Telit Communications S p A LE940B6NA User Manual

LE940B6

Hardware User Guide

1VV0301331 Rev. 1.8 - 2017-03-15

LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15

This documentation applies to the following products:

Table 1: Applicability Table

Module Name Description

LE940B6-NA AUTO North America regional variant (AT&T and T-Mobile)

LE940B6-NV AUTO North America region variant (Verizon, AT&T and T-Mobile)

LE940B6-RW AUTO Rest of World variant (Europe, APAC, Latin America and more)

LE940B6-CN AUTO China variant

Note: NV variant - to be developed

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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE

Notice

While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in the content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey any license under its patent rights or the rights of others.

It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country.

Copyrights

This instruction manual and the Telit products described in this instruction manual may be, include, or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute, and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged, or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product.

Computer Software Copyrights

Telit and third-party software (SW) products described in this instruction manual may include copyrighted Telit and other third-party computer programs stored in semiconductor memories or other media. Laws in Italy and other countries preserve for Telit and other third-party SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other third-party SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the third-party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other thirdparty SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.

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Usage and Disclosure Restrictions

License Agreements

The software described in this document is the property of Telit and its licensors. It is furnished by an express license agreement only and may be used only in accordance with the terms of such an agreement.

Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit.

High Risk Materials

Components, units, or third-party products used in the product described herein are NOT faulttolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of nuclear facilities, aircraft navigation or aircraft communication systems, air traffic control, life support, or weapons systems (“high risk activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such high risk activities.

Trademarks

TELIT and the stylized T logo are trademarks and/or registered trademarks of Telit Communications S.p.A. in the Unites States and/or other countries. All other product or service names are the property of their respective owners.

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Contents

Introduction ..................................................................................................... 12

1.1. Scope ................................................................................................................ 12

1.2. Audience .......................................................................................................... 12

1.3. Contact Information, Support .......................................................................... 12

1.4. Text Conventions ............................................................................................. 13

1.5. Related Documents .......................................................................................... 14

1.6. Abbreviations ................................................................................................... 14

1.7. Document Organization ................................................................................... 15

General Product Description ............................................................................ 17

2.1. Overview .......................................................................................................... 17

2.2. Applications ..................................................................................................... 17

2.3. General Functionality and Main Features ....................................................... 18

2.4. Environmental Requirements .......................................................................... 19

2.4.1. Temperature Range .............................................................................. 19

2.4.2. RoHS Compliance.................................................................................. 19

2.5. Operating Frequency Bands............................................................................. 20

2.5.1. RF Bands per Regional Variant ............................................................. 20

2.5.2. Reference Table of RF Bands Characteristics ....................................... 21

2.6. Sensitivity ......................................................................................................... 24

2.7. LE940B6 Mechanical Specifications ................................................................. 25

2.7.1. Dimensions ........................................................................................... 25

2.7.2. Weight .................................................................................................. 25

LE940B6 Module Connections .......................................................................... 26

3.1. Pin-out .............................................................................................................. 26

3.2. LE940B6 Signals That Must Be Connected ...................................................... 36

3.3. LGA Pads Layout ............................................................................................... 38

Electrical Specifications .................................................................................... 39

4.1. Absolute Maximum Ratings – Not Operational ............................................... 39

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4.2. Recommended Operating Conditions ............................................................. 39

4.3. Logic Level Specifications ................................................................................. 40

4.3.1. 1.8V Standard GPIOs ............................................................................ 40

4.3.2. 1.8V I2C Pads ........................................................................................ 41

4.3.3. 1.2V EMIC Pads ..................................................................................... 41

4.3.4. 1.8V/2.9V SIM Pads .............................................................................. 42

4.3.5. USB........................................................................................................ 42

4.3.6. 2.5V/3.3V EMAC Interface for RMII and RGMII ................................... 43

Hardware Commands ....................................................................................... 44

5.1. Turning on the LE940B6 Module ..................................................................... 44

5.2. Initialization and Activation State .................................................................... 44

5.3. Turning off the LE940B6 Module ..................................................................... 48

5.3.1. Shutdown by Software Command ....................................................... 48

5.3.2. Hardware Shutdown ............................................................................. 50

5.3.3. Unconditional Hardware Reset (RESET_N)........................................... 51

5.3.4. Unconditional Hardware Shutdown ..................................................... 52

Power Supply ................................................................................................... 54

6.1. Power Supply Requirements............................................................................ 54

6.2. General Design Rules ....................................................................................... 57

6.2.1. Electrical Design Guidelines .................................................................. 57

6.2.1.1. + 5V Input Source Power Supply – Design Guidelines ......... 57

6.2.1.2. + 12V Input Source Power Supply – Design Guidelines ....... 58

6.2.1.3. Battery Source Power Supply – Design Guidelines .............. 60

6.2.2. Thermal Design Guidelines ................................................................... 61

6.2.3. Power Supply PCB Layout Guidelines ................................................... 61

Antenna(s) ....................................................................................................... 63

7.1. GSM/WCDMA/TD-SCDMA/LTE Antenna Requirements ................................. 63

7.2. GSM/WCDMA/TD-SCDMA/LTE Antenna – PCB Line Guidelines ..................... 63

7.3. GSM/WCDMA/TD-SCDMA/LTE Antenna – Installation Guidelines ................. 65

7.4. Secondary Antenna Requirements .................................................................. 65

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7.5. PCB Guidelines in case of FCC certification ..................................................... 65

7.5.1. Transmission line design....................................................................... 65

7.5.2. Transmission line measurements ......................................................... 66

Hardware Interfaces......................................................................................... 69

8.1. USB Port ........................................................................................................... 70

8.2. Serial Ports ....................................................................................................... 71

8.2.1. Modem Serial Port 1 ............................................................................. 72

8.2.2. Modem Serial Port 2 ............................................................................. 73

8.2.3. Modem Serial Port 3 ............................................................................. 73

8.2.4. RS232 Level Translation ........................................................................ 74

8.3. Peripheral Ports ............................................................................................... 76

8.3.1. SPI – Serial Peripheral Interface ........................................................... 76

8.3.2. I2C - Inter-integrated Circuit ................................................................ 77

8.4. Ethernet Interface ............................................................................................ 77

8.5. Audio Interface ................................................................................................ 78

8.5.1. Analog Audio ........................................................................................ 78

8.5.2. Digital Audio ......................................................................................... 79

8.6. General Purpose I/O ........................................................................................ 79

8.6.1. Using a GPIO Pad as Input .................................................................... 80

8.6.2. Using a GPIO Pad as Output ................................................................. 80

Miscellaneous Functions .................................................................................. 82

9.1. Indication of Network Service Availability ....................................................... 82

9.2. RTC – Real Time Clock ...................................................................................... 83

9.3. VAUX Power Output ........................................................................................ 83

9.4. ADC Converter ................................................................................................. 83

9.4.1. Description............................................................................................ 83

9.4.2. Using the ADC Converter ...................................................................... 83

9.5. Using the Temperature Monitor Function ...................................................... 84

9.6. Fuel Gauge (TBD) ............................................................................................. 84

9.7. eFuse ................................................................................................................ 84

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10. Mounting the Module on your Board ............................................................... 85

10.1. General ............................................................................................................. 85

10.2. Finishing & Dimensions .................................................................................... 85

10.3. Recommended Footprint for the Application ................................................. 86

10.4. Stencil ............................................................................................................... 87

10.5. PCB Pad Design ................................................................................................ 87

10.6. Recommendations for PCB Pad Dimensions (mm) .......................................... 88

10.7. Solder Paste ..................................................................................................... 89

10.7.1. Solder Reflow ........................................................................................ 89

11. Application Guide ............................................................................................ 91

11.1. Debug of the LE940B6 Module in Production ................................................. 91

11.2. Bypass Capacitor on Power Supplies ............................................................... 92

11.3. SIM Interface .................................................................................................... 93

11.3.1. SIM Schematic Example ........................................................................ 93

11.4. EMC Recommendations ................................................................................... 94

11.5. Download and Debug Port ............................................................................... 94

11.6. Antenna Detection ........................................................................................... 95

12. Packing System ................................................................................................ 96

12.1. Tray Drawing .................................................................................................... 98

12.2. Moisture Sensitivity ......................................................................................... 98

13. Conformity Assessment Issues ......................................................................... 99

13.1. FCC/IC Regulatory Notices ............................................................................... 99

14. Safety Recommendations ................................................................................ 101

15. Document History ........................................................................................... 102

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List of Tables

Table 1: Applicability Table ................................................................................................................. 2

Table 2: Related Documents ............................................................................................................ 14

Table 3: Document Structure ........................................................................................................... 15

Table 4: RF Bands per Regional Variant ............................................................................................ 20

Table 5: RF Bands Characteristics ..................................................................................................... 21

Table 6: LE940B6 Pin-out .................................................................................................................. 26

Table 7: Mandatory Signals .............................................................................................................. 36

Table 8: Absolute Maximum Ratings – Not Operational .................................................................. 39

Table 9: Recommended Operating Conditions ................................................................................ 39

Table 10: Absolute Maximum Ratings – Not Functional .................................................................. 40

Table 11: Operating Range – Interface Levels (1.8V CMOS) ............................................................ 40

Table 12: Operating Range – 1.8V I2C Pads ..................................................................................... 41

Table 13: Operating Range – 1.2V EMIC Pads .................................................................................. 41

Table 14: Operating Range – 1.8V SIM Pads .................................................................................... 42

Table 15: Operating Range – 2.9V SIM Pads .................................................................................... 42

Table 16: Operating Range – USB_D+, USB_D- Pads ........................................................................ 42

Table 17: Absolute Maximum Ratings – 3.3V EMAC Interface......................................................... 43

Table 18: Operating Range – 2.5V EMAC Interface .......................................................................... 43

Table 19: Operating Range – 3.3V EMAC Interface .......................................................................... 43

Table 20: Power Supply Requirements ............................................................................................ 54

Table 21: LE940B6 Current Consumption ........................................................................................ 54

Table 22: Primary Antenna Requirements ...................................................................................... 63

Table 23: Antenna Line on PCB Requirements ................................................................................. 64

Table 24: LE940B6 Hardware Interfaces .......................................................................................... 69

Table 25: USB Interface Signals ........................................................................................................ 70

Table 26: Modem Serial Port 1 Signals ............................................................................................. 72

Table 27: Modem Serial Port 2 Signals ............................................................................................. 73

Table 28: Modem Serial Port 3 Signals ............................................................................................. 73

Table 29: SPI Signals ......................................................................................................................... 76

Table 30: Ethernet Interface ............................................................................................................. 77

Table 31: Analog Audio Signals ......................................................................................................... 78

Table 32: Digital Audio Interface (DVI) Signals ................................................................................. 79

Table 33: GPIOs ................................................................................................................................ 79

Table 34: Network Service Availability Indication ............................................................................ 82

Table 35: Operating Range – VAUX Power Supply ........................................................................... 83

Table 36: ADC Parameters ................................................................................................................ 83

Table 37: Recommendations for PCB Pad Surfaces ......................................................................... 88

Table 38: Solder Profile Characteristics ............................................................................................ 90

Table 39: SIM Interface – C1 Range .................................................................................................. 93

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Table 40: EMC Recommendations ................................................................................................... 94

Table 41: Tray Packing ...................................................................................................................... 96

Table 42: Packing Quantities ............................................................................................................ 96

Table 43: Document Revision History ............................................................................................ 102

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List of Figures

Figure 1: LE940B6 High-level Functionality ...................................................................................... 18

Figure 2: LGA Pads Layout LE940B6 334 Pads Top View .................................................................. 38

Figure 3: Power-on Circuit ................................................................................................................ 44

Figure 4: LE940B6 Initialization and Activation ................................................................................ 45

Figure 5: Power-up Flow Chart ......................................................................................................... 46

Figure 6: AT Command Managing Flow Chart .................................................................................. 47

Figure 7: Shutdown by Software Command ..................................................................................... 49

Figure 8: Hardware Shutdown .......................................................................................................... 50

Figure 9: Circuit for Unconditional Hardware Reset ........................................................................ 51

Figure 10: Circuit for Unconditional Hardware Shutdown ............................................................... 52

Figure 11: Turn Off Procedure .......................................................................................................... 53

Figure 12: Example of Linear Regulator with 5V Input ..................................................................... 58

Figure 13: Example of Switching Regulator with 12V Input – Part 1 ................................................ 59

Figure 14: Example of Switching Regulator with 12V Input – Part 2 ................................................ 59

Figure 15: ESD Protection for USB2.0 ............................................................................................... 71

Figure 16: RS232 Level Adaption Circuitry Example ......................................................................... 75

Figure 17: RS232 Serial Port Lines Connection Layout ..................................................................... 75

Figure 18: SPI Signal Connectivity ..................................................................................................... 76

Figure 19: GPIO Output Pad Equivalent Circuit ................................................................................ 81

Figure 20: Status LED circuit example .............................................................................................. 82

Figure 21: Fuel Gauge Connectivity Example ................................................................................... 84

Figure 22: Application Module Top View ......................................................................................... 86

Figure 23: PCB Pad Design ................................................................................................................ 87

Figure 24: PCB Pad Dimensions ........................................................................................................ 88

Figure 25: Inhibit Area for Micro-via ................................................................................................ 88

Figure 26: Solder Reflow Profile ....................................................................................................... 89

Figure 27: SIM Schematics ................................................................................................................ 93

Figure 28: Tray Packing ..................................................................................................................... 97

Figure 29: Tray Drawing .................................................................................................................... 98

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1. Introduction

1.1. Scope

This document introduces the Telit LE940B6 module and presents possible and recommended hardware solutions for developing a product based on the LE940B6 module. All the features and solutions detailed in this document are applicable to all LE940B6 variants, where “LE940B6” refers to the variants listed in the applicability table.

If a specific feature is applicable to a specific product only, it will be clearly marked.

NOTE:

LE940B6 refers to all modules listed in the Applicability Table.

This document takes into account all the basic functions of a wireless module; suggests a valid hardware solution for each function, and points out incorrect solutions and common errors to be avoided.

Obviously, this document cannot embrace every hardware solution or every product that can be designed. Obviously, avoiding invalid solutions must be considered mandatory. Where the suggested hardware configurations need not be considered mandatory, the information given should be used as a guide and a starting point for properly developing your product with the Telit LE940B6 module.

NOTE:

The integration of the GSM/GPRS/EGPRS/WCDMA/HSPA+/LTE LE940B6 cellular module within a user application must be done according to the design rules described in this manual.

1.2. Audience

This document is intended for Telit customers, especially system integrators, about to implement their applications using the Telit LE940B6 module.

1.3. Contact Information, Support

For general contact, technical support, to report documentation errors and to order manuals, contact Telit’s Technical Support Center (TTSC) at:

• TS-EMEA@telit.com

• TS-NORTHAMERICA@telit.com

• TS-LATINAMERICA@telit.com

• TS-APAC@telit.com

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Alternatively, use:

http://www.telit.com/en/products/technical-support-center/contact.php

For detailed information about where you can buy the Telit modules or for recommendations on accessories and components, visit:

http://www.telit.com

To register for product news and announcements or for product questions contact Telit’s Technical Support Center (TTSC).

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements.

Telit appreciates feedback from the users about the information provided.

1.4. Text Conventions

The following conventions are used to emphasize specific types of information:

Danger:

This information MUST be followed or catastrophic equipment failure or bodily injury may occur.

Caution or Warning:

Alerts the user to important points about integrating the module. If these points are not followed, the module and end user equipment may fail or malfunction.

NOTE:

Tip or Information – Provides advice and suggestions that may be useful when integrating the module.

All dates are in ISO 8601 format, that is, YYYY-MM-DD.

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1.5. Related Documents

Table 2: Related Documents

Document Title Document Number

Ref 1: LE940B6 AT Command Reference Guide 80514ST10767A

Ref 2: LE940B6 SW User Guide 1VV0301296

Ref 3: Telit EVK2 User Guide 1vv0300704

Ref 4: SIM Integration Design Guide 80000NT10001A

1.6. Abbreviations

Table 3: Table of Abbreviations

Term Definition

ADC Analog-to-digital converter

AE Application-enabled

DAC Digital-to-analog converter

FDD Frequency division duplex

GLONASS Global orbiting navigation satellite system

GNSS Global navigation satellite system

GPIO General-purpose input/output

GPRS General packet radio services

GPS Global positioning system

GSM Global system for mobile communications

I2C Inter-integrated circuit

LTE Long term evolution

SD Secure digital

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Term Definition

RGMII Reduced Gigabit media-independent interface

SIM Subscriber identity module

SOC System-on-Chip

SMX SmartMX

SPI Serial peripheral interface

UART Universal asynchronous receiver transmitter

UMTS Universal mobile telecommunications system

USB Universal serial bus

WCI Wireless Coexistence Interface

WCDMA Wideband code division multiple access

1.7. Document Organization

This document contains the following chapters:

Table 3: Document Structure

Chapter#

1 Introduction Provides the scope of this document, target

2 General Product Description An overview of the product features

3 LE940B6 Module

Connections

Chapter Title Description

audience, contact and support information, and text conventions

Pinout configuration and layout

4 Electrical Specifications Specifies electrical values of logic levels for this

module

5 Hardware Commands Instructs how to control the module via hardware

6 Power Supply Supply lines and current consumption

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Chapter#

Chapter Title Description

7 Antenna(s) Describes the antenna connections and related

aspects of board layout design, which are most critical for the overall product design

8 Hardware Interfaces Specifies the peripheral and audio interfaces

9 Miscellaneous Functions

10 Mounting the Module on

your Board

11 Application Guide

12 Packing System

13 Conformity Assessment

Issues

14 Safety Recommendations

15 Document History

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2. General Product Description

2.1. Overview

LE940B6 is Telit’s platform for automotive telematics on-board units (OBU's) for applications, such as automotive telematics and eCall, based on the following technologies:

• 4G cellular for voice and data communication

• GNSS (optional) - GPS, GLONASS, BeiDou, Galileo, QZSS, for positioning service

• Embedded security

• Designed for automotive markets

In its most basic use case, LE940B6 can be applied as a wireless communication front-end for telematics products, offering GNSS and mobile communication features to an external host CPU through its rich interfaces.

quality needs

LE940B6 can further support customer software applications and security features. LE940B6 is based on a Yocto Linux system running on an application processor. Thanks to a dedicated application processor and embedded security resources, product developers and manufacturers can create products that guarantee fraud prevention and tamper evidence without extra effort for additional security precautions.

LE940B6 can be self-sufficient and serve as a fully integrated solution for applications, such as location-based cellular telematics, navigation, road pricing and eCall. In such a case, the customer would simply complement the module with a power supply, speaker amplifier, microphone, antennas, and an HMI (if applicable).

LE940B6 is offered with different regional variants according to the list in Table 1: Applicability Table.

2.2. Applications

LE940B6 can be used for telematics applications where tamper-resistance, confidentiality, integrity, and authenticity of end-user information are required, for example:

• Emergency call

• Telematics services

• Road pricing

• Pay-as-you-drive insurance

• Stolen vehicles tracking

• Internet connectivity

In accordance with Telit’s Robustness Validation, using AEC-Q100-defined qualification tests

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2.3. General Functionality and Main Features

The LE940B6 family of automotive cellular modules features an LTE and multi-RAT modem together with a powerful on-chip application processor and a rich set of interfaces.

The major functions and features are listed below:

• Multi-RAT with LTE carrier aggregation (Rel. 10, Cat. 6)

• Flash + DDR large enough to allow the space for customer’s own software applications

• Advanced security features

• FOTA (optional)

• Several region variants with optimal choice of RF bands in each for worldwide coverage of

countries and MNOs

• Well-designed form factor (40x40mm), accommodating the multiple RF bands in each region

variant

• Digital audio and analog audio codec

• A GNSS function is not included within the module, but can be supported with the proper

interface while mounted on the customer board

• The entire module is designed by Telit for satisfying the environment and quality

requirements of the automotive market

Figure 1 shows the high-level functionality of the LE940B6 module.

Figure 1: LE940B6 High-level Functionality

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2.4. Environmental Requirements

2.4.1. Temperature Range

Operating temperature range

Storage and nonoperating temperature range

-20 ~ +55°C.

This range is defined by 3GPP (the global standard for wireless mobile communication). Telit guarantees its modules to comply with all the 3GPP requirements and to have full functionality of the module with in this range.

-40 ~ +85°C.

Telit guarantees full functionality within this range as well. However, there may possibly be some performance deviations in this extended range relative to 3GPP requirements, which means that some RF parameters may deviate from the 3GPP specification in the order of a few dB. For example: receiver sensitivity or maximum output power may be slightly degraded.

Even so, all the functionalities, such as call connection, SMS, USB communication, UART activation etc., will be maintained, and the effect of such degradations will not lead to malfunction.

–40°C ~ +95°C.

eCall must be functional (until the module is broken)

–40°C ~ +95°C

2.4.2. RoHS Compliance

As a part of the Telit corporate policy of environmental protection, the LE940B6 complies with the RoHS (Restriction of Hazardous Substances) directive of the European Union (EU directive 2011/65/EU).

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2.5. Operating Frequency Bands

The operating frequencies in WCDMA and LTE modes conform to the 3GPP specifications.

2.5.1. RF Bands per Regional Variant

Table 4 summarizes all region variants within the LE940B6 family, showing the supported band sets in each variant and the supported band pairs for 2x carrier aggregation.

Table 4: RF Bands per Regional Variant

Region

LTE FDD LTE TDD HSPA+ TD-

Variant

LE940B6-NA

LE940B6-NV

LE940B6-RW

LE940B6-CN

2, 4, 5, 7, 12, 29(DL) - 2, 4, 5

LTE Carrier Aggregation 2+5, 2+12, 2+29, 4+4, 4+5, 4+12, 4+29

2, 4, 5, 7, 12, 13, 29(DL) - 2, 4, 5 - 2, 5

LTE Carrier Aggregation 2+5, 2+12, 2+13, 2+29, 4+4, 4+5, 4+12, 4+13, 4+29,

1, 2, 3, 4, 5, 7, 8, 19, 20, 21, 26, 28, 32(DL)

LTE Carrier Aggregation 1+5, 1+8, 1+19, 1+21, 1+26, 3+3, 3+5, 3+7, 3+19, 3+20,

1, 3, 5, 8, 26 38, 39, 40, 41M 1, 3, 5, 8 34, 39 3, 8

LTE Carrier Aggregation 1+26, 3+3, 3+5, 3+26, 39+41, 40+40, 41+41

Band 41M for China: 2,555 - 2,655 MHz

SCDMA

- 1, 2, 3, 4, 5, 8, 19 - 2, 3, 5, 8

3+26, 3+28, 4+4, 7+20, 7+28, 19+21, 20+32

- 2, 5

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2.5.2. Reference Table of RF Bands Characteristics

Table 5: RF Bands Characteristics

Mode Freq. Tx (MHz) Freq. Rx (MHz)

PCS 1900 1850.2 ~ 1909.8 1930.2 ~ 1989.8 512 ~ 810 80 MHz

DCS 1800 1710.2 ~ 1784.8 1805.2 ~ 1879.8 512 ~ 885 95 MHz

GSM 850 824.2 ~ 848.8 869.2 ~ 893.8 128 ~ 251 45 MHz

EGSM 900 880.2 ~ 914.8 925.2 ~ 959.8 975 ~ 1023, 1 ~ 124 45 MHz

WCDMA 2100 – B1 1920 ~ 1980 2110 ~ 2170 Tx: 9612 ~ 9888

WCDMA 1900 – B2 1850 ~ 1910 1930 ~ 1990 Tx: 9262 ~ 9538

WCDMA 1800 – B3 1710 ~ 1785 1805 ~ 1880 Tx: 937 ~ 1288

WCDMA AWS – B4 1710 ~ 1755 2110 ~ 2155 Tx: 1312 ~ 1513

Channels Tx-Rx Offset

190 MHz

Rx: 10562 ~ 10838

80 MHz

Rx: 9662 ~ 9938

95 MHz

Rx: 1162 ~ 1513

400 MHz

Rx: 1537 ~ 1738

WCDMA 850 – B5 824 ~ 849 869 ~ 894 Tx: 4132 ~ 4233

Rx: 4357 ~ 4458

WCDMA 900 – B8 880 ~ 915 925 ~ 960 Tx: 2712 ~ 2863

Rx: 2937 ~ 3088

WCDMA 1800 –B9 1750 ~ 1784.8 1845 ~ 1879.8 Tx: 8762 ~ 8912

Rx: 9237 ~ 9387

WCDMA 800 – B19 830 ~ 845 875 ~ 890 Tx: 312 ~ 363

Rx: 712 ~ 763

TDSCDMA 2000 – B34

2010 ~ 2025 2010 ~ 2025 Tx: 10050 ~ 10125

Rx: 10050 ~ 10125

45 MHz

95 MHz

45 MHz

0 MHz

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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15

Mode Freq. Tx (MHz) Freq. Rx (MHz)

TDSCDMA 1900 – B39

1880 ~ 1920 1880 ~ 1920 Tx: 9400 ~ 9600

Channels Tx-Rx Offset

Rx: 9400 ~ 9600

LTE 2100 – B1 1920 ~ 1980 2110 ~ 2170 Tx: 18000 ~ 18599

Rx: 0 ~ 599

LTE 1900 – B2 1850 ~ 1910 1930 ~ 1990 Tx: 18600 ~ 19199

Rx: 600 ~ 1199

LTE 1800 – B3 1710 ~ 1785 1805 ~ 1880 Tx: 19200 ~ 19949

Rx: 1200 ~ 1949

LTE AWS – B4 1710 ~ 1755 2110 ~ 2155 Tx: 19950 ~ 20399

Rx: 1950 ~ 2399

LTE 850 – B5 824 ~ 849 869 ~ 894 Tx: 20400 ~ 20649

Rx: 2400 ~ 2649

0 MHz

190 MHz

80 MHz

95 MHz

400 MHz

45 MHz

LTE 2600 – B7 2500 ~ 2570 2620 ~ 2690 Tx: 20750 ~ 21449

Rx: 2750 ~ 3449

LTE 900 – B8 880 ~ 915 925 ~ 960 Tx: 21450 ~ 21799

Rx: 3450 ~ 3799

LTE 1800 – B9 1749.9 ~ 1784.9 1844.9 ~ 1879.9 Tx: 21800 ~ 2149

Rx: 3800 ~ 4149

LTE AWS+ – B10 1710 ~ 1770 2110 ~ 2170 Tx: 22150 ~ 22749

Rx: 4150 ~ 4749

LTE 700a – B12 699 ~ 716 729 ~ 746 Tx : 23010 ~ 23179

Rx : 5010 ~ 5179

LTE 700c – B13 777 ~ 787 746 ~ 756 Tx : 23180 ~ 23279

Rx : 5180 ~ 5279

LTE 700b – B17 704 ~ 716 734 ~ 746 Tx: 23730 ~ 23849

120 MHz

45 MHz

95 MHz

400 MHz

30 MHz

-31 MHz

30 MHz

Rx: 5730 ~ 5849

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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15

Mode Freq. Tx (MHz) Freq. Rx (MHz)

LTE 800 – B19 830 ~ 845 875 ~ 890 Tx: 24000 ~ 24149

Channels Tx-Rx Offset

45 MHz

Rx: 6000 ~ 6149

LTE 800 – B20 832 ~ 862 791 ~ 821 Tx: 24150 ~ 24449

-41 MHz

Rx: 6150 ~ 6449

LTE 1500 – B21 1447.9 ~ 1462.9 1495.9 ~ 1510.9 Tx: 24450 ~ 24599

48 MHz

Rx: 6450 ~ 6599

LTE 850+ – B26 814 ~ 849 859 ~ 894 Tx: 26690 ~ 27039

45 MHz

Rx: 8690 ~ 9039

LTE 700 – B28 703 ~ 748 758 ~ 803 Tx : 27210 ~ 27659

45 MHz

Rx : 9210 ~ 9659

LTE 700d – B29 Downlink only 717 ~ 728 Rx: 9660 ~ 9769 0 MHz

LTE 1500 – B32 Downlink only 1452 ~ 1496 Rx: 9920 ~ 10359 0 MHz

LTE TDD 2600 – B38 2570 ~ 2620 2570 ~ 2620 Tx: 37750 ~ 38249

Rx: 37750 ~ 38249

LTE TDD 1900 – B39 1880 ~ 1920 1880 ~ 1920 Tx: 38250 ~ 38649

Rx: 38250 ~ 38649

LTE TDD 2300 – B40 2300 ~ 2400 2300 ~ 2400 Tx: 38650 ~ 39649

Rx: 38650 ~ 39649

LTE TDD 2500 – B41 2496 ~ 2690 2496 ~ 2690 Tx: 39650 ~ 41589

Rx: 39650 ~ 41589

0 MHz

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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15

2.6. Sensitivity

LE940B6 maximum sensitivity levels are as follows (exact performance figures will be specified at a later stage):

• < 3GPP @ 2G

• < 3GPP @ 3G

• < 3GPP @ 4G FDD (BW=5 MHz)

• < 3GPP @ 4G TDD (BW=5 MHz)

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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15

2.7. LE940B6 Mechanical Specifications

2.7.1. Dimensions

The LE940B6 module’s overall dimensions are:

• Length: 40 mm, +/- 0.20 mm tolerance

• Width: 40 mm, +/- 0.20 mm tolerance

• Thickness: 3.0 mm, +/- 0.15 mm tolerance (with label)

2.7.2. Weight

The nominal weight of the LE940B6 module is 11 gram.

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Power sense for the internal USB

Input for Request To Send signal

Output for Clear To Send signal

Output for Data Set Ready signal

Input for Data Terminal Ready

Output for

Data Carrier Detect

Output for Ring Indicator signal (RI)

Input for Request To Send (RTS)

Output for Clear To Send (CTS) to

LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15

3. LE940B6 Module Connections

3.1. Pin-out

Table 6: LE940B6 Pin-out

PAD Signal I/O

USB HS 2.0 Communication Port

A18 USB_VBUS AI

D19 USB_D+ I/O USB differential Data (+) F19 USB_D- I/O USB differential Data (-)

AH19 C103/TXD I Serial data input (TXD) from DTE 1.8V AF19 C104/RXD O Serial data output (RXD) to DTE 1.8V

AA18 C105/RTS I

AK19 C106/CTS O

AG18 C107/DSR O

AC18 C108/DTR I

AE18 C109/DCD O

AJ18 C125/RING O

AB19 TXD_AUX O Auxiliary UART (Tx Data to DTE) 1.8V AD19 RXD_AUX I Auxiliary UART (Rx Data from DTE) 1.8V

AM9 UART3_TXD I Serial data input (TXD) from DTE 1.8V AM11 UART3_RXD O Serial data output (RXD) to DTE 1.8V

transceiver

Asynchronous UART

(RTS) from DTE

(CTS) to DTE

(DSR) to DTE

signal (DTR) from DTE

signal (DCD) to DTE

to DTE

Asynchronous Auxiliary UART

Asynchronous UART3

Function Type COMMENT

1.8V

AM13 UART3_RTS I

AM15 UART3_CTS O

E4 JTAG_TDI I JTAG_TDI 1.8V F3 JTAG_RESOUT_N O JTAG_RESOUT* 1.8V F5 JTAG_TRIGOUT - JTAG_TRIGOUT 1.8V G2 JTAG_RTCK O JTAG_RTCK 1.8V

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from DTE

DTE

JTAG – Joint Test Action Group

1.8V

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External SIM signal

– Power supply

External SIM signal

– Power supply

External SIM signal

– Presence

Digital Voice interface (CLK master

Digital Voice interface (WA0 master

LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15

H3 JTAG_TCK I JTAG_TCK 1.8V J2 JTAG_TRST_N I JTAG_TRST* 1.8V K3 JTAG_TDO O JTAG_TDO 1.8V L2 JTAG_TMS I JTAG_TMS 1.8V M3 JTAG_TRIGIN - JTAG_TRIGIN 1.8V

JTAG - MiPi 34 Interface

L4 JTAG_PTI_CLK O MiPi Clock 1.8V N4 JTAG_PTI_DATA0 I/O MiPi Data 0 1.8V R4 JTAG_PTI_DATA1 I/O MiPi Data 1 1.8V T4 JTAG_PTI_DATA2 I/O MiPi Data 2 1.8V V4 JTAG_PTI_DATA3 I/O MiPi Data 3 1.8V

SIM Card Interface

A8 SIMVCC1 -

for the SIM

A10 SIMCLK1 O External SIM signal – Clock 1.8/2.9V

1.8/2.9V

B7 SIMIN1 I External SIM signal – Presence 1.8V Active Low B9 SIMIO1 I/O External SIM signal – Data I/O 1.8/2.9V B11 SIMRST1 O External SIM signal – Reset 1.8/2.9V

SIM Card Interface 2

D15 SIMVCC2 -

for the SIM

C16 SIMCLK2 O External SIM signal – Clock 1.8/2.9V

C18 SIMIN2 I

(active low) E16 SIMIO2 I/O External SIM signal – Data I/O 1.8/2.9V D17 SIMRST2 O External SIM signal – Reset 1.8/2.9V

1.8/2.9V

1.8V Active Low

Analog Audio Interface

B5 EAR1_MT+ AO Earphone signal output, phase + A4 EAR1_MT- AO Earphone signal output, phase - B3 MIC1_MT+ AI Microphone input, phase + A2 MIC1_MT- AI Microphone input, phase - G6 MIC_BIAS AO Microphone Bias Power

Digital Voice Interface (DVI)

C8 DVI_RX I Digital Voice interface (Rx) 1.8V

C10 DVI_CLK O

D9 DVI_TX O Digital Voice interface (Tx) 1.8V

D11 DVI_WA0 O

K19 SPI_MOSI O SPI data Master output Slave input 1.8V M19 SPI_MISO I SPI data Master input Slave output 1.8V

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output)

SPI – Serial Peripheral Interface

1.8V

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RGMII Transmit Enable / Error or

LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15

N18 SPI_CS O SPI Chip select output 1.8V P19 SPI_CLK O SPI Clock output 1.8V

I2C Interface

C14 I2C_SCL I/O I2C Clock 1.8V D13 I2C_SDA I/O I2C Data 1.8V

Digital I/O

F9 GPIO_01 I/O GPIO_01 1.8V E10 GPIO_02 I/O GPIO_02 1.8V F11 GPIO_03 I/O GPIO_03 1.8V E12 GPIO_04 I/O GPIO_04 1.8V F13 GPIO_05 I/O GPIO_05 1.8V E14 GPIO_06 I/O GPIO_06 1.8V R18 GPIO_07 I/O GPIO_07 1.8V S19 GPIO_08 I/O GPIO_08 1.8V U19 GPIO_09 I/O GPIO_09 1.8V W19 GPIO_10 I/O GPIO_10 1.8V L18 GPIO_11 I/O GPIO_11 1.8V J18 GPIO_12 I/O GPIO_12 1.8V AN4 GPIO_20 I/O GPIO_20 1.8V H1 GPIO_21 I/O GPIO_21 1.8V K1 GPIO_22 I/O GPIO_22 1.8V

Analog to Digital Converter

D5 ADC_IN1 AI Analog to Digital Converter Input 1 Analog E6 ADC_IN2 AI Analog to Digital Converter Input 2 Analog F7 ADC_IN3 AI Analog to Digital Converter Input 3 Analog

Ethernet MAC/PHY Signals

G14 MAC_MDC O Management Data Clock 2.5/3.3V G12 MAC_MDIO I/O Management Data I/O 2.5/3.3V V16 MAC_TXD[0] O RGMII or RMII TXD[0] 2.5/3.3V T16 MAC_TXD[1] O RGMII or RMII TXD[1] 2.5/3.3V R16 MAC_TXD[2] O RGMII TXD[2] 2.5/3.3V N16 MAC_TXD[3] O RGMII TXD[3] 2.5/3.3V L16 MAC_GTX_CLK O RGMII Transmit Clock 2.5/3.3V

G16 MAC_TXEN_ER O

AL16 MAC_RXD[0] I RGMII or RMII RXD[0] 2.5/3.3V AJ16 MAC_RXD[1] I RGMII or RMII RXD[1] 2.5/3.3V AG16 MAC_RXD[2] I RGMII RXD[2] 2.5/3.3V AE16 MAC_RXD[3] I RGMII RXD[3] 2.5/3.3V AC16 MAC_RX_CLK I RGMII Receive Clock 2.5/3.3V

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RMII Transmit Enable

2.5/3.3V

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RGMII Receive Data Available/Error

Indicates that the boot sequence

Supply output for external

Main Power Supply (RF Transmit

in Power Supply (RF Transmit

Main Power Supply (RF Transmit

LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15

X16 MAC_RXDV_ER I

or RMII Receive Error G10 ETH_INT_N I Ethernet PHY Interrupt 2.5/3.3V G8 ETH_RST_N O Ethernet PHY Reset Output 2.5/3.3V

2.5/3.3V

RF Section

AD1 ANT_1 I/O Primary Antenna 1 RF AU9 ANT_DIV_1 I Diversity Antenna 1 RF S1 ANT_GPS I GPS Antenna RF

Miscellaneous Functions

F17 VRTC AI VRTC Backup capacitor - K17 VIO_1.8V O VIO_1.8V for reference voltage 1.8V AN8 RESET_N I Reset Input Active low

AN10 SW_RDY O

completed successfully

1.8V

AN12 SHDN_N I Unconditional Shutdown Input Active low AS1 ON_OFF_N I Power ON/OFF Input Active low AU3 STAT_LED O Status Indicator LED 1.8V

P17 VAUX/PWRMON O

accessories / Power ON Monitor

1.8V

H17 VPP I Vpp for eFuse

Power Supply

AP17 VBATT - Main Power Supply (Digital Section) Power AP19 VBATT - Main Power Supply (Digital Section) Power AR18 VBATT - Main Power Supply (Digital Section) Power AR20 VBATT - Main Power Supply (Digital Section) Power

AS17 VBATT_PA -

AS19 VBATT_PA -

AT18 VBATT_PA -

AU17 VBATT_PA -

AU19 VBATT_PA -

AT20 VBATT_PA -

Power Section)

Power

Ground

A6 GND - Ground Ground A12 GND - Ground Ground B13 GND - Ground Ground B15 GND - Ground Ground

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LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15

B17 GND - Ground Ground C4 GND - Ground Ground C6 GND - Ground Ground D3 GND - Ground Ground D7 GND - Ground Ground E18 GND - Ground Ground F1 GND - Ground Ground G18 GND - Ground Ground H19 GND - Ground Ground M1 GND - Ground Ground N2 GND - Ground Ground P1 GND - Ground Ground P3 GND - Ground Ground R2 GND - Ground Ground T2 GND - Ground Ground T18 GND - Ground Ground U1 GND - Ground Ground V18 GND - Ground Ground W1 GND - Ground Ground X2 GND - Ground Ground X18 GND - Ground Ground Y1 GND - Ground Ground Y19 GND - Ground Ground AA2 GND - Ground Ground AB1 GND - Ground Ground AC2 GND - Ground Ground AE2 GND - Ground Ground AF1 GND - Ground Ground AG2 GND - Ground Ground AH1 GND - Ground Ground AJ2 GND - Ground Ground AK1 GND - Ground Ground AK17 GND - Ground Ground AL18 GND - Ground Ground AM17 GND - Ground Ground AM19 GND - Ground Ground AN16 GND - Ground Ground AN18 GND - Ground Ground AP3 GND - Ground Ground AP5 GND - Ground Ground

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Frequently Asked Questions

User Manual