Telit Communications S p A LE910C1LA Users Manual
LE910Cx
HW User Guide
Doc#: 1VV0301298
Rev. 14.0 – 2019-06-07
LE910Cx HW User Guide
Doc#: 1VV0301298
SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE
NOTICE
While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been
carefully checked and is believed to be reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products
described herein and reserves the right to revise this document and to make changes
from time to time in content hereof with no obligation to notify any person of revisions or
changes. Telit does not assume any liability arising out of the application or use of any
product, software, or circuit described herein; neither does it convey license under its
patent rights or the rights of others.
It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in
your country. Such references or information must not be construed to mean that Telit
intends to announce such Telit products, programming, or services in your country.
COPYRIGHTS
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve
for Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be
deemed to grant either directly or by implication, estoppel, or otherwise, any license under
the copyrights, patents or patent applications of Telit, as arises by operation of law in the
sale of a product.
COMPUTER SOFTWARE COPYRIGHTS
The Telit and 3rd Party supplied Software (SW) products described in this instruction
manual may include copyrighted Telit and other 3rd Party supplied computer programs
stored in semiconductor memories or other media. Laws in the Italy and other countries
preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted
computer programs, including the exclusive right to copy or reproduce in any form the
copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party
supplied SW computer programs contained in the Telit products described in this
instruction manual may not be copied (reverse engineered) or reproduced in any manner
without the express written permission of Telit or the 3rd Party SW supplier. Furthermore,
the purchase of Telit products shall not be deemed to grant either directly or by
implication, estoppel, or otherwise, any license under the copyrights, patents or patent
applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive,
royalty free license to use that arises by operation of law in the sale of a product.
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USAGE AND DISCLOSURE RESTRICTIONS
I. License Agreements
The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with
the terms of such an agreement.
II. Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language or
computer language, in any form or by any means, without prior written permission of Telit
III. High Risk Materials
Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the
operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air
Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its
supplier(s) specifically disclaim any expressed or implied warranty of fitness for such
High-Risk Activities.
IV. Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.
V. Third Party Rights
The software may include Third Party Right software. In this case you agree to comply
with all terms and conditions imposed on you in respect of such separate software. In
addition to Third Party Terms, the disclaimer of warranty and limitation of liability
provisions in this License shall apply to the Third-Party Right software.
TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED
FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD
PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS
FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND
THE USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE
SOFTWARE, INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF
SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.
NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR
ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR
CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS),
HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER
LEGAL THEORY, ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF
THE OTHER CODE OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER
OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE
FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
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APPLICABILITY TABLE
This documentation applies to the following products:
Table 1: Applicability Table
Module Name Description
LE910C1-NA North America – AT&T with global roaming
LE910C1-NS North America - Sprint variant
LE910C1-AP APAC variant CAT1 variant
LE910C4-AP APAC variant CAT4 variant
LE910C4-EU Europe CAT4 variant
LE910C1-EU Europe CAT1 variant
LE910C4-NF North America CAT4 variant
LE910C1-NF North America CAT1 variant
LE910C1-SA North America CAT1 variant – AT&T
LE910C1-ST North America CAT1 variant – T Mobile
LE910C1-SV North America CAT1 variant – Verizon
LE910C1-LA Latin America CAT1 variant
LE910C4-LA Latin America CAT4 variant
LE910C4-CN China CAT4 variant
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CONTENTS
1. INTRODUCTION .............................................................................................9
Scope ............................................................................................................. 9
Audience......................................................................................................... 9
Contact Information, Support .......................................................................... 9
Text Conventions ...........................................................................................10
Related Documents .......................................................................................11
2. PRODUCT DESCRIPTION ............................................................................ 12
Overview........................................................................................................12
Applications ...................................................................................................13
General Functionality and Main Features.......................................................13
Block Diagram ...............................................................................................16
Environmental Requirements .........................................................................17
2.5.1. Temperature Range .......................................................................................17
2.5.2. RoHS Compliance .........................................................................................17
Operating Frequency Bands ..........................................................................18
2.6.1. RF Bands per Regional Variant .....................................................................18
2.6.2. Reference Table of RF Bands Characteristics ...............................................19
RF Parameters ..............................................................................................22
2.7.1. Sensitivity ......................................................................................................22
2.7.2. Output power .................................................................................................22
Mechanical Specifications ..............................................................................23
2.8.1. Dimensions ....................................................................................................23
2.8.2. Weight ...........................................................................................................23
3. MODULE CONNECTIONS ............................................................................ 24
Pin-out ...........................................................................................................24
Signals That Must Be Connected ...................................................................33
LGA Pads Layout ...........................................................................................35
Backward Compatibility to xE910 Family .......................................................35
4. ELECTRICAL SPECIFICATIONS ................................................................. 37
Absolute Maximum Ratings – Not Operational ...............................................37
Recommended Operating Conditions ............................................................37
Logic Level Specifications ..............................................................................38
4.3.1. 1.8V Pads - Absolute Maximum Ratings ........................................................38
4.3.2. 1.8V Standard GPIOs ....................................................................................38
4.3.3. 1.8V SD Card Pads .......................................................................................39
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4.3.4. 1.8V SIM Card Pads ......................................................................................40
4.3.5. Dual Voltage Pads - Absolute Maximum Ratings ...........................................40
4.3.6. SD Card Pads @ 2.95V .................................................................................40
4.3.7. SIM Card Pads @2.95V.................................................................................41
5. HARDWARE COMMANDS ........................................................................... 42
Turning on the LE910Cx Module ...................................................................42
Initialization and Activation State ...................................................................42
Turning off the LE910Cx Module ...................................................................45
5.3.1. Shutdown by Software Command ..................................................................46
5.3.2. Hardware Shutdown ......................................................................................47
5.3.3. Unconditional Hardware Shutdown ................................................................48
Powering OFF the Module .............................................................................49
Fast Power Down ..........................................................................................50
5.5.1. Fast Shut Down by Hardware ........................................................................50
5.5.2. Fast Shut Down by Software..........................................................................52
6. POWER SUPPLY .......................................................................................... 53
Power Supply Requirements ..........................................................................53
Power Consumption ......................................................................................53
General Design Rules ....................................................................................55
6.3.1. Electrical Design Guidelines ..........................................................................55
6.3.1.1. + 5V Input Source Power Supply – Design Guidelines ...................................55
6.3.1.2. + 12V Input Source Power Supply – Design Guidelines .................................56
6.3.1.3. Battery Source Power Supply – Design Guidelines ........................................57
6.3.2. Thermal Design Guidelines ............................................................................58
6.3.3. Power Supply PCB Layout Guidelines ...........................................................59
7. ANTENNA(S) ................................................................................................ 60
GSM/WCDMA/TD-SCDMA/LTE Antenna Requirements ...............................60
GSM/WCDMA/TD-SCDMA/LTE Antenna – PCB Line Guidelines ..................61
GSM/WCDMA/LTE Antenna – Installation Guidelines....................................62
Antenna Diversity Requirements ....................................................................62
GNSS Antenna Requirements .......................................................................63
7.5.1. Combined GNSS Antenna .............................................................................63
7.5.2. Linear and Patch GNSS Antenna ..................................................................63
7.5.3. Front End Design Considerations ..................................................................64
7.5.4. GNSS Antenna – PCB Line Guidelines ..........................................................64
8. HARDWARE INTERFACES .......................................................................... 66
USB Port........................................................................................................67
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HSIC Interface (Optional) ...............................................................................68
SGMII Interface..............................................................................................68
8.3.1. Ethernet Control interface ..............................................................................68
Serial Ports ....................................................................................................70
8.4.1. Modem Serial Port 1 Signals..........................................................................70
8.4.2. Modem Serial Port 2 ......................................................................................72
8.4.3. RS232 Level Translation ................................................................................72
Peripheral Ports .............................................................................................74
8.5.1. SPI – Serial Peripheral Interface ....................................................................74
8.5.2. I2C - Inter-integrated Circuit ...........................................................................75
8.5.3. SD/MMC Card Interface .................................................................................75
8.5.4. WiFi SDIO Interface .......................................................................................77
Audio Interface ..............................................................................................79
8.6.1. Digital Audio ..................................................................................................79
8.6.1.1. Short Frame Timing Diagrams .......................................................................80
8.6.1.2. Long Frame Timing Diagrams ........................................................................81
General Purpose I/O ......................................................................................83
8.7.1. Using a GPIO Pad as Input ............................................................................85
8.7.2. Using a GPIO Pad as an interrupt / Wakeup source ......................................85
8.7.3. Using a GPIO Pad as Output .........................................................................86
9. MISCELLANEOUS FUNCTIONS .................................................................. 87
Indication of Network Service Availability .......................................................87
Indication of Software Ready .........................................................................88
RTC – Real Time Clock .................................................................................88
VAUX Power Output ......................................................................................88
ADC Converter ..............................................................................................88
9.5.1. Description .....................................................................................................88
9.5.2. Using the ADC Converter ..............................................................................89
Using the Temperature Monitor Function .......................................................89
GNSS Characteristics ....................................................................................90
10. MOUNTING THE MODULE ON YOUR BOARD ........................................... 91
General ..........................................................................................................91
Finishing & Dimensions .................................................................................91
Recommended Footprint for the Application ..................................................94
Stencil ............................................................................................................95
PCB Pad Design ............................................................................................95
Recommendations for PCB Pad Dimensions (mm) ........................................96
Solder Paste ..................................................................................................97
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10.7.1. Solder Reflow ................................................................................................97
10.7.2. Cleaning ........................................................................................................99
11. APPLICATION GUIDE ................................................................................ 100
Debug of the LE910Cx Module in Production .............................................. 100
Bypass Capacitor on Power Supplies .......................................................... 101
SIM Interface ............................................................................................... 102
11.3.1. SIM Schematic Example .............................................................................. 102
EMC Recommendations .............................................................................. 103
Download and Debug Port ........................................................................... 103
11.5.1. Fast Boot mode ........................................................................................... 104
11.5.2. Recovery Boot Mode ................................................................................... 104
12. PACKING SYSTEM .................................................................................... 105
Packing System – Tray ................................................................................ 105
Tape & Reel ................................................................................................. 107
Moisture Sensitivity ...................................................................................... 109
13. SAFETY RECOMMENDATIONS................................................................. 110
14. CONFORMITY ASSESSMENT ISSUES ..................................................... 111
FCC/ISED Regulatory Notices ..................................................................... 111
JTBL Regulatory Notices ............................................................................. 116
15. ACRONYMS ................................................................................................ 117
16. DOCUMENT HISTORY ............................................................................... 120
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1. Introduction
Scope
This document introduces the Telit LE910Cx module and presents possible and
recommended hardware solutions for developing a product based on the LE910Cx
module. All the features and solutions detailed in this document are applicable to all
LE910Cx variants, where “LE910Cx” refers to the variants listed in the applicability table.
If a specific feature is applicable to a specific product only, it will be clearly marked.
NOTE:
LE910Cx refers to all modules listed in the Applicability Table.
This document takes into account all the basic functions of a wireless module; suggests a
valid hardware solution for each function and points out incorrect solutions and common
errors to be avoided.
Obviously, this document cannot embrace every hardware solution or every product that
can be designed. Obviously, avoiding invalid solutions must be considered mandatory.
Where the suggested hardware configurations need not be considered mandatory, the
information given should be used as a guide and a starting point for properly developing
your product with the Telit LE910Cx module.
NOTE:
The integration of the GSM/GPRS/EGPRS/WCDMA/HSPA+/LTE LE910Cx
cellular module within a user application must be done according to the
design rules described in this manual.
Audience
This document is intended for Telit customers, especially system integrators, about to
implement their applications using the Telit LE910Cx module.
Contact Information, Support
For general contact, technical support services, technical questions and report
documentation errors, contact Telit Technical Support at:
TS-EMEA@telit.com
TS-AMERICAS@telit.com
TS-APAC@telit.com
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Alternatively, use:
http://www.telit.com/support
For detailed information about where you can buy the Telit modules or for
recommendations on accessories and components visit:
http://www.telit.com
To register for product news and announcements or for product questions contact Telit’s
Technical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Keep us informed of your comments
and suggestions for improvements.
Telit appreciates feedback from the users of our information.
Text Conventions
The following conventions are used to emphasize specific types of information:
DANGER:
Danger – This information MUST be followed, or catastrophic equipment
failure or bodily injury may occur.
WARNING:
Caution or Warning – Alerts the user to important points about integrating the
module, if these points are not followed, the module and end user equipment
may fail or malfunction.
NOTE:
Tip or Information – Provides advice and suggestions that may be useful
when integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
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Related Documents
Table 2: Related Documents
Document Title Document Number
Ref 1: LE920x4/LE910Cx AT Command User Guide 80490ST10778A
Ref 2: Telit EVB HW User Guide 1VV0301249
Ref 3: LE910Cx Interface Board HW User Guide 1VV0301323
Ref 4: LE910/LE920 Digital Voice Interface Application
Note
Ref 5: Telit_LE920A4_LE910Cx_WiFi_Interface_Application_Note_r1
Ref 6: Antenna Detection Application Note 80000NT10002A
Ref 7: High-Speed Inter-Chip USB Electrical Specification,
version 1.0
(a supplement to the USB 2.0 specification, Section 3.8.2)
Ref 8: ETH_Expansion_board_Application Note 80490NT11622A
80000NT11246A
80490NT11511A
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2. Product Description
Overview
LE910Cx is Telit’s new LTE series for IoT applications.
In its most basic use case, LE910Cx can be applied as a wireless communication frontend for telematics products, offering GNSS and mobile communication features to an
external host CPU through its rich interfaces.
LE910Cx is available in hardware variants as listed in Table 1: Applicability Table. For
differences in the designated RF band sets – refer to Section 2.6.1, RF Bands per
Regional Variant.
NOTE:
(EN) The integration of the LE910Cx cellular module within user application
shall be done according to the design rules described in this manual.
(IT) L’integrazione del modulo cellulare LE910Cx all’interno dell’applicazione
dell’utente dovrà rispettare le indicazioni progettuali descritte in questo
manuale.
(DE) Die Integration des LE910Cx Mobilfunk-Moduls in ein Gerät muß gemäß
der in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen.
(SL) Integracija LE910Cx modula v uporabniški aplikaciji bo morala upoštevati
projektna navodila, opisana v tem priročniku.
(SP) La utilización del modulo LE910Cx debe ser conforme a los usos para
los cuales ha sido deseñado descritos en este manual del usuario.
(FR) L’intégration du module cellulaire LE910Cx dans l’application de
l’utilisateur sera faite selon les règles de conception décrites dans ce manuel.
(HE)
The information presented in this document is believed to be accurate and reliable. However, no
responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of patents
or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent rights of Telit Communications S.p.A. other than for circuitry embodied
in Telit products. This document is subject to change without notice.
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Applications
LE910Cx can be used for telematics applications where tamper-resistance, confidentiality,
integrity, and authenticity of end-user information are required, for example:
Emergency call
Telematics services
Road pricing
Pay-as-you-drive insurance
Stolen vehicles tracking
Internet connectivity
General Functionality and Main Features
The LE910Cx series of cellular modules features an LTE and multi-RAT modem together
with a powerful on-chip application processor and a rich set of interfaces.
The major functions and features are listed below:
Table 3: Features Table
Function Features
Modem
Digital audio
subsystem
Two USIM ports
– dual voltage
Multi-RAT cellular modem for voice and data communication
o LTE FDD Cat1 (Other variants) (10/5Mbps DL/UL).
o Carrier aggregation is not supported
o GSM/GPRS/EDGE
o WCDMA up to DC HSPA+, Rel.9
Support for SIM profile switching
Regional variants with optimal choice of RF bands for
worldwide coverage of countries and MNOs
State-of-the-art GNSS solution with
GPS/GLONASS/BeiDou/Galileo/QZSS receiver
PCM/I2S digital audio interface
Up to 48 kHz sample rate, 16-bit words
Class B and Class C support
Hot swap support
Clock rates up to 5 MHz
Application
processor
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Application processor to run customer application code
32-bit ARM Cortex-A7 up to 1.3 GHz running the Linux
operating system
Flash + DDR are large enough to allow for customer’s own
software applications
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Function Features
Interfaces Rich set of interfaces, including:
SD/MMC Card Interface supporting SD3.0 standard
SDIO for external WiFi transceiver supporting SDIO3.0
standard
SGMII for external Ethernet transceiver
o Compliant with IEEE802.3
o Full duplex operation at 1 Gbps
o Half/full duplex operation at 10/100 Mbps
o Support for VLAN tagging
o Support for IEEE1588, PTP (Precision Time Protocol)
USB2.0 – USB port is typically used for:
o Flashing of firmware and module configuration
o Production testing
o Accessing the Application Processor’s file system
o AT command access
o High-speed WWAN access to external host
o Diagnostic monitoring and debugging
o NMEA data to an external host CPU
HSIC (Optional)
o High-speed 480 Mbps (240 MHz DDR) USB transfers are
100% host driver compatible with traditional USB cable
connected topologies
o Bidirectional data strobe signal (STROBE)
o Bidirectional data signal (DATA)
o No power consumption unless a transfer is in progress
o Maximum trace length 10 cm
o Signals driven at 1.2V standard LVCMOS levels
Peripheral Ports – SPI, I2C, UART
GPIOs
Antenna ports
Form factor Form factor (28x28mm), accommodating the multiple RF bands in
each region variant
Environment
and quality
The entire module is designed and qualified by Telit for satisfying the
environment and quality requirements.
requirements
Single supply
The module generates all its internal supply voltages.
module
RTC No dedicated RTC supply, RTC is supplied by VBATT
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Function Features
Operating
temperature
Range -40 °C to +85 °C (conditions as defined in Section 2.5.1,
Temperature Range).
NOTE:
The following interfaces are unique for the LE910Cx and may not be
supported on other (former or future) xE910 family. Special care must be
taken when designing the application board if future compatibility is required:
- SGMII for Ethernet connectivity
- SDIO for WIFI connectivity
- SD/MMC for SD Card connectivity
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Block Diagram
Figure 1 shows an overview of the internal architecture of the LE910Cx module.
It includes the following sub-functions:
Application processor, Modem subsystem and Location processing with their
external interfaces. These three functions are contained in a single SOC.
RF front end and antenna ports.
Digital Audio interface for external codec.
Rich IO interfaces. Depending on which LE910Cx software features are enabled,
some of its interfaces that are exported due to multiplexing may be used internally
and thus may not be usable by the application.
PMIC with the RTC function inside
Figure 1: LE910Cx Block Diagram
GNSS_Sync
GNSS Antennna
LOCATION
JTAG
MEMORIES
MODEM
APPLICATION
PROCESSOR
HSICI2C USB2.0SGMIISPI
UART
GPIO
RF
FRONTEND
PMIC
RTC
2xSDIO
SIM
PCM In/out
VBATT_PA
Cellular antenna 1
Cellular antenna 2
VBATT
ADC
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Environmental Requirements
2.5.1. Temperature Range
Operating
temperature
range
Storage and nonoperating
temperature
range
-40 ~ +85°C Ambient.
Temperatures outside of the range –20°C ÷ +55°C might slightly
deviate from ETSI specifications. The module is fully functional,
able to make and receive voice calls, data calls, SMS and GPRS
traffic.
–40°C ~ +90°C
2.5.2. RoHS Compliance
As a part of the Telit corporate policy of environmental protection, the LE910Cx complies
with the RoHS (Restriction of Hazardous Substances) directive of the European Union
(EU directive 2011/65/EU).
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Operating Frequency Bands
The operating frequencies in GSM850, EGSM900, DCS1800, PCS1900, WCDMA & LTE
modes conform to the 3GPP specifications.
2.6.1. RF Bands per Regional Variant
Table 4 summarizes all region variants within the LE910Cx family, showing the supported
band sets in each variant.
Table 4: RF Bands per Regional Variant
Region
Variant
LE910C1-NA 2, 3, 5, 8 1, 2, 4, 5, 8 2, 4, 12 - -
LE910C1-NS - - 2, 4, 5, 12, 25, 26 - -
LE910C1-AP - 1, 5, 6, 8, 19
LE910C4-AP - 1, 5, 6, 8, 19
LE910C4-EU 3, 8 1, 3, 8 1, 3, 7, 8, 20, 28A - -
LE910C1-EU 3, 8 1, 3, 8 1, 3, 7, 8, 20, 28A - -
LE910C4-NF - 2, 4, 5
LE910C1-NF - 2, 4, 5
LE910C1-SA - - 2, 4, 12, 14, 66 - -
2G HSPA+ LTE FDD LTE TDD TD-SCDMA
1, 3, 5, 8, 9, 18, 19,
26, 28
1, 3, 5, 8, 9, 18, 19,
26, 28
2, 4, 5, 12, 13, 14,
66, 71
2, 4, 5, 12, 13, 14,
66, 71
- -
- -
- -
- -
LE910C1-ST - - 2, 4, 12, 66, 71 - -
LE910C1-SV - - 4, 13 - -
LE910C1-LA 2, 3, 5, 8 1, 2, 4, 5 1, 2, 3, 4, 5, 7, 28 - -
LE910C4-LA 2, 3, 5, 8 1, 2, 4, 5 1, 2, 3, 4, 5, 7, 28 - -
LE910C4-CN 3, 8 1, 8 1, 3, 5, 8, 38, 39,
40, 41M
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2.6.2. Reference Table of RF Bands Characteristics
Table 5: RF Bands Characteristics
Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels
PCS 1900 1850.2 ~ 1909.8 1930.2 ~ 1989.8 512 ~ 810 80 MHz
DCS 1800 1710 ~ 1785 1805 ~ 1880 512 ~ 885 95 MHz
GSM 850 824.2 ~ 848.8 869.2 ~ 893.8 128 ~ 251 45 MHz
890 ~ 915 935 ~ 960 0 ~ 124 45 MHz
EGSM 900
880 ~ 890 925 ~ 935 975 ~ 1023 45 MHz
Tx: 9612 ~ 9888
WCDMA 2100 – B1 1920 ~ 1980 2110 ~ 2170
Rx: 10562 ~ 10838
Tx: 9262 ~ 9538
WCDMA 1900 – B2 1850 ~ 1910 1930 ~ 1990
Rx: 9662 ~ 9938
Tx: 937 ~ 1288
WCDMA 1800 – B3 1710 ~ 1785 1805 ~ 1880
Rx: 1162 ~ 1513
Tx: 1312 ~ 1513
WCDMA AWS – B4 1710 ~ 1755 2110 ~ 2155
Rx: 1537 ~ 1738
Tx-Rx
Offset
190 MHz
80 MHz
95 MHz
400 MHz
WCDMA 850 – B5 824 ~ 849 869 ~ 894
WCDMA 900 – B8 880 ~ 915 925 ~ 960
WCDMA 1800 – B9 1750 ~ 1784.8 1845 ~ 1879.8
WCDMA 800 – B19 830 ~ 845 875 ~ 890
TDS CDMA 2000 – B34 2010 ~ 2025 2010 ~ 2025
TDS CDMA 1900 – B39 1880 ~ 1920 1880 ~ 1920
LTE 2100 – B1 1920 ~ 1980 2110 ~ 2170
Tx: 4132 ~ 4233
45 MHz
Rx: 4357 ~ 4458
Tx: 2712 ~ 2863
45 MHz
Rx: 2937 ~ 3088
Tx: 8762 ~ 8912
95 MHz
Rx: 9237 ~ 9387
Tx: 312 ~ 363
45 MHz
Rx: 712 ~ 763
Tx: 10054 ~ 10121
0 MHz
Rx: 10054 ~ 10121
Tx: 9404 ~ 9596
0 MHz
Rx: 9404 ~ 9596
Tx: 18000 ~ 18599
190 MHz
Rx: 0 ~ 599
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Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels
LTE 1900 – B2 1850 ~ 1910 1930 ~ 1990
LTE 1800 – B3 1710 ~ 1785 1805 ~ 1880
LTE AWS – B4 1710 ~ 1755 2110 ~ 2155
LTE 850 – B5 824 ~ 849 869 ~ 894
LTE 2600 – B7 2500 ~ 2570 2620 ~ 2690
LTE 900 – B8 880 ~ 915 925 ~ 960
LTE 1800 – B9 1749.9 ~ 1784.9 1844.9 ~ 1879.9
Tx-Rx
Offset
Tx: 18600 ~ 19199
80 MHz
Rx: 600 ~ 1199
Tx: 19200 ~ 19949
95 MHz
Rx: 1200 ~ 1949
Tx: 19950 ~ 20399
400 MHz
Rx: 1950 ~ 2399
Tx: 20400 ~ 20649
45 MHz
Rx: 2400 ~ 2649
Tx: 20750 ~ 21449
120 MHz
Rx: 2750 ~ 3449
Tx: 21450 ~ 21799
45 MHz
Rx: 3450 ~ 3799
Tx: 21800 ~ 2149
95 MHz
Rx: 3800 ~ 4149
LTE AWS+ – B10 1710 ~ 1770 2110 ~ 2170
LTE 700a – B12 699 ~ 716 729 ~ 746
LTE 700c – B13 777 ~ 787 746 ~ 756
LTE 700PS – B14 788 ~ 798 758 ~ 768
LTE 700b – B17 704 ~ 716 734 ~ 746
LTE 800 – B19 830 ~ 845 875 ~ 890
LTE 800 – B20 832 ~ 862 791 ~ 821
LTE 1500 – B21 1447.9 ~ 1462.9 1495.9 ~ 1510.9
Tx: 22150 ~ 22749
400 MHz
Rx: 4150 ~ 4749
Tx: 23010 ~ 23179
30 MHz
Rx: 5010 ~ 5179
Tx: 23180 ~ 23279
-31 MHz
Rx: 5180 ~ 5279
Tx: 23280 ~ 23379
-30 MHz
Rx: 5280 ~ 5379
Tx: 23730 ~ 23849
30 MHz
Rx: 5730 ~ 5849
Tx: 24000 ~ 24149
45 MHz
Rx: 6000 ~ 6149
Tx: 24150 ~ 24449
-41 MHz
Rx: 6150 ~ 6449
Tx: 24450 ~ 24599
48 MHz
Rx: 6450 ~ 6599
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Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels
LTE 1900+ – B25 1930 ~ 1995 1850 ~ 1915
LTE 850+ – B26 814 ~ 849 859 ~ 894
LTE 700 – B28A 703 ~ 733 758 ~ 788
LTE 700 – B28 703 ~ 748 758 ~ 803
LTE AWS-3 – B66 1710 ~ 1780 2210 ~ 2200
LTE600 – B71 663 ~ 698 617 ~ 652
LTE TDD 2600 – B38 2570 ~ 2620 2570 ~ 2620
Tx: 26040 ~ 26689
Rx: 8040 ~ 8689
Tx: 26690 ~ 27039
Rx: 8690 ~ 9039
Tx: 27210 ~ 27510
Rx: 9210 ~ 9510
Tx: 27210 ~ 27659
Rx: 9210 ~ 9659
Tx: 131972-132671
Rx: 66436-67335
Tx: 133122-133471
Rx: 68568-68935
Tx: 37750 ~ 38250
Rx: 37750 ~ 38250
Tx-Rx
Offset
80 MHz
45 MHz
55 MHz
55 MHz
400 MHz
46 MHz
0 MHz
LTE TDD 1900 – B39 1880 ~ 1920 1880 ~ 1920
LTE TDD 2300 – B40 2300 ~ 2400 2300 ~ 2400
LTE TDD 2500 – B41M 2555 ~ 2655 2555 ~ 2655
Tx: 38250 ~ 38650
0 MHz
Rx: 38250 ~ 38650
Tx: 38650 ~ 39650
0 MHz
Rx: 38650 ~ 39650
Tx: 40265 ~ 41215
0 MHz
Rx: 40265 ~ 41215
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RF Parameters
2.7.1. Sensitivity
Typical sensitivity levels are as follows:
-108 dBm @ 2G
-112 dBm @ 3G
-102 dBm @ 4G FDD (BW=5 MHz)
2.7.2. Output power
Typical values for Max output level are as follow:
2G:
- LB: 32.5dBm ±0.5dBm
- HB: 29.5dBm ±0.5dBm
3G/TD-SCDMA: 23.5dBm ±0.5dBm
4G (FDD & TDD): 23dBm ±0.5dBm @1RB
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Mechanical Specifications
2.8.1. Dimensions
The module’s overall dimensions are:
Length: 28.2 mm, +/- 0.15 mm tolerance
Width: 28.2 mm, +/- 0.15 mm tolerance
Thickness: 2.2 mm, +/- 0.15 mm tolerance
NOTE:
LE910C1-SV’s thickness is only 2.3mm, +/- 0.15 mm tolerance.
NOTE:
Consider a typical label thickness of 0.1 mm in addition to the module
thickness.
2.8.2. Weight
The nominal weight of the LE910Cx module is 9.0 gram.
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3. Module Connections
Pin-out
Table 6: Pin-out
PAD Signal I/O Function Type Comment
USB HS 2.0 Communication Port
B15 USB_D+ I/O USB differential Data (+)
C15 USB_D- I/O USB differential Data (-)
A13 USB_VBUS AI
A14 USB_ID AI USB ID
Asynchronous UART
N15 C103/TXD I
M15 C104/RXD O Serial data output to DTE 1.8V
L14 C105/RTS I
P15 C106/CTS O
P14 C107/DSR O
M14 C108/DTR I
N14 C109/DCD O
Power sense for the internal
USB transceiver
Serial data input (TXD) from
DTE
Input for Request to send
signal (RTS) from DTE
Output for Clear to send signal
(CTS) to DTE
Output for Data Set Ready
(DSR) to DTE
Input for Data Terminal Ready
(DTR) from DTE
Output for Data Carrier Detect
(DCD) to DTE
Power
1.8V
1.8V
1.8V
1.8V
1.8V
1.8V
See note
below
Alternate Fn
GPIO_32
Alternate Fn
GPIO_34
Alternate Fn
GPIO_33
R14 C125/RING O
SPI – Serial Peripheral Interface / AUX UART
F15 SPI_CLK O SPI Clock output 1.8V
E15 SPI_MISO/ RX_AUX I
D15 SPI_MOSI/TX_AUX O
H14 SPI_CS/GPIO11 O
Output for Ring Indication (RI)
to DTE
SPI data Master Input Slave
output / RX_AUX
SPI data Master Output Slave
input/ TX_AUX
SPI Chip select output /
GPIO11
1.8V
1.8V
1.8V
1.8V
Alternate Fn
GPIO_31
See note
below
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PAD Signal I/O Function Type Comment
SD/MMC Card Digital I/O
J12 SD/MMC_CMD O SD Command 1.8/2.95V
F12 SD/MMC_CLK O SD Card Clock 1.8/2.95V
E12 SD/MMC_DATA0 I/O SD Serial Data 0 1.8/2.95V
G12 SD/MMC_DATA1 I/O SD Serial Data 1 1.8/2.95V
K12 SD/MMC_DATA2 I/O SD Serial Data 2 1.8/2.95V
H12 SD/MMC_DATA3 I/O SD Serial Data 3 1.8/2.95V
G13 SD/MMC_CD I SD card detect input 1.8V Active Low
F13 VMMC -
WiFi (SDIO) Interface
N13 WiFi_SD_CMD O Wi-Fi SD Command 1.8V
L13 WiFi_SD_CLK O Wi-Fi SD Clock 1.8V
J13 WiFi_SD_DATA0 I/O Wi-Fi SD Serial Data 0 1.8V
M13 WiFi_SD_DATA1 I/O Wi-Fi SD Serial Data 1 1.8V
K13 WiFi_SD_DATA2 I/O Wi-Fi SD Serial Data 2 1.8V
H13 WiFi_SD_DATA3 I/O Wi-Fi SD Serial Data 3 1.8V
L12 WiFi_SDRST O
M11 WLAN_SLEEP_CLK O Wi-Fi Sleep clock output 1.8V
M10 RFCLK2_QCA O
LTE-WiFi Coexistence
Power supply for MMC card
pull-up resistors
Wi-Fi Reset / Power enable
control
Wi-Fi low noise RF clock
output
1.8/2.95V
1.8V Active Low
1.8V
M8 WCI_TX O
M9 WCI_RX I
SIM Card Interface 1
A6 SIMCLK1 O External SIM 1 signal – Clock 1.8/2.85V
A7 SIMRST1 O External SIM 1 signal – Reset 1.8/2.85V
Wireless coexistence interface
TXD
Wireless coexistence interface
RXD
1.8V
1.8V
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PAD Signal I/O Function Type Comment
A5 SIMIO1 I/O
A4 SIMIN1 I
A3 SIMVCC1 -
SIM Card Interface 2
C1 SIMCLK2 O External SIM 2 signal – Clock 1.8/2.85V
D1 SIMRST2 O External SIM 2 signal – Reset 1.8/2.85V
C2 SIMIO2 I/O
G4 SIMIN2 I
D2 SIMVCC2 -
Digital Voice Interface (DVI)
External SIM 1 signal - Data
I/O
External SIM 1 signal Presence
External SIM 1 signal – Power
supply for SIM 1
External SIM 2 signal – Data
I/O
External SIM 2 signal –
Presence
External SIM 2 signal – Power
supply for SIM 2
1.8/2.85V
1.8V Active low
1.8/2.85V
1.8/2.85V
1.8V Active low
1.8/2.85V
Internally PU
10 kΩ to
SIMVCC1
Internally PU
10kΩ to
SIMVCC2
B9 DVI_WAO O
B6 DVI_RX I Digital Voice interface (Rx) 1.8V
B7 DVI_TX O Digital Voice interface (Tx) 1.8V
B8 DVI_CLK O
B12 REF_CLK O
General Purpose Digital I/O
C8 GPIO_01 I/O GPIO_01 / STAT_LED 1.8V
C9 GPIO_02 I/O GPIO_02 1.8V
C10 GPIO_03 I/O GPIO_03 1.8V
C11 GPIO_04 I/O GPIO_04 1.8V
Digital Voice interface (WAO
master output)
Digital Voice interface (CLK
master output)
Reference clock for external
Codec
1.8V
1.8V
1.8V
See Note
below
Alternate Fn
I2C
Alternate Fn
I2C
Alternate Fn
I2C
Alternate Fn
I2C
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PAD Signal I/O Function Type Comment
B14 GPIO_05 I/O GPIO_05 1.8V
C12 GPIO_06 I/O GPIO_06 1.8V
C13 GPIO_07 I/O GPIO_07 1.8V
K15 GPIO_08 I/O GPIO_08 / SW_RDY 1.8V
L15 GPIO_09 I/O GPIO_09 1.8V
G15 GPIO_10 I/O GPIO_10 1.8V
RF Section
K1 Antenna I/O
F1 ANT_DIV I
GPS Section
GSM/EDGE/UMTS/LTE Main
antenna (50 Ohm)
UMTS/LTE antenna diversity
input (50 Ohm)
RF
RF
Alternate Fn
I2C
Alternate Fn
I2C
Alternate Fn
I2C
Alternate Fn
I2C
Alternate Fn
I2C
Alternate Fn
I2C
R9 ANT_GPS I GPS antenna (50 Ohm) RF
R7 GPS_LNA_EN O
N9 GPS_SYNC O
Miscellaneous Functions
R12 ON_OFF_N I Power ON / Power OFF input Active low
R13 HW_SHUTDOWN_N I Unconditional Shutdown input Active low
R11 VAUX/PWRMON O
E13 VIO_1V8 O
B1 ADC_IN1 AI
H4 ADC_IN2 AI
Enables the external regulator
for GPS LNA
GPS sync signal for Dead
Reckoning
Supply output for external
accessories /
Power ON monitor
IO voltage for internal ICs
It should be turned off
Analog/Digital Converter Input
1
Analog/Digital Converter Input
2
1.8V
1.8V
1.8V
1.8V
Analog
Analog
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PAD Signal I/O Function Type Comment
D7 ADC_IN3 AI
SGMII Interface
E4 SGMII_RX_P AI SGMII receive – plus PHY
F4 SGMII_RX_M AI SGMII receive – minus PHY
D5 SGMII_TX_P AO SGMII transmit – plus PHY
D6 SGMII_TX_M AO SGMII transmit - minus PHY
HSIC Interface
A12 HSIC_DATA I/O
A11 HSIC_STB I/O
I2C Interface
B11 I2C_SCL I/O I2C clock 1.8V
Analog/Digital Converter Input
3
High-speed inter-chip interface
- data
High-speed inter-chip interface
- strobe
Analog
1.2V Optional
1.2V Optional
Internally PU
2.2kΩ to 1.8V
B10 I2C_SDA I/O I2C Data 1.8V
Power Supply
M1 VBATT -
M2 VBATT -
N1 VBATT_PA -
N2 VBATT_PA -
P1 VBATT_PA -
P2 VBATT_PA -
A2 GND - Ground
B13 GND Ground
Main Power Supply (Digital
Section)
Main Power Supply (Digital
Section)
Main Power Supply (RF
Section)
Main Power Supply (RF
Section)
Main Power Supply (RF
Section)
Main Power Supply (RF
Section)
Power
Power
Power
Power
Power
Power
Internally PU
2.2kΩ to 1.8V
D4 GND - Ground
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PAD Signal I/O Function Type Comment
E1 GND - Ground
E2 GND - Ground
E14 GND - Ground
F2 GND - Ground
G1 GND - Ground
G2 GND - Ground
G7 GND - Ground
G8 GND - Ground
G9 GND - Ground
H1 GND - Ground
H2 GND - Ground
H7 GND - Ground
H8 GND - Ground
H9 GND - Ground
J1 GND - Ground
J2 GND - Ground
J7 GND - Ground
J8 GND - Ground
J9 GND - Ground
K2 GND - Ground
L1 GND - Ground
L2 GND - Ground
M3 GND - Ground
M4 GND - Ground
M12 GND - Ground
N3 GND - Ground
N4 GND - Ground
N5 GND - Ground
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PAD Signal I/O Function Type Comment
N6 GND - Ground
P3 GND - Ground
P4 GND - Ground
P5 GND - Ground
P6 GND - Ground
P8 GND - Ground
P9 GND - Ground
P10 GND - Ground
P13 GND - Ground
R2 GND - Ground
R3 GND - Ground
R5 GND - Ground
R6 GND - Ground
R8 GND - Ground
R10 GND - Ground
Reserved
A8 Reserved - Reserved
A9 Reserved - Reserved
A10 Reserved - Reserved
B2 Reserved - Reserved
B3 Reserved - Reserved
B4 Reserved - Reserved
B5 Reserved - Reserved
C3 Reserved - Reserved
C4 Reserved - Reserved
C5 Reserved - Reserved
C6 Reserved - Reserved
C7 Reserved - Reserved
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