Telegesis ETRX2-PA Product Manual

Telegesis TG-ETRX2PA-PM-003-106

ETRX2PA

Product Manual 1.06

ETRX2-PA ZIGBEE® MODULE

PRODUCT MANUAL

ETRX2PA

Table of Contents

1 INTRODUCTION................................................................................................................... 5

1.1 Hardware Description ........................................................................................................ 5

1.2 Hardware precautions........................................................................................................ 5

1.2.1 Unexpected start-up in bootloader mode........................................................................... 5

2 PRODUCT APPROVALS..................................................................................................... 6

2.1 FCC Approvals................................................................................................................... 6

2.1.1 FCC Labelling Requirements............................................................................................. 7

2.2 European Certification ....................................................................................................... 7

2.3 Declarations of Conformity................................................................................................. 8

2.4 IEEE 802.15.4.................................................................................................................... 8

2.5 The ZigBee® Protocol ....................................................................................................... 8

3 MODULE PINOUT................................................................................................................9

4 HARDWARE DESCRIPTION .............................................................................................11

4.1 Hardware Options ............................................................................................................ 11

4.1.1 On-board DC Regulator ................................................................................................... 11

4.1.2 On-board Reference Crystal ............................................................................................ 11

4.1.3 RF output pad .................................................................................................................. 11

5 HARDWARE INTERFACE .................................................................................................12

6 FIRMWARE DESCRIPTION............................................................................................... 13

6.1 Custom Firmware............................................................................................................. 13

6.2 Software Interface............................................................................................................ 14

7 ABSOLUTE MAXIMUM RATINGS..................................................................................... 15

8 OPERATING CONDITIONS ...............................................................................................15

9 DC ELECTRICAL CHARACTERISTICS............................................................................17

10 A/D CONVERTER CHARACTERISTICS........................................................................... 18

11 AC ELECTRICAL CHARACTERISTICS............................................................................18

11.1 TX Power Characteristics ................................................................................................ 20

12 PHYSICAL DIMENSIONS ..................................................................................................21

13 SOLDERING TEMPERATURE TIME PROFILE (FOR REFLOW SOLDERING) .............. 23

13.1 For Leaded Solder ........................................................................................................... 23

13.2 For Lead-free Solder........................................................................................................ 23

14 PRODUCT LABEL DRAWING........................................................................................... 24

15 RECOMMENDED FOOTPRINT ......................................................................................... 25

15.1 Example carrier board...................................................................................................... 26

16 RELIABILITY TESTS ......................................................................................................... 27

ETRX2PA

17 APPLICATION NOTES ...................................................................................................... 27

17.1 Safety Precautions........................................................................................................... 27

17.2 Design Engineering Notes ............................................................................................... 27

17.3 Storage Conditions .......................................................................................................... 28

18 PACKAGING ...................................................................................................................... 29

18.1 Embossed Tape............................................................................................................... 29

18.2 Component Orientation.................................................................................................... 30

18.3 Reel Dimensions.............................................................................................................. 30

18.4 Packaging ........................................................................................................................ 30

19 ORDERING INFORMATION .............................................................................................. 31

20 TRADEMARKS................................................................................................................... 32

21 DISCLAIMER...................................................................................................................... 32

22 ROHS DECLARATION ....................................................................................................... 32

23 DATA SHEET STATUS...................................................................................................... 32

24 LIFE SUPPORT POLICY.................................................................................................... 32

25 RELATED DOCUMENTS................................................................................................... 33

26 CONTACT INFORMATION ................................................................................................33

ETRX2PA

ETRX2-PA Summary

Image not shown actual size; enlarged to show detail.

Module Features

• Small form factor, SMT module 37.5 x 20.5 x 3.2 mm

• Same Form Factor as ETRX2

• Optional board-to-board or board-to-cable connector

• 3 RF output options: Integrated ceramic antenna, Hirose U.FL coaxial connector or single port 50Ω pad

• XAP2b microcontroller with non intrusive debug

interface (SIF)

• 128k of flash and 5kbytes of SRAM

• UART interface with DMA, hardware I

accessible with custom firmware

• Wide supply voltage range (2.7 to 3.5V)

• Module ships with standard Telegesis AT-style

software interface based on the EmberNet meshing stack.

• Can act as ZigBee End Device, Router or Coordinator

• 12 general-purpose I/O lines and 2 analogue inputs (all

17 GPIOs of the EM250 are accessible)

• Supports 4 different power modes

• Current consumption below 1µA in deep sleep mode

with self wakeup

• Firmware upgrades via RS232 or over the air (password protected)

• Hardware supported encryption (AES-128)

• Tests for CE and FCC compliance

pending

• Operating temperature range: -40

• Options include: On board low power voltage regulator,

DC/DC regulator and watch crystal

C to +85°C

C and SPI

Radio Features

• Based on the Ember EM250 single chip ZigBee®/IEEE802.15.4 solution

• 2.4GHz ISM Band

• 250kbit/s over the air data rate – NB: actual usable data

throughput with ZigBee® is about 20kbps

• 16 channels (802.15.4 Channel 11 to 26)

• Typically 17dBm (50mW) output power

• High sensitivity of up to -97Bm typ. at 1% packet error

rate

• Hardware acceleration for IEEE 802.15.4 compliant transmissions

The Telegesis ETRX2-PA module is a power amplified 2.4GHz ISM band transceiver based on the Ember EM250 single chip ZigBee®/IEEE802.15.4 solution. It has been designed to be integrated into any device without the need for RF experience and expertise. The form factor of the ETRX2-PA is identical to the ETRX2, so either module can be used depending on the range requirements of the particular application. Utilizing the EmberZNet meshing and self-healing stack, the ETRX2-PA enables you to add powerful wireless networking capability to your products and quickly bring them to market. The module’s unique AT-style command line interface allows you to quickly integrate meshing radio technology without complex software engineering.

Suggested Applications

• AMR – Automatic Meter Reading

• Wireless Alarms and Security

• Home/Building Automation

• Wireless Sensor Networks

• M2M Industrial Controls

• Future ZigBee

• PC Peripherals

• IEEE 802.15.4 Systems

• Item Tracking

® systems

Development Kits

• Two complementary development kits consisting of three or six modules and a single development board with USB connectivity and I/O breakouts.

• AT-style software interface command dictionary can be modified for high volume customers.

• Custom software development available upon request.

Example AT-Style Commands

AT+BCAST Sends a Broadcast AT+UCAST:<address> Sends a Unicast AT+EN Establish PAN network AT+JN Join any PAN

At power-up the last configuration is loaded from non volatile S-Registers, which can eliminate the need for an additional host controller.

ETRX2PA

1 Introduction

This document describes the Telegesis ETRX2-PA ZigBee® module which has been designed to be integrated into another device and to provide a fast, simple and low cost wireless mesh networking interface.

The Telegesis ETRX2-PA module is based on the Ember ZigBee® platform consisting of the single chip EM250 combined with the ZigBee PRO compliant EmberZNet meshing stack. Integration into a wide range of applications is made easy using a simple AT style command interface and advanced hardware design.

The configurable functionality often allows the ETRX2-PA wireless meshing module to be used without an additional host microcontroller saving even more integration time and costs. In addition to the Telegesis AT Commandset, the ETRX2-PA can be used in with custom build firmware or the Ember EZSP over UART protocol interface...

No RF experience or expertise is required to add this powerful wireless networking capability to your products. The ETRX2-PA offers fast integration opportunities and the shortest possible time to market for your product.

1.1 Hardware Description

The main building blocks of the ETRX2-PA are the single chip EM250 from Ember, a 24MHz reference crystal and RF front-end circuitry optimized for best RF performance. With single ended RF output, the module is available with integrated antenna or 50Ω U.FL coaxial connector or 50Ω pad terminal on the bottom of the module.

The integrated antenna is a Johanson 2450AT43A100, and details of the radiation pattern etc are available from their website [4].

Compared to the ETRX2, the ETRX2-PA module allows extended range of operation by means of an integrated high efficiency power amplifier inserted in the Tx path.

A low loss LTCC band-pass filter for the 2.4GHz ISM band is added to both the Tx and Rx path. As a result for Rx mode the immunity against interferers (for example operating at 1.8 GHz) is improved compared to the standard ETRX2.

The ETRX2 is used for ZigBee® custom firmware, and not use the pre-loaded Telegesis AT-Command interface, you will need the InSight toolchain, consisting of InSight Desktop™ together with a comprehensive integrated development environment (IDE) and C-language compiler toolchain from Ember. The Ember firmware is not suitable for an 802.15.4-only application that does not use the ZigBee layer.

As an alternative to the Telegesis R2xx and R3xx series AT Command interfaces, the ETRX2-PA can also be supplied with Ember’s UART EZSP (Ember ZigBee Serial Protocol) firmware. Please refer to the Ember EM260 manual for more information on the EZSP.

(www.zigbee.org) applications. If you wish to create your own

1.2 Hardware precautions

1.2.1 Unexpected start-up in bootloader mode

The bootloader which runs on the ETRX2 can be initiated with a firmware command, but it can also be triggered in hardware. If the A/D2 input (pad 10) is pulled low during the boot-up of the module it will enter the bootloader routine, so exercise caution when doing hardware design and ensure

ETRX2PA

that this pin is not grounded during start-up and reset or driven from an analogue voltage that may be sensed as a logic 0. If unused the pad can be left floating and a pull-up is not required.

2 Product Approvals

The ETRX2 has been designed to meet all national regulations for world-wide use. In particular the following certifications have been obtained:

2.1 FCC Approvals

The Telegesis ETRX2-PA and also the ETRX2HR-PA including the antennae listed in Table 1 complies with FCC CFR Part 15 (USA). The devices meet the requirements for modular transmitter approval as detailed in the FCC public notice DA00.1407.transmitter.

This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

FCC ID: T7VEM250B

This module complies with the USA SAR requirements and is not intended to be operated within 20cm of the body. The following statement must be included as a CAUTION statement in manuals for OEM products to alert users on FCC RF exposure compliance:

“WARNING: To satisfy FCC RF exposure requirements for mobile transmitting devices, a separation distance of 20cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operations at closer distances than this are not recommended.”

Item Part No. Manufacturer Type Gain

1 BKR2400 Embedded Antenna Design Ltd. ½ Wave Dipole 2 dBi 2 BT-Stubby (Straight) Embedded Antenna Design Ltd. Wire 0 dBi

While the applicant for a device into which the ETRX2-PA or ETRX2HR-PA (with an antenna listed in Table 1) is installed is not required to obtain a new authorization for the module, this does not preclude the possibility that some other form of authorization or testing may be required for the end product.

BT-Stubby (right-angle)

Embedded Antenna Design Ltd. Wire 0 dBi

Table 1: Approved Antennae

The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Telegesis (UK) Ltd. may void the user's authority to operate the equipment.

When using the ETRX2HR-PA with approved antennae, it is required to prevent end-users from replacing them with non-approved ones.

ETRX2PA

2.1.1 FCC Labelling Requirements

When integrating the ETRX2-PA or ETRX2HR-PA into a product if must be ensured that the FCC labelling requirements are met. This includes a clearly visible label on the outside of the finished

product specifying the Telegesis FCC identifier (FCC ID: T7VEM250B) as well as the notice above. This exterior label can use wording such as “Contains Transmitter Module FCC ID: T7VEM250B” or “Contains FCC ID: T7VEM250B” although any similar wording that expresses

the same meaning may be used.

2.2 European Certification

The ETRX2PA and ETRX2HR-PA are certified at a power level of 21.15mW e.i.r.p. (13.2dBm) to the following standards:

• Radio: EN 300 328 v1.7.1 (10/2006)

• EMC: EN 301 489-17 v1.2.1 (08/2002)

• Safety: EN 60950-1:2006

The ETRX2HR-PA was tested with the antennae listed in Table 1.

0681 EC-R&TTE Certificated

If the ETRX2 module is incorporated into an OEM product, the OEM product manufacturer must ensure compliance of the final product to the European Harmonised EMC, and low voltage/safety standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in the R&TTE Directive. The final product must not exceed the specified power ratings, antenna specifications and installation requirements as specified in this ETRX2 user manual. If any of these specifications are exceeded in the final product then a submission must be made to a notified body for compliance testing to all of the required standards.

The ‘CE’ marking must be applied to a visible location on any OEM product. For more information please refer to

http://ec.europa.eu/enterprise/faq/ce-mark.htm. Customers assume full

responsibility for learning and meeting the required guidelines for each country in their distribution market.

Important Note: In Europe the regulations for the 2.4GHz frequency band are only harmonized for

devices with an e.i.r.p. of less than 10mW (10dBm). In the case of e.i.r.p. of more than 10mW the manufacturer or his authorised representative established within the community or the person responsible for placing the equipment on the market shall notify the national authority responsible in the relevant Member State for spectrum management of the intention to place such equipment on its national market. This notification shall be given no less than four weeks in advance of the start of placing on the market.

Because of this Telegesis recommends that the user limit the output power to 10mW (10dBm) for Europe to avoid having to deal with the local authorities for spectrum management of each relevant member state.

ETRX2PA

2.3 Declarations of Conformity

Telegesis (UK) Ltd has issued Declarations of Conformity for the ETRX2 ZigBee® RF Modules, which cover Radio Emissions, EMC and Safety. These documents are available from our website or on request

2.4 IEEE 802.15.4

IEEE 802.15.4 is a standard for low data rate, wireless networks (raw bit-rate within a radio packet of 250kbps @2.4GHz) which focuses on low cost, low duty cycle, long primary battery life applications as well as mains-powered applications. It is the basis for the open ZigBee® Protocol.

2.5 The ZigBee® Protocol

The ZigBee® Protocol is a set of standards for wireless connectivity for use between any devices over short to medium distances. The specification was originally ratified in December 2004, paving the way for companies to start making low-power networks a reality.

ZigBee® uses an IEEE 802.15.4 radio specification running on the 2.4GHz band, plus three additional layers for networking, security and applications. What makes the specification unique is its use of a mesh network architecture which, in bucket chain style, passes data from one node to the next until it lands at its destination. The network is self-healing and adapts its routing as link quality changes or nodes move. Furthermore, nodes can be defined as End Devices which do not act as routers, but can therefore be put into a low-power sleep state.

The enhanced version of the ZigBee® standard (or ZigBee® 2006) was released in December 2006, adding new features and improvements to the only global wireless communication standard enabling the development of easily deployable low-cost, low-power, monitoring and control products for homes, commercial buildings and industrial plant monitoring. In 2007 the ZigBee Alliance produced the very latest edition of the standard including the PRO featureset which offers advantages over earlier versions, including

• Truly self healing mesh networking

• Messages can now travel up to 30 hops

• Source-Routing for improved point to multipoint message transmission

• Improved security including Trust-Centre link keys

• New message types and options

Based on this latest standard, the Telegesis R3xx firmware for ZigBee PRO allows for

• Support for up to 4 external interrupts and 4 analogue inputs

• Nodes can be addressed by their EUI as well as their 16 bit NodeID

• Some level of interoperability with 3rd party ZigBee PRO compliant nodes

Please note that the R2xx and to some extent the Telegesis AT-Command line interpreter are

based on a private application profile and use the Ember meshing and self-healing stack, so interoperability with wireless mesh networking solutions from other manufacturers is unlikely when using this default firmware. For more information on ZigBee® compliance and the AT command interface please refer to the latest AT command dictionary and the ETRX2 user guide.

ETRX2PA

3 Module Pinout

The ETRX2-PA is pin-compatible with the ETRX1, (NB: it has additional pins to the ETRX1). For all new designs using either ETRX1 or ETRX2 it is recommended that you use the ETRX2 footprint to ensure the option of future upgrading is guaranteed.

Figure 1: ETRX2 Module Pinout

The table below gives details about the 38 module pin signals for direct SMD soldering of the ETRX2-PA to the application board. The pin numbers shown in brackets () are the related pins of the EM250. In order to use the ETRX2-PA as a plug-in solution a Harwin 1.27mm pitch connector can be fitted on the bottom of the ETRX2-PA (Harwin part number M50-3601042). Other connectors that use the same footprint may also be used, such as a Samtec TFML-110-02-S-D.

All GND pads are connected within the module, but for best RF performance all of them should be grounded externally.

ETRX2PA

Notes:

ETRX2 Pad

1 GND GND 2 Antenna 3 GND GND 4 I/O9 GPIO 0 (21) 1 5 Vreg {1} 2 6 GND GND 3 7 Vcc 10 8 GND GND 3 9 A/D1 GPIO 4 (26) 4 10 A/D2 GPIO 5 (27) 5 11 I/O7 GPIO 3 (25) 6 12 I/O6 GPIO 2 (24) 7 13 I/O5 GPIO 1 (22) 8 14 I/O4 or RTS {3} GPIO 12 (20) 9 15 GND GND 16 SIF CLK SIF CLK 17 SIF MISO SIF MISO 18 SIF MOSI SIF MOSI 19 SIF LOADB SIF LOADB 20 GND GND 21 I/O8 GPIO 6 (29) 11 22 I/O2 or CTS {3} GPIO 11 (19) 12 23 I/O3 GPIO 13 (43) 13 24 Reset (13) 14 25 I/O1 GPIO 14 (42) 15 26 I/O0 GPIO 8 (31) 16 27 TXD GPIO 9 (32) 18 28 RXD GPIO 10 (33) 17 29 GND GND 3 30 I/O10 GPIO 15 (41) 19 31 I/O11 GPIO 16 (40) 20 32 GND GND 33 VCONT {2} n/a 34 GND GND 35 GND GND 36 GND GND 37 GND GND 38 N/C GPIO 7 (30)

Function EM250 GPIO ETRX2

Harwin Pin

Table 2. Pin Information

{1} Where the onboard regulator option is mounted this pin is connected to the output voltage of the

onboard regulator option and

NOT to the output voltage VREG_OUT of the EM250

{2} VCONT is the internal amplifier gain control voltage, resistive external loading to ground can reduce

the amplifier gain and therefore lower the maximum available module Tx output power. For most of the applications this pin is NOT connected and the amplifier is working at maximum gain. Controlling the maximum output Power can also be achieved in software.

{3} RTS/CTS handshaking is selectable in firmware. See the AT Command Manual.

+ 23 hidden pages

Telegesis ETRX2-PA Product Manual

Specifications and Main Features

Frequently Asked Questions

User Manual