Telit Communications S p A HE920NA User Manual
HE920
Hardware User Guide
1VV0301014 Rev.5 – 2013-03-21
HE920 Hardware User Guide
1VV0301014 Rev.5 – 2013-03-21
APPLICABILITY TABLE
PRODUCT
HE920-EU
HE920-NA
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HE920 Hardware User Guide
1VV0301014 Rev.5 – 2013-03-21
SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Notice
While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been carefully
checked and is believed to be entirely reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products described
herein and reserves the right to revise this document and to make changes from time to time
in content hereof with no obligation to notify any person of revisions or changes. Telit does
not assume any liability arising out of the application or use of any product, software, or
circuit described herein; neither does it convey license under its patent rights or the rights of
others.
It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in your
country. Such references or information must not be construed to mean that Telit intends to
announce such Telit products, programming, or services in your country.
Copyrights
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed
to grant either directly or by implication, estoppel, or otherwise, any license under the
copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a
product.
Computer Software Copyrights
The Telit and 3rd Party supplied Software (SW) products described in this instruction manual
may include copyrighted Telit and other 3rd Party supplied computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer
programs, including the exclusive right to copy or reproduce in any form the copyrighted
computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW
computer programs contained in the Telit products described in this instruction manual may
not be copied (reverse engineered) or reproduced in any manner without the express written
permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products
shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any
license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied
SW, except for the normal non-exclusive, royalty free license to use that arises by operation
of law in the sale of a product.
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HE920 Hardware User Guide
1VV0301014 Rev.5 – 2013-03-21
Usage and Disclosure Restrictions
License Agreements
The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with the
terms of such an agreement.
Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or computer language,
in any form or by any means, without prior written permission of Telit
High Risk Materials
Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the operation
of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic
Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s)
specifically disclaim any expressed or implied warranty of fitness for such High Risk
Activities.
Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.
Copyright © Telit Communications S.p.A. 2012.
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HE920 Hardware User Guide
1VV0301014 Rev.5 – 2013-03-21
Contents
1. Introduction ............................................................................................................. 9
1.1. Scope ............................................................................................................................ 9
1.2. Audience ....................................................................................................................... 9
1.3. Contact Information, Support ...................................................................................... 9
1.4. Document Organization ............................................................................................. 10
1.5. Text Conventions ........................................................................................................ 11
1.6. Related Documents ................................................................................................... 11
2. General Product Description .................................................................................. 12
2.1. Overview ..................................................................................................................... 12
2.2. HE920 Mechanical Dimensions ................................................................................. 13
2.3. Weight ........................................................................................................................ 13
2.4. Environmental requirements .................................................................................... 14
2.4.1. Temperature range .......................................................................................................... 14
2.4.2. RoHS compliance ............................................................................................................. 14
2.5. Operating Frequency ................................................................................................. 15
3. HE920 Module Connections .................................................................................... 16
3.1. PIN-OUT ..................................................................................................................... 16
3.1.1. LGA Pads Layout ............................................................................................................... 23
4. Hardware Commands ............................................................................................ 24
4.1. Turning ON the HE920 ............................................................................................... 24
4.2. Initialization and Activation state ............................................................................... 24
4.3. Turning OFF the HE920 .............................................................................................. 26
4.3.1. Shutdown by Software Command .................................................................................... 27
4.3.2. Hardware Shutdown ......................................................................................................... 28
4.4. Hardware Unconditional Restart (RESET) ................................................................. 29
4.5. Hardware Unconditional Shutdown (Power Off) ....................................................... 30
4.6. Summary of Turning ON and OFF the module .......................................................... 31
5. Power Supply ......................................................................................................... 32
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5.1. Power Supply Requirements ..................................................................................... 32
5.2. General Design Rules ................................................................................................ 34
5.2.1. Electrical Design Guidelines ............................................................................................ 34
5.2.1.1. + 5V Input Source Power Supply Design Guidelines ................................................ 34
5.2.1.2. + 12V Input Source Power Supply Design Guidelines .............................................. 35
5.2.1.3. Battery Source Power Supply Design Guidelines .................................................... 37
5.2.2. Thermal Design Guidelines .............................................................................................. 38
5.2.3. Power Supply PCB Layout Guidelines ............................................................................. 39
6. Antenna(s) .............................................................................................................. 41
6.1. GSM/WCDMA Antenna Requirements ....................................................................... 41
6.2. GSM/WCDMA Antenna – PCB line Guidelines ........................................................... 42
6.3. GSM/WCDMA Antenna – Installation Guidelines ...................................................... 43
6.4. Antenna Diversity Requirements ............................................................................... 43
6.5. GPS/GNSS Antenna Requirements ........................................................................... 44
6.5.1. Combined GPS/GNSS Antenna ........................................................................................ 44
6.5.2. Linear and Patch GPS/GNSS Antenna ............................................................................. 44
6.5.3. LNA and Front End Design Considerations ..................................................................... 44
6.5.4. GPS/GNSS Antenna - PCB Line Guidelines ..................................................................... 46
6.5.5. GPS/GNSS Antenna – Installation Guidelines ................................................................. 47
7. Logic Level Specifications ...................................................................................... 48
7.1. Reset Signal(Module Restart) .................................................................................... 49
8. USB Port ................................................................................................................ 50
9. Serial Ports ............................................................................................................ 51
9.1. Modem Serial Port 1 .................................................................................................. 52
9.2. Modem Serial Port 2 .................................................................................................. 53
9.3. RS232 Level Translation ............................................................................................ 53
10. Audio Section Overview ....................................................................................... 55
10.1. Analog Audio (TBD) ................................................................................................. 55
10.2. Digital Audio ........................................................................................................... 55
10.2.1. CODEC Example ............................................................................................................... 55
11. General Purpose I/O............................................................................................ 56
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11.1. Logic Level Specifications ...................................................................................... 57
11.2. Using a GPIO Pad as Input ...................................................................................... 57
11.3. Using a GPIO Pad as Output ................................................................................... 58
11.4. Using the Temperature Monitor Function ............................................................. 59
11.4.1. Short Description.............................................................................................................. 59
11.5. Indication of Network Service Availability .............................................................. 59
11.6. RTC Bypass Out ...................................................................................................... 60
11.7. VAUX Power Output ................................................................................................ 60
12. DAC and ADC section .......................................................................................... 61
12.1. DAC Converter ........................................................................................................ 61
12.1.1. Description ........................................................................................................................ 61
12.1.2. Enabling DAC .................................................................................................................... 61
12.1.3. Low Pass Filter Example ................................................................................................. 62
12.2. ADC Converter ........................................................................................................ 62
12.2.1. Description ........................................................................................................................ 62
12.2.2. Using ADC Converter ........................................................................................................ 62
13. Mounting the module on your board ................................................................... 63
13.1. General ................................................................................................................... 63
13.2. Module Finishing & Dimensions ............................................................................ 64
13.3. Recommended foot print for the application ......................................................... 65
13.4. Stencil ..................................................................................................................... 66
13.5. PCB Pad Design ...................................................................................................... 66
13.6. Recommendations for PCB Pad Dimensions (mm) ............................................... 66
13.7. Solder Paste ........................................................................................................... 68
13.7.1. Solder Reflow ................................................................................................................... 68
14. Application guide ................................................................................................ 69
14.1. Debug of the HE920 in production ......................................................................... 69
14.2. Bypass capacitor on Power supplies ..................................................................... 70
14.3. SIM interface .......................................................................................................... 70
14.4. EMC recommendations .......................................................................................... 71
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14.5. Download and Debug Port ...................................................................................... 72
15. Packing system (TBD) ......................................................................................... 73
15.1. Tray Drawing (TBD) ................................................................................................ 73
15.2. Moisture Sensibility ................................................................................................ 73
16. Conformity Assessment Issues ........................................................................... 74
16.1. 1999/5/EC Directive ................................................................................................ 74
16.2. FCC/IC Regulatory notices ........................................................................................ 76
17. Safety Recommendations .................................................................................... 78
18. Document History ............................................................................................... 79
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1. Introduction
1.1. Scope
The aim of this document is the description of some hardware solutions useful for developing
a product with the Telit HE920-EU/NA module. All the features and solutions detailed are
applicable to all HE920, whereas “HE920” is intended the modules listed in the applicability
table.
When a specific feature is applicable to a specific product, it will be clearly highlighted.
1.2. Audience
HE920 Hardware User Guide
1VV0301014 Rev.5 – 2013-03-21
This document is intended for Telit customers, who are integrators, about to implement their
applications using our HE920
module.
1.3. Contact Information, Support
For general contact, technical support, to report documentation errors and to order manuals,
contact Telit’s Technical Support Center (TTSC) at:
TS-EMEA@telit.com
TS-NORTHAMERICA@telit.com
TS-LATINAMERICA@telit.com
TS-APAC@telit.com
Alternatively, use:
http://www.telit.com/en/products/technical-support-center/contact.php
For detailed information about where you can buy the Telit modules or for recommendations
on accessories and components visit:
http://www.telit.com
To register for product news and announcements or for product questions contact Telit’s
Technical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Keep us informed of your comments and
suggestions for improvements.
Telit appreciates feedback from the users of our information.
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1.4. Document Organization
This document contains the following chapters:
HE920 Hardware User Guide
1VV0301014 Rev.5 – 2013-03-21
Chapter 1: “Introduction”
support information, and text conventions.
Chapter 2: “General Product Description”
Chapter 3: “HE920 Module Connections”
Chapter 4: “Hardware Commands”
Chapter 5: “Power Supply”
Chapter 6: “Antenna”
parts in the full product design
Chapter 7: “Logic Level specifications”
logic levels for this module.
Chapter 8: “USB Port”
Chapter 9: “Serial Ports”
Chapter 10: “Audio Section Overview”
Chapter 11: “General Purpose I/O”
Chapter 12 “DAC and ADC Section”
Chapter 13: “Mounting the module on your board”
Chapter 14: “Application Guides”
Chapter 15: “Packing System”
Chapter 16: “Conformity Assessments Issues”
Chapter 17: “Safety Recommendations”
Chapter 18: “Document History”
provides a scope for this document, target audience, contact and
gives an overview of the features of the product.
deals with the pin out configuration and layout.
How to control the module via hardware
deals on supply and consumption.
The antenna connection and board layout design are the most important
Specific values adopted in the implementation of
How the general purpose I/O pads can be configured.
Deals with these two kind of converters.
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1.5. Text Conventions
Danger – This information MUST be followed or catastrophic equipment failure or bodily
injury may occur.
Caution or Warning – Alerts the user to important points about integrating the module, if
these points are not followed, the module and end user equipment may fail or malfunction.
Tip or Information – Provides advice and suggestions that may be useful when
integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
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1VV0301014 Rev.5 – 2013-03-21
1.6. Related Documents
• HE920-EU/NA Product Description, 80404ST10112A
• HE920-EU/NA Software User guide, 1vv0301015
• HE920-EU/NA AT command reference guide, TBD
• HE920-EU/NA Digital Voice Interface Application Note, TBD
• Telit EVK2 User Guide, 1vv0300704
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2. General Product Description
2.1. Overview
The aim of this document is the description of some hardware solutions useful for developing
a product with the Telit HE920 module.
In this document all the basic functions of a mobile phone will be taken into account; for each
one of them a proper hardware solution will be suggested and eventually the wrong solutions
and common errors to be avoided will be evidenced. Obviously this document cannot
embrace the whole hardware solutions and products that may be designed. The wrong
solutions to be avoided must be considered as mandatory, while the suggested hardware
configurations must not be considered mandatory, instead the information given must be used
as a guide and a starting point for properly developing your product with the Telit HE920
module.
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.
NOTICE:
The integration of the GSM/GPRS/EGPRS/WCDMA/HSPA+ HE920 cellular module within
user application must be done according to the design rules described in this manual.
The information presented in this document is believed to be accurate and reliable. However,
no responsibility is assumed by Telit Communication S.p.A. for its use, such as any
infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent rights of Telit Communication
S.p.A. other than for circuitry embodied in Telit products. This document is subject to change
without notice.
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2.2. HE920 Mechanical Dimensions
The Telit HE920 module overall dimensions are:
• Length: 34 mm
• Width: 40 mm
• Thickness: 2.8 mm
2.3. Weight
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1VV0301014 Rev.5 – 2013-03-21
The module weight of HE920-EU/NA is about 9.0 gram.
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2.4. Environmental requirements
2.4.1. Temperature range
–20°C ~ +55°C The module is fully functional(*) in all the
Operating Temperature
Range
–40°C ~ +85°C The module is fully functional(*) in all the
HE920 Hardware User Guide
1VV0301014 Rev.5 – 2013-03-21
Note
temperature range, and it fully meets the ETSI
specifications.
temperature range. Temperatures outside of
the range –20°C ÷ +55°C might slightly
deviate from ETSI specifications.
Storage and non-operating
Temperature Range
(*)Functional: the module is able to make and receive voice calls, data calls and SMS.
2.4.2. RoHS compliance
As a part of Telit corporate policy of environmental protection, the HE920 complies with the
RoHS (Restriction of Hazardous Substances) directive of the European Union (EU directive
2002/95/EG).
–40°C ~ +90°C
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2.5. Operating Frequency
The operating frequencies in GSM850, EGSM900, DCS1800, PCS1900, WCDMA modes are
conformed to the 3GPP specifications.
Mode Freq. TX (MHz) Freq. RX (MHz) Channels TX - RX offset
GSM850 824.2 ~ 848.8 869.2 ~ 893.8 128 ~ 251 45 MHz
890.0 ~ 914.8 935.0 ~ 959.8 0 ~ 124 45 MHz
EGSM900
880.2 ~ 889.8 925.2 ~ 934.8 975 ~ 1023 45 MHz
DCS1800 1710.2 ~ 1784.8 1805.2 ~ 1879.8 512 ~ 885 95MHz
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PCS1900 1850.2 ~ 1909.8 1930.2 ~ 1989.8 512 ~ 810 80MHz
WCDMA850 826.4 ~ 846.6 871.4 ~ 891.6
WCDMA900
882.4 ~ 912.6 927.4 ~ 957.6
(HE920-EU only)
WCDMA(AWS)
1712.4 ~ 1752.6 2112.4 ~ 2152.6
(HE920-NA only)
WCDMA1900
1852.4 ~ 1907.6 1932.4 ~ 1987.6
(HE920-NA only)
WCDMA2100
1922.4 ~ 1977.6 2112.4 ~ 2167.6
(HE920-EU only)
Tx: 4132 ~ 4233
45MHz
Rx: 4357 ~ 4458
Tx: 2712 ~ 2863
45MHz
Rx: 2937 ~ 3088
Tx: 1312 ~ 1513
400MHz
Rx: 1537 ~ 1738
Tx: 9262 ~ 9538
80MHz
Rx: 9662 ~ 9938
Tx: 9612 ~ 9888
190MHz
Rx: 10562 ~ 10838
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HE920 Hardware User Guide
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3. HE920 Module Connections
3.1. PIN-OUT
PAD Signal I/O Function Type COMMENT
USB HS 2.0 Communication Port
D19
F19
B19
A18
Asynchronous UART – Prog. / data +HW Flow Control
AH19
AF19
AC18
AA18
AK19
AE18
AG18
AJ18
Asynchronous Auxiliary UART
AB19
AD19
SIM Card Interface
A10
B11
B9
B7
A8
Audio
B5
A4
B3
A2
E2
D1
C2
B1
Digital Voice interface (DVI)
USB_D+ I/O USB differential Data(+)
USB_D- I/O USB differential Data(+)
Analog input used to sense whether a peripheral device
USB_ID(TBD) AI
USB_VBUS AI Power sense for the internal USB transceiver Power
C103/TXD I Serial data input (TXD) from DTE 1.8V
C104/RXD O Serial data output to DTE 1.8V
C108/DTR I Input for Data terminal ready signal (DTR) from DTE 1.8V
C105/RTS I Input for Request to send signal (RTS) from DTE 1.8V
C106/CTS O Output for Clear to send signal (CTS) to DTE 1.8V
C109/DCD O Output for Data carrier detect signal (DCD) to DTE 1.8V
C107/DSR O Output for Data set ready signal (DSR) to DTE 1.8V
C125/RING O Output for Ring indicator signal (RI) to DTE 1.8V
TXD_AUX O Auxillary UART (TX Data to DTE) 1.8V
RXD_AUX I Auxillary UART (RX Data from DTE) 1.8V
SIMCLK O External SIM signal – Clock 1.8/2.85V
SIMRST O External SIM signal – Reset 1.8/2.85V
SIMIO I/O External SIM signal - Data I/O 1.8/2.85V
SIMIN I External SIM signal - Presence (active low) 1.8V
SIMVCC - External SIM signal – Power supply for the SIM 1.8/2.85V
EAR1_MT+ AO Earphone signal output1, phase + Audio
EAR1_MT- AO Earphone signal output1, phase - Audio
MIC1_MT+ AI Mic signal input1, phase + Audio
MIC1_MT- AI Mic signal input1, phase - Audio
EAR2_MT+ AO Earphone signal output2, phase + Audio
EAR2_MT- AO Earphone signal output2, phase - Audio
MIC2_MT+ AI Mic signal input2, phase + Audio
MIC2_MT- AI Mic signal input2, phase - Audio
is connected, and determine the peripheral type, a host
or a peripheral
Analog
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b
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PAD Signal I/O Function Type COMMENT
D11
C8
D9
C10
DVI_WA0 I/O Digital Voice interface (WA0) 1.8V
DVI_RX I/O Digital Voice interface (RX) 1.8V
DVI_TX I/O Digital Voice interface (TX) 1.8V
DVI_CLK I/O Digital Voice interface (CLK) 1.8V
Digital IO
F9
E10
F11
E12
F13
E14
R18
S19
U19
W19
GPIO_01
GPIO_02
GPIO_03
GPIO_04
GPIO_05
GPIO_06
GPIO_07
GPIO_08
GPIO_09
GPIO_10
I/O
GPIO_01
I/O
GPIO_02
I/O
GPIO_03
I/O
GPIO_04
I/O
GPIO_05
I/O
GPIO_06 / DAC_OUT(PDM)
I/O
GPIO_07
I/O
GPIO_08
I/O
GPIO_09
I/O
GPIO_10
1.8V
1.8V
1.8V
1.8V
1.8V
1.8V
1.8V
1.8V
1.8V
1.8V
RF Section
AD1
AU9
Antenna I/O GSM/EDGE/UMTS Antenna (50Ohm) RF
ANT_DIV I UMTS Antenna Diversity Input (50Ohm) RF
GPS Section
S1
V2
ANT_GPS I GPS Antenna (50Ohm) RF
GPS_LNA_EN O Output enable for External LNA supply 1.8V
Miscellaneous Function
AP1
AS1
RESET* I Reset Input 1.8V Active Low
ON_OFF* I Input Command for Power ON/OFF 1.8V Active Low
To be used to
F17
VRTC AI VRTC Backup Capacitor Power
ack up the
RTC section
P17
D5
E6
AU3
AN10
AN12
M17
VAUX/PWRMON O
ADC_IN1 AI Analog/Digital Converter Input 1 Analog
ADC_IN2 AI Analog/Digital Converter Input 2 Analog
STAT_LED O Status Indicator LED 1.8V
SW_RDY O Indicates that the boot sequence completed successfully 1.8V
SHDN* I Unconditional Shut down Input 1.8V
LED_DRV_EN O Enable for the external LED Driver circuit 1.8V
Supply Output for External Accessories / Power ON
Monitor
1.8V
Power Supply
AP17
AP19
AR18
AS17
AS19
VBATT - Main Power Supply (Baseband)
VBATT - Main Power Supply (Baseband)
VBATT - Main Power Supply (Baseband)
VBATT_PA - Main Power Supply (PAM)
VBATT_PA - Main Power Supply (PAM)
Power
Power
Power
Power
Power
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PAD Signal I/O Function Type COMMENT
AT18
AU17
AU19
A6
A12
B13
B15
B17
C4
C6
D3
D7
E18
F1
G18
H19
M1
N2
P1
P3
R2
T2
T18
U1
V18
W1
X2
X18
Y1
Y19
AA2
AB1
AC2
AE2
AF1
AG2
AH1
AJ2
AK1
AK17
AL18
VBATT_PA - Main Power Supply (PAM)
VBATT_PA - Main Power Supply (PAM)
VBATT_PA - Main Power Supply (PAM)
GND - Ground
GND - Ground
GND
GND
- Ground
- Ground
GND - Ground
GND - Ground
GND
- Ground
GND - Ground
GND - Ground
GND
- Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND
GND
- Ground
- Ground
GND - Ground
GND Ground
GND Ground
GND - Ground
GND - Ground
GND - Ground
GND
GND
- Ground
- Ground
GND - Ground
GND - Ground
GND Ground
GND - Ground
GND - Ground
GND
GND
- Ground
- Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
Power
Power
Power
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PAD Signal I/O Function Type COMMENT
AM17
AM19
AN16
AN18
AP3
AP5
AP7
AP9
AP11
AP13
AP15
AR2
AR4
AR6
AR8
AR10
AR12
AR14
AR16
AS5
AS7
AS9
AS11
AS13
AS15
AT4
AT6
AT8
AT10
AT12
AT14
AT16
AU1
AU5
AU7
AU11
AU15
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
GND - Ground
Reserved
A14
A16
C12
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
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HE920 Hardware User Guide
1VV0301014 Rev.5 – 2013-03-21
PAD Signal I/O Function Type COMMENT
C14
C16
C18
D13
D15
D17
E4
E8
E16
F3
F5
F7
F15
G2
H1
H3
H17
J2
J18
K1
K3
K17
K19
L2
L18
M3
M19
N18
P19
S3
S17
U3
U17
W3
W17
Y3
Y17
AB3
AB17
AD3
AD17
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 20 of 79
HE920 Hardware User Guide
1VV0301014 Rev.5 – 2013-03-21
PAD Signal I/O Function Type COMMENT
AF3
AF17
AH3
AH17
AK3
AL2
AM1
AM3
AN2
AN4
AN6
AN8
AN14
AS3
AT2
AU13
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
Reserved - Reserved
NOTE:
DTR pin must be connected in order to enter HE920’s power saving mode.
NOTE:
RI pin must be connected in order to wake up the host when a call is coming in sleep mode of
host.
NOTE:
RESERVED pins must not be connected
RTS must be connected to the GND (on the module side) if flow control is not used
NOTE:
If not used, almost all pins must be left disconnected. The only exceptions are the following:
PAD Signal
AP17,AP19,AR18,AS17,AS19,AT18,AU17,AU19 VBATT & VBATT_PA
A6,A12,B13,B15,B17,C4,C6,D3,D7,E18,F1,G18,H19,
M1,N2,P1,P3,R2,T2,T18,U1,V18,W1,X2,X18,Y1,Y19,
AA2,AB1,AC2,AE2,AF1,AG2,AH1,AJ2,AK1,AK17,
AL18,AM17,AM19,AN16,AN18,AP3,AP5,AP7,AP9,
GND
AP11,AP13,AP15,AR2,AR4AR6,AR8,AR10,AR12,
AR14,AR16,AS5,AS7,AS9,AS11,AS13,AS15,AT4,
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 21 of 79
HE920 Hardware User Guide
1VV0301014 Rev.5 – 2013-03-21
AT6,AT8,AT10,AT12,AT14,AT16,AU1,AU5,AU7,
AU11,AU15
AS1 ON/OFF*
AP1 RESET*
D19 USB_D+
F19 USB_DA18 USB_VBUS
AH19 C103/TXD
AF19 C104/RXD
AA18 C105/RTS
AK19 C106/CTS
AB19 TXD_AUX
AD19 RXD_AUX
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 22 of 79
3.1.1. LGA Pads Layout
HE920 Hardware User Guide
1VV0301014 Rev.5 – 2013-03-21
NOTE:
The pin defined as RES has to be considered RESERVED and not connected on any
pin in the application. The related area on the application has to be kept empty.
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4. Hardware Commands
4.1. Turning ON the HE920
To turn on HE920, the pad ON_OFF* must be tied low for at least 1 second and then released.
The maximum current that can be drained from the ON_OFF* pad is 0.1 mA.
A simple circuit to power on the module is illustrated below:
HE920 Hardware User Guide
1VV0301014 Rev.5 – 2013-03-21
4.2. Initialization and Activation state
Upon turning on HE920 module, The HE920 is not activated yet because the boot sequence of
HE920 is still going on internally. It takes about 10 seconds to complete the initializing the
module internally.
For this reason, it would be useless to try to access HE920 during the Initialization state as
below. To get the desirable stability, The HE920 needs at least 10 seconds after the
PWRMON goes High to become operational by reaching the activation state.
During the Initialization state, any kind of AT-command is not available. DTE must be
waiting for the Activation state to communicate with HE920.
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