Telit LE910Cx Service Manual

Mod.08

LE910Cx - mPCIe

HW Design Guide

1VV0301510 Rev. 12 – 2021-01-27

1.2017]

18 2017-01 Rev.0

LE910Cx mPCIe HW Design Guide

SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE

NOTICE

While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey license under its patent rights or the rights of others.

It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country.

COPYRIGHTS

This instruction manual and the Telit products described in this instruction manual may be, include or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product.

COMPUTER SOFTWARE COPYRIGHTS

The Telit and 3rd Party supplied Software (SW) products described in this instruction manual may include copyrighted Telit and other 3rd Party supplied computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.

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LE910Cx mPCIe HW Design Guide

USAGE AND DISCLOSURE RESTRICTIONS

I. License Agreements

The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement.

II. Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit

III. High Risk Materials

Components, units, or third-party products used in the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High Risk Activities.

IV. Trademarks

TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service names are the property of their respective owners.

V. Third Party Rights

The software may include Third Party Right software. In this case you agree to comply with all terms and conditions imposed on you in respect of such separate software. In addition to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this License shall apply to the Third Party Right software.

TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND THE USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE, INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.

NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY, ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

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LE910Cx mPCIe HW Design Guide

LE910C1-AP

LE910C1-ST

LE910C1-SV

APPLICABILITY TABLE

PRODUCTS

LE910C1-NS

LE910C1-NA

LE910C1-NF

LE910C4-NF

LE910C4-AP

LE910C1-EU

LE910C4-EU

LE910C1-EUX

LE910C1-SA

LE910C1-LA

LE910C4-LA

LE910C4-CN

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NOTICE 2

COPYRIGHTS .................................................................................................. 2

COMPUTER SOFTWARE COPYRIGHTS ....................................................... 2

USAGE AND DISCLOSURE RESTRICTIONS ................................................ 3

APPLICABILITY TABLE .................................................................................. 4

CONTENTS ...................................................................................................... 5

1. INTRODUCTION ............................................................................ 8

Scope ............................................................................................. 8

Audience ........................................................................................ 8

Contact Information, Support ......................................................... 8

Text Conventions ........................................................................... 9

Related Documents ...................................................................... 10

2. GENERAL PRODUCT DESCRIPTION ........................................ 11

Overview ...................................................................................... 11

Product Variants and Frequency Bands ....................................... 11

Target market ............................................................................... 12

Main features ................................................................................ 13

TX Output Power .......................................................................... 14

RX Sensitivity ............................................................................... 14

Mechanical specifications ............................................................. 17

2.7.1. Dimensions ................................................................................... 17

2.7.2. Weight .......................................................................................... 17

Temperature range ....................................................................... 18

3. PINS ALLOCATION .................................................................... 19

Pin-out .......................................................................................... 19

4. POWER SUPPLY ........................................................................ 23

Power Supply Requirements ........................................................ 28

Power Consumption ..................................................................... 28

General Design Rules .................................................................. 28

4.3.1. Electrical Design Guidelines ......................................................... 29

4.3.1.1. +5V Source Power Supply Design Guidelines ............................. 29

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4.3.1.2. +12V Source Power Supply Design Guidelines ........................... 29

4.3.2. Thermal Design Guidelines .......................................................... 30

4.3.3. Power Supply PCB layout Guidelines .......................................... 31

VAUX Power Output ..................................................................... 33

GNSS LNA BIAS .......................................................................... 34

5. ELECTRICAL SPECIFICATION .................................................. 35

Absolute Maximum Ratings – Not Operational ............................. 35

Recommended Operating Conditions .......................................... 35

6. DIGITAL SECTION ...................................................................... 36

Logic Levels ................................................................................. 36

Power On ..................................................................................... 38

Unconditional Restart ................................................................... 40

Power OFF procedure .................................................................. 43

Control signals .............................................................................. 45

6.5.1. WAKE_N ...................................................................................... 45

6.5.2. W_DISABLE_N ............................................................................ 47

6.5.3. LED_WWAN_N ............................................................................ 47

6.5.4. PERST_N ..................................................................................... 48

Hardware Interfaces ..................................................................... 48

6.6.1. USB Port ...................................................................................... 49

6.6.2. Serial Port ..................................................................................... 50

6.6.2.1. Modem Serial Port 1 Signals ........................................................ 50

6.6.2.2. RS232 Level Translation .............................................................. 51

6.6.3. I2C – Inter-integrated Circuit ........................................................ 53

6.6.4. Digital Audio ................................................................................. 53

SIM Interface ................................................................................ 54

7. RF SECTION ................................................................................ 56

Band Variants ............................................................................... 56

TX and RX characteristics ............................................................ 56

Antenna requirements .................................................................. 56

7.3.1. Antenna Connectors ..................................................................... 56

7.3.2. Main GSM/WCDMA/LTE Antenna Requirements ........................ 57

7.3.3. Antenna Diversity Requirements .................................................. 57

7.3.4. GNSS Antenna Requirements ..................................................... 58

7.3.4.1. Combined GNSS Antenna ........................................................... 59

7.3.4.2. Linear and Patch GNSS Antenna ................................................. 59

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8. MECHANICAL DESIGN............................................................... 60

Mechanical Dimensions ............................................................... 60

8.1.1. Mechanical Drawing (with SIM holder) ......................................... 60

8.1.1.1. Top View ...................................................................................... 60

8.1.1.2. Bottom View ................................................................................. 61

8.1.1.3. Side View ..................................................................................... 62

8.1.2. Mechanical Drawing (without SIM holder) .................................... 63

8.1.2.1. Top View ...................................................................................... 64

8.1.2.2. Bottom View ................................................................................. 64

8.1.2.3. Side View ..................................................................................... 66

9. APPLICATION PCB DESIGN ...................................................... 67

Recommended footprint for the application .................................. 67

10. EMC RECOMMENDATIONS ....................................................... 68

11. PACKAGING ............................................................................... 69

Tray .............................................................................................. 69

Tray Drawing ................................................................................ 71

Moisture sensitivity ....................................................................... 72

12. CONFORMITY ASSESSMENT ISSUES ..................................... 73

Declaration of Conformity ............................................................. 73

13. SAFETY RECOMMENDATIONS ................................................. 74

READ CAREFULLY ..................................................................... 74

14. REFERENCE TABLE OF RF BANDS CHARACTERISTICS ..... 75

15. ACRONYMS ................................................................................ 78

16. DOCUMENT HISTORY ................................................................ 80

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LE910Cx mPCIe HW Design Guide

1. INTRODUCTION

Scope

The aim of this document is the description of some hardware solutions useful for developing a product with the Telit xE910Cx Mini PCIe Adapter.

Audience

This document is intended for Telit customers, especially system integrators, about to implement their applications using the Telit xE910Cx Mini PCIe Adapter.

Contact Information, Support

For general contact, technical support services, technical questions and report documentation errors contact Telit Technical Support at:

• TS-EMEA@telit.com

• TS-AMERICAS@telit.com

• TS-APAC@telit.com

• TS-SRD@telit.com

Alternatively, use:

https://www.telit.com/support-training/

For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:

http://www.telit.com

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements.

Telit appreciates feedback from the users of our information.

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This information MUST be followed or catastrophic

Alerts the user to important points about

Text Conventions

Danger – equipment failure or bodily injury may occur.

Caution or Warning – integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction.

Tip or Information – Provides advice and suggestions that may be useful when integrating the module.

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

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LE910Cx mPCIe HW Design Guide

2. GENERAL PRODUCT DESCRIPTION

Overview

The aim of this document is to present possible and recommended hardware solutions useful for developing a product with the Telit LE910Cx-mPCIe module.

LE910Cx-mPCIe is Telit platform for Mini PCIe applications, such as M2M applications, table PC, based on the following technologies:

• LTE / WCDMA networks for data communication

• Designed for industrial grade quality

In its most basic use case, LE910Cx-mPCIe can be applied as a wireless communication front-end for mobile products, offering mobile communication features to an external host CPU through its rich interfaces. LE910Cx-mPCIe can further support customer software applications and security features. LE910Cx-mPCIe provides a software application development environment with sufficient system resources for creating rich on-board applications. Thanks to a dedicated application processor and embedded security resources, product developers and manufacturers can create products that guarantee fraud prevention and tamper evidence without extra effort for additional security precautions. LE910Cx-mPCIe is available in hardware and band variants as listed in 2.2

Product Variants and Frequency Bands.

Product Variants and Frequency Bands

LE910Cx modules bands combinations are listed below:

Product 2G Band 3G Band 4G Band Region

LE910C1-NA 2, 3, 5, 8 1, 2, 4, 5, 8 2, 4, 12 North America

LE910C1-AP - 1, 5, 6, 8, 19

LE910C4-AP - 1, 5, 6, 8, 19

LE910C1-NS - -

LE910C4-NF - 2, 4, 5

1, 3, 5, 8, 9, 18, 19, 26, 28

2, 4, 5, 12, 25, 26

2, 4, 5, 12, 13, 14, 66, 71

Asia-Pacific

North America

- Sprint

North America

LE910C1-NF - 2, 4, 5

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2, 4, 5, 12, 13, 14, 66, 71

North America

LE910Cx mPCIe HW Design Guide

Product 2G Band 3G Band 4G Band Region

LE910C1-EU 3, 8 1, 3, 8

LE910C4-EU 3, 8 1, 3, 8

LE910C4EUX

3, 8 1, 3, 8

1, 3, 7, 8, 20, 28A

LE910C1-SA - - 2, 4, 12, 14, 66

LE910C1-ST - - 2, 4, 12, 66, 71

LE910C1-SV - - 4, 13

LE910C1-LA 2, 3, 5, 8 1, 2, 4, 5

1, 2, 3, 4, 5, 7, 28

Europe

North America – AT&T

North America – T-Mobile

North America

- Verizon

Latin America

LE910C4-LA 2, 3, 5, 8 1, 2, 4, 5

W: 1, 8

LE910C4-CN 3, 8

TDS: 34, 39

1, 2, 3, 4, 5, 7, 28

1, 3, 5, 8, 38, 39, 40, 41M

Latin America

China

Refer to Chapter Reference Table of RF Bands Characteristics 14 for details information about frequencies and bands.

Target market

LE910Cx-mPCIe can be used for wide variety applications, where low power consumption and low cost are required while sufficient data rates are achieved:

• Mini PCIe applications

• Notebook PC

• M2M applications

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LE910Cx mPCIe HW Design Guide

Application processor to run customer application code

Main features

Function Features

Modem

Digital audio subsystem

USIM ports – dual voltage

• Multi-RAT cellular modem for voice and data communication

• LTE FDD Catx data rates per the module variant used.

• Carrier aggregation is not supported

• GSM/GPRS/EDGE

• WCDMA up to DC HSPA+, Rel.9

• Regional variants with optimal choice of RF bands

• coverage of countries and MNOs

• State-of-the-art GNSS solution with

GPS/GLONASS/BeiDou/Galileo/QZSS receiver

• PCM/I2S digital audio interface

• Up to 48 kHz sample rate, 16 bit words

• Class B and Class C support

• Hot swap support

• Clock rates up to 4 MHz

Application processor

• 32 bit ARM Cortex-A7 up to 1.3 GHz running the Linux operating system

• Flash + DDR are large enough to allow for customer’s own software applications

Interfaces

• USB2.0 – USB port is typically used for:

o Flashing of firmware and module configuration

o Production testing

o Accessing the Application Processor’s file system

o AT command access

o High-speed WWAN access to external host

o Diagnostic monitoring and debugging

o Communication between Java application environment and

an external host CPU

o NMEA data to an external host CPU

• Peripheral Ports – SPI, I2C, UART

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LE910Cx mPCIe HW Design Guide

• GPIOs

Function Features

• Antenna ports

Form factor Full-Mini Card 52 pin, 50.95mm x 30mm x 1mm

Environment and quality

The entire module is designed and qualified by Telit for satisfying the

environment and quality requirements.

requirements

Single supply

The module generates all its internal supply voltages.

module

RTC No dedicated RTC supply, RTC is supplied by VBATT

TX Output Power

Technology

2G LB 32.5

2G HB 29.5

3G/TD-SCDMA 23.5

Power (dBm)

4G FDD 22.5 @1RB

RX Sensitivity

Typical sensitivity levels are as follows:

Mode

Primary Diversity SIMO

PCS 1900 -107.0 - - -102

DCS 1800 -106.5 - - -102

GSM 850 -108.0 - - -102

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3GPP

LE910Cx mPCIe HW Design Guide

Mode

Primary Diversity SIMO

3GPP

EGSM 900 -107.0 - - -102

WCDMA 2100 – B1 -108.5 -109.5 -111.0 -106.7

WCDMA 1900 – B2 -109.0 -110.0 -111.5 -104.7

WCDMA 1800 – B3 -107.0 -109.0 -109.0 -103.7

WCDMA AWS – B4 -109.0 -109.5 -111.5 -106.7

WCDMA 850 – B5 -109.5 -110.5 -112.0 -104.7

WCDMA 850 – B6 -109.5 -110.5 -112.0 -106.7

WCDMA 850 – B19 -109.5 -110.5 -112.0 -106.7

WCDMA 900 – B8 -109.0 -110.0 -111.5 -103.7

TDS CDMA 2000 –

B34

TDS CDMA 1900 –

B39

-109.5 -

-105

LTE 2100 – B1 -97.5 -98.0 -100.0 -96.3

LTE 1900 – B2 -96.5 -98.5 -98.5 -94.3

LTE 1800 – B3 -97.0 -99.0 -99.0 -93.3

LTE AWS – B4 -97.5 -98.5 -100.0 -96.3

LTE 850 – B5 -98.5 -100.0 -101.0 -94.3

LTE 2600 – B7 -97.0 -97.0 -99.0 -94.3

LTE 900 – B8 -98.0 -99.0 -100.5 -93.3

LTE 1800 – B9 -97.5 -98.5 -100.0 -95.3

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LE910Cx mPCIe HW Design Guide

Mode

Primary Diversity SIMO

3GPP

LTE 700a – B12 -98.0 -99.0 -100.5 -93.3

LTE 700c – B13 -98.0 -99.0 -100.5 -93.3

LTE 700PS – B14 -97.5 -99.0 -100.0 -93.3

LTE 700b – B18 -98.5 -99.5 -101.0 -96.3

LTE 800 – B19 -98.5 -99.0 -101.0 -96.3

LTE 800 – B20 -98.5 -98.5 -101.0 -93.3

LTE 1900+ – B25 -96.0 -98.0 -98.0 -92.8

LTE 850+ – B26 -98.5 -99.5 -101.0 -93.8

LTE 700 – B28A/B -98.0 -100.0 -101.0 -94.8

LTE AWS-3 – B66 -97.5 -98.5 -100.0 -95.8

LTE600 – B71 -97.5 -97.0 -100.0 -93.5

LTE TDD 2600 –

B38 -97.5 -98.0 -100.0

LTE TDD 1900 –

B39 -98.0 -99.0 -100.5

LTE TDD 2300 –

B40 -96.5 -98.0 -99.0

LTE TDD 2500 –

B41M -96.5 -97.5 -99.0

-96.3

-94.3

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LE910Cx mPCIe HW Design Guide

NOTE – The sensitivity level has a deviation about +/- <2dB each

model, device and channel because the level shows typical value.

LTE level is measured at BW 10M.

Mechanical specifications

2.7.1. Dimensions

The overall dimensions of LE910Cx-mPCIe family are:

 Length: 50.95 mm, +0/-0.3mm

 Width: 30 mm, +0/-0.3mm

 Thickness : 3.2 mm, +/-0.15mm (Version with SIM holder : 4.62 mm, +/-0.15mm)

2.7.2. Weight

The nominal weight of the module;

With SIM holder: 10.3 grams

Without SIM holder: 9.1 grams

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LE910Cx mPCIe HW Design Guide

Temperature range

Case Range Note

–20°C ~ +55°C

The module is fully functional(*) in all the temperature range, and it fully meets the

3GPP specifications.

The module is fully functional (*) in all the

temperature range.

Operating

Temperature Range

However, there may be some performance

deviations in this extended range relative to 3GPP requirements, which means that

–40°C ~ +85°C

some RF parameters may deviate from the 3GPP specification in the order of a

few dB.

For example: receiver sensitivity or

maximum output power may be slightly

degraded

Storage and non-

operating

–40°C ~ +105°C

Temperature Range

(*) Functional: the module is able to make and receive voice calls, data calls, SMS and make data traffic.

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LE910Cx mPCIe HW Design Guide

3. PINS ALLOCATION

Pin-out

Pin Signal I/O Function Type Comment

Power Supply

2 3V3_AUX -

39 3V3_AUX - 3.3V Main Power

41 3V3_AUX - 3.3V Main Power

52 3V3_AUX - 3.3V Main Power

4 GND - Ground

9 GND - Ground

15 GND - Ground

18 GND - Ground

3.3V Main Power Supply

Supply

Power

21 GND - Ground

26 GND - Ground

27 GND - Ground

29 GND - Ground

34 GND - Ground

35 GND - Ground

37 GND - Ground

40 GND - Ground

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LE910Cx mPCIe HW Design Guide

Pin Signal I/O Function Type Comment

43 GND - Ground

50 GND - Ground

USB Interface

36 USB D- I/O USB differential

Data (-)

38 USB D+ I/O

USB differential

Data (+)

Digital Voice Interface (DVI)

45 PCM_CLK I/O Digital Audio

Interface (BIT Clock)

47 PCM_TX O

Digital Audio

Interface (TX Out of

the card)

49 PCM_RX I Digital Audio

Interface (RX Into

the card)

1.8V

51 PCM_SYNC I/O

Digital Audio

1.8V

Interface

(Frame_Sync)

16 REF_CLK O Reference clock for

1.8V

external Codec

SIM Card Interface

8 SIMVCC I/O External SIM signal

1.8 / 3V

– Power supply for

the SIM

10 SIMIO I/O External SIM signal -

1.8 / 3V

Data I/O

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Active low signal for

Supply output for

Pin Signal I/O Function Type Comment

12 SIMCLK O External SIM signal

– Clock

14 SIMRST O External SIM signal

– Reset

UART

3 UART_RX I

Serial data input

(RX) from DTE

5 UART_TX O Serial data output

(TX) to DTE

17 UART_RTS O Output Request To

Send signal (RTS) to

DTE

19 UART_CTS I Input for Clear To

Send signal (CTS)

from DTE

1.8 / 3V

1.8V

Miscellaneous Functions

1 WAKE_N O

20 W_DISABLE_N I

22 PERST_N I

28 VAUX_PWRMON O

Active low output

signal used to wake

up the system from

stand-by

wireless disabling

(Flight mode)

Active low functional

reset input to the

card

external accessories /

Power ON monitor

3.3V

1.8V

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Pin Signal I/O Function Type Comment

Active low, open

drain signal for

42 LED_WWAN_N O

WWAN LED driving,

used to provide

3.3V

module’s status

indication

30 I2C_SCL I/O I2C clock 1.8V

32 I2C_SDA I/O I2C Data 1.8V

Internally Pull Up

2.2kΩ to 1.8V

Internally PU 2.2kΩ to

Enables the external

48 GPS_LNA_EN O

regulator for GPS

1.8V

LNA

Reserved

6 Reserved -

7 Reserved -

11 Reserved -

13 Reserved -

1.8V

23 Reserved -

24 Reserved -

25 Reserved -

31 Reserved -

33 Reserved -

44 Reserved -

46 Reserved -

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LE910Cx mPCIe HW Design Guide

WARNING

There are two different types of mPCIe modules; LE910Cx mPCIe V1 and LE910Cx mPCIe V2. Two types of mPCIe modules have the different pinout on PCM signals but rest of pins are exactly same.

mPCIe Pin-out mPCIe V1

PCM_RX

PCM_TX

mPCIe V2

PCM_TX

PCM_RX

LE910Cx mPCIe V2 was developed to provide the improved thermal performance with the large solder resist opening area on the bottom side of the module. For more detail, please refer to 80576DSW10190A LE910Cx mPCIe HW Release notes.

Warning – Reserved pins must be left floating.

Pin-out for the full compatibility with PCI Express miniCard specification.

Some pins of LE910Cx mPCIe are different from the pin-out defined by PCI Express miniCard specification to support various Telit’s own functions.

But there have been a need for the full compatibility with both PCI Express miniCard specification and old Telit’s xE910 mPCIe models. In order to meet this requirement, this model was developed.

Some pins of LE910Cx mPCIe which are different from PCI Express miniCard specification were changed to reserved. For more detail, please refer to the following Pinout.

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LE910Cx mPCIe HW Design Guide

Pin Signal I/O Function Type Comment

Power Supply

2 3V3_AUX - 3.3V Main Power

Power

Supply

39 3V3_AUX - 3.3V Main Power

Power

Supply

41 3V3_AUX -

3.3V Main Power

Power

Supply

52 3V3_AUX - 3.3V Main Power

Power

Supply

4 GND - Ground

9 GND - Ground

15 GND - Ground

18 GND - Ground

21 GND - Ground

26 GND - Ground

27 GND - Ground

29 GND - Ground

34 GND - Ground

35 GND - Ground

37 GND - Ground

40 GND - Ground

43 GND - Ground

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LE910Cx mPCIe HW Design Guide

Active low signal for

drain signal for

Pin Signal I/O Function Type Comment

50 GND - Ground

USB Interface

36 USB D- I/O USB differential

Data (-)

38 USB D+ I/O USB differential

Data (+)

SIM Card Interface

8 SIMVCC I/O External SIM signal

– Power supply for

the SIM

10 SIMIO I/O

External SIM signal -

Data I/O

12 SIMCLK O External SIM signal

– Clock

14 SIMRST O External SIM signal

– Reset

1.8 / 3V

Miscellaneous Functions

1 WAKE_N O

20 W_DISABLE_N I

22 PERST_N I

42 LED_WWAN_N O

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Active low output

signal used to wake

up the system from

stand-by

wireless disabling

(Flight mode)

Active low functional

reset input to the

card

Active low, open

3.3V

+ 57 hidden pages

Telit LE910Cx Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

NOTICE

COPYRIGHTS

COMPUTER SOFTWARE COPYRIGHTS

USAGE AND DISCLOSURE RESTRICTIONS

APPLICABILITY TABLE

Contents

1. INTRODUCTION

Scope

Audience

Contact Information, Support

Text Conventions

Related Documents

2. GENERAL PRODUCT DESCRIPTION

Overview

Product Variants and Frequency Bands.

Target market

Main features

TX Output Power

RX Sensitivity

Mechanical specifications

2.7.1. Dimensions

2.7.2. Weight

Temperature Range

3. PINS ALLOCATION

Pin-out

Pin-out for the full compatibility with PCI Express miniCard specification.