Telit Communications S p A LE910NAV2 User Guide

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1VV0301200 Rev.10 2017-08-29

LE910 V2 HARDWARE USER GUIDE

LE910 V2 HARDWARE USER GUIDE 1VV0301200 Rev.10 • 2017-08-29 2 of 84

APPLICABILITY TABLE

PRODUCTS

LE910-NA V2

LE910-SV V2

LE910-EU V2

LE910-AU V2

LE910-SV1

LE910-NA1

LE910-EU1

LE910-SVL

LE910B1-EU

LE910-JN1

LE910B4-NA

LE910B1-NA

LE910B1-SA

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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE

LEGAL NOTICE

These Specifications are general guidelines pertaining to product selection and application and may not be appropriate for your particular project. Telit (which hereinafter shall include, its agents, licensors and affiliated companies) makes no representation as to the particular products identified in this document and makes no endorsement of any product. Telit disclaims any warranties, expressed or implied, relating to these specifications, including without limitation, warranties or merchantability, fitness for a particular purpose or satisfactory quality. Without limitation, Telit reserves the right to make changes to any products described herein and to remove any product, without notice. It is possible that this document may contain references to, or information about Telit products, services and programs, that are not available in your region. Such references or information must not be construed to mean that Telit intends to make available such products, services and programs in your area.

USE AND INTELLECTUAL PROPERTY RIGHTS

These Specifications (and the products and services contained herein) are proprietary to Telit and its licensors and constitute the intellectual property of Telit (and its licensors). All title and intellectual property rights in and to the Specifications (and the products and services contained herein) is owned exclusively by Telit and its licensors. Other than as expressly set forth herein, no license or other rights in or to the Specifications and intellectual property rights related thereto are granted to you. Nothing in these Specifications shall, or shall be deemed to, convey

license or any other right under Telit’s patents, copyright, mask work or other intellectual property rights or the rights

of others.

You may not, without the express written permission of Telit: (i) copy, reproduce, create derivative works of, reverse engineer, disassemble, decompile, distribute, merge or modify in any manner these Specifications or the products and components described herein; (ii) separate any component part of the products described herein, or separately use any component part thereof on any equipment, machinery, hardware or system; (iii) remove or destroy any proprietary marking or legends placed upon or contained within the products or their components or these Specifications; (iv) develop methods to enable unauthorized parties to use the products or their components; and (v) attempt to reconstruct or discover any source code, underlying ideas, algorithms, file formats or programming or interoperability interfaces of the products or their components by any means whatsoever. No part of these Specifications or any products or components described herein may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without the prior express written permission of Telit.

HIGH RISK MATERIALS

Components, units, or third-party products contained or used with the products described herein are NOT faulttolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following

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hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (“High Risk Activities"). Telit, its licensors and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High Risk Activities.

TRADEMARKS

You may not and may not allow others to use Telit or its third party licensors’ trademarks. To the extent that any portion of the products, components and any accompanying documents contain proprietary and confidential notices or legends, you will not remove such notices or legends.

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CONTENTS

1 Introduction 8

1.1 Scope 8

1.2 Audience 8

1.3 Contact Information, Support 8

1.4 List of acronyms 9

1.5 Text Conventions 11

1.6 Related Documents 11

2 Overview 12 3 Pins Allocation 13

3.1 Pin-out 13

3.2 LGA Pads Layout 19

4 Power Supply 20

4.1 Power Supply Requirements 20

4.2 Power Consumption 21

4.3 General Design Rules 23

4.3.1 Electrical Design Guidelines 23

4.3.1.1 +5V Source Power Supply Design Guidelines 23

4.3.1.3 Battery Source Power Supply Design Guidelines 25

4.3.1.4 Thermal Design Guidelines 26

4.3.1.5 Power Supply PCB layout Guidelines 27

4.4 RTC Bypass out 29

4.5 VAUX Power Output 29

5 Digital Section 30

5.1 Logic Levels 30

5.2 Power on 31

5.3 Power off 36

5.4 Unconditional Shutdown 38

5.5 Fast power down 41

5.5.1 Fast Shut Down by Hardware 41

5.5.2 Fast Shut Down by Software 42

5.6 Communication ports 43

5.6.1 USB 2.0 HS 43

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5.6.2 SPI 44

5.6.2.1 SPI Connections 44

5.6.3 Serial Ports 45

5.6.3.1 Modem serial port 1 (USIF0) 45

5.6.3.2 Modem serial port 2 (USIF1) 46

5.6.3.3 RS232 level translation 47

5.7 General Purpose I/O 48

5.7.1 Using a GPIO as INPUT 49

5.7.2 Using a GPIO as OUTPUT 49

5.7.3 Indication of network service availability 49

5.8 External SIM Holder 51

5.9 ADC Converter 51

6 RF Section 52

6.1 Bands Variants 52

6.2 TX Output Power 53

6.3 RX Sensitivity 54

6.4 Antenna Requirements 56

6.4.1 PCB design guidelines 59

6.4.2 PCB Guidelines in case of FCC Certification 60

6.4.2.1 Transmission line design 60

6.4.2.2 Transmission Line Measurements 61

6.4.2.3 Antenna Installation Guidelines 63

6.5 Second Antenna Requirements 64

6.5.1 Single Antenna Operation 66

7 Audio Section Overview 67

7.1 Electrical Characteristics 67

7.2 Codec examples 67

8 Mechanical Design 68

8.1 Drawing 68

9 Application PCB Design 69

9.1 Footprint 69

9.2 PCB pad design 69

9.3 PCB pad dimensions 70

9.4 Stencil 72

9.5 Solder paste 72

9.6 Solder reflow 72

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10 Packaging 74

10.1 Tray 74

10.2 Reel 76

10.2.1 Carrier Tape detail 76

10.2.2 Reel detail 77

10.2.3 Packaging detail 78

10.3 Moisture sensitivity 78

11 Conformity Assessment Issues 79

11.1 FCC/ISED Regulatory notices 79

12 Safety Recommendations 82

12.1 READ CAREFULLY 82

13 Document History 83

13.1 Revisions 83

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1 INTRODUCTION

1.1 Scope

Scope of this document is to give a description of some hardware solutions useful for developing a product with the Telit LE910 V2 module.

1.2 Audience

This document is intended for Telit customers, who are integrators, about to implement their applications using our LE910 V2 modules.

1.3 Contact Information, Support

For general contact, technical support services, technical questions and report documentation errors contact Telit Technical Support at:

TS-EMEA@telit.com TS-AMERICAS@telit.com TS-APAC@telit.com

Alternatively, use:

http://www.telit.com/support

For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:

http://www.telit.com

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements. Telit appreciates feedback from the users of our information.

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1.4 List of acronyms

Acronym

Description

LTE

Long Term Evolution

Radio Frequency

EMC

Electromagnetic Compatibility

FDD

Frequency Division Duplexing

Electromagnetic

EMI

Electromagnetic Interference

PCB

Printed Circuit Board

USB

Universal Serial Bus

High Speed

DTE

Data Terminal Equipment

UMTS

Universal Mobile Telecommunication System

WCDMA

Wideband Code Division Multiple Access

HSDPA

High Speed Downlink Packet Access

HSUPA

High Speed Uplink Packet Access

UART

Universal Asynchronous Receiver Transmitter

HSIC

High Speed Inter Chip

SIM

Subscriber Identification Module

SPI

Serial Peripheral Interface

ADC

Analog – Digital Converter

DAC

Digital – Analog Converter

I/O

Input Output

GPIO

General Purpose Input Output

CMOS

Complementary Metal – Oxide Semiconductor

MOSI

Master Output – Slave Input

MISO

Master Input – Slave Output

CLK

Clock

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Acronym

Description

DVI

Digital Voice Interface

MRDY

Master Ready

SRDY

Slave Ready

Chip Select

RTC

Real Time Clock

ESR

Equivalent Series Resistance

VSWR

Voltage Standing Wave Radio

VNA

Vector Network Analyzer

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1.5 Text Conventions

Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur.

Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction.

Tip or Information – Provides advice and suggestions that may be useful when integrating the module.

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

1.6 Related Documents

● Telit_xE910_Global_Form_Factor_Application_Note_r13

● Telit_Event_Monitor_Application_Note_r6

● Telit_SIM/USIM_Toolkit_Application_Note_r4

● Telit_Modem_Integration_Design_Guide_r0

● SIM Holder Design Guides, 80000NT10001a

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2 OVERVIEW

The aim of this document is the description of some hardware solutions useful for developing a product with the Telit LE910 V2 module. In this document all the basic functions of a mobile phone will be taken into account; for each one of them a proper hardware solution will be suggested and eventually the wrong solutions and common errors to be avoided will be evidenced. Obviously this document cannot embrace the whole hardware solutions and products that may be designed. The wrong solutions to be avoided shall be considered as mandatory, while the suggested hardware configurations shall not be considered mandatory, instead the information given shall be used as a guide and a starting point for properly developing your product with the Telit LE910 V2 module. For further hardware details that may not be explained in this document refer to the Telit LE910 V2 Product Description document where all the hardware information is reported.

NOTE: (EN) The integration of the LE910 V2 cellular module within user application shall be done according to the design rules described in this manual.

(IT) L’integrazione del modulo cellulare LE910 V2 all’interno dell’applicazione dell’utente dovrà rispettare le indicazioni progettuali descritte in questo manuale.

(DE) Die Integration des LE910 V2 Mobilfunk-Moduls in ein Gerät muß gemäß der in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen.

(SL) Integracija LE910 V2 modula v uporabniški aplikaciji bo morala upoštevati projektna navodila, opisana v tem priročniku.

(SP) La utilización del modulo LE910 V2 debe ser conforme a los usos para los cuales ha sido deseñado descritos en este manual del usuario.

(FR) L’intégration du module cellulaire LE910 V2 dans l’application de l’utilisateur sera faite selon les règles de conception décrites dans ce manuel.

(HE)

The information presented in this document is believed to be accurate and reliable. However, no responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent rights of Telit Communications S.p.A. other than for circuitry embodied in Telit products. This document is subject to change without notice.

LE910 V2

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3 PINS ALLOCATION

3.1 Pin-out

Signal

I/O

Function

Type

Comment

USB HS 2.0 COMMUNICATION PORT

B15

USB_D+

I/O

USB differential Data (+)

C15

USB_D-

I/O

USB differential Data (-)

A13

VUSB

Power sense for the

internal USB transceiver.

Asynchronous Serial Port (USIF0) - Prog. / Data + HW Flow Control

N15

C103/TXD

Serial data input from

DTE

CMOS 1.8V

M15

C104/RXD

Serial data output to DTE

CMOS 1.8V

M14

C108/DTR

Input for (DTR) from DTE

CMOS 1.8V

L14

C105/RTS

Input for Request to send

signal (RTS) from DTE

CMOS 1.8V

P15

C106/CTS

Output for Clear to Send

signal (CTS) to DTE

CMOS 1.8V

N14

C109/DCD

Output for (DCD) to DTE

CMOS 1.8V

P14

C107/DSR

Output for (DSR) to DTE

CMOS 1.8V

R14

C125/RING

Output for Ring (RI) to

DTE

CMOS 1.8V

Asynchronous Auxiliary Serial Port (USIF1)

D15

TX_AUX

Auxiliary UART (TX Data

to DTE)

CMOS 1.8V

E15

RX_AUX

Auxiliary UART (RX Data

from DTE)

CMOS 1.8V

SIM card interface

SIMCLK

External SIM signal –

Clock

1.8 / 3V

SIMRST

External SIM signal –

Reset

1.8 / 3V

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SIMIO

I/O

External SIM signal –

Data I/O

1.8 / 3V

SIMIN

External SIM signal – Presence (active low)

CMOS 1.8

Internal pullup

47K

SIMVCC

External SIM signal –

Power supply for the SIM

1.8 / 3V

Digital Voice Interface (DVI)

DVI_WA0

I/O

Digital Audio Interface

(WA0)

1.8V

DVI_RX

Digital Audio Interface

(RX)

1.8V

DVI_TX

I/O

Digital Audio Interface

(TX)

1.8V

DVI_CLK

I/O

Digital Audio Interface

(CLK)

1.8V

SPI

D15

SPI_MOSI

SPI MOSI

CMOS 1.8V

E15

SPI_MISO

CMOS 1.8V

F15

SPI_CLK

SPI Clock

CMOS 1.8V

DIGITAL IO

GPIO_01

I/O

GPIO_01 /STAT LED

CMOS 1.8V

STAT LED is

alternate function

GPIO_02

I/O

GPIO_02

CMOS 1.8V

C10

GPIO_03

I/O

GPIO_03

CMOS 1.8V

C11

GPIO_04

I/O

GPIO_04

CMOS 1.8V

B14

GPIO_05

I/O

GPIO_05

CMOS 1.8V

C12

GPIO_06

I/O

GPIO_06

CMOS 1.8V

C13

GPIO_07

I/O

GPIO_07

CMOS 1.8V

K15

GPIO_08

I/O

GPIO_08

CMOS 1.8V

L15

GPIO_09

I/O

GPIO_09

CMOS 1.8V

G15

GPIO_10

I/O

GPIO_10

CMOS 1.8V

ADC

ADC_IN1

Analog / Digital converter

input

A/D

Accepted values 0

to 1.2V DC

RF SECTION

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ANTENNA

I/O

GSM/EDGE/UMTS

Antenna

(50 ohm)

ANT_DIV

Antenna Diversity Input

(50 ohm)

Miscellaneous Functions

R13

HW_SHUTDOWN*

HW Unconditional

Shutdown

1.8V

Active low

R12

ON_OFF*

Input command for power

1.8V

Active low

C14

VRTC

VRTC Backup capacitor

Power

backup for the

embedded RTC

supply (1.8V)

R11

VAUX/PWRMON

Supply Output for

external accessories /

Power ON Monitor

1.8V

Power Supply

VBATT

Main power supply

(Baseband)

Power

VBATT

Main power supply

(Baseband)

Power

VBATT_PA

Main power supply

(Radio PA)

Power

VBATT_PA

Main power supply

(Radio PA)

Power

VBATT_PA

Main power supply

(Radio PA)

Power

VBATT_PA

Main power supply

(Radio PA)

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

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GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

GND

Ground

Power

P10

GND

Ground

Power

R10

GND

Ground

Power

M12

GND

Ground

Power

B13

GND

Ground

Power

P13

GND

Ground

Power

E14

GND

Ground

Power

RESERVED

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RESERVED

A10

RESERVED

N10

RESERVED

N11

RESERVED

P11

RESERVED

B12

RESERVED

D12

RESERVED

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WARNING: Reserved pins must not be connected.

N12

RESERVED

P12

RESERVED

F14

RESERVED

G14

RESERVED

H14

RESERVED

J14

RESERVED

K14

RESERVED

N13

RESERVED

L13

RESERVED

J13

RESERVED

M13

RESERVED

K13

RESERVED

H13

RESERVED

G13

RESERVED

F13

RESERVED

B11

RESERVED

B10

RESERVED

E13

RESERVED

D13

RESERVED

D14

RESERVED

A14

RESERVED

A12

RESERVED

A11

RESERVED

H15

RESERVED

J15

RESERVED

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3.2 LGA Pads Layout

TOP VIEW

A B C D E F

G H J K L M N P R

1 ADC_IN1

RES

GND

ANT_DIV

GND

ANT

GND

VBATT

VBATT_

GND

RES

GND

VBATT

VBATT_

GND

SIMVC

RES

GND

SIMIN

RES

GND GND

GND

SIMIO

RES

RES GND

GND

SIMCLK

DVI_RX

RES GND

GND

SIMRS

DVI_TX

RES RES

RES

DVI_CLK

GPIO_01 RES

GND

RES

DVI_WA

GPIO_02 RES

GND

RES

GPIO_03 RES

GND

RES

GPIO_04 RES

RES

VAUX/P

WRMON

RES

GPIO_06

RES GND

RES

ON_OFF

VUSB

GND

GPIO_07

RES

GND

HW_SH UTDOW

RES

GPIO_05

VRTC

RES

GND

RES

C105/RTS C108/DTR C109/DC

C107/DSR C125/RI

15 USB_D+

USB_D-

TX AUX

RX AUX

SPI_CLK

GPIO_10

SPI_MR

SPI_SR

GPIO_08

GPIO_09

C104/RXD C103/TX

C106/CT

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4 POWER SUPPLY

The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product overall performances, hence read carefully the requirements and the guidelines that will follow for a proper design.

4.1 Power Supply Requirements

The external power supply must be connected to VBATT & VBATT_PA signals and must fulfil the following requirements:

Power Supply

Value

Nominal Supply Voltage

3.8V

Normal Operating Voltage Range

3.40 V÷ 4.20 V

Extended Operating Voltage Range

3.10 V÷ 4.50 V

NOTE: The Operating Voltage Range MUST never be exceeded; care must be taken when

designing the application’s power supply section to avoid having an excessive voltage

drop. If the voltage drop is exceeding the limits it could cause a Power Off of the module. The Power supply must be higher than 3.10 V to power on the module.

Overshoot voltage (regarding MAX Extended Operating Voltage) and drop in voltage (regarding MIN Extended Operating Voltage) MUST never be exceeded; The “Extended Operating Voltage Range” can be used only with completely assumption and application of the HW User guide suggestions.

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4.2 Power Consumption

The reported values in the following table has to be considered preliminary:

Mode

Average

(mA)

Mode Description

Switched Off

0.095

Module supplied but switched off

IDLE mode

AT+CFUN=1

LTE

Normal mode: full functionality of the module

WCDMA

GSM

AT+CFUN=4 11

Disabled TX and RX; module is not registered on the network

AT+CFUN=5

LTE

5.8

Paging cycle #32 frames (0.32 sec DRx cycle)

3.5

Paging cycle #64 frames (0.64 sec DRx cycle)

Paging cycle #128 frames (1.28 sec DRx cycle)

1.8

Paging cycle #256 frames (2.56 sec DRx cycle)

WCDMA

1.7

DRx7

GSM

2.2

DRx2

1.7

DRx5

1.5

DRx9

Operative mode

LTE Data call

190

Channel BW 5MHz, RB=1, TX=0dBm

LTE Data call

Max power

500

Channel BW 5MHz, RB=1, TX=22dBm

WCDMA Voice

140

WCDMA voice call (TX = 9dBm)

WCDMA HSDPA

Max power

440

WCDMA data call (RMC, TX = 23dBm)

EDGE 2TX+3RX

Low Band Gamma 7

290

EDGE Sending data mode

High Band Gamma 6

220

GSM TX and RX

Low Band PL5

300

GSM VOICE CALL

High Band PL0

180

GPRS 2TX+3RX

Low band Gamma 3

580

GPRS Sending data mode

High band Gamma 3

350

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NOTE: The electrical design for the Power supply should be made ensuring it will be capable of a peak current output of at least:

0.8 A for WCDMA and LTE mode (3.80V supply). 2A for GSM mode (3.80V supply).

NOTE: The reported values are an average among all the product variants and bands for each network wireless technology. The support of specific network wireless technology depends on product variant configuration.

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4.3 General Design Rules

The principal guidelines for the Power Supply Design embrace three different design steps:

• the electrical design

• the thermal design

• the PCB layout.

4.3.1 Electrical Design Guidelines

The electrical design of the power supply depends strongly from the power source where this power is drained. We will distinguish them into three categories:

• +5V input (typically PC internal regulator output)

• +12V input (typically automotive)

• Battery

4.3.1.1 +5V Source Power Supply Design Guidelines

• The desired output for the power supply is 3.8V, hence there's not a big difference between the input source and the desired output and a linear regulator can be used. A switching power supply will not be suited because of the low drop out requirements.

• When using a linear regulator, a proper heat sink shall be provided in order to dissipate the power generated.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks close to the Module, a 100μF capacitor is usually suited.

• Make sure the low ESR capacitor on the power supply output rated at least 10V.

An example of linear regulator with 5V input is:

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4.3.1.2 + 12V input Source Power Supply Design Guidelines

• The desired output for the power supply is 3.8V, hence due to the big difference between the input source and the desired output, a linear regulator is not suited and shall not be used. A switching power supply will be preferable because of its better efficiency.

• When using a switching regulator, a 500kHz or more switching frequency regulator is preferable because of its smaller inductor size and its faster transient response. This allows the regulator to respond quickly to the current peaks absorption.

• In any case the frequency and Switching design selection is related to the application to be developed due to the fact the switching frequency could also generate EMC interferences.

• For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind when choosing components: all components in the power supply must withstand this voltage.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks, a 100μF capacitor is usually suited.

• Make sure the low ESR capacitor on the power supply output is rated at least 10V.

• For Car applications a spike protection diode should be inserted close to the power input, in order to clean

the supply from spikes.

An example of switching regulator with 12V input is in the below schematic:

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4.3.1.3 Battery Source Power Supply Design Guidelines

The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is 4.2V, hence a single

3.7V Li-Ion cell battery type is suited for supplying the power to the Telit LE910 V2 module.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks, a 100μF tantalum capacitor is usually suited.

• Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.

• A protection diode should be inserted close to the power input, in order to save the LE910 V2 from power

polarity inversion. Otherwise the battery connector should be done in a way to avoid polarity inversions when connecting the battery.

• The battery must be rated to supply peaks of current up to 0.8 A for LTE and WCDMA mode and 2A for GSM mode.

NOTE: DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with LE910 V2. Their use can lead to overvoltage on the LE910 V2 and damage it. USE ONLY Li-Ion battery types.

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4.3.1.4 Thermal Design Guidelines

Worst case as reference values for thermal design of LE910 V2 are:

• Average current consumption: 800 mA

• Supply voltage: 3.80V

NOTE: Make PCB design in order to have the best connection of GND pads to large surfaces.

NOTE: The LE910 V2 includes a function to prevent overheating.

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4.3.1.5 Power Supply PCB layout Guidelines

As seen on the electrical design guidelines the power supply shall have a low ESR capacitor on the output to cut the current peaks on the input to protect the supply from spikes The placement of this component is crucial for the correct working of the circuitry. A misplaced component can be useless or can even decrease the power supply performances.

• The Bypass low ESR capacitor must be placed close to the Telit LE910 V2 power input pads or in the case the power supply is a switching type it can be placed close to the inductor to cut the ripple provided the PCB trace from the capacitor to the LE910 V2 is wide enough to ensure a dropless connection even during an 0.8 A current peak.

• The protection diode must be placed close to the input connector where the power source is drained.

• The PCB traces from the input connector to the power regulator IC must be wide enough to ensure no

voltage drops occur when an 2 A current peak is absorbed (worst case of GSM mode).

• The PCB traces to the LE910 V2 and the Bypass capacitor must be wide enough to ensure no significant voltage drops occur. This is for the same reason as previous point. Try to keep this trace as short as possible.

• To reduce the EMI due to switching, it is important to keep very small the mesh involved; thus the input capacitor, the output diode (if not embodied in the IC) and the regulator have to form a very small loop.This is done in order to reduce the radiated field (noise) at the switching frequency (100-500 kHz usually).

• A dedicated ground for the Switching regulator separated by the common ground plane is suggested.

• The placement of the power supply on the board should be done in such a way to guarantee that the high

current return paths in the ground plane are not overlapped to any noise sensitive circuitry as the microphone amplifier/buffer or earphone amplifier.

• The power supply input cables should be kept separate from noise sensitive lines such as microphone/earphone cables.

• The insertion of EMI filter on VBATT pins is suggested in those designs where antenna is placed close to battery or supply lines. A ferrite bead like Murata BLM18EG101TN1 or Taiyo Yuden P/N FBMH1608HM101 can be used for this purpose.

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The below figure shows the recommended circuit:

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4.4 RTC Bypass out

The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the digital part, allowing having only RTC going on when all the other parts of the device are off. To this power output a backup capacitor can be added in order to increase the RTC autonomy during power off of the battery. NO Devices must be powered from this pin.

In order to keep the RTC active when VBATT is not supplied it is possible to back up the RTC section connecting a backup circuit to the related VRTC signal (pad C14 on module’s Pinout).

For additional details on the Backup solutions please refer to the related application note (xE910 RTC Backup Application Note)

4.5 VAUX Power Output

A regulated power supply output is provided in order to supply small devices from the module. The signal is present on Pad R11 and it is in common with the PWRMON (module powered ON indication) function. This output is always active when the module is powered ON.

The operating range characteristics of the supply are:

Item

Min

Typical

Max

Output voltage

1.78V

1.80V

1.82V

Output current - -

60mA

Output bypass capacitor

(inside the module)

1uF

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5 DIGITAL SECTION

5.1 Logic Levels

ABSOLUTE MAXIMUM RATINGS – NOT FUNCTIONAL:

OPERATING RANGE - INTERFACE LEVELS (1.8V CMOS):

Parameter

Min

Max

Input high level

1.5V

1.9V

Input low level

0.35V

Output high level

1.6V

1.9V

Output low level

0.2V

OPERATING RANGE - INTERFACE LEVELS (1.2V CMOS):

Parameter

Min

Max

Input high level

0.9V

1.3V

Input low level

0.3V

Output high level

1.3V

Output low level

0.1V

CURRENT CHARACTERISTICS:

Parameter

AVG

Output Current

1mA

Input Current

1uA

Parameter

Min

Max

Input level on any digital pin (CMOS 1.8) with respect to ground

-0.3V

2.1V

Input level on any digital pin (CMOS 1.2) with respect to ground

-0.3V

1.4V

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5.2 Power on

To turn on the LE910 V2 the pad ON_OFF* must be tied low for at least 5 seconds and then released. The maximum current that can be drained from the ON_OFF* pad is 0,1 mA. A simple circuit to do it is:

NOTE: Don't use any pull up resistor on the ON_OFF* line, it is internally pulled up. Using pull up resistor may bring to latch up problems on the LE910 V2 power regulator and improper power on/off of the module. The line ON_OFF* must be connected only in open collector or open drain configuration.

In this document all the lines that are inverted, hence have active low signals are labelled with a name that ends with”#",”*” or with a bar over the name.

To check if the device has powered on, the hardware line PWRMON should be monitored.

It is mandatory to avoid sending data to the serial ports during the first 200ms of the module start-up.

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A flow chart showing the proper turn on procedure is displayed below:

NOTE: When the USB is connected or after the firmware updating, Delay must be equal at least to 10 seconds.

“Modem ON Proc”

START

VBATT > 3.10V

ON_OFF* = LOW

PWRMON=ON

Delay = 5 sec (see note below)

ON_OFF* = HIGH

GO TO

“HW Shutdown

Unconditional”

PWRMON=ON

Delay = 1 sec

GO TO

“Start AT Commands””

“Modem ON Proc”

END

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A flow chart showing the AT commands managing procedure is displayed below:

NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the LE910 V2 when the module is powered off or during an ON/OFF transition.

“Start AT CMD”

START

Delay = 300 msec

Enter AT <CR>

GO TO

“HW Shutdown

Unconditional”

AT answer in

1 sec ?

GO TO

“Modem ON Proc.”

“Start AT CMD”

END

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For example: 1- Let's assume you need to drive the ON_OFF* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT1):

2- Let's assume you need to drive the

ON_OFF* pad directly with an ON/OFF button:

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WARNING It is recommended to set the ON_OFF* line LOW to power on the module only after VBATT is higher than 3.10V. In case this condition it is not satisfied you could use the HW_SHUTDOWN* line to recover it and then restart the power on activity using the ON_OFF * line. An example of this is described in the following diagram.

Power ON diagram:

After HW_SHUTSDOWN* is released you could again use the ON_OFF* line to power on the module.

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5.3 Power off

Turning off of the device can be done in two ways:

• via AT command (see LE910 V2 Software User Guide, AT#SHDN)

• by tying low pin ON_OFF*

Either ways, the device issues a detach request to network informing that the device will not be reachable any more. To turn OFF the LE910 V2 the pad ON_OFF* must be tied low for at least 3 seconds and then released.

NOTE: To check if the device has been powered off, the hardware line PWRMON must be monitored. The device is powered off when PWRMON goes low.

In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the LE910 V2 when the module is powered off or during an ON/OFF transition.

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The following flow chart shows the proper turn off procedure:

“Modem OFF Proc.”

START

ON_OFF* = LOW

PWRMON=ON?

Delay >= 3 sec

ON_OFF* = HIGH

PWRMON=ON?

GO TO

“HW SHUTDOWN

Unconditional”

“Modem OFF Proc.”

END

OFF Mode

AT#SHDN

Looping for more

than 15s?

Key

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5.4 Unconditional Shutdown

HW_SHUTDOWN* is used to unconditionally shutdown the LE910 V2. Whenever this signal is pulled low, the LE910 V2 is reset. When the device is reset it stops any operation. After the release of the line, the LE910 V2 is unconditionally shut down, without doing any detach operation from the network where it is registered. This behaviour is not a proper shut down because any WCDMA device is requested to issue a detach request on turn off. The HW_SHUTDOWN* is internally controlled on start-up to achieve always a proper power-on reset sequence, so there's no need to control this pin on start-up. To unconditionally shutdown the LE910 V2, the pad HW_SHUTDOWN* must be tied low for at least 200 milliseconds and then released. The signal is internally pulled up so the pin can be left floating if not used. If used, then it must always be connected with an open collector transistor, to permit to the internal circuitry the power on reset and under voltage lockout functions.

PIN DESCRIPTION

Signal

Function

I/O

PAD

HW_SHUTDOWN*

Unconditional Shutdown of the Module

R13

OPERATING LEVELS

Signal Status

Min

Max

HW_SHUTDOWN* Input high

1.5V

1.9V

HW_SHUTDOWN* Input Low

0.35V

WARNING: The hardware unconditional Shutdown must not be used during normal operation of the device since it does not detach the device from the network. It shall be kept as an emergency exit procedure.

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A typical circuit is the following:

For example:

Let us assume you need to drive the HW_SHUTDOWN* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT2):

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In the following flow chart is detailed the proper restart procedure:

NOTE: Do not use any pull up resistor on the HW_SHUTDOWN* line nor any totem pole digital output. Using pull up resistor may bring to latch up problems on the LE910 V2 power regulator and improper functioning of the module. To proper power on again the module please refer to the related paragraph (“Power ON”) The unconditional hardware shutdown must always be implemented on the boards and should be used only as an emergency exit procedure.

“HW SHUTDOWN

Unconditional”

START

HW_SHUTDOWN* = LOW

Delay = 200ms

PWRMON = ON

Disconnect

VBATT

“HW SHUTDOWN

Unconditional”

END

HW_SHUTDOWN* = HIGH

Delay = 1s

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5.5 Fast power down

The procedure to power off LE910 V2 described in Chapter 5.3 normally takes more than 1 second to detach from network and make LE910 V2 internal filesystem properly closed. In case of unwanted supply voltage loss the system can be switched off without any risk of filesystem data corruption by implementing Fast Shut Down feature. Fast Shut Down feature permits to reduce the current consumption and the time-to-poweroff to minimum values.

NOTE: Refer to LE910 V2 series AT command reference guide (Fast power down #FASTSHDN) in order to set up detailed AT command.

5.5.1 Fast Shut Down by Hardware

The Fast Power Down can be triggered by configuration of any GPIO. HI level to LOW level transition of GPIO commands fast power down.

Example circuit:

NOTE: In case of power on with slow ramp-up of Vbatt supply voltage while ON/OFF* is tied to GND (case possibile if timing are not properly controlled), HW_SHUTDOWN* line has to be used according to power on diagram in chapter 5.2.

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NOTE: Consider voltage drop under max current conditions when defining the voltage detector thereshold in order to avoid unwanted shutdown.

Tipical timings are reported in the plot above when testing the example circuit with Ctank=47mF. The capacitor is rated with the following formula:

where 80mA is a typical current during fast shut down procedure, 300ms is the typical time to execute the shutdown and 0.5V is the minimum voltage marging from threshold of LE910 V2 hardware reset.

TIP: Make the same plot during system verification to check timings and voltage levels.

5.5.2 Fast Shut Down by Software

The Fast Power Down can be triggered by AT command.

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5.6 Communication ports

5.6.1 USB 2.0 HS

The LE910 V2 includes one integrated universal serial bus (USB 2.0 HS) transceiver. The following table is listing the available signals:

PAD

Signal

I/O

Function

Type

NOTE

B15

USB_D+

I/O

USB differential Data (+)

3.3V

C15

USB_D-

I/O

USB differential Data (-)

3.3V

A13

VUSB

Power sense for the internal USB transceiver.

Accepted range:

4.4V to 5.25V

The USB_DPLUS and USB_DMINUS signals have a clock rate of 480 MHz. The signal traces should be routed carefully. Trace lengths, number of vias and capacitive loading should be minimized. The characteristic impedance value should be as close as possible to 90 Ohms differential. In case there is a need to add an ESD protection, the suggested connection is the following:

NOTE: VUSB pin should be disconnected before activating the Power Saving Mode.

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5.6.2 SPI

The LE910 V2 Module is provided by a standard 3-wire master SPI interface.

The following table is listing the available signals:

PAD

Signal

I/O

Function

Type

NOTE

D15

SPI_MOSI

SPI MOSI

CMOS 1.8V

Shared with TX_AUX

E15

SPI_MISO

SPI MISO

CMOS 1.8V

Shared with RX_AUX

F15

SPI_CLK

SPI Clock

CMOS 1.8V

NOTE: Due to the shared functions, when the SPI port is used, it is not possible to use the AUX_UART port.

5.6.2.1 SPI Connections

SPI_MISO

SPI_MOSI

SPI_CLK

E15

D15

F15

LE910 V2

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5.6.3 Serial Ports

The LE910 V2 module is provided with by 2 Asynchronous serial ports:

• MODEM SERIAL PORT 1 (Main)

• MODEM SERIAL PORT 2 (Auxiliary)

Several configurations can be designed for the serial port on the OEM hardware, but the most common are:

• RS232 PC com port

• microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit)

• microcontroller UART @ 5V or other voltages different from 1.8V

Depending from the type of serial port on the OEM hardware a level translator circuit may be needed to make the system work. On the LE910 V2 the ports are CMOS 1.8.

5.6.3.1 Modem serial port 1 (USIF0)

The serial port 1 on the LE910 V2 is a +1.8V UART with all the 7 RS232 signals. It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels.

The following table is listing the available signals:

RS232

Signal

Pad

Name

Usage

C109/DCD

N14

Data Carrier Detect

Output from the LE910 V2 that indicates the carrier presence

C104/RXD

M15

Transmit line *see Note

Output transmit line of LE910 V2 UART

C103/TXD

N15

Receive line *see Note

Input receive of the LE910 V2 UART

C108/DTR

M14

Data Terminal Ready

Input to the LE910 V2 that controls the DTE READY condition

GND

M12,

B13,

P13,

E14 …

Ground

C107/DSR

P14

Data Set Ready

Output from the LE910 V2 that indicates the module is ready

C106/CTS

P15

Clear to Send

Output from the LE910 V2 that controls the Hardware flow control

C105/RTS

L14

Request to Send

Input to the LE910 V2 that controls the Hardware flow control

C125/RING

R14

Ring Indicator

Output from the LE910 V2 that indicates the incoming call condition

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NOTE: According to V.24, some signal names are referred to the application side, therefore on the LE910 V2 side these signal are on the opposite direction: TXD on the application side will be connected to the receive line (here named C103/TXD) RXD on the application side will be connected to the transmit line (here named C104/RXD)

For a minimum implementation, only the TXD, RXD lines can be connected, the other lines can be left open provided a software flow control is implemented.

5.6.3.2 Modem serial port 2 (USIF1)

The secondary serial port on the LE910 V2 is a CMOS1.8V with only the RX and TX signals. The signals of the LE910 V2 serial port are:

PAD

Signal

I/O

Function

Type

NOTE

D15

TX_AUX

Auxiliary UART (TX Data to DTE)

CMOS 1.8V

Shared with SPI_MOSI

E15

RX_AUX

Auxiliary UART (RX Data from DTE)

CMOS 1.8V

Shared with SPI_MISO

NOTE: Due to the shared pins, when the Modem Serial port is used, it is not possible to use the SPI functions.

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5.6.3.3 RS232 level translation

In order to interface the LE910 V2 with a PC com port or a RS232 (EIA/TIA-232) application a level translator is required. This level translator must:

• invert the electrical signal in both directions;

• Change the level from 0/1.8V to +15/-15V.

Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level translator. Note that the negative signal voltage must be less than 0V and hence some sort of level translation is always required. The simplest way to translate the levels and invert the signal is by using a single chip level translator. There are a multitude of them, differing in the number of drivers and receivers and in the levels (be sure to get a true RS232 level translator not a RS485 or other standards). By convention the driver is the level translator from the 0-1.8V UART to the RS232 level. The receiver is the translator from the RS232 level to 0-1.8V UART. In order to translate the whole set of control lines of the UART you will need:

• 5 drivers

• 3 receivers

An example of RS232 level adaptation circuitry could be done using a MAXIM transceiver (MAX218) In this case the chipset is capable to translate directly from 1.8V to the RS232 levels (Example done on 4 signals only).

The RS232 serial port lines are usually connected to a DB9 connector with the following layout:

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5.7 General Purpose I/O

The LE910 V2 module is provided by a set of Configurable Digital Input / Output pins (CMOS 1.8V). Input pads can only be read; they report the digital value (high or low) present on the pad at the read time. Output pads can only be written or queried and set the value of the pad output. An alternate function pad is internally controlled by the LE910 V2 firmware and acts depending on the function implemented.

The following table shows the available GPIO on the LE910 V2:

PAD

Signal

I/O

Drive

Strength

Default

State

NOTE

GPIO_01

I/O

1 mA

INPUT

Alternate function STAT LED

GPIO_02

I/O

1 mA

INPUT

C10

GPIO_03

I/O

1 mA

INPUT

C11

GPIO_04

I/O

1 mA

INPUT

B14

GPIO_05

I/O

1 mA

INPUT

C12

GPIO_06

I/O

1 mA

INPUT

C13

GPIO_07

I/O

1 mA

INPUT

K15

GPIO_08

I/O

1 mA

INPUT

L15

GPIO_09

I/O

1 mA

INPUT

G15

GPIO_10

I/O

1 mA

INPUT

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5.7.1 Using a GPIO as INPUT

The GPIO pads, when used as inputs, can be connected to a digital output of another device and report its status, provided this device has interface levels compatible with the 1.8V CMOS levels of the GPIO. If the digital output of the device to be connected with the GPIO input pad has interface levels different from the

1.8V CMOS, then it can be buffered with an open collector transistor with a 47K pull up to 1.8V supplied by VAUX/POWERMON R11 pad.

5.7.2 Using a GPIO as OUTPUT

The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware. When set as outputs, the pads have a push-pull output and therefore the pull-up resistor may be omitted.

5.7.3 Indication of network service availability

The STAT_LED pin status shows information on the network service availability and Call status. The function is available as alternate function of GPIO_01 (to be enabled using the AT#GPIO=1,0,2 command). In the LE910 V2 modules, the STAT_LED needs an external transistor to drive an external LED and its voltage level is defined accordingly to the table below:.

Device Status

Led Status

Device off

Permanently off

Not Registered

Permanently on

Registered in idle

Blinking 1sec on + 2 sec off

Registered in idle + power saving

It depends on the event that triggers the wakeup (In sync with network paging)

Voice Call Active

Permanently on

Dial-Up

Blinking 1 sec on + 2 sec off

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The reference schematic for LED indicator. :

R3 must be calculated taking in account VBATT value and LED type.

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5.8 External SIM Holder

Please refer to 0 the related User Guide (SIM Holder Design Guides, 80000NT10001a).

5.9 ADC Converter

The LE910 V2 is provided by one AD converter. It is able to read a voltage level in the range of 0÷1.2 volts applied on the ADC pin input, store and convert it into 10 bit word. The input line is named as ADC_IN1 and it is available on Pad B1

The following table is showing the ADC characteristics:

Item

Min

Typical

Max

Unit

Input Voltage range

0 - 1.2

Volt

AD conversion

- - 10

bits

Input Resistance

1 - -

Mohm

Input Capacitance

- 1 -

The ADC could be controlled using an AT command. The command is AT#ADC=1,2 The read value is expressed in mV

Refer to SW User Guide or AT Commands Reference Guide for the full description of this function.

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6 RF SECTION

6.1 Bands Variants

The following table lists the supported bands for CAT4 products:

The following table lists the supported bands for CAT1 products:

Product

4G bands

3G bands

2G bands

LE910-NA V2

FDD B2, B4, B5, B12, B13

B2, B5

LE910-SV V2

FDD B2, B4, B13

LE910-EU V2

FDD B1, B3, B7, B8, B20

B1, B8

900 /1800

LE910-AU V2

FDD B3, B7, B28H/L

LE910B4-NA

FDD B2, B4, B5, B12, B13

B2, B5

Product

4G bands

3G bands

2G bands

LE910-SV1

FDD B2, B4, B13

LE910-SVL

FDD B4, B13

LE910-NA1

FDD B2, B4, B5, B12, B13

B2, B5

LE910-EU1

FDD B1, B3, B7, B8, B20

GSM900, DCS1800

LE910B1-EU

FDD B3, B8, B20

LE910-JN1

FDD B1, B19, B21

LE910B1-NA

FDD B2, B4, B5, B12, B13

B2, B5

LE910B1-SA

FDD B2, B4, B12

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6.2 TX Output Power

Band

Power Class

LTE All Bands

Class 3 (0.2W)

WCDMA All Bands

Class 3 (0.25W)

GSM 900

Class 4 (2W)

DCS 1800

Class 1 (1W)

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6.3 RX Sensitivity

Measurement setup

Technology

3GPP Compliance

LTE

Throughput >95% 10MHz Dual Receiver

WCDMA

BER <0.1% 12.2 Kbps Dual Receiver

GSM/DCS

BER Class II <2.44% Dual Receiver

LE910-NA V2 LE910-NA1 LE910B4-NA LE910B1-NA

Band

Sensitivity

LTE FDD B2

-103.0 dBm

LTE FDD B4

-102.5 dBm

LTE FDD B5

-103.0 dBm

LTE FDD B12

-103.0 dBm

LTE FDD B13

-103.0 dBm

WCDMA FDD B2

-113.0 dBm

WCDMA FDD B5

-113.0 dBm

LE910B1-SA

Band

Sensitivity

LTE FDD B2

-103.0 dBm

LTE FDD B4

-102.5 dBm

LTE FDD B12

-103.0 dBm

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LE910-AU V2

Band

Sensitivity

LTE FDD B3

-102.5 dBm

LTE FDD B7

-101.5 dBm

LTE FDD B28

-100.0 dBm

LE910-SV V2 LE910-SV1

Band

Sensitivity

LTE FDD B2

-103.0 dBm

LTE FDD B4

-102.5 dBm

LTE FDD B13

-103.0 dBm

LE910-EU V2 LE910-EU1 LE910B1-EU

Band

Sensitivity

LTE FDD B1

-103.0 dBm

LTE FDD B3

-101.5 dBm

LTE FDD B7

-101.5 dBm

LTE FDD B8

-102.5 dBm

LTE FDD B20

-101.5 dBm

WCDMA FDD B1

-113.0 dBm

WCDMA FDD B8

-113.0 dBm

GSM 900

-112.5 dBm

GSM 1800

-111.5 dBm

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6.4 Antenna Requirements

The antenna connection and board layout design are the most important aspect in the full product design as they strongly affect the product overall performances, hence read carefully and follow the requirements and the guidelines for a proper design. The antenna and antenna transmission line on PCB for a Telit LE910 V2 device shall fulfil the following requirements:

LE910-JN1

Band

Sensitivity

LTE FDD B1

-103.0 dBm

LTE FDD B19

-103.0 dBm

LTE FDD B21

-103.0 dBm

LE910-NA V2 LE910-NA1 LE910B4-NA LE910B1-NA LE910B1-SA

Item

Value

Frequency range

Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s)

Bandwidth

140 MHz in LTE/WCDMA Band 2 445 MHz in LTE Band 4 70 MHz in LTE/WCDMA Band 5 47 MHz in LTE Band 12 41 MHz in LTE Band 13

Impedance

50 ohm

Input power

> 24dBm Average power

VSWR absolute max

≤ 10:1 (limit to avoid permanent damage)

VSWR recommended

≤ 2:1 (limit to fulfill all regulatory requirements)

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LE910-SV V2 LE910-SV1 LE910-SVL

Item

Value

Frequency range

Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s)

Bandwidth

140 MHz in LTE/WCDMA Band 2 (not applicable to LE910-SVL) 445 MHz in LTE Band 4 41 MHz in LTE Band 13

Impedance

50 ohm

Input power

> 24dBm Average power

VSWR absolute max

≤ 10:1 (limit to avoid permanent damage)

VSWR recommended

≤ 2:1 (limit to fulfill all regulatory requirements)

LE910-AU V2

Item

Value

Frequency range

Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s)

Bandwidth

170 MHz in LTE Band 3 190 MHz in LTE Band 7 100 MHz in LTE Band 28

Impedance

50 ohm

Input power

> 24dBm Average power

VSWR absolute max

≤ 10:1 (limit to avoid permanent damage)

VSWR recommended

≤ 2:1 (limit to fulfill all regulatory requirements)

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LE910-EU V2 LE910-EU1 LE910B1-EU

Item

Value

Frequency range

Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s)

Bandwidth

250 MHz in LTE/WCDMA Band 1 170 MHz in LTE/WCDMA Band 3 / DCS1800 190 MHz in LTE Band 7 80 MHz in LTE/WCDMA Band 8 / GSM900 71 MHz in LTE Band 20

Impedance

50 ohm

Input power

> 24dBm Average power

VSWR absolute max

≤ 10:1 (limit to avoid permanent damage)

VSWR recommended

≤ 2:1 (limit to fulfill all regulatory requirements)

LE910-JN1

Item

Value

Frequency range

Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s)

Bandwidth

250 MHz in LTE Band 1 60 MHz in LTE Band 19 63 MHz in LTE Band 21

Impedance

50 ohm

Input power

> 24dBm Average power

VSWR absolute max

≤ 10:1 (limit to avoid permanent damage)

VSWR recommended

≤ 2:1 (limit to fulfill all regulatory requirements)

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6.4.1 PCB design guidelines

When using the LE910 V2, since there's no antenna connector on the module, the antenna must be connected to the LE910 V2 antenna pad (K1) by means of a transmission line implemented on the PCB. This transmission line shall fulfil the following requirements:

The transmission line should be designed according to the following guidelines:

• Make sure that the transmission line’s characteristic impedance is 50ohm ;

• Keep line on the PCB as short as possible, since the antenna line loss shall be less than about 0,3 dB;

• Line geometry should have uniform characteristics, constant cross section, avoid meanders and abrupt

curves;

• Any kind of suitable geometry / structure (Microstrip, Stripline, Coplanar, Grounded Coplanar Waveguide...) can be used for implementing the printed transmission line afferent the antenna;

• If a Ground plane is required in line geometry, that plane has to be continuous and sufficiently extended, so the geometry can be as similar as possible to the related canonical model;

• Keep, if possible, at least one layer of the PCB used only for the Ground plane; If possible, use this layer as reference Ground plane for the transmission line;

• It is wise to surround (on both sides) the PCB transmission line with Ground, avoid having other signal tracks facing directly the antenna line track.

• Avoid crossing any un-shielded transmission line footprint with other signal tracks on different layers;

• The ground surrounding the antenna line on PCB has to be strictly connected to the main Ground Plane

by means of via holes (once per 2mm at least), placed close to the ground edges facing line track;

• Place EM noisy devices as far as possible from LE910 V2 antenna line;

• Keep the antenna line far away from the LE910 V2 power supply lines;

• If EM noisy devices (such as fast switching ICs, LCD and so on) are present on the PCB hosting the

LE910, take care of the shielding of the antenna line by burying it in an inner layer of PCB and surround it with Ground planes, or shield it with a metal frame cover.

• If EM noisy devices are not present around the line, the use of geometries like Microstrip or Grounded Coplanar Waveguide has to be preferred, since they typically ensure less attenuation if compared to a Stripline having same length;

Item

Value

Characteristic Impedance

50 ohm (+-10%)

Max Attenuation

0,3 dB

Coupling

Coupling with other signals shall be avoided

Ground Plane

Cold End (Ground Plane) of antenna shall be equipotential to the LE910 V2 ground pins

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The following image is showing the suggested layout for the Antenna pad connection:

6.4.2 PCB Guidelines in case of FCC Certification

In the case FCC certification is required for an application using LE910 V2, according to FCC KDB 996369 for modular approval requirements, the transmission line has to be similar to that implemented on LE910 V2 interface board and described in the following chapter.

6.4.2.1 Transmission line design

During the design of the LE910 V2 interface board, the placement of components has been chosen properly, in order to keep the line length as short as possible, thus leading to lowest power losses possible. A Grounded Coplanar Waveguide (G-CPW) line has been chosen, since this kind of transmission line ensures good impedance control and can be implemented in an outer PCB layer as needed in this case. A SMA female connector has been used to feed the line. The interface board is realized on a FR4, 4-layers PCB. Substrate material is characterized by relative permittivity

εr = 4.6 ± 0.4 @ 1 GHz, TanD= 0.019 ÷ 0.026 @ 1 GHz. A characteristic impedance of nearly 50 Ω is achieved using trace width = 1.1 mm, clearance from coplanar ground

plane = 0.3 mm each side. The line uses reference ground plane on layer 3, while copper is removed from layer 2 underneath the line. Height of trace above ground plane is 1.335 mm. Calculated characteristic impedance is 51.6 Ω, estimated line loss is less than 0.1 dB. The line geometry is shown below:

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6.4.2.2 Transmission Line Measurements

An HP8753E VNA (Full-2-port calibration) has been used in this measurement session. A calibrated coaxial cable has been soldered at the pad corresponding to RF output; a SMA connector has been soldered to the board in order to characterize the losses of the transmission line including the connector itself. During Return Loss / impedance measurements, the transmission line has been terminated to 50 Ω load. Return Loss plot of line under test is shown below:

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Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω load) is shown in the

following figure:

Insertion Loss of G-CPW line plus SMA connector is shown below:

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6.4.2.3 Antenna Installation Guidelines

• Install the antenna in a place covered by the LTE signal.

• Antenna must not be installed inside metal cases

• Antenna shall also be installed according Antenna manufacturer instructions

• Antenna integration should optimize the Radiation Efficiency. Efficiency values > 50% are recommended

on all frequency bands

• Antenna integration should not dramatically perturb the radiation pattern. It is preferable to get, after antenna installation, an omnidirectional radiation pattern, at least in one pattern cut

• Antenna Gain must not exceed values indicated in regulatory requirements, where applicable, in order to meet related EIRP limitations. Typical antenna Gain in most M2M applications does not exceed 2dBi

• If the device antenna is located farther than 20cm from the human body and there are no co-located transmitter then the Telit FCC/IC approvals can be re-used by the end product

• If the device antenna is located closer than 20cm from the human body or there are co-located transmitter then the additional FCC/IC testing may be required for the end product (Telit FCC/IC approvals cannot be reused)

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6.5 Second Antenna Requirements

This product is including an input for a second Rx antenna to improve radio sensitivity and interference cancellation for better data throughput. This function is named Antenna Diversity in case of 2G and 3G modes. The seconda antenna for a Telit LE910 V2 device shall fulfil the following requirements:

LE910-NA V2 LE910-NA1 LE910B4-NA LE910B1-NA LE910B1-SA

Item

Value

Frequency range

Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s)

Bandwidth

60 MHz in LTE/WCDMA Band 2 45 MHz in LTE Band 4 25 MHz in LTE/WCDMA Band 5 15 MHz in LTE Band 12 10 MHz in LTE Band 13

Impedance

50 ohm

VSWR recommended

≤ 2:1 (limit to obtain max sensitivity)

LE910-SV V2 LE910-SV1 LE910-SVL

Item

Value

Frequency range

Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s)

Bandwidth

60 MHz in LTE/WCDMA Band 2 (not applicable to LE910-SVL) 45 MHz in LTE Band 4 10 MHz in LTE Band 13

Impedance

50 ohm

VSWR recommended

≤ 2:1 (limit to obtain max sensitivity)

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LE910-AU V2

Item

Value

Frequency range

Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s)

Bandwidth

75 MHz in LTE Band 3 70 MHz in LTE Band 7 45 MHz in LTE Band 28

Impedance

50 ohm

VSWR recommended

≤ 2:1 (limit to obtain the maximum sensitivity)

LE910-EU V2 LE910-EU1 LE910B1-EU

Item

Value

Frequency range

Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s)

Bandwidth

60 MHz in LTE/WCDMA Band 1 75 MHz in LTE/WCDMA Band 3 / DCS1800 70 MHz in LTE Band 7 35 MHz in LTE/WCDMA Band 8 / GSM900 30 MHz in LTE Band 20

Impedance

50 ohm

VSWR recommended

≤ 2:1 (limit to obtain the maximum sensitivity)

LE910-JN1

Item

Value

Frequency range

Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s)

Bandwidth

60 MHz in LTE Band 1 15 MHz in LTE Band 19 15 MHz in LTE Band 21

Impedance

50 ohm

VSWR recommended

≤ 2:1 (limit to obtain the maximum sensitivity)

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When using the LE910 V2, since there's no antenna connector on the module, the diversity antenna must be connected to the LE910 V2 Diversity Antenna pad (F1) by means of a transmission line implemented on the PCB.

The second Rx antenna should not be located in the close vicinity of main antenna. In order to improve Diversity Gain, Isolation and reduce mutual interaction, the two antennas should be located at the maximum reciprocal distance possible, taking into consideration the available space into the application. For the same reason, the Rx antenna should also be cross-polarized with respect to the main antenna. Isolation between main antenna and Rx antenna must be at least 10 dB in all uplink frequency bands. Envelope Correlation Coefficient (ECC) value should be as close as possible to zero, for best diversity performance. ECC values below 0.5 on all frequency bands are recommended.

6.5.1 Single Antenna Operation

In 2G and 3G mode second antenna (Diversity) is optional and secondary receiver can be disabled. In 4G LTE mode, 3GPP standard does not include single antenna operation because MIMO is the standard downlink configuration in this cellular system and because of reduced overall downlink performance when one or more neighbor cells are present. Nevertheless, LE910 V2 might be used with second antenna removed or not connected if this degradation in performance is accepted: for some MNOs, for example, a single receive antenna could be permissible with Cat.1 devices that operates at very low data rates (integrators should always refer to their network-provider to double check requirements applicability conditions). When possible, add a 50ohm (or 47ohm) resistor in order to terminate correctly the secondary receiver input and/or to provide antenna connection for test/debug purposes.

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7 AUDIO SECTION OVERVIEW

The Telit digital audio interface (DVI) of the LE910-V2 Module is based on the I2S serial bus interface standard. The audio port can be directly connected to end device using digital interface, or via one of the several compliant codecs (in case an analog audio is needed).

7.1 Electrical Characteristics

The product is providing the DVI on the following pins:

7.2 Codec examples

Please refer to the Digital Audio Application note.

Signal

I/O

Function

Internal Pull up

Type

DVI_WA0

I/O

Digital Audio Interface (Word Alignment / LRCLK)

CMOS 1.8V B6

DVI_RX

Digital Audio Interface (RX)

CMOS 1.8V

DVI_TX

Digital Audio Interface (TX)

CMOS 1.8V

DVI_CLK

I/O

Digital Audio Interface (BCLK)

CMOS 1.8V

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8 MECHANICAL DESIGN

8.1 Drawing

Dimensions in mm PIN B1

Lead Free Alloy:

Surface Finishing Ni/Au for all solder pads

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9 APPLICATION PCB DESIGN

The LE910 V2 modules have been designed in order to be compliant with a standard lead-free SMT process.

9.1 Footprint

TOP VIEW

In order to easily rework the LE910 V2 is suggested to consider on the application a 1.5 mm placement inhibit area around the module. It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module.

NOTE: In the customer application, the region under WIRING INHIBIT (see figure above) must be clear from signal or ground paths.

9.2 PCB pad design

Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.

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9.3 PCB pad dimensions

The recommendation for the PCB pads dimensions are described in the following image (dimensions in mm)

It is not recommended to place via or micro-via not covered by solder resist in an area of 0,3 mm around the pads unless it carries the same signal of the pad itself

PCB

Copper Pad

Solder Mask

SMD

(Solder Mask Defined)

NSMD

(Non Solder Mask Defined)

Solder resist openings

Inhibit area for micro-via

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(see following figure).

Holes in pad are allowed only for blind holes and not for through holes.

Recommendations for PCB pad surfaces:

Finish

Layer Thickness (um)

Properties

Electro-less Ni / Immersion Au

3 –7 / 0.05 – 0.15

good solder ability protection,

high shear force values

The PCB must be able to resist the higher temperatures which are occurring at the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste.

It is not necessary to panel the application’s PCB, however in that case it is suggested to use milled contours and

predrilled board breakouts; scoring or v-cut solutions are not recommended.

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9.4 Stencil

Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a thickness of stencil foil ≥ 120 µm.

9.5 Solder paste

Item

Lead Free

Solder Paste

Sn/Ag/Cu

We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules after assembly.

9.6 Solder reflow

Recommended solder reflow profile:

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Profile Feature

Pb-Free Assembly

Average ramp-up rate (TL to TP)

3°C/second max

Preheat

– Temperature Min (Tsmin) – Temperature Max (Tsmax) – Time (min to max) (ts)

150°C 200°C 60-180 seconds

Tsmax to TL – Ramp-up Rate

3°C/second max

Time maintained above:

– Temperature (TL) – Time (tL)

217°C 60-150 seconds

Peak Temperature (Tp)

245 +0/-5°C

Time within 5°C of actual Peak Temperature (tp)

10-30 seconds Ramp-down Rate

6°C/second max.

Time 25°C to Peak Temperature

8 minutes max.

NOTE: All temperatures refer to topside of the package, measured on the package body surface

WARNING: THE LE910 V2 MODULE WITHSTANDS ONE REFLOW PROCESS ONLY.

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10 PACKAGING

10.1 Tray

The LE910 modules are packaged on trays that can be used in SMT processes for pick & place handling.The first Marketing and Engineering samples of the LE910 V2 series will be shipped with the current packaging of the xE910 modules (on trays of 20 pieces each). Please note that Telit is going to introduce a new packaging for the xE910 family, as per the Product Change Notification PCN-0000-14-0055, therefore the mass production units of LE910 V2 will be shipped according to the following drawings:

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10.2 Reel

The LE910 can be packaged on reels of 200 pieces each. See figure for module positioning into the carrier.

10.2.1 Carrier Tape detail

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10.2.2 Reel detail

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10.2.3 Packaging detail

10.3 Moisture sensitivity

The LE910 V2 is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions: a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH). b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC J-STD-033A paragraph

5. c) The maximum time between the opening of the sealed bag and the reflow process must be 168 hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected d) Baking is required if conditions b) or c) are not respected e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more

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11 CONFORMITY ASSESSMENT

ISSUES

11.1 FCC/ISED Regulatory notices

Modification statement

Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment.

Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur.

Interference statement

This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Cet appareil est conforme aux limites d'exposition aux rayonnements de l’ISED pour un environnement non contrôlé. L'antenne doit être installé de façon à garder une distance minimale de 20 centimètres entre la source de rayonnements et votre corps. Gain de l'antenne doit être ci-dessous:

RF exposure

This equipment complies with FCC and ISED radiation exposure limits set forth for an uncontrolled environment. The antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body. Antenna gain must be below:

Antenna Gain

Frequency Band

LE910-NA V2

LE910-NA1 LE910B4-NA LE910B1-NA

LE910-SV V2

LE910-SV1

LE910-SVL

LE910B1-SA

700 MHz

6.63 dBi

6.94 dBi

6.95 dBi

6.63 dBi

850 MHz

6.63 dBi

N/A

1700 MHz

6.00 dBi

1900 MHz

8.51 dBi

9.01 dBi

N/A

6.00 dBi

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This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

Cet appareil est conforme aux limites d'exposition aux rayonnements de l’ISED pour un environnement non contrôlé. L'antenne doit être installé de façon à garder une distance minimale de 20 centimètres entre la source de rayonnements et votre corps. Gain de l'antenne doit être ci-dessous:

Gain de l‘antenne

Bande de fréquence

LE910-NA V2

LE910-NA1 LE910B4-NA LE910B1-NA

LE910-SV V2

LE910-SV1

LE910-SVL

LE910B1-SA

700 MHz

6.63 dBi

6.94 dBi

6.95 dBi

6.63 dBi

850 MHz

6.63 dBi

N/A

1700 MHz

6.00 dBi

1900 MHz

8.51 dBi

9.01 dBi

N/A

6.00 dBi

L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur.

FCC Class B digital device notice

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help.

Labelling Requirements for the Host device

The host device shall be properly labelled to identify the modules within the host device. The certification label of the module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labelled to display the FCC ID and ISED of the module, preceded by the words "Contains transmitter module", or the word "Contains", or similar wording expressing the same meaning, as follows:

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LE910-NA V2, LE910-NA1, LE910B4-NA and LE910B1-NA Contains FCC ID: RI7LE910NAV2 Contains IC: 5131A-LE910NAV2

LE910-SV V2 and LE910-SV1 Contains FCC ID: RI7LE910SVV2 Contains IC: 5131A-LE910SVV2

LE910-SVL Contains FCC ID: RI7LE910SVL Contains IC: 5131A-LE910SVL

LE910B1-SA Contains FCC ID: RI7LE910B1SA Contains IC: 5131A-LE910B1SA

L'appareil hôte doit être étiqueté comme il faut pour permettre l'identification des modules qui s'y trouvent. L'étiquette de certification du module donné doit être posée sur l'appareil hôte à un endroit bien en vue en tout temps. En l'absence d'étiquette, l'appareil hôte doit porter une étiquette donnant le FCC ID et l’ISED du module, précédé des mots « Contient un module d'émission », du mot « Contient » ou d'une formulation similaire exprimant le même sens, comme suit :

LE910-NA V2, LE910-NA1, LE910B4-NA and LE910B1-NA

Contains FCC ID: RI7LE910NAV2 Contains IC: 5131A-LE910NAV2

LE910-SV V2 and LE910-SV1 Contains FCC ID: RI7LE910SVV2 Contains IC: 5131A-LE910SVV2

LE910-SVL Contains FCC ID: RI7LE910SVL Contains IC: 5131A-LE910SVL

LE910B1-SA Contains FCC ID: RI7LE910B1SA Contains IC: 5131A-LE910B1SA

CAN ICES-3 (B) / NMB-3 (B) This Class B digital apparatus complies with Canadian ICES-003.

Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.

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12 SAFETY RECOMMENDATIONS

12.1 READ CAREFULLY

Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas:

• Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc.

• Where there is risk of explosion such as gasoline stations, oil refineries, etc. It is responsibility of the user to enforce the country regulation and the specific environment regulation.

Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for a correct wiring of the product. The product has to be supplied with a stabilized voltage source and the wiring has to be conforming to the security and fire prevention regulations. The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode. The system integrator is responsible of the functioning of the final product; therefore, care has to be taken to the external components of the module, as well as of any project or installation issue, because the risk of disturbing the GSM network or external devices or having impact on the security. Should there be any doubt, please refer to the technical documentation and the regulations in force. Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed with care in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm). In case of this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation.

The European Community provides some Directives for the electronic equipment introduced on the market. All the relevant information’s are available on the European Community website:

http://ec.europa.eu/enterprise/sectors/rtte/documents/

The text of the Directive 99/05 regarding telecommunication equipment is available, while the applicable Directives (Low Voltage and EMC) are available at:

http://ec.europa.eu/enterprise/sectors/electrical/

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13 DOCUMENT HISTORY

13.1 Revisions

Revision

Date

Changes

2015-01-15

First issue

2015-07-01

Updated chapters 3, 4.2, 6 Added RX Sensitivity

2015-09-02

Updated Applicability table, section 6.1 and 6.3, chapter 11

2015-12-09

Chapter 6 and applicability table, LE910-NA1 and LE910-EU1 adding Section 3.1, RESERVED pins updated Section 5.5.2, SPI configuration updated

2016-02-08

Section 5.5, Fast power down adding

2016-02-29

Section 4.2, Power consumption updated LE910-JK V2 removed

2016-05-09

Chapter 11, Conformity Assessment Issues updated for LE910-NA1 and LE910-SV1 Section 6.5.1 Single antenna config updating

2016-09-19

Added LE910-SVL, LE910B1-EU, LE910-JN1

2016-10-07

Updated FCC/IC Regulatory notices for LE910-SVL IC changed to ISED

2017-05-15

Added LE910B4-NA, LE910B1-NA, LE910B1-SA

2017-08-29

IDs and antenna gain updated in Chap 11 for LE910B1-SA

Telit Communications S p A LE910NAV2 User Guide

Specifications and Main Features

Frequently Asked Questions

User Manual