/73M1922 Data Sheet.

Table 3: JS1 Host Interface Connector

PIN Number Name Description PIN Number Name Description

1
2

NC
VCC 3.3V power

11
12

RINGD Ring Det.out
NC

supply

3
4
5
6
7
8
9

10

NC
RESET Reset Input
NC
NC
NC
NC
RINGD Ring Det.out
NC

13
14
15
16
17
18
19
20

NC
NC
AFEIN Serial Data In
AFEOUT Serial Data Out
SCLK Serial Clock
FS Frame Sync
NC
GND Ground

Rev. 5.1 7

R4

100K, 1%

R2
10M

C7
1uF

R6

100K, 1%

C12

0.1uF

U2

73M1912

OFH

4

VND/VNX

5

SCP

6

MID

7

VPX

8

SRE

9

SRB

10

VBG

11

ACS

12

VNS

13

VPS

14

RXP

15

RXM

16

TXM

17

DCD

18

DCE

19

DCB

20

DCI

1

RGN

2

RGP

3

L1 2kOhm

R5

8.2

-+

BR1

HD04

4

1

3

2

C43
1nF

Q4

MMBTA92

1

3 2

C26 1nF

C48

0.01uF

J1

RJ-11

1

2

3

4

5

6

C38

0.1uF

C24
NC (1nF, 3kV)

C41
220pF

R12 5.1K

TP15

VPS

1

C37

0.01uF

C35

220pF, 3KV

C9

0.47uF

L2 2kOhm

C13
15pF

F1

TRF600-150

R8
100K, 1%

Q7
MMBTA42

1

32

TP14
OFH

1

R58 1K

C50

100pF

R3 412K, 1%

Q3

MMBTA42

1

3

2

R65 200

C47
1nF

C34

3,3uF

C28
1nF

C30
1nF

C31
1nF

VCC

VCC

C46
1nF

TP1

GND

1

C1

0.022uF, 250V
C3

0.022uF, 250V

NOTE: GND f or C 35 and C 36 c onnec t
to GND on t he H OST side of t he barrier

TB3100H

GND

C14
15pF

T1

Pulse TFR

1 4

2 3

D1
MMSZ4710

1

2

VCCVCCVCC

C29

3,3uF

VCCVCC

C22
3,3uF

R67 1M, 1%

R53

49.9

R52 49.9

R11
3K

GND

R66 1M, 1%

C21

3.3uF

GND

VCC

TP16
FSBD

1

R51

49.9

U1
73M1902

FSBD

1

AOUT

8

VPT/VPD

15

TYPE

9

OSCIN

5

OSCOUT

6

VPA/VPM

10

VNM/VNT

11

SCLK

17

SDOUT

20

SDIN

19

VND

3

FS

2

VPD

4

VNPLL

7

M/S

12

PRM

13

PRP

14

INT

16

VND

18

VCCVCC

U3

NJM#2135M

CD

1

-VIN

4

V+

6

GND

7

VOUT1

5

VOUT2

8

VREF1

2

VREF2

3

R50

49.9

8DMP

R48 20K

LS2

Projects U nlim it ed

AST-2308MR-R

C27
1uF

R46 120K

R49

20K

C25
3,3uF

C45 0.1uF

VCCVCCVCC

VCCVCCVCC

C19
27pF

C17

0.1uF

C18

27pF

C33

0.1uF

C15

0.1uF

J4

3.3V POWER

3

3

1

1

2

2

R54 0

JS1

CONN SOC KET 10X2

2
4
6
8
10
12
14
16
18
20

1
3
5
7

9
11
13
15
17
19

R61 1K

C32

3.3uF

R9 100K, 1%

C10 0.47uF

R10

255, 1%

C8

4.7uF

C4

2.2uF

VCC

Q5

MMBTA06

1

32

TP10
TXM

1

C36

220pF, 3KV

Y2

24.576MHz

13

24

Q6

BCP56

1

2

3

4

TP18
VNS

1

C49

0.1uF

E1

P3100SBRP

C6

1uF

73M1922 Demo Board User Manual UM_1x22_006

3 Demo Board Schematics, PCB Layouts and Bill of Materials

3.1 Schematic

8 Rev. 5.0

Figure 2: 73M1922 MicroDAA 20-Pin TSSOP Demo Board Schematic Diagram

UM_1922_006 73M1922 Demo Board User Manual

3.2 73M1922 20-Pin TS SOP Demo Board Lay out

Figure 3: 73M1922 20-Pin TSSOP Demo Board: Top Signal Layer

Figure 4: 73M1922 20-Pin TSSOP Demo Board: Layer 2, Ground Plane

9 Rev. 5.0

73M1922 Demo Board User Manual UM_1922_006

Figure 5: 73M1922 20-Pin TSSOP Demo Board: Layer 3, Supply Plane

Figure 6: 73M1922 20-Pin TSSOP Demo Board: Bottom Signal Layer

10 Rev. 5.0

UM_1922_006 73M1922 Demo Board User Manual

Figure 7: 73M1922 20-Pin TSSOP Demo Board: Silk Screen Top

Figure 8: 73M1922 20-Pin TSSOP Demo Board: Silk Screen Bottom

Rev. 5.0 11

73M1922 Demo Board User Manual UM_1922_006

3.3 Demo Board P hy sica l Dimensions

PCB Dimensions

• Size
73M1922DB 3.16 x 2.05” (80.20 x 52.50 mm)
Height w/ components and solder
73M1922DB 0.65” (16.5 mm)

Environmental

• Operating Temperature °-40 to +85°C
(function of crystal oscillator affected outside –10°C to +60°C)

• Storage Temperature -65 to 150°C

Power Supply

• DC Input Voltage (powered from DC supply) 3.3 VDC ±10%

• Supply Current 25 mA (off-hooked at room temperature) typical

12 Rev. 5.0

UM_1922_006 73M1922 Demo Board User Manual

Qty

Reference

Part

DigikeyPN

MFRPN

MFR

1

BR1

HD04

HD04DICT-ND

HD04-T

DIOD E S In c.

2

C1,C3

0.022uF, 250V

399-1242-1-ND

C1206C223K5RACTU

Kemet

1

C4

10uF

399-3522-1-ND

C0805C225K8RACTU

Kemet

2

C6,C7

1uF

587-1241-1-ND

EMK107BJ105KA-TR

Taiyo Yuden

1

C8

4.7uF

PCC2176CT-ND

ECJ-2FB0J475M

Panasonic

2

C10,C9

0.47uF

PCC1911CT-ND

ECJ-1VB0J474K

Panasonic

6

C12,15,17,33,38,49

0.1uF

399-1095-1-ND

C0603C104K8RACTU

Kemet

2

C14,C13

15pF

445-1271-1-ND

C1608COG1H150J

TDK

2

C19,C18

27pF

PCC270ACVCT-ND

ECJ-1VC1H270J

Panasonic

4

C21,C22,C32,C34

3.3uF

PCC1925CT-ND

ECJ-2YB0J335K

Panasonic

2

C35,C36

220pF, 3KV

445-2380-1-ND

C4532COG3F221K

TDK

8

C26,28,30,31,39,43,46,47

1nF

PCC1772CT-ND

ECJ-1VB1H102K

Panasonic

2

C37,C48

0.01uF

478-1227-1-ND

06035C103KAT2A

AVX

1

C50

100pF

311-1069-1-ND

CC0603JRNP09BN101

Yageo

1

C51

220pF, 630V

445-2338-1-ND

C3216COG2J221J

TDK

1

E1

TB3100H

TB3100H-FDICT

TB3100H-13-H

DIODES

1

F1

TRF600-150

576-04611.25ER

04611.25ER

Littlefuse

1

JS1

CONN 10X2

517-8520-4500

8520-4500JL

3M 1 J1

RJ-11

A31420-ND

5555163-1

AMP/Tyco

1

J4

POWER CONN

SC237-ND

RAPC712X

Switchcraft Inc.

2

L1,L2

100MHz, 200mA

240-2396-1-ND

HZ0805C202R-10

Steward

2

Q3,Q7

MMBTA42

863-MMBTA42LT1G

MMBTA42LT1G

ON Semi.

1

Q4

MMBTA92

863-MMBTA92LT1G

MMBTA92LT1G

ON Semi.

1

Q5

MMBTA06

863-MMBTA06LT1G

MMBTA06LT1G

ON Semi.

1

Q6

BCP56

568-1639-1-ND

BCP56

Philips

1

R2

10M

541-10.0MCCT-ND

CRCW080510M0FKEA

Vishay

1

R3

412K, 1%

P412KHTR-ND

ERJ-3EKF4123V

Panasonic

4

R4,R6,R8,R9

100K, 1%

P100KHCT-ND

ERJ-3EKF1003V

Panasonic

1

R5

8.2

541-8.20CCT-ND

CRCW08058R20FNEA

Vishay

1

R10

255, 1%

311-255HRCT-ND

RC0603FR-07255RL

Yageo

1

R11

3K

311-3.00KHRCT-ND

RC0603FR-073K0L

Yageo

1

R12

5.1K

311-5.10KHRCT-ND

RC0603FR-075K1L

Yageo

4

R50,R51,R52,R53

49.9

P49.9HCT-ND

ERJ-3EKF49R9V

Panasonic

1

R54 0 P0.0GCT-ND

ERJ-3GEY0R00V

Panasonic

2

R58,R61

1K

P1.00KHCT-ND

ERJ-3EKF1001V

Panasonic

1

R65

200

P200HCT-ND

ERJ-3EKF2000V

Panasonic

2

R67,R66

1M, 1%

311-1.00MCRCT-ND

RC0805FR-071ML

Yageo

2

TP1,10, 14, 15,16,18

Test Points

5002K-ND

5002

Keystone

1

T1

Pulse TFR

ESMIT-4180/750110001

Sumida//Midcom

1

U1

73M1902

73M1902

Teridian

1

U2

73M1912

73M1912

Teridian

1

Y2

24.576MHz

815-ABMM2-24.576-E2T

ABRACON

3.4 Bill of Materials

Table 4: 73M1922 20-Pin TSSOP Dem o Board Bill of Materials

2kOhm@

Rev. 5.0 13

ABMM2-24.576MHZ-E2-T

73M1922 Demo Board User Manual UM_1922_006

3.5 Pin Descriptions

Table 5 shows the 73M1902 20-pin TSSOP package pin names and Table 6 s hows the 73M1912 20-pin
TSSO P package pin definitions.

Table 5: 73M1902 HIC 20-Pin TSSOP Package Pin Definitions

Pin Name Pin Name

1 FSD 11 VNM/VNT
2 FS 12 M/S
3 VND 13 PRM
4 VPD/VPPLL 14 PRP
5 OSCIN 15 VPT/VPD
6 OSOUT 16 INT/RGDT
7 VNPLL/VNA 17 SCLK
8 AOUT 18 VND
9 TYPE 19 SDIN

10 VPA/VPM 20 SDOUT

Table 6: 73M1912 LIC 20-Pin TSSOP Package Pin Definitions

Pin Name Pin Name

1 DCI 11 VBG
2 RGN 12 ACS
3 RGP 13 VNS
4 OFH 14 VPS
5 VNX/VNS 15 RXP
6 SCP 16 RXM
7 MID/LEV 17 TXM
8 VPX 18 DCD
9 SRE 19 DCE

10 SRB 20 DCB

14 Rev. 5.0

UM_1922_006 73M1922 Demo Board User Manual

73M1902

1

2

3

4

5

6

7

8

9

10 11

12

13

14

15

16

17

18

19

20

FSD

FS

VND

VPD/VPPLL

OSCIN

OSCOUT

VNPLL/VNA

AOUT

VPA/VPM VNM/VNT

SDIN

SCLK

INT

VND

VPT/VPD

M/S

PRM

PRP

SDOUT

TYPE

73M1912

1

2

3

4

5

6

7

8

9

10 11

12

13

14

15

16

17

18

19

20

DCI

RGN

RGP

OFH

VND/VNX

SCP

MID

VPX

SRE

SRB VBG

DCE
DCD

TXM

RXM

RXP

ACS

VNS

VPS/VPD

DCB

3.5.1 731922 Micr oDAA Pinout

Figure 9 shows the pinout top views of the 73M1902/73M1912 TSSOP packages.

Figure 9: 73M1902/73M1912 20-Pin TSSOP Packages: Pinout (top view)

4 Related Documentation

The following 73M1x22 documents ar e availab le from Teridian Semiconductor Corp or ation:

73M1822/73M1922 Dat a Sheet
73M1922 Demo Board User Manual (this document)
73M1822/73M1922 Layout Guideline
73M1x22 Worldw ide Design G uide
73M1822/73M1922 Evaluation System with Linux Softmodem User’s Guide
73M1x22/73M1x66B MicroDAA DC Control Loop Operation
73M1x22/ 73 M 1x 6 6 Mi cr oDAA Hy bri d O p er ation

5 Contact Information

For m or e i nform ation about Teridian Sem i conductor p r oduct s or to c heck the availability of the 73M1922,
contact us at:

644 0 Oak Canyon Road
Suite 100
Irvin e, CA 92618-5201

Telephone: [phone]
FAX: [phone]
Email: [e-mail]

For a complete list of worldwid e sales offices, go to http://www.teridian.com.

Rev. 5.0 15