Tektronix TDS7054, TDS7104, TDS7000 Service Manual

Service Manual
TDS7000 Series Digital Phosphor Oscilloscopes (TDS7104 & TDS7054)
071-0711-03
This document applies to firmware version 2.3.2 and above.
Warning
www.tektronix.com
Copyright © Tektronix, Inc. All rights reserved.
Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supercede s that in all previously published material. Specifications and price change privileges reserved.
Tektronix, Inc., P.O. Box 500, Beaverton, OR 97077
TEKTRONIX and TEK are registered trademarks of Tektronix, Inc.

WARRANTY

Tektronix warrants that the products that it ma nufactures and sells will be free from de fects in materials and workmanship for a period of one (1) year from the date of shipment. If this product proves defective during its warranty period, Tektronix, at its option, will either repair the defective product without charge for parts and labor, or provide a replacement in exchange for the defective product.
This warranty applies only to products returned to the designated Tektronix depot or the Tektronix authorized representative from which the product was originally purchased. For products returned to other locations, Customer will be assessed an applicable service charge. The preceding limitation shall not apply within the European Economic Area, where products may be returned for warranty service to the nearest designated service depot regardl ess of the place of purchase.
In order to obtain service under this warranty, Customer must provide the appli cable office of Tektronix or its authorized representative with notice of the defect before the expiration of the warranty period and make suitable arrangements for the performance of service. Customer shall be responsible for packaging and shipping the defective product to the service center designated by Tektronix or its representative, with shipping charges prepaid. Tektronix or its representative shall pay for the return of the product to Customer. Customer shall be responsible for paying any associated taxes or duties.
This warranty shall not apply to any defect, failure or damage caused by improper use or im proper or inadequate maintenance and care. Tektronix shall not be obliga ted to furnish service under this warranty:
a) to repair damage resulting from attempts by personnel other than Tektronix representatives to install, repa ir or service
the product;
b) to repair damage resulting from improper use or connection to incompat ible equipment;
c) to repair any damage or malfunction caused by the use of non-Tektronix supplies or consumables;
d) to repair a product that has been modified or integra ted with other products when the effect of such modification or
integration increases the time or difficulty of servicing the product; or
e) to repair damage or malfunction resulting from failure to perform user maintenance and cleaning at the frequency and
as prescribed in the user manual (if applicable).
THE ABOVE WARRANTIES ARE GIVEN BY TEKTRONIX WITH RESPECT TO THIS PRODUCT IN LIEU OF ANY OTHER
WARRANTIES, EXPRESS OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’ RESPONSIBILITY TO REPAIR OR
REPLACE DEFECTIVE PRODUCTS IS THE SOLE AND EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR
BREACH OF THIS WARRANTY. TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT,
SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR THE
VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.

Table of Contents

Specifications
Operating Information
General Safety Summary xi...................................
Service Safety Summary xiii....................................
Preface xv...................................................
Manual Structure xv................................................
Manual Conventions xv..............................................
Related Documentation xvi...........................................
Contacting Tektronix xvii.............................................
Product and Feature Description 1--1....................................
Acquisition Features 1--2..........................................
Signal Processing Features 1--2.....................................
Display Features 1--3.............................................
Measurement Features 1--3.........................................
Trigger Features 1--3..............................................
Convenience Features 1--4.........................................
Specification Tables 1--5..............................................
Installation 2--1.....................................................
Before You Start 2--1.............................................
Environmental Considerations 2--1..................................
Connect the Peripherals 2--2........................................
Power On the Instrument 2--4.......................................
Powering Off the Oscilloscope 2--5..................................
Create an Emergency Startup Disk 2--5...............................
Software Installation 2--6..........................................
Operating Information 2--7............................................
Back Up User Files 2--7...........................................
User Interface Map 2--7...........................................
Front Panel Controls Map 2--9......................................
Front Panel I/O Map 2--10..........................................
Instrument Diagnostics 2--10........................................
Signal Path Compensation 2--10.....................................
Using the Online Help 2--11.........................................
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Table of Contents
Theory of Operation
Logic Conventions 3--1...............................................
Module Overviews 3--1...............................................
Performance Verification
Conventions 4--2....................................................
Brief Procedures 4--5...........................................
Self Tests 4--5.......................................................
Functional Tests 4--6.................................................
Performance Tests — Semi-Automated Method 4--17.................
Overview of the Procedure 4--19.........................................
Initial Instrumentation Setup 4--20.......................................
Test Program Installation 4--22..........................................
Test Program Execution 4--23...........................................
Performance Tests 4--27.........................................
Prerequisites 4--27....................................................
Equipment Required 4--28..............................................
TDS7000 Test Record 4--30............................................
Signal Acquisition System Checks 4--35...................................
Time Base System Checks 4--57.........................................
Trigger System Checks 4--65............................................
Output Signal Checks 4--74.............................................
Sine Wave Generator Leveling Procedure 4--81.............................
General 3--1....................................................
Input Signal Path 3--1.............................................
Display Panel 3--2................................................
Front Panel 3--2..................................................
Rear Panel 3--3..................................................
Low Voltage Power Supply 3--3.....................................
Fans 3--3.......................................................
Verify Internal Adjustment, Self Compensation, and Diagnostics 4--5.......
Verify All Input Channels 4--7......................................
Verify the Time Base 4--10..........................................
Verify the A (Main) and B (Delayed) Trigger Systems 4--12...............
Verify the File System 4--13.........................................
Check DC Voltage Measurement Accuracy 4--35........................
Check DC Gain Accuracy 4--39......................................
Check Analog Bandwidth 4--43......................................
Check Delay Between Channels 4--48.................................
Check Channel Isolation (Crosstalk) 4--52.............................
Check Long-Term Sample Rate and Delay Time Accuracy and
Reference 4--57............................................
Check Delta Time Measurement Accuracy 4--62........................
Check Time Accuracy for Pulse, Glitch, Timeout, and
Width Triggering 4--65......................................
Check Sensitivity, Edge Trigger, DC Coupled 4--69......................
Check Outputs — CH 3 Signal Out and Aux Trigger Out 4--74.............
Check Probe Compensation Output 4--77..............................
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Adjustment Procedure
Maintenance
Table of Contents
Adjustment Procedures 5--1.....................................
Adjustment Interval 5--1...........................................
Adjustment Environment 5--1......................................
Adjustment Dependencies 5--1......................................
Adjustment After Repair 5--1.......................................
Required Equipment 5--2..........................................
Overview of the Procedure 5--3.........................................
Instrumentation Setup 5--4.............................................
Adjustment Program Installation 5--9....................................
Adjustment Program Execution 5--10.....................................
Preventing ESD 6--1.................................................
Inspection and Cleaning 6--2...........................................
General Care 6--2................................................
Interior Cleaning 6--2.............................................
Exterior Cleaning 6--2............................................
Flat Panel Display Cleaning 6--3....................................
Removal and Installation Procedures 6--7.........................
Preparation 6--7.....................................................
Procedures for External Modules 6--9....................................
Procedures for Outer-Chassis Modules 6--20...............................
Troubleshooting 6--51...........................................
Service Level 6--51...................................................
Check for Common Problems 6--51......................................
Equipment Required 6--53..............................................
Fault Isolation Procedure 6--53..........................................
PPC and NLX PC Diagnostics 6--58......................................
Firmware Updates 6--62................................................
After Repair 6--63....................................................
BIOS Error Messages (Bali NLX) 6--63...................................
BIOS Error Messages (Radisys NLX) 6--64................................
BIOS Beep Codes (Bali NLX) 6--67......................................
BIOS Beep Codes (Radisys NLX) 6--68...................................
Dip Switch Controls 6 --68..............................................
Diagnostic LED 6--69.................................................
Troubleshooting Using Reset Circuits 6--71................................
Update/Restore the NLX Board CMOS 6--73...............................
Installing an Authorization Key 6--74.....................................
Hard Disk Drive Maintenance 6--75......................................
Repackaging Instructions 6--77...................................
Packaging 6--77......................................................
Shipping to the Service Center 6--77......................................
Options
Options 7--1........................................................
Accessories 7--2.....................................................
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Table of Contents
Electrical Parts List
Diagrams
Mechanical Parts List
Electrical Parts List 8--1........................................
Diagrams 9--1.................................................
Symbols 9--1.......................................................
Parts Ordering Information 10--1.........................................
Module Servicing 10--1............................................
Using the Replaceable Parts List 10--2....................................
Abbreviations 10--2...............................................
Mfr. Code to Manufacturer Cross Index 10--2...........................
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List of Figures

Table of Contents
Figure 2--1: Locations of peripheral connectors on rear panel 2--3.....
Figure 2--2: Line fuse and power cord connector locations,
rear panel 2-- 4.............................................
Figure 2-- 3: On/Standby switch location 2-- 5.......................
Figure 4-- 1: Toolbar and menu bar 4 --3...........................
Figure 4--2: Universal test hookup for functional
tests -- CH 1 shown 4--7.....................................
Figure 4-- 3: Channel button location 4 --8..........................
Figure 4--4: Setup for time base test 4--10...........................
Figure 4--5: Setup for trigger test 4--12.............................
Figure 4--6: Setup for the file system test 4--14.......................
Figure 4--7: Initial setup 4--20....................................
Figure 4--8: Setup to characterize signal sou rce outputs 4--23..........
Figure 4--9: Setup to check delay between channels 4--24..............
Figure 4--10: Setup to check delta time accuracy 4--24................
Figure 4-- 11: Setup to check probe compensation output 4-- 25.........
Figure 4--12: Setup to check analog signal output 4--25...............
Figure 4--13: Setup to check auxiliary output 4--25...................
Figure 4--14: Initial test hookup 4--36..............................
Figure 4--15: Measurement of DC accuracy at maximum
offset and position 4--38......................................
Figure 4--16: Initial test hookup 4--39..............................
Figure 4--17: Measurement of DC gain accuracy 4--42................
Figure 4--18: Initial test hookup 4--44..............................
Figure 4--19: Optional initial test hookup 4--44......................
Figure 4--20: Measurement of an alog bandwid th 4--47................
Figure 4--21: Initial test hookup 4--49..............................
Figure 4--22: Measurement of chan nel delay 4--51...................
Figure 4--23: Initial test hookup 4--53..............................
Figure 4--24: Initial test hookup 4--57..............................
Figure 4--25: Measurement of accuracy -- long-term and
delay time 4--59.............................................
Figure 4--26: Initial test hookup for external reference 4--60...........
Figure 4-- 27: Final test hookup for external reference input 4-- 61.......
Figure 4--28: Delta time accuracy test hookup 4--62..................
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Figure 4--29: Initial test hookup 4--66..............................
Figure 4--30: Measurement of time accuracy for pulse and
glitch triggering 4--67........................................
Figure 4--31: Initial test hookup 4--70..............................
Figure 4--32: Measurement of trigger sensitivity -- 50 MHz
results shown 4--71..........................................
Figure 4--33: Initial test hookup 4--74..............................
Figure 4--34: Measurement of main trigger ou t limits 4--76............
Figure 4--35: Initial test hookup 4--77..............................
Figure 4--36: Measurement of p robe compensator frequency 4--78......
Figure 4-- 37: Subsequent test hookup 4-- 79.........................
Figure 4--38: Measurement of p robe compensator amplitude 4--80......
Figure 4-- 39: Sine wave generator leveling equipment setup 4-- 81......
Figure 4-- 40: Equipment setup for maximum amplitude 4-- 83.........
Figure 5--1: Adjustment setup using a separate controller 5--4........
Figure 5--2: Adjustment setup using the oscilloscope as
the controller 5--5..........................................
Figure 5--3: National Instruments GPIB Interface Properties
dialog box 5--8.............................................
Figure 6--1: Line fuse and line cord removal 6--10...................
Figure 6--2: Knob removal 6--11..................................
Figure 6--3: Trim removal 6--13...................................
Figure 6--4: Bottom cover removal 6--14............................
Figure 6--5: Cover removal 6--16..................................
Figure 6--6: Cover removal 6--17..................................
Figure 6--7: External modules 6--18................................
Figure 6-- 8: Internal modules 6-- 19................................
Figure 6--9: Front-panel assembly removal 6--21.....................
Figure 6--10: J1 flex cable connector removal 6--22...................
Figure 6--11: Front panel board and keyboard removal 6--23..........
Figure 6--12: Display removal 6--25................................
Figure 6--13: Touch panel and LCD assembly removal 6--26...........
Figure 6--14: Display adaptor board removal 6--27...................
Figure 6--15: Cable clip removal 6--27..............................
Figure 6--16: Power flex circuit removal 6--29.......................
Figure 6--17: Floppy disk drive removal 6--30.......................
Figure 6--18: Hard disk drive removal 6--32.........................
Figure 6--19: Removing the hard disk drive from the cartridge 6--32....
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Table of Contents
Figure 6--20: CD drive and bracket removal 6--34....................
Figure 6--21: Fan assembly removal 6--35...........................
Figure 6-- 22: Front and rear power distribution and PA bus
boards removal 6--37........................................
Figure 6-- 23: Low-voltage power supply removal 6--38................
Figure 6--24: NLX battery removal 6--39...........................
Figure 6--25: NLX assembly removal 6--42..........................
Figure 6--26: Riser adapter and NLX board removal 6--44............
Figure 6--27: Microprocessor removal 6--46.........................
Figure 6--28: PPC Processor board removal 6--48....................
Figure 6--29: Acquisition circuit board removal 6--50.................
Figure 6--30: Primary troubleshooting tree 6--54.....................
Figure 6--31: Location of power-on and over current LEDs 6--55.......
Figure 6--32: Location of debug pins 6--56..........................
Figure 6--33: Connectors J1 and J2 6--57...........................
Figure 6--34: The three PCI busses 6--71...........................
Figure 6--35: PCI and NLX video connectors 6--72...................
Figure 6--36: Location of jumpers and reset button 6 --73..............
Figure 9--1: TDS7000 series block diagram 9--2.....................
Figure 10--1: External parts 10--6.................................
Figure 10--2: Front panel and drives 10--8..........................
Figure 10--3: Power supply 10--11..................................
Figure 10--4: Acquisition assembly 10--12............................
Figure 10--5: Accessories 10--13....................................
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Table of Contents

List of Tables

Table 1--1: TDS7000 models 1--1.................................
Table 1--2: Channel input and vertical specifications 1-- 5............
T able 1--3: Horizontal and acquisition system specifications 1--10......
Table 1--4: Trigger specifications 1--12.............................
Table 1--5: Display specifications 1--15.............................
Table 1--6: Input/output port specifications 1-- 16....................
Table 1--7: Data storage specifications 1--18........................
Table 1--8: Power source specifications 1--18........................
T able 1--9: Mechanical specifications 1--19.........................
Table 1--10: Environmental specifications 1--20.....................
Table 1--11: Certifications and compliances 1--21....................
Table 2--1: Additional accessory connection information 2--2.........
Table 2--2: Line fuses 2--4......................................
Table 4--1: Required equipment and materials 4-- 17.................
Table 4--2: Test sequence overview 4-- 19...........................
Table 4--3: GPIB devices required by test program 4--21.............
Table 4--4: Test equipment 4--28..................................
T able 4--5: DC V oltage measurement accuracy 4--37.................
T able 4--6: Gain accuracy 4--41...................................
Table 4--7: Analog bandwidth 4--46...............................
T able 4--8: Delay between channels worksheet 4--52.................
Table 4--9: Delta time measurement 4--64..........................
Table 5--1: Adjustments required for module replaced 5--1...........
Table 5--2: Required equipment and materials 5-- 2.................
Table 5--3: GPIB devices required by test program 5--6.............
Table 5--4: Renaming the GPIB devices 5--8.......................
Table 5--5: Setting the GPIB addresses 5--9........................
T able 6--1: External inspection check list 6--3......................
T able 6--2: Internal inspection check list 6--4......................
Table 6--3: Tools required for module removal 6--8.................
Table 6--4: Failure symptoms and possible causes 6--51...............
Table 6--5: Power supply voltages 6-- 56............................
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Table of Contents
Table 6--6: Power-on diagnostic tests 6--59.........................
Table 6--7: Action required for module replaced 6-- 63................
Table 6--8: BIOS Error messages 6--63............................
Table 6--9: BIOS Error messages (Radisys) 6--65....................
T able 6--10: Beep codes (Bali) 6--67...............................
Table 6--11: Beep codes (Radisys) 6-- 68............................
Table 6--12: DIP switch functions 6--69............................
Table 6--13: Diagnostic LED 6--70................................
T able 7--1: Standard accessories 7--2.............................
Table 7--2: Optional accessories 7--3..............................
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Table of Contents
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TDS7104 & TDS7054 Service Manual

General Safety Summary

Review the following safety precautions to avoid injury and prevent damage to this product or any products connected to it. To avoid potential hazards, use this product only as specified.
Only qualified personnel should perform service procedures.
While using this product, you may need to access other parts of the system. Read the General Safety Summary in other system manuals for warnings and cautions related to operating the system.
ToAvoidFireor
Personal Injury
Use Proper Power Cord. Use only the power cord specified for this product and certified for the country of use.
Connect and Disconnect Properly. Do not connect or disconnect probes or test leads while they are connected to a voltage source.
Ground the Product. This product is grounded through the grounding conductor of the power cord. To avoid electric shock, the grounding conductor must be connected to earth ground. Before making connections to the input or output terminals of the product, ensure that the product is properly grounded.
Observe All Terminal Ratings. To avoid fire or shock hazard, observe all ratings and markings on the product. Consult the product manual for further ratings information before making connections to the product.
Do Not Operate Without Covers. Do not operate this product with covers or panels removed.
Use Proper Fuse. Use only the fuse type and rating specified for this product.
Avoid Exposed Circuitry. Do not touch exposed connections and components
when power is present.
Wear Eye Protection. Wear eye protection if exposure to high-intensity rays or laser radiation exists.
Do Not Operate With Suspected Failures. If you suspect there is damage to this product, have it inspected by qualified service personnel.
Do Not Operate in Wet/Damp Conditions.
Do Not Operate in an Explosive Atmosphere.
Keep Product Surfaces Clean and Dry.
Provide Proper Ventilation. Refer to the manual’s installation instructions for
details on installing the product so it has proper ventilation.
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General Safety Summary
Symbols and Terms
Terms in this Manual. These terms may appear in this manual:
WARNING. Warning statements identify conditions or practices that could result in injury or loss of life.
CAUTION. Caution statements identify conditions or practices that could result in damage to this product or other property.
Terms on the Product. These terms may appear on the product:
DANGER indicates an injury hazard immediately accessible as you read the marking.
WARNING indicates an injury hazard not immediately accessible as you read the marking.
CAUTION indicates a hazard to property including the product.
Symbols on the Product. The following symbols may appear on the product:
CAUTION
Refer to Manual
Mains Disconnected
OFF (Power)
WARNING
High Voltage
Mains Connected
ON (Power)
Protective Ground
(Earth) Terminal
Standby
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TDS7104 & TDS7054 Service Manual

Service Safety Summary

Only qualified personnel should perform service procedures. Read this Service Safety Summary and the General Safety Summary before performing any service
procedures.
Do Not Service Alone. Do not perform internal service or adjustments of this product unless another person capable of rendering first aid and resuscitation is present.
Disconnect Power. To avoid electric shock, switch off the instrument power, then disconnect the power cord from the mains power.
Use Care When Servicing With Power On. Dangerous voltages or currents may exist in this product. Disconnect power, remove battery (if applicable), and disconnect test leads before removing protective panels, soldering, or replacing components.
To avoid electric shock, do not touch exposed connections.
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Service Safety Summary
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TDS7104 & TDS7054 Service Manual

Preface

Manual Structure

Manual Conventions

This is the service manual for the TDS7000 Digital Oscilloscope products. Read this preface to learn how this manual is structured, what conventions it uses, and where you can find other information related to servicing this product. Read the Introduction following this preface for safety and other important background information needed before using this manual for servicing this product.
This manual is divided into chapters, which are made up of related subordinate topics. These topics can be cross referenced as sections.
Be sure to read the introductions to all procedures. These introductions provide important information needed to do the service correctly, safely, and efficiently.
This manual uses certain conventions that you should become familiar with before attempting service.
Modules
Replaceable Parts
Safety
Throughout this manual, any replaceable component, assembly, or part is referred to by the term module. A module is composed of electrical and mechanical assemblies, circuit cards, interconnecting cables, and user-accessible controls.
This manual refers to any field-replaceable assembly or mechanical part specifically by its name or generically as a replaceable part. In general, a replaceable part is any circuit board or assembly, such as the hard disk drive, or a mechanical part, such as the I/O port connectors, that is listed in the replaceable parts list of Chapter 10.
Symbols and terms related to safety appear in the Service Safety Summary found at the beginning of this manual.
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Preface

Related Documentation

The oscilloscope, electrical sampling modules and optical sampling modules come with the following manuals:
H CSA7000, TDS7000 & TDS6000 Series User manual. Tektronix part number
071-7010-XX.
H CSA7000, TDS7000 & TDS6000 Series Reference manual. Tektronix part
number 020-2404-XX.
H TDS7000 & TLA600 Series Rackmount Kit (Option 1R) Instructions.
Tektronix part number 071-0716-XX.
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TDS7104 & TDS7054 Service Manual

Contacting Tektronix

Preface
Phone 1-800-833-9200*
Address Tektronix, Inc.
Department or name (if known) 14200 SW Karl Braun Drive P.O. Box 500 Beaverton, OR 97077 USA
Web site www.tektronix.com
Sales support 1-800-833-9200, select option 1*
Service support 1-800-833-9200, select option 2*
Technical support Email: support@tektronix.com
1-800-833-9200, select option 3* 1-503-627-2400
6:00 a.m. -- 5:00 p.m. Pacific time
* This phone number is toll free in North America. After office hours, please leave a
voice mail message. Outside North America, contact a Tektronix sales office or distributor; see the Tektronix web site for a list of offices.
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Preface
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TDS7104 & TDS7054 Service Manual

Specifications

This chapter contains the specifications for the TDS7000 series Digital Phosphor Oscilloscopes. All specifications are guaranteed unless labeled typical.Typical specifications are provided for your convenience but are not guaranteed. Specifications that are marked with the n symbol are checked in chapter four, Performance Verification.
All specifications apply to all models unless noted otherwise. To meet specifica­tions, the following conditions must be met:
H The instrument must have been calibrated in an ambient temperature
between 20 °C and 30 °C(68°F and 86 °F).
H The instrument must be operating within the environmental limits listed in
Table 1--10 on page 1--20.
H The instrument must be powered from a source that meets the specifications
listed in Table 1--8 on page 1--18.
H The instrument must have been operating continuously for at least 20
minutes within the specified operating temperature range.
H You must perform the Signal Path Compensation procedure after the
20-minute warm-up period, and if the ambient temperature changes more
than 5 °C(41°F), repeat the procedure. See Run the signal-path compensa-
tion routine on page 4--6 for instructions to perform this procedure.

Product and Feature Description

Your oscilloscope is shown in Table 1--1.
Table 1- 1: TDS7000 models
Model
TDS7054 4 500 MHz 5 GS/s
TDS7104 4 1GHz 10 GS/s
Number of channels
Bandwidth
Maximum sample rate (real time)
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Specifications
Acquisition Features
Separate Digitizers. Ensure accurate timing measurements with separate digitizers for each channel. Acquisition on multiple channels is always concurrent. The digitizers can also be combined to yield a higher sample rate on a single channel.
Fast Acquisition. Acquire up to 400,000 waveforms per second to see rapidly changing signals or intermittent signal irregularities.
Long Record Lengths. Choose record lengths from 500 points to up to 500,000 points per channel (up 2,000,000 points on a single channel). Extend the maximum record length up to a maximum of 16,000,000 points with memory options.
Peak Detect Acquisition Mode. See pulses as narrow as 400 ps even at the slower time base settings. Peak detect helps you see noise and glitches in your signal.
Acquisition Control. Acquire continuously or set up to capture single shot acquisitions. Enable or disable optional acquisition features such as equivalent time or roll mode. Use Fast Frame acquisition to capture and time stamp many events in a rapid sequence.
Signal Processing
Features
Horizontal Delay. Use delay when you want to acquire a signal at a significant time interval after the trigger point. Toggle delay on and off to quickly compare the signal at two different points in time.
Average, Envelope, and Hi Res Acquisition. Use Average acquisition mode to remove uncorrelated noise from your signal. Use Envelope to capture and display the maximum variation of the signal. Use Hi Res to increase vertical resolution for lower bandwidth signals.
Waveform Math. Set up simple math waveforms using the basic arithmetic functions or create more advanced math waveforms using the math expression editor. W aveform expressions can even contain measurement results and other math waveforms.
Spectral Analysis. Display spectral magnitude and phase waveforms based on your time-domain acquisitions. Control the instrument using the traditional spectrum analyzer controls such as span and center frequency.
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TDS7104 & TDS7054 Service Manual
Specifications
Display Features
Measurement Features
Color LCD Display. Identify and differentiate waveforms easily with color coding. Waveforms, readouts, and inputs are color matched to increase productivity and reduce operating errors. Enhance visualization of waveforms with color grading.
Digital Phosphor. A Digital Phosphor Oscilloscope can clearly display intensity modulation in your signals. The instrument automatically overlays subsequent acquisitions and then decays them to simulate the writing and decay of the phosphor in an analog instrument CRT. The feature results in an intensity-graded or color-graded waveform display that shows the information in the intensity modulation.
Fit to Screen. The Digital Phosphor technology performs the compression required to represent all record points on the screen, even at the maximum record length settings.
Zoom. To take advantage of the full resolution of the instrument you can zoom in on a waveform to see the fine details. Both vertical and horizontal zoom functions are available. Zoomed waveforms can be aligned, locked, and automatically scrolled.
Cursors. Use cursors to take simple voltage, time, and frequency measurements.
Trigger Features
Automatic Measurements. Choose from a large palette of amplitude, time, and histogram measurements. You can customize the measurements by changing reference levels or by adding measurement gating.
Mask Testing. Option SM only. Provides mask testing for verifying compliance to standards.
Simple and Advanced Trigger Types. Choose simple edge trigger or choose from eight advanced trigger types to help you capture a specific signal fault or event.
Dual Triggers. Use the A (main) trigger system alone or add the B trigger to capture more complex events. You can use the A and B triggers together to set up a delay-by-time or delay-by-events trigger condition.
Comm Triggers. Option SM only. Use comm triggers to trigger on communica­tion signals.
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Specifications
Convenience Features
Autoset. Use Autoset to quickly set up the vertical, horizontal, and trigger controls for a usable display. If a standard mask is active (Option SM only), Autoset adjusts the selected waveform to match the mask, if possible.
Touch Screen Interface. You can operate all instrument functions (except the power switch and the touch screen enable/disable switch) from the touch screen interface. If convenient, you can also install a mouse and keyboard to use the interface.
Toolbar or Menu Bar. You can choose a toolbar operating mode that is optimized for use with the touch screen, or a PC-style menu-bar operating mode that is optimized for use with a mouse.
Open Desktop. The instrument is built on a Microsoft Windows software platform; the instrument application program starts automatically when you apply power to the instrument. You can minimize the instrument application and take full advantage of the built-in PC to run other applications. Moving waveform images and data into other applications is as simple as a copy/paste operation.
Dedicated Front Panel Controls. The front panel contains knobs and buttons to provide immediate access to the most common instrument controls. Separate vertical controls are provided for each channel. The same functions are also available through the screen interface.
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Data Storage and I/O. The instrument has a removeable hard disk drive, a CD-RW
drive, and a floppy disk drive that can be used for storage and retrieval of data. The instrument has GPIB, USB, Centronics, COM, and Ethernet ports for input and output to other devices.
Online Help. The instrument has a complete online help system that covers all its features. The help system is context sensitive; help for the displayed control window is automatically shown if you touch the help button. Graphical aids in the help windows assist you in getting to the information you need. You can also access the help topics through a table of contents or index.
TDS7104 & TDS7054 Service Manual

Specification Tables

Specifications
Table 1- 2: Channel input and vertical specifications
Characteristic Description
Input channels Four, all identical
Input coupling DC, AC, and GND
Channel input is disconnected from input termination when using GND coupling.
Input impedance, DC coupled 1M± 0.5% in parallel with 10 pF (3pF)
50 ±1%; VSWR 1.3:1 from DC to 500 MHz, 1.5: 1 from 500 MHz to 1 GHz
Maximum voltage at input BNC (1 MΩ)
Maximum voltage at input BNC (50 Ω)
n Delay between channels 50 ps between any two channels with the same scale
n Channel-to-channel crosstalk 100:1 at 100 MHz, and 30:1 at the rated bandwidth
Digitizers 8-bit resolution, separate digitizers for each channel
Sensitivity range 1MΩ: 1 mV/div to 10 V/div, in a 1-2-5 sequence
150 V
For steady state sinusoidal waveforms, derate at 20 dB/decade above 200 kHz to 9 V above
5V
and coupling settings
for any two channels with the same scale and coupling settings
sample simultaneously
50 Ω: 1 mV/div to 1 V/div, in a 1-2-5 sequence
Fine adjustment available with 1% resolution
CAT I,
RMS
, with peaks ≤±30 V
RMS
at 3 MHz and
RMS
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Specifications
Table 1- 2: Channel input and vertical specifications (Cont .)
Characteristic Description
n Analog bandwidth DC 50 Ω coupling, bandwidth limit set to Full, operating
ambient 30 °C, derated by 2.5 MHz/°C above 30 °C
SCALE range Bandwidth
1mV/divto1.99mV/div TDS7054: DC to 450 MHz
TDS7104: DC to 500 MHz
2mV/divto4.98mV/div TDS7054: DC to 500 MHz
TDS7104: DC to 600 MHz
5mV/divto9.95mV/div TDS7054: DC to 500 MHz
TDS7104: DC to 750 MHz
10 mV/div to 1 V/div TDS7054: DC to 500 MHz
TDS7104: DC to 1 GHz
Analog bandwidth limit, typical Selectable between 20 MHz, 200 MHz, or Full
Lower frequency limit, AC coupled <10Hzfor1MΩ, reduced by a factor of ten when using
a 10X probe; <200 kHz for 50
Calculated rise time, typical DC 50 coupling, bandwidth limit set to Full
SCALE range Rise time
1mV/divto1.99mV/div TDS7054: 890 ps
TDS7104: 800 ps
2mV/divto4.98mV/div TDS7054: 800 ps
TDS7104: 667 ps
5mV/divto9.95mV/div TDS7054: 800 ps
TDS7104: 533 ps
10 mV/div to 1 V/div TDS7054: 800 ps
TDS7104: 400 ps
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TDS7104 & TDS7054 Service Manual
Table 1- 2: Channel input and vertical specifications (Cont .)
c
a
Characteristic Description
Step response settling errors, typi
l
Bandwidth limit set to Full
SCALE range and step amplitude
Specifications
Settling error at time after step
1 mV/div to 100 mV/div, with 2Vstep
101 mV/div to 1 V/div, with 20 V step
1.01 V/div to 10 V/div, with 200 V step
Position range ± 5 divisions
Offset range SCALE range Offset range
1 mV/div to 100 mV/div ±1V
101 mV/div to 1 V/div ±10 V
1.01 V/div to 10 V/div ±100 V
Offset accuracy SCALE range Offset range
1 mV/div to 100 mV/div ±(0.2% ×| net offset | +
20 ns: 0.5%
100 ns: 0.2%
20 ms: 0.1%
20 ns: 1.0%
100 ns: 0.5%
20 ms: 0.2%
20 ns: 1.0%
100 ns: 0.5%
20 ms: 0.2%
1.5 mV + 0.1 div ×V/div setting)
101 mV/div to 1 V/div ±(0.25% ×| net offset | +
15 mV + 0.1 div ×V/div setting)
1.01 V/div to 10 V/div ±(0.25% ×| net offset | + 150 mV + 0.1 div ×V/div setting)
Net offset is the nominal voltage that must be applied to the channel to bring the trace to center screen. Net offset = offset -- (position × volts/division) and is expressed in volts
TDS7104 & TDS7054 Service Manual
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Specifications
Table 1- 2: Channel input and vertical specifications (Cont .)
Characteristic Description
DC gain accuracy, ±1% in Sample or Average acquisition mode
DC voltage measurement accuracy Measurement type DC accuracy (in volts)
Sample acquisition mode, typical
n Average acquisition mode (16 averages)
Absolute measurement of any waveform point, and High, Low, Max, and Min measurements
Delta voltage measurement between any two points acquired under the same setup and ambient condi­tions, and all other auto­matic measurements
Net offset = offset -- (position × volts/division) and is expressed in volts
Absolute measurement of any waveform point, and High, Low, Max, and Min measurements
Delta voltage measurement between any two points acquired under the same setup and ambient condi­tions, and all other auto­matic measurements
Net offset = offset -- (position × volts/division) and is expressed in volts
±[(1.0% × | reading -- net offset | ) + offset accuracy + (0.13 div × V/div setting) +
0.6 mV]
±[(1.0% × | reading | ) + (0.26 div × V/div setting) +
1.2 mV]
±[(1.0% × | reading -- net offset | ) + offset accuracy +(0.06 × V/div)]
±[(1.0% × | reading | ) + (0.1 div × V/div setting) +
0.3 mV]
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Nonlinearity, typical < 1 LSB differential, < 1 LSB integral, independently
based
TDS7104 & TDS7054 Service Manual
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