Telit Communications S p A ME910C1WW, NE910C1NA User Guide

ME910C1
HW User Guide
1VV03001351 Rev. 8 – 2018-09-28
Mod. 0805 2016-08 Rev.5
SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE
NOTICE
While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey license under its patent rights or the rights of others.
It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country.
COPYRIGHTS
This instruction manual and the Telit products described in this instruction manual may be, include or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product.
COMPUTER SOFTWARE COPYRIGHTS
The Telit and 3rd Party supplied Software (SW) products described in this instruction manual may include copyrighted Telit and other 3rd Party supplied computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.
1VV0301351 Rev.8 Page 2 of 100 2018-09-28
USAGE AND DISCLOSURE RESTRICTIONS
I. License Agreements
The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement.
II. Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit
III. High Risk Materials
Components, units, or third-party products used in the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High Risk Activities.
IV. Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service names are the property of their respective owners.
V. Third Party Rights
The software may include Third Party Right software. In this case you agree to comply with all terms and conditions imposed on you in respect of such separate software. In addition to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this License shall apply to the Third Party Right software.
TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND THE USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE, INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.
NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY, ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
1VV0301351 Rev.8 Page 3 of 100 2018-09-28
APPLICABILITY TABLE
PRODUCTS
ME910C1-NA
ME910C1-NV ME910C1-N1 ME910C1-E1 ME910C1-AU ME910C1-K1 ME910C1-J1 ME910C1-E2
ME910C1-WW
NE910C1-E1
NE910C1-NA
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Contents
NOTICE 2
COPYRIGHTS ................................................................................................ 2
COMPUTER SOFTWARE COPYRIGHTS ...................................................... 2
USAGE AND DISCLOSURE RESTRICTIONS ............................................... 3
I. License Agreements ..................................................................... 3
II. Copyrighted Materials ................................................................... 3
III. High Risk Materials ....................................................................... 3
IV. Trademarks .................................................................................. 3
V. Third Party Rights ......................................................................... 3
APPLICABILITY TABLE ................................................................................ 4
CONTENTS .................................................................................................... 5
1.
INTRODUCTION .......................................................................... 9
Scope ........................................................................................... 9
Audience....................................................................................... 9
Contact Information, Support ........................................................ 9
Text Conventions ........................................................................ 10
Related Documents .................................................................... 10
2.
3.
OVERVIEW ................................................................................ 11
PINS ALLOCATION ................................................................... 13
Pin-out ........................................................................................ 13
LGA Pads Layout ........................................................................ 23
4.
POWER SUPPLY ....................................................................... 24
Power Supply Requirements ....................................................... 24
Power Consumption ................................................................... 26
General Design Rules ................................................................. 29
4.3.1. Electrical Design Guidelines of the power supply ........................ 29
4.3.1.1. +5V Source Power Supply Design Guidelines ............................ 29
4.3.1.2. +12V Source Power Supply Design Guidelines .......................... 30
4.3.1.3. Battery Source Power Supply Design Guidelines ........................ 31
4.3.2. Thermal Design Guidelines ......................................................... 32
4.3.3. Power Supply PCB layout Guidelines ......................................... 32
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VAUX Power Output ................................................................... 35
RTC Supply ................................................................................ 35
5.
DIGITAL SECTION .................................................................... 36
Logic Levels ................................................................................ 36
Power On.................................................................................... 36
Power Off.................................................................................... 41
Wake from deep sleep mode ...................................................... 43
Unconditional Shutdown ............................................................. 43
Fast power down ........................................................................ 47
5.6.1. Fast Shut Down by Hardware ..................................................... 47
5.6.2. Fast Shut Down by Software....................................................... 48
Communication ports .................................................................. 49
5.7.1. USB 2.0 HS ................................................................................ 49
5.7.2. SPI.............................................................................................. 50
5.7.3. Serial Ports ................................................................................. 51
5.7.3.1. Modem serial port 1 .................................................................... 51
5.7.3.2. Modem serial port 2 .................................................................... 53
5.7.3.3. RS232 level translation ............................................................... 54
General purpose I/O ................................................................... 55
5.8.1. Using a GPIO as INPUT ............................................................. 56
5.8.2. Using a GPIO as OUTPUT ......................................................... 57
5.8.3. Indication of network service availability ..................................... 57
External SIM Holder .................................................................... 58
ADC Converter ........................................................................... 58
6.
RF SECTION .............................................................................. 60
Bands Variants ........................................................................... 60
TX Output power ......................................................................... 60
RX Sensitivity ............................................................................. 61
Antenna requirements................................................................. 66
6.4.1. PCB Design guidelines ............................................................... 70
6.4.2. PCB Guidelines in case of FCC Certification .............................. 72
6.4.2.1. Transmission line design ............................................................ 72
6.4.2.2. Transmission Line Measurements .............................................. 73
6.4.2.3. Antenna Installation Guidelines ................................................... 75
7.
AUDIO SECTION ....................................................................... 76
Electrical Characteristics ............................................................. 76
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Codec examples ......................................................................... 76
8.
GNSS SECTION ......................................................................... 77
GNSS Signals Pin-out................................................................. 77
RF Front End Design .................................................................. 77
8.2.1. Guidelines of PCB line for GNSS Antenna .................................. 77
GNSS Antenna Requirements .................................................... 77
8.3.1. GNSS Antenna specification ....................................................... 78
8.3.2. GNSS Antenna – Installation Guidelines ..................................... 78
8.3.3. Powering the External LNA (active antenna) ............................... 78
GNSS Characteristics * ............................................................... 79
9.
MECHANICAL DESIGN ............................................................. 80
Drawing ...................................................................................... 80
10.
APPLICATION PCB DESIGN .................................................... 81
Footprint ..................................................................................... 81
PCB pad design .......................................................................... 82
PCB pad dimensions .................................................................. 83
Stencil ......................................................................................... 84
Solder paste ............................................................................... 84
Solder Reflow ............................................................................. 85
11.
PACKAGING .............................................................................. 87
Tray ............................................................................................ 87
Reel ............................................................................................ 88
Carrier Tape detail ...................................................................... 89
Reel detail ................................................................................... 90
Packaging detail ......................................................................... 91
Moisture sensitivity ..................................................................... 91
12.
CONFORMITY ASSESSMENT ISSUES .................................... 92
Approvals.................................................................................... 92
FCC certificates .......................................................................... 92
IC/ISED certificates ..................................................................... 92
FCC/ISED Regulatory notices ..................................................... 92
Declaration of Conformity ........................................................... 95
13.
SAFETY RECOMMENDATIONS................................................ 96
READ CAREFULLY .................................................................... 96
14.
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ACRONYMS ............................................................................... 97
15.
DOCUMENT HISTORY .............................................................. 99
1VV0301351 Rev.8 Page 8 of 100 2018-09-28
1. INTRODUCTION
Scope
Scope of this document is to give a description of some hardware solutions useful for developing a product with the Telit ME910C1 module.
Audience
This document is intended for Telit customers, who are integrators, about to implement their applications using our ME910C1 modules.
Contact Information, Support
For general contact, technical support services, technical questions and report documentation errors contact Telit Technical Support at:
TS-EMEA@telit.com
TS-AMERICAS@telit.com
TS-APAC@telit.com
TS-SRD@telit.com
Alternatively, use:
http://www.telit.com/support
For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:
http://www.telit.com
Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements.
Telit appreciates feedback from the users of our information.
1VV0301351 Rev.8 Page 9 of 100 2018-09-28
Text Conventions
Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur.
Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction.
Tip or Information – Provides advice and suggestions that may be useful when integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
Related Documents
80000NT10001A - SIM INTEGRATION DESIGN GUIDES Application Note 80000NT10060A - xE910 Global Form Factor Application Note 80000NT10002A - ANTENNA DETECTION 80000NT10003A - Rework procedure for BGA modules 80000NT10028A - Event Monitor Application Note 80000NT11246A - LE910/LE920 Digital Voice Interface Application Note
1VV0301351 Rev.8 Page 10 of 100 2018-09-28
2. OVERVIEW
The aim of this document is the description of some hardware solutions useful for developing a product with the Telit ME910C1 module. In this document all the basic functions of a m2m module will be taken into account; for each one of them a proper hardware solution will be suggested and eventually the wrong solutions and common errors to be avoided will be evidenced. Obviously this document cannot embrace the whole hardware solutions and products that may be designed. The wrong solutions to be avoided shall be considered as mandatory, while the suggested hardware configurations shall not be considered mandatory, instead the information given shall be used as a guide and a starting point for properly developing your product with the Telit ME910C1 module. For further hardware details that may not be explained in this document refer to the Telit ME910C1 Product Description document where all the hardware information is reported.
NOTE: (EN) The integration of the ME910C1 cellular module within user
application shall be done according to the design rules described in this manual.
(IT) L’integrazione del modulo cellulare ME910C1 all’interno dell’applicazione dell’utente dovrà rispettare le indicazioni progettuali descritte in questo manuale.
(DE) Die Integration des ME910C1 Mobilfunk-Moduls in ein Gerät muß gemäß der in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen.
(SL) Integracija ME910C1 modula v uporabniški aplikaciji bo morala upoštevati projektna navodila, opisana v tem priročniku.
(SP) La utilización del modulo ME910C1 debe ser conforme a los usos para los cuales ha sido deseñado descritos en este manual del usuario.
(FR) L’intégration du module cellulaire ME910C1 dans l’application de l’utilisateur sera faite selon les règles de conception décrites dans ce manuel.
(HE)
ME910C1
The information presented in this document is believed to be accurate and reliable. However, no responsibility is assumed by Telit Communications S.p.A. for its use, nor any
1VV0301351 Rev.8 Page 11 of 100 2018-09-28
ME910C1 HW User Guide
infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent rights of Telit Communications S.p.A. other than for circuitry embodied in Telit products. This document is subject to change without notice.
1VV0301351 Rev.8 Page 12 of 100 2018-09-28
ME910C1 HW User Guide
3. PINS ALLOCATION
Pin-out
Pin Signal I/O
USB HS 2.0 COMMUNICATION PORT (FW upgrade and Data)
B15
C15
A13
Asynchronous Serial Port (FW upgrade and Data with Flow Control)
N15
M15
M14
USB_D+ I/O USB differential Data (+)
USB_D- I/O USB differential Data (-)
VUSB I Enable pin for the internal
C103/TXD I Serial data input from DTE CMOS 1.8V
C104/RXD O Serial data output to DTE CMOS 1.8V
C108/DTR I Input for (DTR) from DTE CMOS 1.8V
Function Type Comment
5 / 3V Internal PD
USB transceiver.
(100K)
L14
P15
N14
P14
R14
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C105/RTS I Input for Request to send
signal (RTS) from DTE
C106/CTS O Output for Clear to Send
signal (CTS) to DTE
C109/DCD O Output for (DCD) to DTE CMOS 1.8V
C107/DSR O Output for (DSR) to DTE CMOS 1.8V
C125/RING O Output for Ring (RI) to
DTE
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
ME910C1 HW User Guide
SIM Card Interface
A6
A7
A5
A4
A3
SIMCLK
SIMRST
SIMIO
SIMIN
SIMVCC
Digital Voice Interface (DVI)
B9
DVI_WA0 I/O
O
O
I/O
I
-
External SIM signal –
Clock
External SIM signal –
Reset
External SIM signal –
Data I/O
External SIM signal – Presence (active low)
External SIM signal –
Power supply for the SIM
Digital Audio Interface
(WA0)
1.8 / 3V
1.8 / 3V
1.8 / 3V
CMOS 1.8
Internal PU
1.8 / 3V
1.8V
(47K)
SPI
B6
B7
B8
D15
E15
F15
H14
DVI_RX I
DVI_TX I/O
DVI_CLK I/O
Digital Audio Interface
(RX)
Digital Audio Interface
(TX)
Digital Audio Interface
(CLK)
1.8V
1.8V
1.8V
SPI_MOSI O SPI MOSI CMOS 1.8V
SPI_MISO I SPI_MISO CMOS 1.8V
SPI_CLK O SPI Clock CMOS 1.8V
SPI_CS O SPI Chip Select CMOS 1.8V
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ME910C1 HW User Guide
DIGITAL IO
C8
GPIO_01 I/O GPIO_01 /STAT LED CMOS 1.8V
STAT LED
is alternate
function
C9
C10
C11
B14
C12
C13
K15
L15
GPIO_09 I/O GPIO_09 CMOS 1.8V
G15
GPIO_10 I/O GPIO_10 CMOS 1.8V
GPIO_02 I/O GPIO_02 CMOS 1.8V
GPIO_03 I/O GPIO_03 CMOS 1.8V
GPIO_04 I/O GPIO_04 CMOS 1.8V
GPIO_05 I/O GPIO_05 CMOS 1.8V
GPIO_06 I/O GPIO_06 CMOS 1.8V
GPIO_07 I/O GPIO_07 CMOS 1.8V
GPIO_08 I/O GPIO_08 CMOS 1.8V
ADC
B1
ADC_IN AI
Analog Digital Converter
input
RF SECTION
K1
ANTENNA I/O
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LTE Antenna
(50 ohm)
RF
ME910C1 HW User Guide
GNSS Section
R9
ANT_GNSS I
R7
GNSS_LNA_EN O
Miscellaneous Functions
R13
HW_SHUTDOWN* I
R12
ON_OFF*/WAKE* I
R11
VAUX/PWRMON O
F14
FORCED_USB_BOO
T
GNSS Antenna
(50 ohm)
External GNSS LNA
Enable
HW Unconditional
Shutdown
Input command for power
ON and to wake from deep
sleep mode
Supply Output for external
accessories / Power ON
Monitor
Debug pin, connect to test
I
point
RF
CMOS 1.8V
1.8V Active low
1.8V Active low
1.8V
Active high,
CMOS 1.8V
internal PD
(100K)
Power Supply
M1
VBATT -
M2
VBATT -
N1
VBATT_PA -
N2
VBATT_PA -
P1
VBATT_PA -
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Main power supply
(Baseband)
Main power supply
(Baseband)
Main power supply (Radio
PA)
Main power supply (Radio
PA)
Main power supply (Radio
PA)
Power
Power
Power
Power
Power
ME910C1 HW User Guide
P2
VBATT_PA -
E1
GND -
G1
GND -
H1
GND -
J1
GND -
L1
GND -
A2
GND -
E2
GND -
F2
GND -
Main power supply (Radio
PA)
Ground Power
Ground Power
Ground Power
Ground Power
Ground Power
Ground Power
Ground Power
Ground Power
Power
G2
GND -
H2
GND -
J2
GND -
K2
GND -
L2
GND -
R2
GND -
M3
GND -
N3
GND -
P3
GND -
R3
GND -
Ground Power
Ground Power
Ground Power
Ground Power
Ground Power
Ground Power
Ground Power
Ground Power
Ground Power
Ground Power
D4
GND -
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Ground Power
ME910C1 HW User Guide
M4
GND -
N4
GND -
P4
GND -
R4
GND -
N5
GND -
P5
GND -
R5
GND -
N6
GND -
Ground Power
Ground Power
Ground Power
Ground Power
Ground Power
Ground Power
Ground Power
Ground Power
P6
GND -
R6
GND -
P8
GND -
R8
GND -
P9
GND -
P10
GND -
R10
GND -
M12
GND -
B13
GND -
P13
GND -
Ground Power
Ground Power
Ground Power
Ground Power
Ground Power
Ground Power
Ground Power
Ground Power
Ground Power
Ground Power
E14
GND -
Ground Power
RESERVED
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ME910C1 HW User Guide
C1
D1
RESERVED - RESERVED
F1
RESERVED - RESERVED
B2
RESERVED - RESERVED
C2
RESERVED - RESERVED
D2
RESERVED - RESERVED
B3
RESERVED - RESERVED
C3
RESERVED - RESERVED
RESERVED
-
RESERVED
D3
RESERVED - RESERVED
E3
RESERVED - RESERVED
F3
RESERVED - RESERVED
G3
RESERVED - RESERVED
K3
RESERVED - RESERVED
L3
RESERVED - RESERVED
B4
RESERVED - RESERVED
C4
RESERVED - RESERVED
B5
RESERVED - RESERVED
C5
RESERVED - RESERVED
C6
RESERVED - RESERVED
C7
RESERVED - RESERVED
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ME910C1 HW User Guide
N7
RESERVED - RESERVED
P7
RESERVED - RESERVED
N8
RESERVED - RESERVED
N9
RESERVED - RESERVED
A10
RESERVED - RESERVED
N10
RESERVED - RESERVED
N11
RESERVED - RESERVED
P11
RESERVED - RESERVED
B12
RESERVED - RESERVED
D12
RESERVED - RESERVED
N12
RESERVED - RESERVED
P12
RESERVED - RESERVED
G14
RESERVED - RESERVED
J14
RESERVED - RESERVED
K14
RESERVED - RESERVED
N13
RESERVED - RESERVED
L13
RESERVED - RESERVED
J13
RESERVED - RESERVED
M13
RESERVED - RESERVED
K13
RESERVED - RESERVED
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ME910C1 HW User Guide
H13
RESERVED - RESERVED
G13
RESERVED - RESERVED
F13
RESERVED - RESERVED
B11
RESERVED - RESERVED
B10
RESERVED - RESERVED
A9
RESERVED - RESERVED
A8
RESERVED - RESERVED
E13
RESERVED - RESERVED
D13
RESERVED - RESERVED
D14
RESERVED - RESERVED
A14
RESERVED - RESERVED
A12
RESERVED - RESERVED
A11
RESERVED - RESERVED
H15
RESERVED - RESERVED
J15
RESERVED - RESERVED
C14
H3
J3
RESERVED - RESERVED
RESERVED - RESERVED
RESERVED - RESERVED
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ME910C1 HW User Guide
WARNING: Reserved pins must not be connected. Only D13-E13 pins can be connected together in order to be compatible with HE910 module.
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ME910C1 HW User Guide
LGA Pads Layout
TOP VIEW
A B C D E F G H J K L M N P R
1 ADC_IN1 RES RES GND RES GND GND GND ANT GND VBATT
2 GND RES RES RES GND GND GND GND GND GND GND VBATT
3 SIMVCC RES RES RES RES RES RES RES RES RES RES GND GND GND GND
4 SIMIN RES RES GND GND GND GND GND
5 SIMIO RES RES GND GND GND
6 SIMCLK DVI_RX RES GND GND GND
7 SIMRST DVI_TX RES RES RES
8 RES DVI_CLK GPIO_01 RES GND GND
9 RES DVI_WA0 GPIO_02 RES GND ANT_GNSS
10 RES RES GPIO_03 RES GND GND
11 RES RES GPIO_04 RES RES
VBATT_PA VBATT_PA
VBATT_PA VBATT_PA
GND
GNSS_LNA
_EN
VAUX/PWR
MON
12 RES RES GPIO_06 RES GND RES RES
13 VUSB GND GPIO_07 RES RES RES RES RES RES RES RES RES RES GND
SPI_MISO
RX_AUX
FORCE_U SB_BOOT
SPI_CLK GPIO_10 RES RES GPIO_08 GPIO_09 C104/RXD C103/TXD C106/CTS
RES SPI_CS RES RES C105/RTS C108/DTR C109/DCD C107/DSR C125/RING
14 RES GPIO_05 RES RES GND
15 USB_D+ USB_D-
SPI_MOSI
TX_AUX
ON_OFF*/
WAKE*
HW_SHUT
DOWN*
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ME910C1 HW User Guide
4. POWER SUPPLY
The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product overall performances, hence read carefully the requirements and the guidelines that will follow for a proper design.
Power Supply Requirements
The external power supply must be connected to VBATT and VBATT_PA pads and must fulfil the following requirements:
Power Supply
Nominal Supply Voltage
Operating Voltage Range
Extended Voltange Range
NOTE: The Operating Voltage Range MUST never be exceeded; care must be taken when designing the application’s power supply section to avoid having an excessive voltage drop. If the voltage drop is exceeding the limits it could cause an unintentional power off of ME910C1 module. The Power supply must be higher than 3.20 V to power on the ME910C1 module.
3.8V
Value
3.40 V÷ 4.20 V
3.20 V÷ 4.50 V
Overshoot voltage (regarding MAX Extended Operating Voltage) and drop in voltage (regarding MIN Extended Operating Voltage) MUST never be exceeded; The “Extended Operating Voltage Range” can be used only with completely assumption and application of the HW User guide suggestions.
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ME910C1 HW User Guide
NOTE: For PTCRB approval on the final products the power supply is required to be within the “Normal Operating Voltage Range”.
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ME910C1 HW User Guide
Power Consumption
*Preliminary data
Mode
Switched off
IDLE mode
AT+CFUN=1
AT+CFUN=4
AT+CFUN=5
Operative Mode
Average
Mode Description
(mA)
0.008mA Module supplied but switched off
12 mA Normal mode: full functionality of the module
11 mA Disabled TX and RX; module is not registered on
the network
2.3 mA Paging cycle #64 frames (0.64 sec DRx cycle)
1.4 mA Paging cycle #128 frames (1.28 sec DRx cycle)
1.1 mA Paging cycle #256 frames (2.56 sec DRx cycle)
(LTE) CAT M1
Data call
10MHz RB=1
(LTE) CAT NB1
Data call
GPRS Data call 1TX+1RX slots,
GSM900
GPRS Data call 4TX+1RX slots,
GSM900
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190mA VBATT_PA+VBATT TX=23dBm
112mA VBATT_PA+VBATT TX=0dBm
50mA VBATT_PA+VBATT TX=23dBm
30mA VBATT_PA+VBATT TX=0dBm
240mA VBATT_PA+VBATT TX=33dBm
112mA VBATT_PA+VBATT TX=0dBm
520mA VBATT_PA+VBATT TX=28dBm
130mA VBATT_PA+VBATT TX=0dBm
ME910C1 HW User Guide
PSM Mode
AT+CPSMS=1
GPS
GNSS
GNSS
GPS
GPS
1800
1600
1400
1200
0.008mA No current source or sink by any connected pin
29 mA GNSS Standalone 1Hz Acquisition ( Non-Dpo)
30 mA GNSS Standalone 1Hz Tracking ( Non-DPO)
28 mA GPS Standalone 1Hz Acquisition ( Non-Dpo)
29 mA GPS Standalone 1Hz Tracking ( Non-DPO)
Current Profile at Max Power (23 dBm) Average Value at Max Power Current Profile at Low Power (<0 dBm) Average Value at Low Power
1000
800
600
400
200
0
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Current consumption profile of Vbatt + Vbatt_PA in LTE CAT M1 mode with max thought­put configuration. LTE NB1 mode has a similar current consumption profile.
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1800
1600
1400
1200
1000
800
600
400
200
Current Profile at Max Power (33 dBm) Average Value at Max Power Current Profile at Low Power (< 0 dBm) Average Value at Low Power
0
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Current consumption profile of Vbatt + Vbatt_PA in GPRS mode with 1TX+1RX configuration
NOTE: The reported LTE CAT M1 values are an average among all
the product variants and bands for each network wireless technology.
The support of specific network wireless technology depends on product variant configuration.
NOTE: The electrical design for the Power supply should be made
ensuring it will be capable of a peak current output of at least:
0.6 A for LTE mode (3.80V supply).
2A for GPRS mode (3.80V supply).
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General Design Rules
The principal guidelines for the Power Supply Design embrace three different design steps:
the electrical design of the power supply
the thermal design
the PCB layout
4.3.1. Electrical Design Guidelines of the power supply
The electrical design of the power supply depends strongly from the power source where this power is drained. We will distinguish them into three categories:
+5V input (typically PC internal regulator output)
+12V input (typically automotive)
Battery
4.3.1.1. +5V Source Power Supply Design Guidelines
The desired output for the power supply is 3.8V, hence there's not a big difference
between the input source and the desired output and a linear regulator can be used. A switching power supply will not be suited because of the low drop out requirements.
When using a linear regulator, a proper heat sink shall be provided in order to
dissipate the power generated.
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut
the current absorption peaks close to the Module, a 100μF capacitor is usually suited.
Make sure the low ESR capacitor on the power supply output rated at least 10V.
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An example of linear regulator with 5V input is:
Guidelines
4.3.1.2. +12V Source Power Supply Design Guidelines
The desired output for the power supply is 3.8V, hence due to the big difference
between the input source and the desired output, a linear regulator is not suited and shall not be used. A switching power supply will be preferable because of its better efficiency.
When using a switching regulator, a 500kHz or more switching frequency regulator
is preferable because of its smaller inductor size and its faster transient response. This allows the regulator to respond quickly to the current peaks absorption.
In any case the frequency and Switching design selection is related to the
application to be developed due to the fact the switching frequency could also generate EMC interferences.
For car PB battery the input voltage can rise up to 15,8V and this should be kept in
mind when choosing components: all components in the power supply must withstand this voltage.
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut
the current absorption peaks, a 100μF capacitor is usually suited.
Make sure the low ESR capacitor on the power supply output is rated at least 10V.
For Car applications a spike protection diode should be inserted close to the power
input, in order to clean the supply from spikes.
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An example of switching regulator with 12V input is in the below schematic:
4.3.1.3. Battery Source Power Supply Design Guidelines
The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is 4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the power to the Telit ME910C1 module.
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut
the current absorption peaks, a 100μF tantalum capacitor is usually suited.
Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.
A protection diode should be inserted close to the power input, in order to save the
ME910C1 from power polarity inversion. Otherwise the battery connector should be done in a way to avoid polarity inversions when connecting the battery.
The battery must be rated to supply peaks of current up to 0.6 A for LTE.
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NOTE: DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with ME910C1. Their use can lead to overvoltage on the ME910C1 and damage it. USE ONLY Li-Ion battery types.
4.3.2. Thermal Design Guidelines
Worst case as reference values for thermal design of ME910C1 are:
Average current consumption: 250 mA (LTE CAT M1 and NB1 modes)
Average current consumption: 600 mA (GPRS and EDGE modes)
Supply voltage: 4.50V
NOTE: Make PCB design in order to have the best connection of GND pads to large surfaces of copper.
NOTE: The ME910C1 includes a function to prevent overheating.
4.3.3. Power Supply PCB layout Guidelines
As seen on the electrical design guidelines the power supply shall have a low ESR capacitor on the output to cut the current peaks on the input to protect the supply from spikes The placement of this component is crucial for the correct working of the circuitry. A misplaced component can be useless or can even decrease the power supply performances.
The Bypass low ESR capacitor must be placed close to the Telit ME910C1 power
input pads or in the case the power supply is a switching type it can be placed close to the inductor to cut the ripple provided the PCB trace from the capacitor to the
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ME910C1 is wide enough to ensure a dropless connection even during an 0.6 A (LTE) or 2A (GSM) current peak.
The protection diode must be placed close to the input connector where the power
source is drained.
The PCB traces from the input connector to the power regulator IC must be wide
enough to ensure no voltage drops occur when an 2 A current peak is absorbed (valid only for product supporting GSM mode).
The PCB traces to the ME910C1 and the Bypass capacitor must be wide enough to
ensure no significant voltage drops occur. This is for the same reason as previous point. Try to keep this trace as short as possible.
To reduce the EMI due to switching, it is important to keep very small the mesh
involved; thus the input capacitor, the output diode (if not embodied in the IC) and the regulator have to form a very small loop.This is done in order to reduce the radiated field (noise) at the switching frequency (100-500 kHz usually).
A dedicated ground for the Switching regulator separated by the common ground
plane is suggested.
The placement of the power supply on the board should be done in such a way to
guarantee that the high current return paths in the ground plane are not overlapped to any noise sensitive circuitry as the microphone amplifier/buffer or earphone amplifier.
The power supply input cables should be kept separate from noise sensitive lines
such as microphone/earphone cables.
The insertion of EMI filter on VBATT pins is suggested in those designs where
antenna is placed close to battery or supply lines. A ferrite bead like Murata BLM18EG101TN1 or Taiyo Yuden P/N FBMH1608HM101 can be used for this purpose.
The below figure shows the recommended circuit:
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VAUX Power Output
A regulated power supply output is provided in order to supply small devices from the module, like: level translators, audio codec, sensors, and others.
Pin R11 can be used also as PWRMON (module powered ON indication) function, because is always active when the module is powered ON and cannot be set to LOW level by any AT command.
Host can only detect deep sleep mode by monitoring of VAUX/PWRMON output pin, since there is no pin dedicated to PSM status indicator,
The operating range characteristics of the supply are:
Item Min Typical Max
Output voltage
Output current - - 60mA
Output bypass capacitor
(inside the module)
1.78V
1uF
1.80V
1.82V
If power saving configuration is enabled by AT+CPSMS Command, VAUX during deep sleep mode period is OFF
RTC Supply
RTC is functional when ME910C1 is in PSM state and VBATT pin is supplied. RTC settings are erased if VBATT supply is temporary disconnected.
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Operating Range
- Interface levels (1.8V CMOS)
5. DIGITAL SECTION
Logic Levels
Parameter Min Max
ABSOLUTE MAXIMUM RATINGS – NOT FUNCTIONAL
Input level on any digital pin (CMOS 1.8) with respect to ground
Input high level
Input low level
Output high level
Output low level
-0.3V 2.1V
1.5V 1.9V
0V 0.35V
1.6V 1.9V
0V 0.2V
Parameter AVG
CURRENT CHARACTERISTICS:
Output Current
Input Current
1mA
1uA
Power On
To turn on the ME910C1 the pad ON_OFF*/WAKE* must be tied low for at least 5 second and then released. The maximum current that can be drained from the ON_OFF*/WAKE* pad is 0,1 mA. ON_OFF*/WAKE* pad can make an asynchronous wakeup of the system from the PSM Mode, before the scheduled event of timer T3412 expired. To make asynchronous exit from PSM mode ON_OFF*/WAKE* pin must be set LOW for at least 5 seconds.
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Figure 1 illustrates a simple circuit to power on the module using an inverted buffer output.
Figure 1: Power-on Circuit
NOTE: Don't use any pull up resistor on the ON_OFF*/WAKE* line, it is internally pulled up. Using pull up resistor may bring to latch up problems on the ME910C1 power regulator and improper power on/off of the module. The line ON_OFF*/WAKE* must be connected only in open collector or open drain configuration.
In this document all the lines that are inverted, hence have active low signals are labelled with a name that ends with”#",”*” or with a bar over the name.
To check if the device has powered on, the hardware line PWRMON should be monitored.
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A flow chart showing the proper turn on procedure is displayed below:
“Modem ON Proc”
START
VBATT>3.20V?
PWRMON=ON
ON_OFF*/WAKE* = LOW
Delay = 5 sec (see note
GO TO
“HW Shutdown
ON_OFF*/WAKE*= HIGH
PWRMON=ON
Delay = 1 sec
GO TO
“Start AT Commands””
“Modem ON Proc”
END
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A flow chart showing the AT commands managing procedure is displayed below:
“Start AT CMD”
START
Delay = 300 msec
Enter AT <CR>
AT answer in
1 sec ?
N
GO TO
“HW Shutdown
Unconditional”
Y
“Start AT CMD”
END
GO TO
“Modem ON Proc.”
NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the ME910C1 when the module is powered off or during an ON-OFF transition.
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For example: 1- Let's assume you need to drive the ON_OFF*/WAKE* pad with a totem pole output of a
+3/5 V microcontroller (uP_OUT1):
2- Let's assume you need to drive the ON_OFF*/WAKE* pad directly with an ON/OFF button:
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WARNING
It is recommended to set the ON_OFF*/WAKE* line LOW to power on the module only after VBATT is higher than 3.20V.
In case this condition it is not satisfied you could use the HW_SHUTDOWN* line to recover it and then restart the power on activity using the ON_OFF*/WAKE* line.
An example of this is described in the following diagram.
After HW_SHUTDOWN* is released you could again use the ON_OFF*/WAKE* line to power on the module.
Power Off
Turning off of the device can be done in two ways:
via AT command (see ME910C1 Software User Guide, AT#SHDN)
pin ON_OFF*/WAKE* for at least 3 seconds
Either ways, the device issues a detach request to network informing that the device will not be reachable any more.
NOTE: To check if the device has been powered off or IN PSM mode, the hardware line PWRMON must be monitored. The device is powered off when PWRMON goes low.
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the ME910C1 when the module is powered off or during an ON-OFF transition.
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START
WARNING: Not following the recommended shut-down procedures might damage the device and consequently void the warranty.
The following flow chart shows the proper turn off procedure:
Modem OFF Proc.
PWRMON=O
OFF Mode
AT#SHDN
PWRMON=O
Looping for
GO TO
HW SHUTDOWN
Unconditional
ON_OFF*/WAKE* = LOW
Delay >= 3 sec
ON_OFF*/WAKE* = HIGH
Modem OFF Proc.
END
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ME910C1 HW User Guide
Wake from deep sleep mode
ME910C1 supports Power Saving Mode (PSM) functionality defined in 3GPP Release 12. When Periodic Update Timer expires, ME910C1 power off until the next scheduled wake­up time. Asynchronous event controlled by host can wake up from deep sleep mode by asserting ON_OFF*/WAKE* pin LOW for at least 5 seconds. Host can detect deep sleep mode by polling VAUX/PWRMON pin if previously configured.
Unconditional Shutdown
HW_SHUTDOWN* is used to unconditionally shutdown the ME910C1. Whenever this signal is pulled low, the ME910C1 is reset. When the device is reset it stops any operation. After the release of the line, the ME910C1 is unconditionally shut down, without doing any detach operation from the network where it is registered. This behaviour is not a proper shut down because any cellular device is requested to issue a detach request on turn off. The HW_SHUTDOWN* is internally controlled on start-up to achieve always a proper power-on reset sequence, so there's no need to control this pin on start-up. To unconditionally shutdown the ME910C1, the pad HW_SHUTDOWN* must be tied low for at least 200 milliseconds and then released. The signal is internally pulled up so the pin can be left floating if not used. If used, then it
must always be connected with an open collector transistor
, to permit to the internal circuitry the power on reset and under voltage lockout functions. During PSM mode, HW_SHUTDOWN toggle has no effect. The use of HW_SHUTDOWN* pin is valid only when ME910C1 has VAUX/PWRMON output HI.
PIN DESCRIPTION
Signal Function I/O PAD
HW_SHUTDOWN*
Unconditional Shutdown of the Module
I R13
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OPERATING LEVELS
Signal Status Min Max
HW_SHUTDOWN* Input high
HW_SHUTDOWN* Input low
WARNING: The hardware unconditional Shutdown must not be used during normal operation of the device since it does not detach the device from the network. It shall be kept as an emergency exit procedure.
A typical circuit is the following:
1.5V 1.9V
0V 0.35V
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For example: Let us assume you need to drive the HW_SHUTDOWN* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT2):
In the following flow chart is detailed the proper restart procedure:
NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the ME910C1 when the module is powered off or during an ON-OFF transition.
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START
END
HW SHUTDOWN
Unconditional
HW_SHUTDOWN* = LOW
Delay = 200ms
HW_SHUTDOWN* = HIGH
Delay = 1s
Disconnect
VBATT
PWRMON = ON
HW SHUTDOWN
Unconditional
NOTE: Do not use any pull up resistor on the HW_SHUTDOWN* line nor any totem pole digital output. Using pull up resistor may bring to latch up problems on the ME910C1 power regulator and improper functioning of the module. To proper power on again the module please refer to the related paragraph (“Power ON”) The unconditional hardware shutdown must always be implemented on the boards and should be used only as an emergency exit procedure.
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Fast power down
The procedure to power off ME910C1 described in Chapter 5.3 normally takes more than 1 second to detach from network and make ME910C1 internal filesystem properly closed. In case of unwanted supply voltage loss the system can be switched off without any risk of filesystem data corruption by implementing Fast Shut Down feature. Fast Shut Down feature permits to reduce the current consumption and the time-to­poweroff to minimum values.
NOTE: Refer to ME910C1 series AT command reference guide (Fast power down - #FASTSHDN) in order to set up detailed AT command.
5.6.1. Fast Shut Down by Hardware
The Fast Power Down can be triggered by configuration of any GPIO. HI level to LOW level transition of GPIO commands fast power down.
Example circuit:
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NOTE: Consider voltage drop under max current conditions when defining the voltage detector thereshold in order to avoid unwanted shutdown.
The capacitor is rated with the following formula:
TIP: Make the same plot during system verification to check timings and voltage levels.
5.6.2. Fast Shut Down by Software
The Fast Power Down can be triggered by AT command.
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Communication ports
5.7.1. USB 2.0 HS
The ME910C1 includes one integrated universal serial bus (USB 2.0 HS) transceiver. The following table is listing the available signals:
PAD Signal I/O Function NOTE
B15
USB_D+ I/O USB differential Data (+)
C15
USB_D- I/O USB differential Data (-)
Accepted range:
3.0V to 5.5V 100K pull down
A13
VUSB AI
Power sense for the internal USB transceiver.
The USB_DPLUS and USB_DMINUS signals have a clock rate of 480 MHz, therefore signal traces should be routed carefully. Trace lengths, number of vias and capacitive loading should be minimized. The characteristic impedance value should be as close as possible to 90 Ohms differential. ESD protection can be added to USB D+/D- lines in case of external connector for cable connection. Proper components for USB 2.0 must be used.
NOTE: Disconnect or assert to GND the VUSB pin before activating the Power Saving Mode.
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5.7.2. SPI
The ME910C1 Module is provided by a standard 3-wire master SPI interface + chip select control.
The following table is listing the available signals:
PAD Signal I/O Function Type NOTE
D15
SPI_MOSI O SPI MOSI
E15
SPI_MISO I SPI MISO
F15
H14
SPI_CLK O SPI Clock
SPI_CS O SPI Chip Select
NOTE: Due to the shared functions, SPI port and TX_AUX/RX_AUX port cannot be used simultanously.
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
CMOS
1.8V
Shared
with
TX_AUX
Shared
with
RX_AUX
Refer to ME910C1 series AT command reference guide for port configuration.
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SPI_MISO
SPI Connections
E15
D15
F15
ME910C1
SPI_MOSI
SPI_CLK
Application
Processor
SPI_CS
H14
5.7.3. Serial Ports
The ME910C1 module is provided with by 2 Asynchronous serial ports:
MODEM SERIAL PORT 1 (Main)
MODEM SERIAL PORT 2 (Auxiliary)
Several configurations can be designed for the serial port on the OEM hardware, but the most common are:
RS232 PC com port
microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit)
microcontroller UART @ 5V or other voltages different from 1.8V
Depending from the type of serial port on the OEM hardware a level translator circuit may be needed to make the system work. On the ME910C1 the ports are CMOS 1.8.
5.7.3.1. Modem serial port 1
The serial port 1 on the ME910C1 is a +1.8V UART with all the 7 RS232 signals. It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels.
The following table is listing the available signals:
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RS232
Signal PAD Name Usage
Pin
1 C109/DCD N14 Data Carrier Detect
2 C104/RXD M15
3 C103/TXD N15
4 C108/DTR M14 Data Terminal Ready
6 C107/DSR P14 Data Set Ready
7 C106/CTS P15 Clear to Send
Transmit line *see Note
Receive line *see Note
Output from the ME910C1 that indicates the carrier presence
Output transmit line of ME910C1 UART
Input receive of the ME910C1 UART
Input to the ME910C1 that controls the DTE READY condition
Output from the ME910C1 that indicates the module is ready
Output from the ME910C1 that controls the Hardware flow control
8 C105/RTS L14 Request to Send
9 C125/RING R14 Ring Indicator
Input to the ME910C1 that controls the Hardware flow control
Output from the ME910C1 that indicates the incoming call condition
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NOTE: According to V.24, some signal names are referred to the application side, therefore on the ME910C1 side these signal are on the opposite direction: TXD on the application side will be connected to the receive line (here named C103/TXD) RXD on the application side will be connected to the transmit line (here named C104/RXD)
For a minimum implementation, only the TXD, RXD lines can be connected, the other lines can be left open provided a software flow control is implemented.
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the ME910C1 when the module is powered off or during an ON/OFF transition.
5.7.3.2. Modem serial port 2
The secondary serial port on the ME910C1 is a CMOS1.8V with only the RX and TX signals. The signals of the ME910C1 serial port are:
PAD Signal I/O Function Type NOTE
Shared with SPI_MOSI
D15 TX_AUX O
Auxiliary UART (TX Data to DTE)
CMOS
1.8V
Shared with SPI_MISO
E15 RX_AUX I
Auxiliary UART (RX Data from DTE)
CMOS
1.8V
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NOTE: Due to the shared functions, TX_AUX/RX_AUX port and SPI port cannot be used simultanously.
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the ME910C1 when the module is powered off or during an ON/OFF transition.
Refer to ME910C1 series AT command reference guide for port configuration.
5.7.3.3. RS232 level translation
In order to interface the ME910C1 with a PC com port or a RS232 (EIA/TIA-232) application a level translator is required. This level translator must:
invert the electrical signal in both directions;
Change the level from 0/1.8V to +15/-15V.
Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level translator. Note that the negative signal voltage must be less than 0V and hence some sort of level translation is always required. The simplest way to translate the levels and invert the signal is by using a single chip level translator. There are a multitude of them, differing in the number of drivers and receivers and in the levels (be sure to get a true RS232 level translator not a RS485 or other standards). By convention the driver is the level translator from the 0-1.8V UART to the RS232 level. The receiver is the translator from the RS232 level to 0-1.8V UART. In order to translate the whole set of control lines of the UART you will need:
5 drivers
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3 receivers
An example of RS232 level adaptation circuitry could be done using a MAXIM transceiver (MAX218) In this case the chipset is capable to translate directly from 1.8V to the RS232 levels (Example done on 4 signals only).
The RS232 serial port lines are usually connected to a DB9 connector with the following layout:
General purpose I/O
The ME910C1 module is provided by a set of Configurable Digital Input / Output pins (CMOS 1.8V). Input pads can only be read; they report the digital value (high or low) present on the pad at the read time. Output pads can only be written or queried and set the value of the pad output. An alternate function pad is internally controlled by the ME910C1 firmware and acts depending on the function implemented.
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The following table shows the available GPIO on the ME910C1:
PAD Signal I/O Output
Drive
Strength
C8 GPIO_01 I/O 1mA
C9 GPIO_02 I/O 1mA
C10 GPIO_03 I/O 1mA
C11 GPIO_04 I/O 1mA
B14 GPIO_05 I/O 1mA
C12 GPIO_06 I/O 1mA
C13 GPIO_07 I/O 1mA
Default State NOTE
INPUT – PD (100K)
INPUT – PD (100K)
INPUT – PD (100K)
INPUT – PD (100K)
INPUT – PD (100K)
INPUT – PD (100K)
INPUT – PD (20K to 100K)
Alternate function STAT LED
(*)
K15 GPIO_08 I/O 1mA
L15 GPIO_09 I/O 1mA
G15 GPIO_10 I/O 1mA
INPUT – PD (100K)
INPUT – PD (18K)
INPUT – PD (100K)
(*) If used, GPIO_07 must not be pullup to 1.8V during ME910 poweron.
5.8.1. Using a GPIO as INPUT
The GPIO pads, when used as inputs, can be connected to a digital output of another device and report its status, provided this device has interface levels compatible with the
1.8V CMOS levels of the GPIO. Input current (@1.8V) is about 18uA (corrisponding to 100K pulldown value) in all GPIO pin expect GPIO_09 where current is about 100uA. This value is present since ME910 poweron.
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Device Status
Led Status
If the digital output of the device to be connected with the GPIO input pad of ME910C1 has interface levels different from the 1.8V CMOS, then it can be buffered with an open collector transistor with a 47K pull up to 1.8V supplied by VAUX/POWERMON R11 pad.
NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the ME910C1 when the module is powered off or during an ON/OFF transition.
Refer to ME910C1 series AT command reference guide for GPIO pins configuration.
5.8.2. Using a GPIO as OUTPUT
The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware. When set as outputs, the pads have a push-pull output and therefore the pull-up resistor may be omitted.
5.8.3. Indication of network service availability The STAT_LED pin status shows information on the network service availability and Call
status. The function is available as alternate function of GPIO_01 (to be enabled using the AT#GPIO=1,0,2 command).
In the ME910C1 modules, the STAT_LED needs an external transistor to drive an external LED and its voltage level is defined accordingly to the table below:.
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Device off Permanently off
Not Registered Permanently on
Registered in idle Blinking 1sec on + 2 sec off
Registered in idle + power saving
It depends on the event that triggers the wakeup (In sync with network paging)
Connecting Blinking 1 sec on + 2 sec off
The reference schematic for LED indicator,
R3 must be calculated taking in account VBATT value and LED type. :
External SIM Holder
Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a).
ADC Converter
The ME910C1 is provided by one AD converter. It is able to read a voltage level in the range of 0÷1.8 volts applied on the ADC pin input, store and convert it into 10 bit word. The input line is named as ADC_IN1 and it is available on Pad B1
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The following table is showing the ADC characteristics:
Item Min Typical Max Unit
Input Voltage range 0 - 1.8 Volt
AD conversion - - 10 bits
Input Resistance 1 - - Mohm
Input Capacitance - 1 - pF
The ADC could be controlled using an AT command. The command is
AT#ADC=1,2
The read value is expressed in mV
Refer to SW User Guide or AT Commands Reference Guide for the full description of this function.
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6. RF SECTION
Bands Variants
Product bands
ME910C1-NV B4,B13
ME910C1-NA B2,B4,B12
ME910C1-N1 B2,B4,B12,B13
ME910C1-E1 B3,B8,B20
ME910C1-AU B3, B5,B8,B28
ME910C1-K1 B3,B5,B8
ME910C1-J1 B1,B3,B8,B18,B19,B26
ME910C1-E2 B3,B8,B20, GSM850, GSM900, DCS1800, PCS1900
ME910C1-WW B1,B2,B3,B4,B5,B8,B12,B13,B18,B19,B20,B26,B28,GSM850,
GSM900, DCS1800, PCS1900
TX Output power
Band
Mode Class RF power (dBm)
all bands (LTE) CAT-M1 3 23 (+-2dB)
all bands (LTE) CAT-NB1 3 23 (+-2 dB)
GSM850, GSM900 GPRS (GMSK) 4 33 (+-2 dB)
GSM850, GSM900 EDGE (8PSK) E2 27 (+-2 dB)
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DCS1800, PCS1900 GPRS (GMSK) 4 30 (+-2 dB)
DCS1800, PCS1900 EDGE (8PSK) E2 26 (+-2 dB)
RX Sensitivity
Measurement setup
MODE
(LTE) CAT M1 Throughput >95%
According to 3GPP 36.521-1
(LTE) CAT NB1 Throughput >95%
According to 3GPP 36.521-1
GPRS BLER <10%, CS2
According to 3GPP 51.010-1
ME910C1-NA/ ME910C1-NV
MODE / Band REFsens (dBm) 3GPP REFsens (dBm)
CAT M1 / Band 2 -108.0 -100.3
CAT M1 / Band 4 -107.0 -102.3
CAT M1 / Band 12 -108.0 -99.3
CAT M1 / Band 13 -107.8 -99.3
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ME910C1-E1
MODE / Band REFsens (dBm) 3GPP REFsens (dBm)
CAT M1 / Band 3 -108.0 -99.3
CAT M1 / Band 8 -108.4 -99.8
CAT M1 / Band 20 -107.6 -99.8
CAT NB1 / Band 3 -115.6 -107.5
CAT NB1 / Band 8 -113.8 -107.5
CAT NB1 / Band 20 -114.8 -107.5
ME910C1-AU
MODE / Band REFsens (dBm) 3GPP REFsens (dBm)
CAT M1 / Band 3 -108.0 -99.3
CAT M1 / Band 5 -108.8 -100.8
CAT M1 / Band 8 -108.4 -99.8
CAT M1 / Band 28 -108.0 -100.8
CAT NB1 / Band 3 -115.6 -107.5
CAT NB1 / Band 5 -114.6 -107.5
CAT NB1 / Band 8 -113.8 -107.5
CAT NB1 / Band 28 -115.2 -107.5
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ME910C1-K1
MODE / Band REFsens (dBm) 3GPP REFsens (dBm)
CAT M1 / Band 3 -108.0 -99.3
CAT M1 / Band 5 -108.8 -100.8
CAT M1 / Band 8 -108.0 -99.8
CAT M1 / Band 26 -108.8 -100.8
CAT NB1 / Band 3 -115.6 -107.5
CAT NB1 / Band 5 -114.6 -107.5
CAT NB1 / Band 8 -113.8 -107.5
CAT NB1 / Band 26 -115.0 -107.5
ME910C1-J1
MODE / Band REFsens (dBm) 3GPP REFsens (dBm)
CAT M1 / Band 1 -106.8 -102.3
CAT M1 / Band 3 -108.0 -99.3
CAT M1 / Band 8 -108.4 -99.8
CAT M1 / Band 18 -108.4 -102.3
CAT M1 / Band 19 -108.4 -102.3
CAT M1 / Band 26 -108.8 -100.8
CAT NB1 / Band 1 -114.0 -107.5
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CAT NB1 / Band 3 -115.6 -107.5
CAT NB1 / Band 8 -113.8 -107.5
CAT NB1 / Band 18 -115.0 -107.5
CAT NB1 / Band 19 -114.8 -107.5
CAT NB1 / Band 26 -115.0 -107.5
ME910C1-E2
MODE / Band REFsens (dBm) 3GPP REFsens (dBm)
CAT M1 / Band 3 -106.2 -99.3
CAT M1 / Band 8 -105.0 -99.8
CAT M1 / Band 20 -105.6 -100.8
CAT NB1/ Band 3 -113.4 -107.5
CAT NB1 / Band 8 -113.6 -107.5
CAT NB1 / Band 20 -114.6 -107.5
GPRS / GSM850 -107.4 -104.0
GPRS / GSM900 -107.2 -104.0
GPRS / DCS1800 -109.6 -104.0
GPRS / PCS1900 -109.6 -104.0
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ME910C1-WW
Band REFsens (dBm) 3GPP REFsens (dBm)
CAT M1 / Band 1 -106.8 -102.3
CAT M1 / Band 2 -104.2 -100.3
CAT M1 / Band 3 -106.2 -99.3
CAT M1 / Band 4 -104.2 -102.3
CAT M1 / Band 5 -105.8 -100.8
CAT M1 / Band 8 -105.0 -99.8
CAT M1 / Band 12 -105.6 -99.3
CAT M1 / Band 13 -105.6 -99.3
CAT M1 / Band 18 -105.8 -102.3
CAT M1 / Band 19 -105.8 -102.3
CAT M1 / Band 20 -105.6 -99.8
CAT M1 / Band 26 -105.8 -100.3
CAT M1 / Band 28 -106.2 -100.8
CAT NB1 / Band 1 -113.0 -107.5
CAT NB1 / Band 2 -113.4 -107.5
CAT NB1 / Band 3 -113.6 -107.5
CAT NB1 / Band 5 -114.4 -107.5
CAT NB1 / Band 8 -113.4 -107.5
CAT NB1 / Band 12 -113.4 -107.5
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CAT NB1 / Band 13 -113.6 -107.5
CAT NB1 / Band 18 -114.6 -107.5
CAT NB1 / Band 19 -114.2 -107.5
CAT NB1 / Band 20 -114.2 -107.5
CAT NB1 / Band 26 -114.2 -107.5
CAT NB1 / Band 28 -114.0 -107.5
GPRS / GSM850 -107.4 -104.0
GPRS / GSM900 -107.2 -104.0
GPRS / DCS1800 -109.6 -104.0
GPRS / PCS1900 -109.6 -104.0
Antenna requirements
The antenna connection and board layout design are the most important aspect in the full product design as they strongly affect the product overall performances, hence read carefully and follow the requirements and the guidelines for a proper design. The antenna and antenna transmission line on PCB for a Telit ME910C1 device shall fulfil the following requirements:
ME910C1-NA / ME910C1-NV
Item Value
Depending by frequency band(s) provided by the network
Frequency range
operator, the customer shall use the most suitable antenna for that/those band(s)
140 MHz in LTE Band 2
Bandwidth
445 MHz in LTE Band 4
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47 MHz in LTE Band 12 41 MHz in LTE Band 13
Impedance 50 ohm
Input power > 24dBm Average power
VSWR absolute max ≤ 10:1 (limit to avoid permanent damage)
VSWR recommended ≤ 2:1 (limit to fulfill all regulatory requirements)
ME910C1-E1/ ME910C1-AU/ ME910C1-K1/ ME910C1-J1
Item Value
Depending by frequency band(s) provided by the network
Frequency range
operator, the customer shall use the most suitable antenna for that/those band(s)
250 MHz in LTE Band 1 170 MHz in LTE Band 3 70 MHz in LTE Band 5
Bandwidth
80 MHz in LTE Band 8 60 MHz in LTE Band 19 71 MHz in LTE Band 20 110 MHz in LTE Band 28
Impedance 50 ohm
Input power > 24dBm Average power
VSWR absolute max ≤ 10:1 (limit to avoid permanent damage)
VSWR recommended ≤ 2:1 (limit to fulfill all regulatory requirements)
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ME910C1-E2
Item Value
Frequency range
Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s)
140 MHz in PCS1900 170 MHz in LTE Band 3, DCS1800
Bandwidth
70 MHz in GSM850 80 MHz in LTE Band 8, GSM900 71 MHz in LTE Band 20
Impedance 50 ohm
Input power > 24dBm Average power
VSWR absolute max ≤ 10:1 (limit to avoid permanent damage)
VSWR recommended ≤ 2:1 (limit to fulfill all regulatory requirements)
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ME910C1-WW
Item Value
Frequency range
Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s)
250 MHz in LTE Band 1 140 MHz in LTE Band B2, PCS1900 170 MHz in LTE Band 3, DCS1800 445 MHz in LTE Band 4 70 MHz in LTE Band 5, GSM850
Bandwidth
60 MHz in LTE Band 18 60 MHz in LTE Band 19 80 MHz in LTE Band 26 80 MHz in LTE Band 8, GSM900 71 MHz in LTE Band 20 110 MHz in LTE Band 28
Impedance 50 ohm
Input power > 24dBm Average power
VSWR absolute max ≤ 10:1 (limit to avoid permanent damage)
VSWR recommended ≤ 2:1 (limit to fulfill all regulatory requirements)
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6.4.1. PCB Design guidelines
When using the ME910C1, since there's no antenna connector on the module, the antenna must be connected to the ME910C1 antenna pad (K1) by means of a transmission line implemented on the PCB. This transmission line shall fulfil the following requirements:
Item Value
Characteristic
Impedance
50 ohm (+-10%)
Max Attenuation 0,3 dB
Coupling Coupling with other signals shall be avoided
Ground Plane
Cold End (Ground Plane) of antenna shall be equipotential to the ME910C1 ground pins
The transmission line should be designed according to the following guidelines:
Make sure that the transmission line’s characteristic impedance is 50ohm ;
Keep line on the PCB as short as possible, since the antenna line loss shall be less than about 0,3 dB;
Line geometry should have uniform characteristics, constant cross section, avoid meanders and abrupt curves;
Any kind of suitable geometry / structure (Microstrip, Stripline, Coplanar, Grounded Coplanar Waveguide...) can be used for implementing the printed transmission line afferent the antenna;
If a Ground plane is required in line geometry, that plane has to be continuous and sufficiently extended, so the geometry can be as similar as possible to the related canonical model;
Keep, if possible, at least one layer of the PCB used only for the Ground plane; If possible, use this layer as reference Ground plane for the transmission line;
It is wise to surround (on both sides) the PCB transmission line with Ground, avoid having other signal tracks facing directly the antenna line track.
Avoid crossing any un-shielded transmission line footprint with other signal tracks on different layers;
The ground surrounding the antenna line on PCB has to be strictly connected to the main Ground Plane by means of via holes (once per 2mm at least), placed close to the ground edges facing line track;
Place EM noisy devices as far as possible from ME910C1 antenna line;
Keep the antenna line far away from the ME910C1 power supply lines;
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If EM noisy devices (such as fast switching ICs, LCD and so on) are present on the PCB hosting the ME910, take care of the shielding of the antenna line by burying it in an inner layer of PCB and surround it with Ground planes, or shield it with a metal frame cover.
If EM noisy devices are not present around the line, the use of geometries like Microstrip or Grounded Coplanar Waveguide has to be preferred, since they typically ensure less attenuation if compared to a Stripline having same length;
The following image is showing the suggested layout for the Antenna pad connection:
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6.4.2. PCB Guidelines in case of FCC Certification
In the case FCC certification is required for an application using ME910C1, according to FCC KDB 996369 for modular approval requirements, the transmission line has to be similar to that implemented on ME910C1 interface board and described in the following chapter.
6.4.2.1. Transmission line design
During the design of the ME910C1 interface board, the placement of components has been chosen properly, in order to keep the line length as short as possible, thus leading to lowest power losses possible. A Grounded Coplanar Waveguide (G-CPW) line has been chosen, since this kind of transmission line ensures good impedance control and can be implemented in an outer PCB layer as needed in this case. A SMA female connector has been used to feed the line. The interface board is realized on a FR4, 4-layers PCB. Substrate material is characterized by relative permittivity εr = 4.6 ± 0.4 @ 1 GHz, TanD= 0.019 ÷ 0.026 @ 1 GHz. A characteristic impedance of nearly 50 Ω is achieved using trace width = 1.1 mm, clearance from coplanar ground plane = 0.3 mm each side. The line uses reference ground plane on layer 3, while copper is removed from layer 2 underneath the line. Height of trace above ground plane is 1.335 mm. Calculated characteristic impedance is 51.6 Ω, estimated line loss is less than 0.1 dB. The line geometry is shown below:
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6.4.2.2. Transmission Line Measurements
An HP8753E VNA (Full-2-port calibration) has been used in this measurement session. A calibrated coaxial cable has been soldered at the pad corresponding to RF output; a SMA connector has been soldered to the board in order to characterize the losses of the transmission line including the connector itself. During Return Loss / impedance measurements, the transmission line has been terminated to 50 Ω load. Return Loss plot of line under test is shown below:
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Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω load) is shown in the following figure:
Insertion Loss of G-CPW line plus SMA connector is shown below:
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6.4.2.3. Antenna Installation Guidelines
Install the antenna in a place covered by the LTE signal with CAT-M1 support.
Antenna must not be installed inside metal cases
Antenna must not be installed according Antenna manufacturer instructions
Antenna integration should optimize the Radiation Efficiency. Efficiency values >
50% are recommended on all frequency bands
Antenna integration should not perturb the radiation pattern described in Antenna
manufacturer documentation.
It is preferable to get an omnidirectional radiation pattern to
Antenna Gain must not exceed values indicated in regulatory requirements, where
applicable, in order to meet related EIRP limitations. Typical antenna Gain in most M2M applications does not exceed 2dBi
If the device antenna is located farther than 20cm from the human body and there
are no co-located transmitter then the Telit FCC/IC approvals can be re-used by the end product
If the device antenna is located closer than 20cm from the human body or there are
co-located transmitter then the additional FCC/IC testing may be required for the end product (Telit FCC/IC approvals cannot be reused)
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7. AUDIO SECTION
The Telit digital audio interface (DVI) of the ME910C1 Module is based on the I2S serial bus interface standard. The audio port can be connected to end device using digital interface, or via one of the several compliant codecs (in case an analog audio is needed).
Electrical Characteristics
The product is providing the DVI on the following pins:
Pin Signal I/O Function Internal
Type
Pull Up
B9 DVI_WA0 I/O Digital Audio Interface (Word
Alignment / LRCLK)
B6 DVI_RX I Digital Audio Interface (RX) CMOS 1.8V
B7 DVI_TX O Digital Audio Interface (TX) CMOS 1.8V
B8 DVI_CLK I/O Digital Audio Interface (BCLK) CMOS 1.8V
CMOS 1.8V
Codec examples
Please refer to the Digital Audio Application note.
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8. GNSS SECTION
ME910C1 module includes a state-of-art receiver that can simultaneously search and track satellite signals from multiple satellite constellations. This multi-GNSS receiver uses the entire spectrum of GNSS systems available: GPS, GLONASS, BeiDou, Galileo, and QZSS.
GNSS Signals Pin-out
Pin Signal I/O Function Type
R9
R7
ANT_GNSS
GNSS_LNA_EN
I GNSS Antenna (50
ohm)
O GNSS External LNA
Enable
CMOS
1.8V
RF Front End Design
The ME910C1 Module contains a pre-select SAW filter but doesn’t contain the LNA needed to reach the maximum sensitivity. Active antenna (antenna with a built-in low noise amplifier) must be used and must be supplied with proper bias-tee circuit.
8.2.1. Guidelines of PCB line for GNSS Antenna
Ensure that the antenna line impedance is 50ohm.
Keep the antenna line on the PCB as short as possible to reduce the loss.
Antenna line must have uniform characteristics, constant cross section, avoid
meanders and abrupt curves.
Keep one layer of the PCB used only for the Ground plane, if possible.
Surround (on both the sides, over and under) the antenna line on PCB with Ground,
avoid having other signal tracks facing directly the antenna line of track.
The ground around the antenna line on PCB has to be strictly connected to the
Ground Plane by placing vias once per 2mm at least.
Place EM noisy devices as far as possible from antenna line.
Keep the antenna line far away from power supply lines.
Keep the antenna line far away from GSM RF lines.
If you have EM noisy devices around the PCB hosting the module, such as fast
switching ICs, take care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with Ground planes, or shield it with a metal frame cover.
If you do not have EM noisy devices around the PCB hosting the module, use a
strip-line on the superficial copper layer for the antenna line. The line attenuation will be lower than a buried one.
GNSS Antenna Requirements
GNSS active antenna must be used or integrated in the application.
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Level
Min [V]
Max [V]
Outp
ut High Level
Output Low Level
8.3.1. GNSS Antenna specification
Item Value
Frequency range 1559.0 ~ 1610.0 MHz
Gain 20 ~ 30dB
Impedance 50 ohm
Noise Figure of LNA < 1.5 (recommended)
DC supply voltage DC 1.8 ~ 3.3V
VSWR
3:1 (recommended)
8.3.2. GNSS Antenna – Installation Guidelines
The antenna must be installed according to the antenna manufacturer’s instructions to obtain the maximum performance of GNSS receiver.
The antenna location must be evaluated carefully if operating in conjunction with any other antenna or transmitter.
The antenna must not be installed inside metal cases or near any obstacle that may degrade features like antenna lobes and gain.
8.3.3. Powering the External LNA (active antenna)
The LNA of active antenna needs a source of power because 1.8V or 3V DC voltage needed by active antenna is not supplied by the ME910C1 module, but can be easily included by the host design.
The electrical characteristics of the GPS_LNA_EN signal are:
1.6 1.9 0V 0.3
Example of external antenna bias circuitry:
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Be aware of max bias current in case of unwanted short on antenna cable, decoupling inductor may be demaged.
In case of LNA with 1.8V supply, VAUX/POWERMON pin can be used to supply active GNSS antenna
GNSS Characteristics *
The table below specifies the GNSS characteristics and expected performance The values are related to typical environment and conditions Table 1 GNSS Characteristics (* external LNA)
Parameters
Sensitivity
Standalone or MS Based Tracking Sensitivity
Navigation -158 dBm
Typical Measurement
-161 dBm
Cold Start Sensitivity -146 dBm
Hot <1s GNSS Simulator test
TTFF
Warm 21s GNSS Simulator test
Cold 32s GNSS Simulator test
Min Navigation update rate 1Hz
Dynamics 2g
A-GPS Supported
Notes
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PIN B1
9. MECHANICAL DESIGN
Drawing
Lead Free Alloy:
Dimensions in mm
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10. APPLICATION PCB DESIGN
The ME910C1 modules have been designed in order to be compliant with a standard lead­free SMT process
Footprint
TOP VIEW
In order to easily rework the ME910C1 is suggested to consider on the application a 1.5 mm placement inhibit area around the module. It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module.
NOTE: In the customer application, the region under WIRING INHIBIT (see figure above) must be clear from signal or ground paths.
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(Solder Mask Defined)
(Non Solder Mask Defined)
PCB pad design
Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
Copper
SMD
Solder Mask
PCB
NSMD
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PCB pad dimensions
The recommendation for the PCB pads dimensions are described in the following image (dimensions in mm)
Solder resist openings
It is not recommended to place via or micro-via not covered by solder resist in an area of 0,3 mm around the pads unless it carries the same signal of the pad itself
Inhibit area for micro-via
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Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish Layer Thickness (um) Properties
Electro-less Ni /
Immersion Au
3 –7 / 0.05 – 0.15 good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead­free process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste.
It is not necessary to panel the application’s PCB, however in that case it is suggested to use milled contours and predrilled board breakouts; scoring or v-cut solutions are not recommended
Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a thickness of stencil foil ≥ 120 µm.
Solder paste
Item Lead Free
Solder Paste Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules after assembly
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Solder Reflow
Recommended solder reflow profile:
Profile Feature Pb-Free Assembly Free
Average ramp-up rate (TL to TP)
Preheat – Temperature Min (Tsmin) – Temperature Max (Tsmax)
– Time (min to max) (ts)
Tsmax to TL
– Ramp-up Rate
Time maintained above: – Temperature (TL)
– Time (tL)
Peak Temperature (Tp)
Time within 5°C of actual Peak
Temperature (tp)
150°C 200°C
217°C
10-30 seconds
3°C/second max
60-180 seconds
3°C/second max
60-150 seconds
245 +0/-5°C
Ramp-down Rate
Time 25°C to Peak Temperature
6°C/second max.
8 minutes max.
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NOTE: All temperatures refer to topside of the package, measured on the package body surface
WARNING: THE ME910C1 MODULE WITHSTANDS ONE REFLOW PROCESS ONLY.
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11. PACKAGING
Tray
The ME910 modules are packaged on trays that can be used in SMT processes for pick & place handling.The first Marketing and Engineering samples of the ME910C1 series will be shipped with the current packaging of the xE910 modules (on trays of 20 pieces each). Please note that Telit is going to introduce a new packaging for the xE910 family, as per the Product Change Notification PCN-0000-14-0055, therefore the mass production units of ME910C1 will be shipped according to the following drawings:
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Reel
The ME910 can be packaged on reels of 200 pieces each. See figure for module positioning into the carrier.
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Carrier Tape detail
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Reel detail
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Packaging detail
Moisture sensitivity
The ME910C1 is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions: a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH). b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC J-STD-033A paragraph 5. c) The maximum time between the opening of the sealed bag and the reflow process must be 168 hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected d) Baking is required if conditions b) or c) are not respected e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more
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12. CONFORMITY ASSESSMENT ISSUES
Approvals
RED (ME910C1-E1, ME910C1-E2)
GCF (ME910C1-AU)
PTCRB (ME910C1-NA)
FCC, IC (ME910C1-NA, ME910C1-NV)
RoHS and REACH (all versions)
Approvals for major Mobile Network Operators
FCC certificates
The FCC Certificate is available here: https://www.fcc.gov/oet/ea/fccid
IC/ISED certificates
The ISED Certificate is available here:
https://sms-sgs.ic.gc.ca/equipmentSearch/searchRadioEquipments?execution=e1s1&lang=en
FCC/ISED Regulatory notices
Modification statement
Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment.
Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur
Interference statement
.
This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
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Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Wireless notice
This device complies with FCC/ISED radiation exposure limits set forth for an uncontrolled environment and meets the FCC radio frequency (RF) Exposure Guidelines and RSS‐102 of the ISED radio frequency (RF) Exposure rules.
Antenna gain must be below:
Band ME910C1-NA ME910C1-NV ME910C1-WW NE910C1-NA
FDD 1
FDD 2 / GSM1900
FDD 3
FDD 4
FDD 5 / GSM850
FDD 8
FDD 12
FDD 13 -- 6,94 dBi
FDD 18 -- -- --
FDD 19 -- -- --
FDD 20 -- -- --
FDD 26 -- -- --
FDD 28 -- -- --
-- -- --
9,01 dBi --
--- -- --
6,00 dBi 6,00 dBi
-- -- --
-- -- --
6,18 dBi --
--
6,00 dBi
--
8,70 dBi
0,60 dBi
--
6,60 dBi
6,60 dBi
--
--
--
0,60 dBi
--
9,50 dBi
9,20 dBi
6,60 dBi 6,90 dBi
Thi
s transmitter must not be co-located or operating in conjunction with any other antenna
or transmitter
.
Le présent appareil est conforme à l'exposition aux radiations FCC / ISED définies pour un environnement non contrôlé et répond aux directives d'exposition de la
fréquence de la FCC radiofréquence (RF) et RSS
102 de la fréquence radio (RF)
ISED règles d'exposition. Gain de l’antenne doit étre ci-dessous :
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ME910C1 HW User Guide
Band ME910C1-NA ME910C1-NV ME910C1-WW NE910C1-NA
FDD 1
FDD 2 / GSM1900
FDD 3
FDD 4
FDD 5 / GSM850
FDD 8
FDD 12
FDD 13 -- 6,94 dBi
FDD 18 -- -- --
FDD 19 -- -- --
FDD 20 -- -- --
FDD 26 -- -- --
FDD 28 -- -- --
-- -- --
9,01 dBi --
--- -- --
6,00 dBi 6,00 dBi
-- -- --
-- -- --
6,18 dBi --
--
6,00 dBi
--
8,70 dBi
0,60 dBi
--
6,60 dBi
6,60 dBi
--
--
--
0,60 dBi
--
9,50 dBi
20 dBi
9,
6,60 dBi
6,90 dBi
L'
émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre
antenne ou autre émetteur.
FCC Class B digital device notice
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
-
Reorient or relocate the receiving antenna.
-
Increase the separation between the equipment and receiver.
-
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-
Consult the dealer or an experienced radio/TV technician for help.
CAN ICES-3 (B) / NMB-3 (B)
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ME910C1 HW User Guide
This Class B digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.
Declaration of Conformity
Hereby, Telit Communications S.p.A declares that the ME910C1 Module is in compliance with Directive 2014/53/EU.
The full text of the EU declaration of conformity is available at the following internet address: http://www.telit.com\red
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ME910C1 HW User Guide
13. SAFETY RECOMMENDATIONS
READ CAREFULLY
Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas:
Where it can interfere with other electronic devices in environments such as
hospitals, airports, aircrafts, etc.
Where there is risk of explosion such as gasoline stations, oil refineries, etc. It is the
responsibility of the user to enforce the country regulation and the specific environment regulation.
Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for correct wiring of the product. The product has to be supplied with a stabilized voltage source and the wiring has to be conformed to the security and fire prevention regulations. The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode.
The system integrator is responsible for the functioning of the final product; therefore, care has to be taken to the external components of the module, as well as any project or installation issue, because the risk of disturbing the GSM network or external devices or having impact on the security. Should there be any doubt, please refer to the technical documentation and the regulations in force. Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed with care in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm). In case this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation.
The equipment is intended to be installed in a restricted area location. The equipment must be supplied by an external specific limited power source in compliance
with the clause 2.5 of the standard IEC 60950-1. The European Community provides some Directives for the electronic equipment
introduced on the market. All of the relevant information is available on the European Community website:
http://ec.europa.eu/enterprise/sectors/rtte/documents/
The text of the Directive 99/05 regarding telecommunication equipment is available, while the applicable Directives (Low Voltage and EMC) are available at:
http://ec.europa.eu/enterprise/sectors/electrical/
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ME910C1 HW User Guide
HSUPA
14. ACRONYMS
TTSC
USB
HS
DTE
UMTS
WCDMA
HSDPA
UART
HSIC
SIM
Telit Technical Support Centre
Universal Serial Bus
High Speed
Data Terminal Equipment
Universal Mobile Telecommunication System
Wideband Code Division Multiple Access
High Speed Downlink Packet Access
High Speed Uplink Packet Access
Universal Asynchronous Receiver Transmitter
High Speed Inter Chip
Subscriber Identification Module
SPI
ADC
DAC
I/O
GPIO
CMOS
MOSI
MISO
CLK
Serial Peripheral Interface
Analog – Digital Converter
Digital – Analog Converter
Input Output
General Purpose Input Output
Complementary Metal – Oxide Semiconductor
Master Output – Slave Input
Master Input – Slave Output
Clock
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ME910C1 HW User Guide
PCB
CS
RTC
ESR
VSWR
VNA
Chip Select
Real Time Clock
Printed Circuit Board
Equivalent Series Resistance
Voltage Standing Wave Radio
Vector Network Analyzer
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15. DOCUMENT HISTORY
Revision Date Changes 0 2017-01-16 First issue (preliminary) 1 2017-02-10 Power consumption and Pinout clarification 2 2017-07-20 Added par.11 – Conformity Assessment Issues 3 2017-08-02 Updated Applicable Product Table
4 2017-09-11 Added GNSS part; Updated RF sensitivity 5 2017-11-30 Added Section 5.4 – Wake from deep sleep
mode
6 2018-03-05 Added ME910C1-E2, ME910C1-WW variants 7 2018-04-04 Updated par 13 – Safety Recommendations
Updated RX Sensitivity Section
8 2018-09-28 Updated applicability table
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[04.2016]
Mod. 0805 2016-08 Rev.5
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