TelCom Semiconductor Inc TC1025CPA, TC1025COA, TC1025EPA, TC1025EUA, TC1025EOA Datasheet

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PRELIMINARY INFORMATION
EVALUATION
KIT
AVAILABLE
TC1025
TC1025
LINEAR BUILDING BLOCK – DUAL LOW POWER COMPARATOR

FEATURES

Rail-to-Rail Inputs and Outputs
Optimized for Single Supply Operation
Small Package ......................................8-Pin MSOP
(Consumes Half the Space of an 8-pin SOIC)
Ultra Low Input Bias Current ...... Less than 100pA
Low Quiescent Current ............................. 8µA max
Operates Down to VDD = 1.8V min.

APPLICATIONS

Power Supply Circuits
Embedded Systems
Instrumentation
Portable Equipment
Consumer Products
Replacements for Discrete Components

GENERAL DESCRIPTION

Packaged in a space-saving 8-pin MSOP, the TC1025 consumes half the board area required by a standard 8-pin SOIC package. It is ideal for applications requiring high integration, small size and low power.

ORDERING INFORMATION

1
2
3
4

PIN CONFIGURATIONS

8-Pin MSOP
OUT
IN IN
1
A
2
V
SS
+
3
A
4
A
8-Pin Plastic DIP
V
IN
IN
IN
IN
1
A
V
2
SS
+
3
A
4
A
1
A
SS
2
+
3
A
4
A
OUT
OUT
TC1025CUA TC1025EUA
TC1025CPA TC1025EPA
8-Pin SOIC
TC1025COA TC1025EOA
Part No. Package Temp. Range
TC1025COA 8-Pin SOIC – 40°C to +85°C TC1025CPA 8-Pin Plastic DIP 0°C to +70°C TC1025CUA 8-Pin MSOP 0°C to +70°C
OUT
8 7 6 5
IN IN
B
V
DD
+
B
B
TC1025EOA 8-Pin SOIC – 40°C to +85°C TC1025EPA 8-Pin Plastic DIP – 40°C to +85°C TC1025EUA 8-Pin MSOP – 40°C to +85°C
TC43EV Evaluation Kit for Linear
5
Building Block Family

FUNCTIONAL BLOCK DIAGRAM

8
OUT
B
V
7
DD
+
IN
6
B
IN
5
B
8
OUT
B
V
7
DD
+
IN
6
B
IN
5
B
OUT
V
IN
IN
SS
A
A
+
A
TC1025
A
B
++–
OUT
V
DD
IN
B
IN
B
B
+
6
7
TELCOM SEMICONDUCTOR, INC.
8
TC1025-01 11/15/96
3-309
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