Telit Communications S p A GE865 User Manual

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GE865 Hardware User Guide

1vv0300799 Rev.6 - 04.06.09

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Contents

GE865 Hardware User Guide

1vv0300799 Rev.6 - 04/06/09

1 Overview ........................................................................................................................... 5

2 GE865 Mechanical Dimensions....................................................................................... 6

3 GE865 module connections ............................................................................................ 7

3.1 PIN-OUT ................................................................................................................................ 7

3.1.1

BGA Balls Layout ........................................................................................................................... 10

4 Hardware Commands .................................................................................................... 11

4.1 Turning ON the GE865 ....................................................................................................... 11

4.2 Turning OFF the GE865 ..................................................................................................... 14

4.2.1

Hardware shutdown ....................................................................................................................... 14

4.2.2

Hardware Unconditional Restart .................................................................................................... 15

5 Power Supply.................................................................................................................. 17

5.1 Power Supply Requirements ............................................................................................ 17

5.2 Power Consumption .......................................................................................................... 18

5.3 General Design Rules ........................................................................................................ 19

5.3.1

Electrical Design Guidelines .......................................................................................................... 19

5.3.1.1 + 5V input Source Power Supply Design Guidelines ................................................................ 19

5.3.1.2 + 12V input Source Power Supply Design Guidelines .............................................................. 20

5.3.1.3 Battery Source Power Supply Design Guidelines ..................................................................... 22

5.3.2

Thermal Design Guidelines ........................................................................................................... 23

5.3.3

Power Supply PCB layout Guidelines ........................................................................................... 24

6 Antenna ........................................................................................................................... 25

6.1 GSM Antenna Requirements ............................................................................................. 25

6.2 GSM Antenna - PCB line Guidelines................................................................................. 26

6.3 GSM Antenna - Installation Guidelines ............................................................................ 27

7 Logic level specifications .............................................................................................. 28

7.1 Reset signal ....................................................................................................................... 29

8 Serial Ports ..................................................................................................................... 30

8.1 MODEM SERIAL PORT ...................................................................................................... 30

8.2 RS232 level translation ...................................................................................................... 32

8.3 5V UART level translation ................................................................................................. 35

9 Audio Section Overview ................................................................................................ 37

9.1 Microphone Paths Characteristic and Requirements ..................................................... 37

10 OUTPUT LINES (Speaker) .............................................................................................. 38

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10.1 Short description ............................................................................................................... 38

10.2 Output Lines Characteristics ............................................................................................ 38

11 General Purpose I/O ....................................................................................................... 39

11.1 GPIO Logic levels .............................................................................................................. 40

11.2 Using a GPIO Pad as INPUT .............................................................................................. 41

11.3 Using a GPIO Pad as OUTPUT .......................................................................................... 41

11.4 Using the RF Transmission Control GPIO4 ..................................................................... 41

11.5 Using the RFTXMON Output GPIO5 ................................................................................. 41

11.6 Using the Alarm Output GPIO6 ......................................................................................... 42

11.7 Using the Buzzer Output GPIO7 ....................................................................................... 42

11.8 Indication of network service availability ......................................................................... 43

11.9 RTC Bypass out ................................................................................................................. 44

11.10 External SIM Holder Implementation ............................................................................ 44

12 DAC and ADC section .................................................................................................... 45

12.1 DAC Converter ................................................................................................................... 45

12.1.1 Description ..................................................................................................................................... 45

12.1.2 Enabling DAC ................................................................................................................................ 46

12.1.3 Low Pass Filter Example ............................................................................................................... 46

12.2 ADC Converter ................................................................................................................... 47

12.2.1 Description ..................................................................................................................................... 47

12.2.2 Using ADC Converter .................................................................................................................... 47

12.3 Mounting the GE865 on your Board ................................................................................. 48

12.3.1 General .......................................................................................................................................... 48

12.3.2 Module finishing & dimensions ...................................................................................................... 48

12.3.3 Suggested Inhibit Area .................................................................................................................. 49

12.3.4 Debug of the GE865 in production ................................................................................................ 50

12.3.5 Stencil ............................................................................................................................................ 50

12.3.6 PCB pad design ............................................................................................................................. 51

12.3.7 Solder paste ................................................................................................................................... 52

12.3.8 GE865 Solder reflow ...................................................................................................................... 53

12.4 Packing system .................................................................................................................. 54

12.4.1 Moisture sensibility ........................................................................................................................ 55

13 Conformity Assessment Issues .................................................................................... 56

14 SAFETY RECOMMANDATIONS ..................................................................................... 57

15 Document Change Log .................................................................................................. 58

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GE865 Hardware User Guide

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DISCLAIMER

The information contained in this document is the proprietary information of Telit Communications S.p.A. and its affiliates (“TELIT”). The contents are confidential and any disclosure to persons other than the officers, employees, agents or subcontractors of the owner or licensee of this document, without the prior written consent of Telit, is strictly prohibited.

Telit makes every effort to ensure the quality of the information it makes available. Notwithstanding the foregoing, Telit does not make any warranty as to the information contained herein, and does not accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the information.

Telit disclaims any and all responsibility for the application of the devices characterized in this document, and notes that the application of the device must comply with the safety standards of the applicable country, and where applicable, with the relevant wiring rules.

Telit reserves the right to make modifications, additions and deletions to this document due to typographical errors, inaccurate information, or improvements to programs and/or equipment at any time and without notice. Such changes will, nevertheless be incorporated into new editions of this application note.

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GE865

QUAD

GE865 Hardware User Guide

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1 Overview

The aim of this document is the description of some hardware solutions useful for developing a product with the

Telit GE865-QUAD module.

In this document all the basic functions of a mobile phone will be taken into account; for each one of them a proper hardware solution will be suggested and eventually the wrong solutions and common errors to be avoided will be evidenced. Obviously this document cannot embrace the whole hardware solutions and products that may be designed. The wrong solutions to be avoided shall be considered as mandatory, while the suggested hardware configurations shall not be considered mandatory, instead the information given shall be used as a guide and a starting point for properly developing your product with the Telit GE865-QUAD module. For further hardware details that may not be explained in this document refer to the Telit GE865 Product Description document where all the hardware information is reported.

NOTICE

(EN) The integration of the GSM/GPRS according to the design rules described in this manual.

(IT) L’integrazione del modulo cellulare GSM/GPRS dovrà rispettare le indicazioni progettuali descritte in questo manuale.

(DE) Die integration des diesem Dokument beschriebenen Kunstruktionsregeln erfolgen

GE865-QUAD

(SL) Integracija GSM/GPRS navodila, opisana v tem piročniku.

GE865-QUAD

(SP) La utilización del modulo GSM/GPRS sido deseñado descritos en este manual del usuario.

(FR) L’intégration du module cellulaire GSM/GPRS faite selon les règles de conception décrites dans ce manuel.

GE865-QUAD

GSM/GPRS Mobilfunk-Moduls in ein Gerät muß gemäß der in

modula v uporabniški aplikaciji bo morala upoštevati projektna

GE865-QUAD

cellular module within user application shall be done

GE865-QUAD

debe ser conforme a los usos para los cuales ha

GE865-QUAD

all’interno dell’applicazione dell’utente

dans l’application de l’utilisateur sera

The information presented in this document is believed to be accurate and reliable. However, no responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent rights of Telit Communications S.p.A. other than for circuitry embodied in Telit products. This document is subject to change without notice.

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GE865 Hardware User Guide

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2 GE865 Mechanical Dimensions

The Telit GE865-QUAD module overall dimension are:

• Length: 22 mm

• Width: 22 mm

• Thickness: 3.0 mm

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3 GE865 module connections

3.1 PIN-OUT

Ball Signal I/O Function Note Type

Audio

EAR- AO Earphone signal output, phase - Audio

EAR+ AO Earphone signal output, phase + Audio

MIC+ AI Mic.signal input; phase+ Audio

MIC- AI Mic.signal input; phase- Audio

SIM card interface

SIMCLK O External SIM signal – Clock 1,8 / 3V

SIMRST O External SIM signal – Reset 1,8 / 3V

SIMIO I/O External SIM signal – Data I/O 4.7K Pull up 1,8 / 3V

SIMIN I External SIM signal – Presence (active low) 1,8 / 3V

SIMVCC - External SIM signal – Power supply for the SIM 1,8 / 3V

Trace

TXD_AUX O Auxiliary UART (TX Data) CMOS 2.8V

RXD_AUX I Auxiliary UART (RX Data) CMOS 2.8V

Prog. / Data + HW Flow Control

C103/TXD I Serial data input (TXD) from DTE CMOS 2.8V

C104/RXD O Serial data output to DTE CMOS 2.8V

C108/DTR I

C105/RTS I

C106/CTS O Output for Clear to send signal (CTS) to DTE CMOS 2.8V

C109/DCD O

C107/DSR O Output for Data set ready signal (DSR) to DTE CMOS 2.8V

C125/RING O Output for Ring indicator signal (RI) to DTE CMOS 2.8V

DAC_OUT AO Digital/Analog converter output D/A

ADC_IN1 AI Analog/Digital converter input A/D

ADC_IN2 AI Analog/Digital converter input A/D

RESET* I Reset input

VRTC AO VRTC Backup capacitor Power

STAT_LED O Status indicator led CMOS 1.8V

ON_OFF* I

Input for Data terminal ready signal (DTR) from DTE Input for Request to send signal (RTS) from DTE

Output for Data carrier detect signal (DCD) to DTE

DAC and ADC

Miscellaneous Functions

Input command for switching power ON or OFF (toggle command).

CMOS 2.8V CMOS 2.8V

CMOS 2.8V

47K Pull Up Pull up to VRTC

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Ball Signal I/O Function Note Type

PWRMON O Power ON Monitor CMOS 2.8V

Antenna O Antenna output – 50 ohm RF

Service pin shall be used to upgrade the module from ASC1 (RXD AUX, TXD_AUX).

Service I

GPIO_01 I/O GPIO01 Configurable GPIO CMOS 2.8V

GPIO_02 / JDR I/O GPIO02 I/O pin / Jammer Detect Report CMOS 2.8V

GPIO_03 I/O GPIO03 GPIO I/O pin CMOS 2.8V

GPIO_04 / TX_DISAB I/O GPIO04 Configurable GPIO / TX Disable input CMOS 2.8V

GPIO_05 / RFTXMON I/O

GPIO_06 / ALARM I/O GPIO06 Configurable GPIO / ALARM CMOS 2.8V

GPIO_07 / BUZZER I/O GPIO07 Configurable GPIO / Buzzer CMOS 2.8V

GPIO_08 I/O GPIO08 Configurable GPIO CMOS 2.8V

GPIO_09 I/O GPIO09 4.7 K Pull Up Open Drain

GPIO_10 I/O GPIO10 4.7 K Pull Up Open Drain

VBATT - Main power supply (Baseband) Power

VBATT_PA - Main power supply (Radio PA) Power

GND - Ground Power

The pin shall be tied low to enable the feature only in case of a Reflashing activity. It is required, for debug purpose, to be connected to a test pad on the final application.

GPIO

GPIO05 Configurable GPIO / Transmitter ON monitor

Power Supply

RESERVED

CMOS 2.8V

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pin signal

F1,F2,F3

G1, C2, C7, E5, E7, G5, G4,

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NOTE: RESERVED pins must not be connected

NOTE: If not used, almost all pins should be left disconnected. The only exceptions are the following

pins:

VBATT &

VBATT_PA

GND

G3, H3, H6

ON/OFF*

TXD

RESET*

RXD

RTS1 TXD_AUX RXD_AUX

Service

RTS should be connected to the GND ( on the module side) if flow control is not used

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AUDIO

SIM CAR

ANTENNA

UART

DAC and ADC

MISCELLANEOUS

GPIO

POWER SUPPLY VBATT

POWER SUPPLY GND

RESERVED

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3.1.1 BGA Balls Layout

TOP VIEW

A B C D E F G H

C105 /

RTS

C106/CTS C107/DSR GND GPIO_02 PWRMON

C103_TXD C108/DTR - GPIO_01 GPIO_10

C104/RXD C125/RING - GPIO_08 GPIO_03 GPIO_09 GND

SIMCLK C109/DCD - - GND ADC1 GND ANT

SIMIO - - - - ADC2 GPIO_07 GND

SIMVCC SIMIN GND - GND - DAC GPIO_04

ON_OFF RESET* TXD_AUX RXD_AUX VBATT GND SERVICE

VBATT_P

GPIO_05 VRTC

GND GND

SIMRST MIC+ MIC- EAR+ EAR- - STATLED GPIO_06

LEGENDA:

NOTE: The pin defined as H4 has to be considered RESERVED and not connected on any pin in the

application. The related area on the application has to be kept empty.

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GE865 Hardware User Guide

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4 Hardware Commands

4.1 Turning ON the GE865

To turn on the GE865 the pad ON# must be tied low for at least 1 seconds and then released. The maximum current that can be drained from the ON# pad is 0,1 mA. A simple circuit to do it is:

ON#

Power ON impulse

GND

NOTE: don't use any pull up resistor on the ON# line, it is internally pulled up. Using pull up resistor may bring to latch up problems on the GE865 power regulator and improper power on/off of the module. The line ON# must be connected only in open collector configuration.

NOTE: In this document all the lines that are inverted, hence have active low signals are labeled with a name that ends with”#" or with a bar over the name.

TIP: To check if the device has powered on, the hardware line PWRMON should be monitored. After 900ms the line raised up the device could be considered powered on.

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A flow chart showing the proper turn on procedure is displayed below:

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For example: 1- Let's assume you need to drive the ON# pad with a totem pole output of a +3/5 V microcontroller (uP_OUT1):

10k

2- Let's assume you need to drive the ON# pad directly with an ON/OFF button:

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GE865 Hardware User Guide

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4.2 Turning OFF the GE865

The turning off of the device can be done in three ways:

• by software command (see GE865 Software User Guide)

• by hardware shutdown

• by Hardware Unconditional Restart

When the device is shut down by software command or by hardware shutdown, it issues to the network a detach request that informs the network that the device will not be reachable any more.

4.2.1 Hardware shutdown

To turn OFF the GE865 the pad ON# must be tied low for at least 2 seconds and then released. The same circuitry and timing for the power on shall be used. The device shuts down after the release of the ON# pad.

TIP: To check if the device has powered off, the hardware line PWRMON should be monitored. When PWRMON goes

low, the device has powered off.

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4.2.2 Hardware Unconditional Restart

To unconditionally Restart the GE865, the pad RESET# must be tied low for at least 200 milliseconds and then released. A simple circuit to do it is:

Unconditional Restart impulse

GND

The following flow chart shows the proper Reset procedure:

NOTE: don't use any pull up resistor on the RESET# line nor any totem pole digital output. Using pull up resistor may bring to latch up problems on the GE865 power regulator and improper functioning of the module. The line RESET# must be connected only in open collector configuration.

RESET#

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NOTE: The unconditional hardware Restart should be always implemented on the boards and software should use it as an emergency exit procedure.

For example: 1- Let's assume you need to drive the RESET# pad with a totem pole output of a +3/5 V microcontroller (uP_OUT2):

10k

NOTE: The RESET# signal is internally pulled up so the pin can be left floating if not used

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GE865 Hardware User Guide

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5 Power Supply

The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product overall performances, hence read carefully the requirements and the guidelines that will follow for a proper design.

5.1 Power Supply Requirements

The external power supply must be connected to VBATT & VBATT_PA signals and must fulfill the following requirements:

POWER SUPPLY

Nominal Supply Voltage Normal Operating Voltage Range Extended Operating Voltage Range

NOTE: The Operating Voltage Range MUST never be exceeded; care must be taken in order to fulfill min/max voltage requirement

3.8 V

3.4 V - 4.2 V

3.22 V - 4.5 V

NOTE: Overshoot voltage (regarding MAX Extended Operating Voltage) and drop in voltage (regarding MIN Extended Operating Voltage) MUST never be exceeded; The “Extended Operating Voltage Range” can be used only with completely assumption and application of the HW User guide suggestions.

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GE865

QUAD

Mode

Average (

mA) Mode description

IDLE mode

RX mode

GSM TX and RX mode

GPRS (class 10) TX and RX mode

POWER OFF

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5.2 Power Consumption

The GE865-QUAD power consumptions are: (Preliminary Values)

Stand by mode; no call in progress

AT+CFUN=1 23,9 Normal mode: full functionality of the module AT+CFUN=4 22

AT+CFUN=0 or

AT+CFUN=5

2,4

Disabled TX and RX; module is not registered on the

network

Power saving: CFUN=0 module registered on the network

and can receive voice call or an SMS; but it is not possible

to send AT commands; module wakes up with an

unsolicited code (call or SMS) or rising RTS line. CFUN=5

full functionality with power saving; module registered on

the network can receive incoming calls and SMS

1 slot in downlink 52,3 2 slot in downlink 65,2 3 slot in downlink 78,6 4 slot in downlink 88,4

Max power level 200,1

Max power level 370,8

Power Off <26uA

GSM Receiving data mode

GSM Sending data mode Min power level 78,1

GPRS Sending data mode Min power level 123,7

Module Powered Off

The GSM system is made in a way that the RF transmission is not continuous, else it is packed into bursts at a base frequency of about 216 Hz, and the relative current peaks can be as high as about 2A. Therefore the power supply has to be designed in order to withstand with these current peaks without big voltage drops; this means that both the electrical design and the board layout must be designed for this current flow. If the layout of the PCB is not well designed a strong noise floor is generated on the ground and the supply; this will reflect on all the audio paths producing an audible annoying noise at 216 Hz; if the voltage drop during the peak current absorption is too much, then the device may even shutdown as a consequence of the supply voltage drop.

TIP: The electrical design for the Power supply should be made ensuring it will be capable of a peak current output of at least 2 A.

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GE865 Hardware User Guide

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5.3 General Design Rules

The principal guidelines for the Power Supply Design embrace three different design steps:

• the electrical design

• the thermal design

• the PCB layout.

5.3.1 Electrical Design Guidelines

The electrical design of the power supply depends strongly from the power source where this power is drained. We will distinguish them into three categories:

• +5V input (typically PC internal regulator output)

• +12V input (typically automotive)

• Battery

5.3.1.1 + 5V input Source Power Supply Design Guidelines

• The desired output for the power supply is 3.8V, hence there's not a big difference between the input source and the desired output and a linear regulator can be used. A switching power supply will not be suited because of the low drop out requirements.

• When using a linear regulator, a proper heat sink shall be provided in order to dissipate the power generated.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks close to the GE865, a 100µF tantalum capacitor is usually suited.

• Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V.

• A protection diode should be inserted close to the power input, in order to save the GE865 from power polarity inversion.

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An example of linear regulator with 5V input is:

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5.3.1.2 + 12V input Source Power Supply Design Guidelines

• The desired output for the power supply is 3.8V, hence due to the big difference between the input source and the desired output, a linear regulator is not suited and shall not be used. A switching power supply will be preferable because of its better efficiency especially with the 2A peak current load represented by the GE865.

• When using a switching regulator, a 500kHz or more switching frequency regulator is preferable because of its smaller inductor size and its faster transient response. This allows the regulator to respond quickly to the current peaks absorption.

• In any case the frequency and Switching design selection is related to the application to be developed due to the fact the switching frequency could also generate EMC interferences.

• For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind when choosing components: all components in the power supply must withstand this voltage.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks, a 100µF tantalum capacitor is usually suited.

• Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V.

• For Car applications a spike protection diode should be inserted close to the power input, in order to clean the supply from spikes.

• A protection diode should be inserted close to the power input, in order to save the GE865-QUAD from power polarity inversion. This can be the same diode as for spike protection.

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An example of switching regulator with 12V input is in the below schematic (it is split in 2 parts):

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5.3.1.3 Battery Source Power Supply Design Guidelines

• The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is

4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the power to the Telit GE865 module.

The three cells Ni/Cd or Ni/MH 3,6 V Nom. battery types or 4V PB types MUST NOT BE USED DIRECTLY since their maximum voltage can rise over the absolute maximum voltage for the GE865 and damage it.

NOTE: DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with GE865. Their use can lead to overvoltage on the GE865 and damage it. USE ONLY Li-Ion battery types.

• A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks, a 100µF tantalum capacitor is usually suited.

• Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.

• A protection diode should be inserted close to the power input, in order to save the GE865 from

power polarity inversion. Otherwise the battery connector should be done in a way to avoid polarity inversions when connecting the battery.

• The battery capacity must be at least 500mAh in order to withstand the current peaks of 2A; the suggested capacity is from 500mAh to 1000mAh.

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5.3.2 Thermal Design Guidelines

The thermal design for the power supply heat sink should be done with the following specifications:

• Average current consumption during transmission @PWR level max: 500mA

• Average current consumption during transmission @ PWR level min: 100mA

• Average current during Power Saving (CFUN=5): 2,4mA

• Average current during idle (Power Saving disabled) 24mA

NOTE: The average consumption during transmissions depends on the power level at which the device is requested to transmit by the network. The average current consumption hence varies significantly.

Considering the very low current during idle, especially if Power Saving function is enabled, it is possible to consider from the thermal point of view that the device absorbs current significantly only during calls. If we assume that the device stays into transmission for short periods of time (let's say few minutes) and then remains for a quite long time in idle (let's say one hour), then the power supply has always the time to cool down between the calls and the heat sink could be smaller than the calculated one for 500mA maximum RMS current, or even could be the simple chip package (no heat sink). Moreover in the average network conditions the device is requested to transmit at a lower power level than the maximum and hence the current consumption will be less than the 500mA, being usually around 150mA. For these reasons the thermal design is rarely a concern and the simple ground plane where the power supply chip is placed can be enough to ensure a good thermal condition and avoid overheating. For the heat generated by the GE865, you can consider it to be during transmission 1W max during CSD/VOICE calls and 2W max during class10 GPRS upload. This generated heat will be mostly conducted to the ground plane under the GE865; you must ensure that your application can dissipate it.

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5.3.3 Power Supply PCB layout Guidelines

As seen on the electrical design guidelines the power supply shall have a low ESR capacitor on the output to cut the current peaks and a protection diode on the input to protect the supply from spikes and polarity inversion. The placement of these components is crucial for the correct working of the circuitry. A misplaced component can be useless or can even decrease the power supply performances.

• The Bypass low ESR capacitor must be placed close to the Telit GE865 power input pads or in the case the power supply is a switching type it can be placed close to the inductor to cut the ripple provided the PCB trace from the capacitor to the GE865 is wide enough to ensure a dropless connection even during the 2A current peaks.

• The protection diode must be placed close to the input connector where the power source is drained.

• The PCB traces from the input connector to the power regulator IC must be wide enough to ensure no voltage drops occur when the 2A current peaks are absorbed. Note that this is not made in order to save power loss but especially to avoid the voltage drops on the power line at the current peaks frequency of 216 Hz that will reflect on all the components connected to that supply, introducing the noise floor at the burst base frequency. For this reason while a voltage drop of 300400 mV may be acceptable from the power loss point of view, the same voltage drop may not be acceptable from the noise point of view. If your application doesn't have audio interface but only uses the data feature of the Telit GE865, then this noise is not so disturbing and power supply layout design can be more forgiving.

• The PCB traces to the GE865 and the Bypass capacitor must be wide enough to ensure no significant voltage drops occur when the 2A current peaks are absorbed. This is for the same reason as previous point. Try to keep this trace as short as possible.

• The PCB traces connecting the Switching output to the inductor and the switching diode must be kept as short as possible by placing the inductor and the diode very close to the power switching IC (only for switching power supply). This is done in order to reduce the radiated field (noise) at the switching frequency (100-500 kHz usually).

• The use of a good common ground plane is suggested.

• The placement of the power supply on the board should be done in such a way to guarantee that

the high current return paths in the ground plane are not overlapped to any noise sensitive circuitry as the microphone amplifier/buffer or earphone amplifier.

• The power supply input cables should be kept separate from noise sensitive lines such as microphone/earphone cables.

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ANTENNA REQUIREMENTS

Frequency range

Bandwidth

Gain

Impedance

Input power

VSWR absolute

VSWR

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6 Antenna

The antenna connection and board layout design are the most important part in the full product design and they strongly reflect on the product overall performances, hence read carefully and follow the requirements and the guidelines for a proper design.

6.1 GSM Antenna Requirements

As suggested on the Product Description the antenna and antenna line on PCB for a Telit GE865 device shall fulfill the following requirements:

Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) 70 MHz in GSM850, 80 MHz in GSM900, 170 MHz in DCS & 140 MHz PCS band Gain < 3dBi 50 ohm > 2 W peak power <= 10:1

max

<= 2:1

recommended

When using the Telit GE865, since there's no antenna connector on the module, the antenna must be connected to the GE865 through the PCB with the antenna pad (BGA Ball H5).

In the case that the antenna is not directly developed on the same PCB, hence directly connected at the antenna pad of the GE865, then a PCB line is needed in order to connect with it or with its connector.

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ANTENNA LINE ON PCB REQUIREMENTS

Impedance

Max Attenuation

o coupling with other signals allowed

Cold End (Ground Plane) of antenna shall be equipotential to

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This line of transmission shall fulfill the following requirements:

50 ohm 0,3 dB

the GE865 ground pins

Furthermore if the device is developed for the US market and/or Canada market, it shall comply with the FCC and/or IC approval requirements: This device is to be used only for mobile and fixed application. In order to re-use the Telit FCC/IC approvals the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. If antenna is installed with a separation distance of less than 20 cm from all persons or is co-located or operating in conjunction with any other antenna or transmitter then additional FCC/IC testing may be required. End-Users must be provided with transmitter operation conditions for satisfying RF exposure compliance. Antennas used for this OEM module must not exceed 3dBi gain for mobile and fixed operating configurations.

6.2 GSM Antenna - PCB line Guidelines

• Ensure that the antenna line impedance is 50 ohm;

• Keep the antenna line on the PCB as short as possible, since the antenna line loss shall be less

than 0,3 dB;

• Antenna line must have uniform characteristics, constant cross section, avoid meanders and abrupt curves;

• Keep, if possible, one layer of the PCB used only for the Ground plane;

• Surround (on the sides, over and under) the antenna line on PCB with Ground, avoid having other

signal tracks facing directly the antenna line track;

• The ground around the antenna line on PCB has to be strictly connected to the Ground Plane by placing vias once per 2mm at least;

• Place EM noisy devices as far as possible from GE865 antenna line;

• Keep the antenna line far away from the GE865 power supply lines;

• If you have EM noisy devices around the PCB hosting the GE865, such as fast switching ICs, take

care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with Ground planes, or shield it with a metal frame cover.

• If you don't have EM noisy devices around the PCB of GE865, by using a strip-line on the superficial copper layer for the antenna line, the line attenuation will be lower than a buried one;

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6.3 GSM Antenna - Installation Guidelines

• Install the antenna in a place covered by the GSM signal.

• If the device antenna is located greater then 20cm from the human body and there are no co-

located transmitter then the Telit FCC/IC approvals can be re-used by the end product

• If the device antenna is located less then 20cm from the human body or there are no co-located transmitter then the additional FCC/IC testing may be required for the end product (Telit FCC/IC approvals cannot be reused)

• Antenna shall not be installed inside metal cases

• Antenna shall be installed also according Antenna manufacturer instructions.

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Parameter

Min Max

Level

Min Max

Level

Min Max

Level

Typical

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7 Logic level specifications

Where not specifically stated, all the interface circuits work at 2.8V CMOS logic levels. The following table shows the logic level specifications used in the Telit GE865 interface circuits:

Absolute Maximum Ratings -Not Functional

For 1.8V signals:

Input level on any digital pin (CMOS 2.8)

when on

Input level on any digital pin (CMOS 1.8)

when on

Input voltage on analog pins when on -0.3V +3.0 V

Operating Range - Interface levels (2.8V CMOS)

Input high level 2.1V 3.0V

Input low level 0V 0.5V

Output high level 2.2V 3.0V

Output low level 0V 0.35V

Operating Range - Interface levels (1.8V CMOS)

Input high level 1.6V 2.0V

Input low level 0V 0.4V

Output high level 1,65V 2.0V

Output low level 0V 0.35V

Current characteristics

-0.3V +3.1V

-0.3V +2.1V

Output Current 1mA Input Current 1uA

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Signal

Function

I/O Bga Ball

Sign

al Min Max

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7.1 Reset signal

RESET# Phone reset I A2

RESET# is used to reset the GE865-QUAD modules. Whenever this signal is pulled low, the GE865 is reset. When the device is reset it stops any operation. After the release of the reset GE865 is unconditionally shut down, without doing any detach operation from the network where it is registered. This behaviour is not a proper shut down because any GSM device is requested to issue a detach request on turn off. For this reason the Reset signal must not be used to normally shutting down the device, but only as an emergency exit in the rare case the device remains stuck waiting for some network response. The RESET# is internally controlled on start-up to achieve always a proper power-on reset sequence, so there's no need to control this pin on start-up. It may only be used to reset a device already on that is not responding to any command.

NOTE: do not use this signal to power off the GE865. Use the ON/OFF signal to perform this function or the AT#SHDN command.

Reset Signal Operating levels:

RESET Input high 1.8V* 2.1V RESET Input low 0V 0.2V

* this signal is internally pulled up so the pin can be left floating if not used.

If unused, this signal may be left unconnected. If used, then it must always be connected with an open collector transistor, to permit to the internal circuitry the power on reset and under voltage lockout functions.

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Parameter

Min Max

Level

Min Max

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8 Serial Ports

The serial port on the Telit GE865-QUAD is the core of the interface between the module and OEM hardware. 2 serial ports are available on the module:

• MODEM SERIAL PORT 1 (MAIN)

• MODEM SERIAL PORT 2 (AUX)

8.1 MODEM SERIAL PORT

Several configurations can be designed for the serial port on the OEM hardware, but the most common are:

• RS232 PC com port

• microcontroller UART @ 2.8V - 3V (Universal Asynchronous Receive Transmit)

• microcontroller UART@ 5V or other voltages different from 2.8V

Depending from the type of serial port on the OEM hardware a level translator circuit may be needed to make the system work. The only configuration that doesn't need a level translation is the 2.8V UART. The serial port on the GE865 is a +2.8V UART with all the 7 RS232 signals. It differs from the PCRS232 in the signal polarity (RS232 is reversed) and levels. The levels for the GE865 UART are the CMOS levels:

Absolute Maximum Ratings -Not Functional

Input level on any digital pad when on

Input voltage on analog pads when on

Operating Range - Interface levels (2.8V CMOS)

Input high level V Input low level VIL 0V 0.5V Output high level VOH 2.2V 3.0V Output low level VOL 0V 0.35V

-0.3V +3.1V

2.1V 3.0 V

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RS232

Signal

GE865

Name

Usage

The signals of the GE865 serial port are:

GE865 Hardware User Guide

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Number

1 DCD - dcd_uart B5 Data Carrier Detect Output from the GE865 that indicates the carrier 2 RXD -

tx_uart

3 TXD -

rx_uart

4 DTR - dtr_uart B3 Data Terminal Ready Input to the GE865 that controls the DTE READY 5 GND C2, C7, E5,

6 DSR - dsr_uart B2 Data Set Ready Output from the GE865 that indicates the module is 7 RTS -rts_uart A1 Request to Send Input to the GE865 that controls the Hardware flow 8 CTS - cts_uart A2 Clear to Send Output from the GE865 that controls the Hardware 9 RI - ri_uart B4 Ring Indicator Output from the GE865 that indicates the incoming

QUAD

Pad

Number

presence

A4 Transmit line *see Note Output transmit line of GE865 UART A3 Receive line *see Note Input receive of the GE865 UART

condition

Ground ground E7, G1, G3, G4, G5, H3,

ready

control

flow control

call condition

NOTE: According to V.24, RX/TX signal names are referred to the application side, therefore on the GE865 side these signal are on the opposite direction: TXD on the application side will be connected to the receive line (here named TXD/ rx_uart ) of the GE865 serial port and viceversa for RX.

TIP: For a minimum implementation, only the TXD and RXD lines can be connected, the other lines can be left open provided a software flow control is implemented.

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8.2 RS232 level translation

In order to interface the Telit GE865 with a PC com port or a RS232 (EIA/TIA-232) application a level translator is required. This level translator must:

• invert the electrical signal in both directions;

• change the level from 0/2.8V to +15/-15V .

Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level translator. Note that the negative signal voltage must be less than 0V and hence some sort of level translation is always required. The simplest way to translate the levels and invert the signal is by using a single chip level translator. There are a multitude of them, differing in the number of drivers and receivers and in the levels (be sure to get a true RS232 level translator not a RS485 or other standards). By convention the driver is the level translator from the 0-2.8V UART to the RS232 level. The receiver is the translator from the RS232 level to 0-2.8V UART. In order to translate the whole set of control lines of the UART you will need:

• 5 drivers

• 3 receivers

The digital input lines working at 2.8V CMOS have an absolute maximum input voltage of 3.0V; therefore the level translator IC shall not be powered by the +3.8V supply of the module. Instead, it must be powered from a +2.7V / +2.9V (dedicated) power supply.

This is because in this way the level translator IC outputs on the module side (i.e. GE865 inputs) will work at +3.8V interface levels, damaging the module inputs.

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An example of level translation circuitry of this kind is:

The example is done with a SIPEX SP3282EB RS232 Transceiver that could accept supply voltages lower than 3V DC.

In this case Vin has to be set with a value compatible with the logic levels of the module. (Max

2.9V DC). In this configuration the SP3282EB will adhere to EIA/TIA-562 voltage levels instead of RS232 (-5 ~ +5V)

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Second solution could be done using a MAXIM transceiver (MAX218) In this case the compliance with RS232 (+-5V) is possible.

Another level adapting method could be done using a standard RS232 Transceiver (MAX3237EAI) adding some resistors to adapt the levels on the GE865 Input lines.

NOTE: In this case has to be taken in account the length of the lines on the application to avoid problems in case of High-speed rates on RS232.

The RS232 serial port lines are usually connected to a DB9 connector with the following layout:

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8.3 5V UART level translation

If the OEM application uses a microcontroller with a serial port (UART) that works at a voltage different from 2.8 - 3V, then a circuitry has to be provided to adapt the different levels of the two set of signals. As for the RS232 translation there are a multitude of single chip translators. For example a possible translator circuit for a 5V TRANSMITTER/RECEIVER can be:

TIP: Note that the TC7SZ07AE has open drain output, therefore the resistor R2 is mandatory.

TO TELIT

MODULE

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NOTE: The UART input line TXD (rx_uart) of the GE865 is NOT internally pulled up with a resistor, so there may be the need to place an external 47KΩ pull-up resistor, either the DTR (dtr_uart) and RTS (rts_uart) input lines are not pulled up internally, so an external pull-up resistor of 47KΩ may be required.

NOTE: The input lines working at 2.8VCMOS can be pulled-up with 47KΩ

In case of reprogramming of the module has to be considered the use of the RESET line to start correctly the activity.

The preferable configuration is having an external supply for the buffer.

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9 Audio Section Overview

The Base Band Chip of the GE865 Telit Module provides one audio Line usable in transmit (Uplink) and in receive (Downlink) direction:

9.1 Microphone Paths Characteristic and Requirements

TIP: being the microphone circuitry the more noise sensitive, its design and layout must be done with particular care. The microphone path is balanced and the OEM circuitry should be balanced designed to reduce the common mode noise typically generated on the ground plane. However also an unbalanced circuitry can be used for particular OEM application needs.

“Mic” differential microphone path

• line coupling AC

• line type balanced

• coupling capacitor ≥ 100nF

• differential input resistance 50kΩ

• differential input voltage ≤ 1,03Vpp (365mV

• microphone nominal sensitivity -45 dBV

• analog gain suggested + 20dB

• echo canceller type handset

/Pa

rms

)

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10 OUTPUT LINES (Speaker)

10.1 Short description

The Telit GE865 provides one audio paths in receive section.



the “Ear” lines EPN1 and EPP1 are the Differential Line-Out Drivers ; they can drive an external

amplifier or directly a 16 Ω earpiece at –12dBFS (*) ; (*) FS : acronym of Full Scale. It is equal to 0dB, the maximum Hardware Analog Receive Gain of

BaseBand Chip. The output is a B.T.L. type (Bridged Tie Load) and the OEM circuitry shall be designed bridged to

reduce the common mode noise typically generated on the ground plane and to get the maximum power output from the device; however also a single ended circuitry can be designed for particular OEM application needs.

10.2 Output Lines Characteristics

“Ear” Differential Line-out Drivers Path

• line coupling: DC

• line type: bridged

• output load resistance : ≥ 14 Ω

• internal output resistance: 4 Ω (typical)

• signal bandwidth: 150 - 4000 Hz @ -3 dB

• max. differential output voltage 1310 mV

• differential output voltage 328mVrms /16 Ω @ -12dBFS

• SW volume level step - 2 dB

• number of SW volume steps 10

For more detailed information about audio please refer to the Audio Settings Application Note

80000NT10007a

(typ, open circuit)

rms

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Input /

State

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11 General Purpose I/O

The general purpose I/O pads can be configured to act in three different ways:

• input

• output

• alternate function (internally controlled)

Input pads can only be read and report the digital value (high or low) present on the pad at the read time; output pads can only be written or queried and set the value of the pad output; an alternate function pad is internally controlled by the GE865 firmware and acts depending on the function implemented. For Logic levels please refer to chapter 7.

The following GPIO are available on the GE865-QUAD:

Signal I/O Function Type

GPIO_01 I/O GPIO01 Configurable GPIO CMOS 2.8V 1uA/1mA INPUT 0 0 GPIO_02 I/O GPIO02 Configurable GPIO CMOS 2.8V 1uA/1mA INPUT 0 0 GPIO_03 I/O GPIO03 Configurable GPIO CMOS 2.8V 1uA/1mA INPUT 0 0

GPIO_04 I/O GPIO04 Configurable GPIO CMOS 2.8V 1uA/1mA INPUT 0 0

GPIO_05 I/O GPIO05 Configurable GPIO CMOS 2.8V 1uA/1mA INPUT 0 0 GPIO_06 I/O GPIO06 Configurable GPIO CMOS 2.8V 1uA/1mA INPUT 0 0 GPIO_07 I/O GPIO07 Configurable GPIO CMOS 2.8V 1uA/1mA INPUT 0 0

GPIO_08 I/O GPIO08 Configurable GPIO CMOS 2.8V 1uA/1mA INPUT 0 0 GPIO_09 I/O GPIO09 Configurable GPIO CMOS 2.8V GPIO_10 I/O GPIO10 Configurable GPIO CMOS 2.8V

output

current

1 1 1 Open Drain 1 1 1 Open Drain

Not all GPIO pads support all these three modes:

• GPIO2 supports all three modes and can be input, output, Jamming Detect Output (Alternate function)

• GPIO4 supports all three modes and can be input, output, RF Transmission Control (Alternate function)

• GPIO5 supports all three modes and can be input, output, RFTX monitor output (Alternate function)

• GPIO6 supports all three modes and can be input, output, alarm output (Alternate function)

• GPIO7 supports all three modes and can be input, output, buzzer output (Alternate function)

Default

State

ON_OFF

state

during

Reset

Note

Alternate function

(JDR)

Alternate function

(RF Transmission

Control)

Alternate function

(RFTXMON)

Alternate function

(ALARM)

Alternate function

(BUZZER)

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Parameter

Min Max

Level

Min Max

Level

Min Max

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11.1 GPIO Logic levels

Where not specifically stated, all the interface circuits work at 2.8V CMOS logic levels. The following table shows the logic level specifications used in the GE865 interface circuits:

Absolute Maximum Ratings -Not Functional

Input level on any digital pin when on (CMOS 2.8) Input level on any digital pin when on (CMOS 1.8) Input voltage on analog pins when on -0.3V +3.0V

Operating Range - Interface levels (2.8V CMOS)

Input high level 2.1V 3.0V Input low level 0V 0.5V Output high level 2.2V 3.0V Output low level 0V 0.35V

For 1.8V signals:

Operating Range - Interface levels (1.8V CMOS)

Input high level 1.6V 2.0V Input low level 0V 0.4V Output high level 1,65V 1.85V Output low level 0V 0.35V

-0.3V +3.1V

-0.3V +2.1V

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11.2 Using a GPIO Pad as INPUT

The GPIO pads, when used as inputs, can be connected to a digital output of another device and report its status, provided this device has interface levels compatible with the 2.8V CMOS levels of the GPIO. If the digital output of the device to be connected with the GPIO input pad has interface levels different from the 2.8V CMOS, then it can be buffered with an open collector transistor with a 47K pull up to

2.8V.

11.3 Using a GPIO Pad as OUTPUT

The GPIO pads, when used as outputs, can drive 2.8V CMOS digital devices or compatible hardware. When set as outputs, the pads have a push-pull output and therefore the pull-up resistor may be omitted.

11.4 Using the RF Transmission Control GPIO4

The GPIO4 pin, when configured as RF Transmission Control Input, permits to disable the Transmitter when the GPIO is set to Low by the application. In the design is necessary to add a pull up resistor (47K to PWRMON);

11.5 Using the RFTXMON Output GPIO5

The GPIO5 pin, when configured as RFTXMON Output, is controlled by the GE865 module and will rise when the transmitter is active and fall after the transmitter activity is completed. For example, if a call is started, the line will be HIGH during all the conversation and it will be again LOW after hanged up.

The line rises up 300ms before first TX burst and will became again LOW from 500ms to 1sec after last TX burst.

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11.6 Using the Alarm Output GPIO6

The GPIO6 pad, when configured as Alarm Output, is controlled by the GE865 module and will rise when the alarm starts and fall after the issue of a dedicated AT command. This output can be used to power up the GE865 controlling microcontroller or application at the alarm time, giving you the possibility to program a timely system wake-up to achieve some periodic actions and completely turn off either the application and the GE865 during sleep periods, dramatically reducing the sleep consumption to few µA. In battery-powered devices this feature will greatly improve the autonomy of the device.

11.7 Using the Buzzer Output GPIO7

The GPIO7 pad, when configured as Buzzer Output, is controlled by the GE865 module and will drive with appropriate square waves a Buzzer driver. This permits to your application to easily implement Buzzer feature with ringing tones or melody played at the call incoming, tone playing on SMS incoming or simply playing a tone or melody when needed by your application. A sample interface scheme is included below to give you an idea of how to interface a Buzzer to the GPIO7:

NOTE: To correctly drive a buzzer a driver must be provided, its characteristics depend on the Buzzer and for them

refer to your buzzer vendor.

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LED status

Device

Status

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11.8 Indication of network service availability

The STAT_LED pin status shows information on the network service availability and Call status. In the GE865 modules, the STAT_LED usually needs an external transistor to drive an external LED. Therefore, the status indicated in the following table is reversed with respect to the pin status.

Permanently off Device off Fast blinking

(Period 1s, Ton 0,5s) Slow blinking (Period 3s, Ton 0,3s) Permanently on a call is active

Net search / Not registered / turning off Registered full service

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11.9 RTC Bypass out

The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the digital part, allowing having only RTC going on when all the other parts of the device are off. To this power output a backup capacitor can be added in order to increase the RTC autonomy during power off of the battery. NO Devices must be powered from this pin.

11.10 External SIM Holder Implementation

Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a).

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Min Max

Units

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12 DAC and ADC section

12.1 DAC Converter

12.1.1 Description

The GE865 module provides a Digital to Analog Converter. The signal (named DAC_OUT) is available on BGA Ball G7 of the GE865 module and on pin 17 of PL102 on EVK2 Board (CS1324). The on board DAC is a 10 bit converter, able to generate a analogue value based a specific input in the range from 0 up to 1023. However, an external low-pass filter is necessary

Voltage range (filtered) 0 2,6 Volt Range 0 1023 Steps

The precision is 10 bits so, if we consider that the maximum voltage is 2V, the integrated voltage could be calculated with the following formula:

Integrated output voltage = 2 * value / 1023

DAC_OUT line must be integrated (for example with a low band pass filter) in order to obtain an analog voltage.

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12.1.2 Enabling DAC

An AT command is available to use the DAC function. The command is AT#DAC[=<enable>[,<value>]]

<value> - scale factor of the integrated output voltage (0..1023 - 10 bit precision) it must be present if <enable>=1

Refer to SW User Guide or AT Commands Reference Guide for the full description of this function.

NOTE: The DAC frequency is selected internally. D/A converter must not be used during POWERSAVING.

12.1.3 Low Pass Filter Example

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Min Max

Units

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12.2 ADC Converter

12.2.1 Description

The on board A/D are 11-bit converter. They are able to read a voltage level in the range of 0÷2 volts applied on the ADC pin input, store and convert it into 11 bit word.

Input Voltage range 0 2 Volt AD conversion - 11 bits Resolution - < 1 mV

The GE865-QUAD module provides 2 Analog to Digital Converters. The input lines are:

ADC_IN1 available on Ball F5 and Pin 19 of PL102 on EVK2 Board (CS1324). ADC_IN2 available on Ball F6 and Pin 20 of PL102 on EVK2 Board (CS1324).

12.2.2 Using ADC Converter

An AT command is available to use the ADC function.

The command is AT#ADC=1,2

The read value is expressed in mV Refer to SW User Guide or AT Commands Reference Guide for the full description of this function.

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Lead

free Alloy:

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12.3 Mounting the GE865 on your Board

12.3.1 General

The Telit GE865 modules have been designed in order to be compliant with a standard lead-free SMT process.

12.3.2 Module finishing & dimensions

Surface finishing Sn/Ag/Cu for all solder pads

Pin A1

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12.3.3 Suggested Inhibit Area

In order to easily rework the GE865 is suggested to consider on the application a 1.5mm Inhibit area around the module:

It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module.

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12.3.4 Debug of the GE865 in production

To test and debug the mounting of the GE865, we strongly recommend to foreseen test pads on the host PCB, in order to check the connection between the GE865 itself and the application and to test the performance of the module connecting it with an external computer. Depending by the customer application, these pads include, but are not limited to the following signals:

• TXD

• RXD

• ON/OFF

• RESET

• GND

• VBATT

• TX_AUX

• RX_AUX

•

PWRMON

•

SERVICE

12.3.5 Stencil

Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a thickness of stencil foil ≥ 120µm.

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Ball pitch [mm]

Solder resist opening diameter A [mm]

Metal pad diameter B [mm]

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12.3.6 PCB pad design

Non solder mask defined” (NSMD) type is recommended for the solder pads on the PCB.

Recommendations for PCB pad dimensions

2,4 1,150 1 ± 0.05

Placement of microvias not covered by solder resist is not recommended inside the “Solder resist opening”, unless the microvia carry the same signal of the pad itself.

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Finish

Layer thickness [µm]

Properties

Lead free

Solder paste

Holes in pad are allowed only for blind holes and not for through holes. Recommendations for PCB pad surfaces:

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Electro-less Ni / Immersion Au

The PCB must be able to resist the higher temperatures which are occurring at the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste.

3 –7 /

0.05 – 0.15

good solder ability protection, high shear force values

12.3.7 Solder paste

Sn/Ag/Cu

Page 53

Profile Feature

Pb-

Free Assembly

12.3.8 GE865 Solder reflow

The following is the recommended solder reflow profile

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Average ramp-up rate (TL to TP) 3°C/second max Preheat – Temperature Min (Tsmin) – Temperature Max (Tsmax) – Time (min to max) (ts) Tsmax to TL – Ramp-up Rate Time maintained above: – Temperature (TL) – Time (tL) Peak Temperature (Tp) 245 +0/-5°C Time within 5°C of actual Peak Temperature (tp) Ramp-down Rate 6°C/second max. Time 25°C to Peak Temperature 8 minutes max.

150°C 200°C 60-180 seconds

3°C/second max 217°C

60-150 seconds 10-30 seconds

NOTE: All temperatures refer to topside of the package, measured on the package body surface.

NNOOTTEE:: GGEE886655 mmoodduullee ccaann aacccceepptt oonnllyy oonnee rreeffllooww pprroocceessss

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12.4 Packing system

The Telit GE865 modules are packaged on trays of 50 pieces each. This is especially suitable for the GE865 according to SMT processes for pick & place movement requirements.

NOTE: These trays can withstand at the maximum temperature of 65° C.

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12.4.1 Moisture sensibility

The level of moisture sensibility of GE865 module is “3”, in according with standard IPC/JEDEC J-STD020, take care all the relatives requirements for using this kind of components.

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13 Conformity Assessment Issues

The GE865-QUAD module are assessed to be conform to the R&TTE Directive as stand-alone products, so If the module is installed in conformance with Dai Telecom installation instructions require no further evaluation under Article 3.2 of the R&TTE Directive and do not require further involvement of a R&TTE Directive Notified Body for the final product.

In all other cases, or if the manufacturer of the final product is in doubt then the equipment integrating the radio module must be assessed against Article 3.2 of the R&TTE Directive. In all cases assessment of the final product must be made against the Essential requirements of the R&TTE Directive Articles 3.1(a) and (b), safety and EMC respectively, and any relevant Article 3.3 requirements.

The GE865-QUAD module is conforming with the following European Union Directives:

• R&TTE Directive 1999/5/EC (Radio Equipment & Telecommunications Terminal Equipments)

• Low Voltage Directive 73/23/EEC and product safety

• Directive 89/336/EEC for conformity for EMC

In order to satisfy the essential requisite of the R&TTE 99/5/EC directive, the GE865-QUAD module is compliant with the following standards:

• GSM (Radio Spectrum). Standard: EN 301 511 and 3GPP 51.010-1

• EMC (Electromagnetic Compatibility). Standards: EN 301 489-1 and EN 301 489-7

• LVD (Low Voltage Directive) Standards: EN 60 950

In this document and the Hardware User Guide, Software User Guide all the information you may need for developing a product meeting the R&TTE Directive is included.

The GE865-QUAD module is conforming with the following US Directives:

• Use of RF Spectrum. Standards: FCC 47 Part 24 (GSM 1900)

• EMC (Electromagnetic Compatibility). Standards: FCC47 Part 15

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

To meet the FCC's RF exposure rules and regulations:

- The system antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all the persons and must not be co-located or operating in conjunction with any other antenna or transmitter.

The system antenna(s) used for this module must not exceed 1.4dBi (850MHz) and 3.0dBi (1900MHz) for mobile and fixed or mobile operating configurations”.

- Users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance.

Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and to have their complete product tested and approved for FCC compliance.

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14 SAFETY RECOMMANDATIONS

READ CAREFULLY

Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas:

 Where it can interfere with other electronic devices in environments such as hospitals, airports,

aircrafts, etc

 Where there is risk of explosion such as gasoline stations, oil refineries, etc It is responsibility of the user to enforce the country regulation and the specific environment regulation. Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for a correct wiring of the

product. The product has to be supplied with a stabilized voltage source and the wiring has to be conforming to the security and fire prevention regulations.

The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode.

The system integrator is responsible of the functioning of the final product; therefore, care has to be taken to the external components of the module, as well as of any project or installation issue, because the risk of disturbing the GSM network or external devices or having impact on the security. Should there be any doubt, please refer to the technical documentation and the regulations in force.

Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed with care in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm). In case of this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation.

The European Community provides some Directives for the electronic equipments introduced on the market. All the relevant information’s are available on the European Community website:

http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm

The text of the Directive 99/05 regarding telecommunication equipments is available, while the applicable Directives (Low Voltage and EMC) are available at:

http://europa.eu.int/comm/enterprise/electr_equipment/index_en.htm

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15 Document Change Log

ISSUE#0 26/01/2009 First ISSUE# 0 - DRAFT ISSUE#1 05/02/2009 Updated current consumptions table ISSUE#2 15/02/2009 Updated Pinout description ISSUE#3 18/03/2009 Updated mechanical dimensions (balls spacing),

charger description removed,

Added better explanation of pin H5 (RF) and H1 (service) ISSUE#4 02/04/2009 Updated VBATT supply Range, DAC schematic, Conformity assessment ISSUE#5 03/06/2009 Updated section 13 (FCC Conformity assessment) ISSUE#5 04/06/2009 Updated section 13 (FCC Conformity assessment)

Telit Communications S p A GE865 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual