The servicing instructions are for use by qualified
personnel only. To avoid personal injury, do not
perform any servicing unless you are qualified to
do so. Refer to all safety summaries prior to
performing service.
that in all previously published material. Specifications and price change privileges reserved.
T ektronix, Inc., P.O. Box 500, Beaverton, OR 97077
TEKTRONIX and TEK are registered trademarks of T ektronix, Inc.
HARDWARE WARRANTY
T ektronix warrants that the products that it manufactures and sells will be free from defects in materials and
workmanship for a period of one (1) year from the date of shipment. If a product proves defective during this
warranty period, T ektronix, at its option, either will repair the defective product without charge for parts and labor,
or will provide a replacement in exchange for the defective product.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration
of the warranty period and make suitable arrangements for the performance of service. Customer shall be
responsible for packaging and shipping the defective product to the service center designated by T ektronix, with
shipping charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a
location within the country in which the T ektronix service center is located. Customer shall be responsible for
paying all shipping charges, duties, taxes, and any other charges for products returned to any other locations.
This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate
maintenance and care. T ektronix shall not be obligated to furnish service under this warranty a) to repair damage
resulting from attempts by personnel other than T ektronix representatives to install, repair or service the product;
b) to repair damage resulting from improper use or connection to incompatible equipment; c) to repair any
damage or malfunction caused by the use of non-T ektronix supplies; or d) to service a product that has been
modified or integrated with other products when the effect of such modification or integration increases the time
or difficulty of servicing the product.
THIS WARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER WARRANTIES, EXPRESS
OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’
RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE AND
EXCLUSIVE REMEDY PROVIDED TO THE CUST OMER FOR BREACH OF THIS WARRANTY.
TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT , SPECIAL,
INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR
THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.
Review the following safety precautions to avoid injury and prevent damage to
this product or any products connected to it. To avoid potential hazards, use this
product only as specified.
Only qualified personnel should perform service procedures.
While using this product, you may need to access other parts of the system. Read
the General Safety Summary in other system manuals for warnings and cautions
related to operating the system.
To Avoid Fire or
Personal Injury
Use Proper Power Cord. Use only the power cord specified for this product and
certified for the country of use.
Connect and Disconnect Properly . Do not connect or disconnect probes or test
leads while they are connected to a voltage source.
Ground the Product. This product is indirectly grounded through the grounding
conductor of the mainframe power cord. To avoid electric shock, the grounding
conductor must be connected to earth ground. Before making connections to the
input or output terminals of the product, ensure that the product is properly
grounded.
Observe All Terminal Ratings. To avoid fire or shock hazard, observe all ratings
and marking on the product. Consult the product manual for further ratings
information before making connections to the product.
The common terminal is at ground potential. Do not connect the common
terminal to elevated voltages.
Do not apply a potential to any terminal, including the common terminal, that
exceeds the maximum rating of that terminal.
Use Proper AC Adapter. Use only the AC adapter specified for this product.
Do Not Operate Without Covers. Do not operate this product with covers or panels
removed.
Use Proper Fuse. Use only the fuse type and rating specified for this product.
Avoid Exposed Circuitry. Do not touch exposed connections and components
when power is present.
Do Not Operate With Suspected Failures. If you suspect there is damage to this
product, have it inspected by qualified service personnel.
Do Not Operate in Wet/Damp Conditions.
Do Not Operate in an Explosive Atmosphere.
TMS PGB FC-PGA Hardware Support
v
General Safety Summary
Keep Product Surfaces Clean and Dry .
Provide Proper Ventilation. Refer to the manual’s installation instructions for
details on installing the product so it has proper ventilation.
Symbols and Terms
T erms in this Manual. These terms may appear in this manual:
WARNING. Warning statements identify conditions or practices that could result
in injury or loss of life.
CAUTION. Caution statements identify conditions or practices that could result in
damage to this product or other property.
T erms on the Product. These terms may appear on the product:
DANGER indicates an injury hazard immediately accessible as you read the
marking.
WARNING indicates an injury hazard not immediately accessible as you read the
marking.
CAUTION indicates a hazard to property including the product.
Symbols on the Product. The following symbols may appear onthe product:
vi
WARNING
High Voltage
Protective Ground
(Earth) T erminal
CAUTION
Refer to Manual
Double
Insulated
TMS PGB FC-PGA Hardware Support
Service Safety Summary
Only qualified personnel should perform service procedures. Read this Service
Safety Summary and the General Safety Summary before performing any service
procedures.
Do Not Service Alone. Do not perform internal service or adjustments of this
product unless another person capable of rendering first aid and resuscitation is
present.
Disconnect Power. To avoid electric shock, switch off the instrument power, then
disconnect the power cord from the mains power.
Use Care When Servicing With Power On. Dangerous voltages or currents may
exist in this product. Disconnect power, remove battery (if applicable), and
disconnect test leads before removing protective panels, soldering, or replacing
components.
To avoid electric shock, do not touch exposed connections.
TMS PGB FC-PGA Hardware Support
vii
Service Safety Summary
viii
TMS PGB FC-PGA Hardware Support
Preface
This instruction manual contains specific information about the TMS PGB FCPGA microprocessor support package and is part of a set of information on how
to operate this product on compatible Tektronix logic analyzers.
If you are familiar with operating microprocessor support packages on the logic
analyzer for which the TMS PGB FC-PGA support was purchased, you will only
need this instruction manual to set up and run the support.
If you are not familiar with operating microprocessor support packages, you will
need to supplement this instruction manual with information on basic operations
to set up and run the support.
This manual provides detailed information on the following topics:
HAssembling and configuring the probe adapter
HConnecting the logic analyzer to the system under test
HApplying power and operating the probe adapter
Manual Conventions
This manual uses the following conventions:
HThe term “module” refers to two 102-channel modules, a 102-channel
module plus a 136-channel module, or two 136-channel modules.
HA pound sign (#) following a signal name indicates an active low signal.
HThe phrase “information on basic operations” refers to basic information in
your online help.
HThe term “HI module” refers to the module in the higher-numbered slot and
the term “LO module” refers to the module in the lower-numbered slot.
TMS PGB FC-PGA Hardware Support
ix
Preface
Contacting Tektronix
Phone1-800-833-9200*
AddressTektronix, Inc.
Department or name (if known)
14200 SW Karl Braun Drive
P.O. Box 500
Beaverton, OR 97077
USA
Web sitewww.tektronix.com
Sales support1-800-833-9200, select option 1*
Service support1-800-833-9200, select option 2*
Technical supportEmail: support@tektronix.com
1-800-833-9200, select option 3*
1-503-627-2400
6:00 a.m. – 5:00 p.m. Pacific time
*This phone number is toll free in North America. After office hours, please leave a
voice mail message.
Outside North America, contact a Tektronix sales office or distributor; see the
Tektronix web site for a list of offices.
x
TMS PGB FC-PGA Hardware Support
Getting Started
Getting Started
This chapter contains information on the TMS PGB FC-PGA hardware support
package, and information on connecting your logic analyzer to your system
under test.
Support Package Description
The FC-PGA probe adapter is nonintrusive hardware that allows the logic
analyzer to acquire data from a microprocessor in its own operating environment
with little effect on that system.
The FC-PGA probe adapter is an interposer design. The probe adapter connects
to the system under test, and then, the microprocessor connects to the probe
adapter. Signals from the microprocessor-based system flow through the probe
adapter into the P6434 probes and through the probe cables to the logic analyzer.
Support Software Compatibility
The FC-PGA probe adapter requires a Tektronix microprocessor software
support package. Contact your Tektronix representative to determine which
software support package is compatible with the FC-PGA probe adapter.
If this product is used with the TMS 113 Software Support package, select the
PG370 clocking selection.
Logic Analyzer Configuration
To use the TMS PGB FC-PGA hardware support package you need a Tektronix
logic analyzer equipped with two 102-channel modules. The modules must be in
adjacent slots and merged.
References to a 204-channel module include the two 102-channel modules that
are merged and any other merged module combination of a minimum of
204-channels (for the merged combination).
You can acquire ITP and APIC bus activity through the FC-PGA probe adapter.
Probing the APIC bus requires the TMS 801 APIC bus support package, a third
102-channel acquisition module, and standard probes. See Alternate Connections
on page 1–12 for more details.
TMS PGB FC-PGA Hardware Support
1–1
Getting Started
Requirements and Restrictions
CAUTION. Forced air cooling must be used to keep the microprocessor from
overheating.
You should review the general requirements and restrictions of microprocessor
support packages in the information on basic operations as they pertain to your
system under test.
You should also review electrical, environmental, and mechanical specifications
in Specifications on page 2–1 as they pertain to your system under test, as well as
the following descriptions of other TMS PGB FC-PGA hardware support
requirements and restrictions.
System Clock Rate
BCLK
System Under Test Power
The TMS PGB FC-PGA microprocessor support can acquire data from front side
buses operating at speeds of up to 100 MHz.
The operating clock rate specifications were measured at the time of printing.
Contact your Tektronix sales representative for current information on the fastest
devices supported.
Refer to the BCLK specifications and restrictions listed in Table 2–5 on
page 2–6, in the Specifications chapter.
Whenever you power off the system under test, remove power from the probe
adapter. Refer to Applying and Removing Power on page 1–15.
1–2
TMS PGB FC-PGA Hardware Support
Getting Started
Signals Supported
The following signals are supported by the FC-PGA probe adapter:
A[31:3]#FLUSH#RS[2:0]#
A20M#HIT#SLP#
ADS#HITM#SMI#
BCLKIERR#STPCLK#
BNR#IGNNE#TCK
BP[3:2]#INIT#TDI
BPM[1:0]#LINT[1:0]TDO
BPRI#LOCK#THERMDN
BR0#PICCLKTHERMDP
BSEL#PICD[1:0]THERMTRIP#
D[63:0]#PRDY#TMS
DBSY#PREQ#TRDY#
DEFER#PWRGOODTRST#
DRDY#REQ[4:0]#
FERR#RESET#
Labeling P6434 Probes
Contact your Tektronix sales representative for other supported signals not shown
in the preceding list.
The TMS PGB FC-PGA hardware support package relies on the standard
channel mapping and labeling scheme for P6434 probes. Apply labels using the
standard method described in the P6434 Mass Termination Probe Instructions.
TMS PGB FC-PGA Hardware Support
1–3
Getting Started
Assembling the Probe Adapter
The probe adapter assembly consists of a Logic board, Interposer board, and
screws.
CAUTION. Static discharge can damage the microprocessor, the probe adapter,
the probes, and the module. To prevent static damage, handle components only in
a static-free environment.
Always wear a grounding wrist strap, heel strap, or similar device while
handling the microprocessor and probe adapter.
Do the following steps to assemble the probe adapter:
1. To discharge any static electricity, touch the ground connector located on the
logic analyzer. Then, before you remove the probe adapter circuit boards
from their protective bags, touch each bag to discharge stored static
electricity.
2. Align the Logic board connector pins with the Interposer board connector
pins, and press firmly to seat the board connector (see Figure 1–1). Both
connectors are polarized and will only mate in one orientation.
NOTE. To ensure a reliable electrical connection between the Logic board and the
Interposer board the 190-pin mictor connector must be completely seated at both
ends (see Figure 1–1).
Logic board
The top of the plug
is not level with the
top of receptacle
Gap
190-pin mictor
Interposer
board
Correct
The top of the plug
is level with the top
of receptacle
No gap on
either end
Incorrect
1–4
Figure 1–1: Seating the 190-pin mictor connector
TMS PGB FC-PGA Hardware Support
Getting Started
3. Align the mounting brackets on the logic board with the mounting holes on
the interposer board (see Figure 1–2).
4. Attach and tighten the screws (see Figure 1–2).
5. Remove the protective socket from the bottom of the Interposer board. This
socket was installed to protect the pins during shipping. Retain this socket to
use later with the FC-PGA probe adapter for timing and disassembly support.
Logic board
Mounting brackets
Mounting holes
Interposer board
Protective
socket
Screws (2)
Figure 1–2: Attaching the Logic board to the Interposer board
TMS PGB FC-PGA Hardware Support
1–5
Getting Started
Configuring The Probe Adapter
The probe adapter uses jumpers to acquire data for disassembly or for timing.
Figure 1–3 shows the location of the jumpers.
TIMING/NORMAL Jumper
MFG_TEST Jumper
Place the TIMING/NORMAL jumper, J600, in the NORMAL position to acquire
and disassemble data.
Place the TIMING/NORMAL jumper in the TIMING position to acquire timing
data.
Figure 1–3 shows the location of J600 on the probe adapter.
To acquire data at frequencies below 40 MHz on the probe adapter, short the two
pins on J512. This disables the PLL signal and buffers the BCLK signal to all
clocked components.
Figure 1–3 shows the location of J512 on the probe adapter.
Logic board
J600 Jumper
J512 Jumper
1–6
Figure 1–3: Jumper locations on the FC-PGA probe adapter
TMS PGB FC-PGA Hardware Support
Connecting the Logic Analyzer to a System Under Test
Before you connect the probe adapter to the system under test, connect three
P6434 probes to the HI module and three P6434 probes to the LO module. The
module in the higher-numbered slot is referred to as the HI module and the
module in the lower-numbered slot is referred to as the LO module.
Your system under test must allow clearance for the probe adapter. Refer to the
dimensions on page 2–7 for the required clearances.
To connect the logic analyzer to your system under test, follow these steps:
1. Power off your system under test. It is not necessary to power off the logic
analyzer.
CAUTION. Static discharge can damage the microprocessor, the probe adapter,
the probes, and the module. To prevent static damage, handle the components
only in a static-free environment.
Getting Started
Always wear a grounding wrist strap, heel strap, or similar device while
handling the microprocessor and probe adapter.
2. Match the A, C, and D probes from the HI module with the corresponding
HI_A, HI_C, and HI_D probe connectors on the probe adapter. Align the
pin 1 indicator on the probe label with the pin 1 indicator of the connector on
the probe adapter.
CAUTION. Incorrect handling of the P6434 probe while connecting it to the probe
adapter can result in damage to the probe or to the mating connector on the
probe adapter. To avoid damaging the probe and probe adapter, always position
the probe perpendicular to the mating connector and gently connect the probe.
3. Position the probe tip perpendicular to the mating connector and gently
connect the probe (see Figure 1–4).
4. When connected, push down the latch releases on the probe to set the latch.
TMS PGB FC-PGA Hardware Support
1–7
Getting Started
Push down to latch after
probe is connected
Push down to latch after
probe is connected
Pin 1
Pin 1
Figure 1–4: Connecting a probe to the probe adapter
5. Match the A, C, and D probes from the LO module with the corresponding
LO_A, LO_C, and LO_D probe connectors on the probe adapter. Align the
pin 1 indicator on the probe label with pin 1 of the connector on the probe
adapter.
6. Repeat steps 3 and 4.
1–8
7. Follow the procedure from the FC-PGA microprocessor vendor to remove
the microprocessor from the FC-PGA socket on your system under test.
8. Choose the correct protective socket.
When using the FC-PGA probe adapter for timing and disassembly support,
choose the 370-pin protective socket. When using the FC-PGA probe adapter for
ITP debugging, choose the 363-pin protective socket.
NOTE. Use one protective socket at a time. Do not install a protective socket
without removing all existing sockets from the system under test and from the
bottom of the probe adapter assembly.
TMS PGB FC-PGA Hardware Support
Getting Started
Standard socket (370 pins)
Black holes are missing pins
ITP socket (363 pins)
Figure 1–5: protective sockets
9. Align the A3 pin indicator on the protective socket with pin A3 of the
FC-PGA socket on your system under test.
10. Insert the protective socket into the system under test as shown in Fig-
ure 1–6.
Protective socket
Pin A3
ZIF socket
Pin A3
Figure 1–6: Inserting a protective socket into the ZIF socket
TMS PGB FC-PGA Hardware Support
1–9
Getting Started
11. Align the A3 pin indicator on the probe adapter with the A3 pin indicator on
the installed protective socket.
12. Insert the probe adapter into the installed protective socket as shown in
Figure 1–7.
Logic board
Interposer board
Pin A3
System under test
Figure 1–7: Inserting the probe adapter into the protective socket
1–10
TMS PGB FC-PGA Hardware Support
Getting Started
13. Insert the microprocessor into the probe adapter as shown in Figure 1–8.
FC-PGA
Microprocessor
Pin A3
System under test
Figure 1–8: Placing the FC-PGA microprocessor into the probe adapter
14. Apply forced air cooling across the FC-PGA microprocessor to keep the
microprocessor from overheating.
TMS PGB FC-PGA Hardware Support
1–11
Getting Started
Alternate Connections
APIC
Four pins on J410 are provided to connect the TMS 801 APIC bus probe adapter
to the PICCLK, PICD0 and PICD1 signals for APIC bus support. The TMS 801
APIC bus probe adapter is not included with the TMS PGB FC-PGA hardware
support package. Contact a Tektronix representative for information on how to
obtain the TMS 801 APIC bus probe adapter.
Figure 1–9 shows the APIC bus signal pins for the FC-PGA probe adapter.
T able 1–1: APIC information
J410
pin number
1GND–––
2J33PICCLK
3L35PICD1
4J35PICD0
Microprocessor
pin number
Microprocessor
signal name
Logic board
1–12
ITP
J410 APIC bus pins
Figure 1–9: APIC bus pins location on the probe adapter
The FC-PGA probe adapter logic board provides J310 as a way to connect to
In-Target Probing (ITP) debugging hardware. ITP debugging hardware is not
included with the TMS PGB FC-PGA hardware support package. Contact your
microprocessor vendor for information on how to obtain ITP debugging
hardware.
TMS PGB FC-PGA Hardware Support
Getting Started
NOTE. The ITP circuitry on the Logic board is active only when the ITP probe
cable is connected to J310. If the ITP probe cable is disconnected from J310, all
ITP data and control lines on the logic board are tristated.
Optional System Reset. The ITP circuitry on the Interposer board does not allow
external ITP debugging hardware to induce a system reset through the
DBRESET# signal on the ITP connector. If you need to enable this feature you
must provide the connection to your system under test. The following Table 1–2
lists the signals on the J510.
T able 1–2: Testpoint (J510) information
Pin numberITP signal name
1GND
2DBRESET#
Figure 1–10 shows the location of the DBRESET# Testpoint and ITP pin header
on the logic board of the probe adapter.
When using ITP debugging hardware with the FC-PGA probe adapter, a special
363-pin protective socket must be installed in the system under test. See
Connecting the Logic Analyzer to a System Under Test on page 1–7 for further
information.
Logic board
J310 ITP
pin header
J510
DBRESET#
Figure 1–10: ITP pin locations on the probe adapter logic board
TMS PGB FC-PGA Hardware Support
1–13
Getting Started
Test Points
Additional test points on the Interposer board at J700 allow alternate ways of
probing for information as shown on Figure 1–11. Table 1–3 lists the signals on
J700.
Figure 1–11: Test point locations on the probe adapter
TMS PGB FC-PGA Hardware Support
Applying and Removing Power
A power supply for the FC-PGA probe adapter is included with this
TMS PGB FC-PGA hardware support. The power supply provides +5 volts
power to the probe adapter.
NOTE. Whenever you power off the system under test, be sure to remove power
from the probe adapter.
To apply power to the FC-PGA probe adapter and system under test, follow these
steps:
CAUTION. Failure to use the +5 V power supply provided by Tektronix can
permanently damage the probe adapter and FC-PGA microprocessor. Do not
mistake another power supply that looks similar for the +5 V power supply.
1. Connect the +5 V power supply to the jack on the probe adapter. Figure 1–12
shows the location of the jack on the adapter board.
Getting Started
CAUTION. Failure to apply power to the probe adapter before applying power to
your system under test can permanently damage the FC-PGA microprocessor
and system under test.
2. Plug the power supply for the probe adapter into an electrical outlet. When
power is present on the probe adapter, an LED lights near the power jack.
3. Power on the system under test.
TMS PGB FC-PGA Hardware Support
1–15
Getting Started
Power jack
Logic board
Figure 1–12: Location of the power jack
To remove power from the system under test and the probe adapter, follow these
steps:
CAUTION. Failure to power down your system under test before removing the
power from the probe adapter can permanently damage the FC-PGA microprocessor and the system under test.
1. Power off the system under test.
2. Unplug the power supply for the probe adapter from the electrical outlet.
1–16
TMS PGB FC-PGA Hardware Support
CPU To Mictor Connections
To probe the microprocessor, you will need to make connections between the
CPU and the Mictor pins of the P6434 Mass Termination Probe. Refer to the
P6434 Mass Termination Probe manual, Tektronix part number 070-9793-XX,
for more information on mechanical specifications. Tables 1–4 through 1–11
show the CPU pin to Mictor pin connections.
Tektronix uses a counterclockwise pin assignment. Pin 1 is located at the top left,
and pin 2 is located directly below it. Pin 20 is located on the bottom right, and
pin 21 is located directly above it (see Figure 1–13).
AMP uses an odd side-even side pin assignment. Pin 1 is located at the top left,
and pin 3 is located directly below it. Pin 2 is located on the top right, and pin 4
is located directly below it (see Figure 1–13).
NOTE. When designing Mictor connectors into your system under test, always
follow the Tektronix pin assignment.
Getting Started
Tektronix PinoutAMP Pinout
Pin 1
Pin 19
Pin 38
Pin 20
Pin 1
Pin 37
Pin 2
Pin 38
Figure 1–13: Pin assignments for a Mictor connector (component side)
T able 1–4: Clock Channels (stored in the acquisition memory)
NOTE. Dashes –– indicates: the CLK or QUAL channel is not used, the channel
is not supported by the support software, or the channel is not connected to the
microprocessor.
CLK and QUAL channels designated as DATA are logged in on the master strobe
defined by the support software.
T able 1–6: CPU to Mictor connections for Mictor C pins (high)
This chapter contains information regarding the specifications of the
TMS PGB FC-PGA microprocessor hardware support.
The following is a description of Signal Probing, Bus Tracking Logic, and ITP
circuitry.
Signal Probing
ITP
The FC-PGA probe adapter uses series isolation to acquire data. For some signals
(see table 2–2), the probe adapter also presents an active device load.
The FC-PGA probe adapter provides a connection point for In-Target Probing
(ITP). In addition to the standard ITP pin header, the probe adapter contains
circuitry to terminate the ITP control and data signals to their appropriate voltage
levels. The ITP circuitry on the probe adapter supports 1.5V CMOS I/O.
When using the ITP port on the probe adapter, a 363-pin sacrificial socket must
be installed on the system under test to isolate the ITP signals between the system
under test and the microprocessor. Isolating the ITP signals allows the probe
adapter to control the ITP signals on the local CPU.
The ITP circuitry on the probe adapter can only control the ITP signals when an
ITP probe cable is plugged into the ITP pin header on the logic board. When the
cable is removed, all ITP data and control lines are tristated.
TMS PGB FC-PGA Hardware Support
2–1
Specifications
Probe Adapter Loading Diagrams
Figures 2–1 through 2–5 are provided for loading reference.
Connect to FC-PGA
CPU
Interposer
87 W
FC-PGA Socket
151 W87 W87 W
Mated 190 - Pin
Mictor Model
P6434
Probe
Sacrificial
FC-PGA Socket
Connect to FC-PGA
socket on system
under test
0.06 nS
0.5 pF
0.55 nS0.58 nS
Figure 2–1: FC-PGA signals without active loads
Connect to FC-PGA
CPU
Interposer
FC-PGA
Sacrificial
FC-PGA
Connect to FC-PGA socket
on system under test
87 W
0.06 nS
100 W
0.5 pF
0.40 nS
Figure 2–2: FC-PGA signals with active loads
87 W
Mated 190 - Pin
Mictor Model
87 W
0.15 nS
6.5 pF
87 W
P6434
Probe
0.60 nS
Connect to FC-PGA CPU
Interposer
FC-PGA
Sacrificial
FC-PGA
Connect to FC-PGA socket on
system under test
87 W182 W
0.08 nS
Figure 2–3: FC-PGA BCLK
2–2
0.5 pF
332 W
87 W
0.02 nS
2.6 pF
TMS PGB FC-PGA Hardware Support
Interposer
FC-PGA Socket
CPU
1.0 nH
Sacrificial
FC-PGA Socket
CPU
1.5 nH
Specifications
Mated 190 - Pin
Mictor Model
InputOutput
10 mW
3.2 nH
1.3 nH
System under test
System under test
0.5
pF
0.7
pF
0.5
pF
Figure 2–4: Detail of FC-PGA sockets and 190-pin mictor connector.
Table 2–1 shows the values you can use to calculate characteristics of the Lossy
delay lines shown in Figure 2–5, which is the equivalent circuit of the P6434
probe.
T able 2–1: Lossy delay line values
CharacteristicValue
C (capacitance)1.58 pF per inch
L (inductance)8.9 nH per inch
R (resistance)
Z0 (impedance)
.067 W per inch
75 W
TMS PGB FC-PGA Hardware Support
2–3
Specifications
Input
1.6 nH
0.005
0.7 pF
W
1.6 nH
0.005
W
1.1 pF
Figure 2–5: Equivalent circuit for the P6434 probe
Specification Tables
These specifications are for a probe adapter connected between a compatible
Tektronix logic analyzer and a system under test. Signal voltage swing in your
system under test must be at least 200 mV around the GTL+ reference voltage.
Table 2–2 lists the electrical requirements of the system under test. Table 2–3
lists the electrical requirements for the power supply that provides power to the
FC-PGA probe adapter. Table 2–4 lists the environmental specifications.
Table 2–5 lists the BCLK timing restrictions and electrical specifications.
0.23 pF
20 KW
LOSS Y
Length = 58 inches
75
W
+2.2 V
2–4
T able 2–2: Electrical specifications for the system under test
CharacteristicsRequirements
System under test DC power requirements
Voltage, VCC_1.5V1.5 V "9 %
Current, VCC_1.5VI maximum 35 mA, I typical 1.8 mA
Voltage, VREF61.0 V "2 %
Current, VREF6I maximum <1 mA, I typical <1 mA
Voltage, VCC_CMOS (1.5 V)
Current, VCC_CMOS (1.5 V)
Voltage, VCC_CMOS (2.5 V)
Current, VCC_CMOS (2.5 V)
1
1
1
1
1.5 V "9 %
I maximum 20 mA, I typical 0.9 mA
2.5 V "5 %
I maximum 35 mA
I typical 1.4 mA
System under test clock rate Maximum 100 MHz
Minimum setup time required, all signals 2.8 ns
TMS PGB FC-PGA Hardware Support
T able 2–2: Electrical specifications for the system under test (cont.)
CharacteristicsRequirements
Minimum hold time required, all signals 0.2 ns
Specification
Measured typical SUT signal loading AC loadDC load
Specifications
All signals with active loads (except
BCLK): INIT#, BREQ0#, REQ4#, ADS#,
RS0#, RS1#, RS2#, HIT#, HITM#,
DRDY#, BNR#, A3#, A8# – A15#,
BCLK2.6 pFAD8009
Signals without active loads2.5 pF
1
The VCC_CMOS supply voltage can be either 1.5. V or 2.5 V depending on the CMOS
I/O voltage level of the target microprocessor.
8 pF74GTL16622 in parallel
with 20 kW
20 kW
T able 2–3: Electrical specifications for the AC adapter
CharacteristicDescription
Input Voltage rating90 – 265 V CAT II
Input Frequency Rating47 – 63 Hz
Output Voltage Rating5 V
Output Current Rating5 A
Output Power Rating25 W
T able 2–4: Environmental specifications
Characteristic
Temperature
Maximum operating+50° C (+122° F)
Minimum operating0° C (+32° F)
Nonoperating–55° C to +75° C (–67° to +167° F)
Humidity 10 to 95% relative humidity
Altitude
Operating4.5 km (15,000 ft) maximum
Nonoperating15 km (50,000 ft) maximum
TMS PGB FC-PGA Hardware Support
1
Description
2
2–5
Specifications
T able 2–4: Environmental specifications (cont.)
Characteristic
1
Description
Electrostatic immunity The probe adapter is static sensitive
1
Designed to meet Tektronix standard 062-2847-00 class 5.
2
Not to exceed microprocessor thermal considerations. Forced air cooling might be
required across the CPU.
T able 2–5: BCLK timing and electrical specifications
Characteristics
Vin (lo)0.5V
Vin (hi)2.0V
Duty Cycle2575%
t
lh
t
hl
MinimumMaximumUnitsNotes
1.25nsMonotonically increasing
1.25nsMonotonically decreasing
2–6
TMS PGB FC-PGA Hardware Support
Specifications
Dimensions
Logic board
Interposer board
97.79 mm
(3.850 in)
Figure 2–6 shows the dimensions of the FC-PGA probe adapter. The figure also
shows the minimum vertical clearance of the high-density probe cable.
139.06 mm
(5.475 in)
15.75 mm
(.620 in)
53.34 mm
(2.100 in)
4.32 mm
(.170 in)
133.35 mm
(5.250 in)
28.32 mm
(1.115 in)
Sacrificial
socket
4.39 mm
(.170 in)
93.98 mm
(3.700 in)
Figure 2–6: Dimensions of the FC-PGA probe adapter
34.29 mm
(1.350 in)
10.16 mm
(.400 in)
13.58 mm
(.535 in)
76.20 mm
(3.00 in)
23.49 mm
(.925 in)
9.78 mm
(.385 in)
72.40 mm
(2.850 in)
TMS PGB FC-PGA Hardware Support
2–7
Specifications
2–8
TMS PGB FC-PGA Hardware Support
Maintenance
Maintenance
Replacing The Fuse
This section contains information on replacing the probe-adapter fuse.
If the fuse on the probe adapter opens (burns out), you can replace it with a 5 A,
125 V fuse. Figures 3–1 illustrates the location of the fuse on the FC-PGA probe
adapter. See the Replaceable Parts List chapter for part descriptions.
F200 Fuse
Figure 3–1: Fuse location on the FC-PGA probe adapter
TMS PGB FC-PGA Hardware Support
3–1
Maintence
3–2
TMS PGB FC-PGA Hardware Support
Replaceable Parts List
Replaceable Parts List
This chapter contains a list of the replaceable mechanical components for the
TMS PGB FC-PGA hardware support product.
Parts Ordering Information
Replacement parts are available through your local Tektronix field office or
representative.
Changes to Tektronix products are sometimes made to accommodate improved
components as they become available and to give you the benefit of the latest
improvements. Therefore, when ordering parts, it is important to include the
following information in your order:
HPart number
HInstrument type or model number
HInstrument serial number
HInstrument modification number, if applicable
If you order a part that has been replaced with a different or improved part, your
local Tektronix field office or representative will contact you concerning any
change in part number.
Change information, if any, is located at the rear of this manual.
Using the Replaceable Parts List
The tabular information in the Replaceable Parts List is arranged for quick
retrieval. Understanding the structure and features of the list will help you find
all of the information you need for ordering replacement parts. The following
table describes the content of each column in the parts list.
TMS PGB FC-PGA Hardware Support
4–1
Replaceable Parts List
Parts list column descriptions
ColumnColumn nameDescription
1Figure & index numberItems in this section are referenced by figure and index numbers to the exploded view illustrations
that follow.
2Tektronix part numberUse this part number when ordering replacement parts from Tektronix.
3 and 4Serial numberColumn three indicates the serial number at which the part was first effective. Column four
indicates the serial number at which the part was discontinued. No entries indicates the part is
good for all serial numbers.
5QtyThis indicates the quantity of parts used.
6Name & descriptionAn item name is separated from the description by a colon (:). Because of space limitations, an
item name may sometimes appear as incomplete. Use the U.S. Federal Catalog handbook H6-1
for further item name identification.
7Mfr . codeThis indicates the code of the actual manufacturer of the part.
8Mfr . part numberThis indicates the actual manufacturer’s or vendor’s part number.
Abbreviations
Chassis Parts
Mfr. Code to Manufacturer
Cross Index
Abbreviations conform to American National Standard ANSI Y1.1–1972.
Chassis-mounted parts and cable assemblies are located at the end of the
Replaceable Electrical Parts List.
The table titled Manufacturers Cross Index shows codes, names, and addresses of
manufacturers or vendors of components listed in the parts list.
4–2
TMS PGB FC-PGA Hardware Support
Replaceable Parts List
Manufacturers cross index
Mfr.
code
00779AMP INC.CUSTOMER SERVICE DEPT
14310AULT INC7300 BOONE AVE NORTH
1AW87LEWIS SCREW CO.4300 SOUTH RACINE AVENUECHICAGO, IL 60609
26742METHODE ELECTRONICS INCBACKPLAIN DIVISION
5Y400TRIAX METAL PRODUCTS INC1880 SW MERLO DRIVEBEAVERTON, OR 97006
60381PRECISION INTERCONNECT CORP.16640 SW 72ND AVEPORTLAND, OR 97224
61857SAN–O INDUSTRIAL CORP91–3 COLIN DRIVEHOLBROOK, NY 11741
63058BERG ELECTRONICS INC.MCKENZIE SOCKET DIV
80009TEKTRONIX INC14150 SW KARL BRAUN DR
82389SWITCHCRAFTDIV OF RAYTHEON
S3109FELLER U.S. CORPORATION72 VERONICA A VE
TK1373PATELEC–CEM10156 TORINO
TK2541AMERICOR ELECTRONICS LTDUNIT–H
TK2548XEROX CORPORATION14181 SW MILLIKAN WAYBEAVERTON, OR 97005
LO module, definition, ix
loading, 2–5
logic analyzer
configuration for disassembler, 1–1
configuration for the application, 1–1
M
manual
conventions, ix
how to use the set, ix
MFG_TEST pins, 1–6
Index–1
Index
Mictor to CPU connections, 1–17
module, definition, ix
P
P6434 probes, labeling, 1–3
Phone number, Tektronix, x
power, for the probe adapter
applying, 1–15
removing, 1–16
power adapter, 1–15
power jack, 1–16
probe adapter
clearance, dimensions, FC–PGA, 2–7
configuring, 1–6
Connecting the logic Analyzer, 1–7
hardware description, 1–1
jumper positions, 1–6
Product support, contact information, x
R
replacing the fuse, 3–1
requirements
cooling, 1–2
forced air cooling, 1–2
Signal Supported, 1–3
System under T est, 1–2
restrictions, 1–2
BCLK, 1–2
S
service information, 3–1
Service support, contact information, x
signal loading, 2–5
Signal Supported, 1–3
signals, active low sign, ix
sockets, 370 pin or 363 pin, 1–8
specifications, 2–1