SUPER MICRO Computer X8DTG-DF User Manual

X8DTG-DF

USER’S MANUAL

Revision 1.0

The information in this User’s Manual has been carefully reviewed and is believed to be accurate.
The vendor assumes no responsibility for any inaccuracies that may be contained in this document,
makes no commitment to update or to keep current the information in this manual, or to notify any
person or organization of the updates. Please Note: For the most up-to-date version of this

manual, please see our web site at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product
described in this manual at any time and without notice. This product, including software, if any,
and documentation may not, in whole or in part, be copied, photocopied, reproduced, translated or
reduced to any medium or machine without prior written consent.

IN NO EVENT WILL SUPERMICRO BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO
USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. IN PARTICULAR, SUPERMICRO SHALL NOT HAVE LIABILITY FOR ANY
HARDWARE, SOFTW ARE, OR DA TA STORED OR USED WITH THE PRODUCT, INCLUDING THE
COSTS OF REPAIRING, REPLACING, INTEGRATING, INSTALLING OR RECOVERING SUCH
HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa
Clara County in the State of California, USA. The State of California, County of Santa Clara shall
be the exclusive venue for the resolution of any such disputes. Super Micro's total liability for all
claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class
A digital device pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the manufacturer’s instruction manual, may cause harmful
interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your
own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate
warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate
Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate”

WARNING: Handling of lead solder materials used in this
product may expose you to lead, a chemical known to
the State of California to cause birth defects and other
reproductive harm.

Manual Revision 1.0
Release Date: July 6, 2009

Unless you request and receive written permission from Super Micro Computer, Inc., you may not
copy any part of this document.

Information in this document is subject to change without notice. Other products and companies
referred to herein are trademarks or registered trademarks of their respective companies or mark
holders.

Copyright © 2009 by Super Micro Computer, Inc.
All rights reserved.

Printed in the United States of America

Preface

About This Manual

This manual is written for system integrators, PC technicians and knowledgeable PC
users. It provides information for the installation and use of the X8DTG­DF motherboard.

About This Motherboard

The X8DTG-DF motherboard supports the Intel 5500 Series Processor
platform and the QuickPath Interconnect (QPI) Technology, providing the next gen­eration point-to-point system interface that replaces the current Front Side Bus. With
the 5500 Series Processor built in, the X8DTG-DF substantially enhances system
performance with increased bandwidth and unprecedented scalability optimized
for HPC/Cluster and high-end IU servers. Please refer to our web site (http://www.
supermicro.com/products/) for updates on supported processors. This product is
intended to be installed and serviced by professional technicians.

Preface

Manual Organization

Chapter 1 describes the features, specifi cations and performance of the mother-

board and provides detailed information about the chipset.
Chapter 2 provides hardware installation instructions. Read this chapter when in-

stalling the processor, memory modules and other hardware components into the
system. If you encounter any problems, see Chapter 3, which describes trouble­shooting procedures for video, memory and system setup stored in the CMOS.

Chapter 4 includes an introduction to BIOS and provides detailed information on
running the CMOS Setup utility.

Appendix A lists BIOS POST Error Codes. Appendix B and Appendix C provide
the Windows OS and Other Software Installation Instructions.

Conventions Used in the Manual

Special attention should be given to the following symbols for proper installation
and to prevent product damage or bodily injury:

Warning: Important information given to ensure proper system installation
or to prevent damage to the components.

Note: Additional Information given to differentiate various models or to
ensure correct system setup.

iii

X8DTG-DF User's Manual

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.
San Jose, CA 95131 U.S.A.

Tel: [phone]
Fax: [phone]
Email: [e-mail] (General Information)

[e-mail] (Technical Support)

Web Site: www.supermicro.com

Europe

Address: Super Micro Computer B.V.

Het Sterrenbeeld 28, 5215 ML
's-Hertogenbosch, The Netherlands

Tel: [phone]
Fax: [phone]
Email: [e-mail] (General Information)

[e-mail] (Technical Support)
[e-mail] (Customer Support)

Asia-Pacifi c

Address: Super Micro Computer, Inc.

4F, No. 232-1, Liancheng Rd.
Chung-Ho 235, Taipei County
Taiwan, R.O.C.

Tel: [phone]
Fax: [phone]
Web Site: www.supermicro.com.tw
Technical Support:
Email: [e-mail]
Tel: [phone], ext.132 or 139

iv

Notes

Contacting Supermicro

v

X8DTG-DF User's Manual

Table of Contents

Preface

About This Manual ........................................................................................................iii

About This Motherboard ................................................................................................iii

Manual Organization .....................................................................................................iii

Conventions Used in the Manual ..................................................................................iii

Contacting Supermicro ..................................................................................................iv

Chapter 1 Introduction

1-1 Overview ........................................................................................................1-1

Checklist ..........................................................................................................1-1

Motherboard Features ...................................................................................1-6

1-2 Chipset Overview ............................................................................................1-9

Main Features of the 5500 Series Processor and the 5520 Chipset .............1-9

1-3 Special Features ...........................................................................................1-10

Recovery from AC Power Loss ..................................................................... 1-10

1-4 PC Health Monitoring .................................................................................... 1-10

Fan Status Monitor with Firmware Control ..................................................1-10

Environmental Temperature Control .............................................................1-10

System Resource Alert ................................................................................. 1-10

1-5 ACPI Features ................................................................................................1-11

Slow Blinking LED for Suspend-State Indicator ............................................1-11

Main Switch Override Mechanism .................................................................1-11

1-6 Power Supply .................................................................................................1-11

1-7 Overview of the Winbond WPCM450 Controller .......................................... 1-12

Chapter 2 Installation

2-1 Static-Sensitive Devices ..................................................................................2-1

\

2-2 Motherboard Installation ..................................................................................2-2

Precautions .....................................................................................................2-1

Unpacking .......................................................................................................2-1

Tools Needed .................................................................................................. 2-2

Installation Instructions ....................................................................................2-2

2-3 Processor and Heatsink Installation................................................................2-3

Installing a CPU Heatsink ............................................................................... 2-5

2-4 Memory Installation ........................................................................................ 2-7

2-5 Control Panel Connectors/IO Ports...............................................................2-10

Back Panel Connectors/IO Ports .................................................................. 2-10

Back Panel Connector Pin Defi nitions ...........................................................2-11

vi

Table of Contents

Universal Serial Bus (USB) .......................................................................2-11

Ethernet Ports .......................................................................................... 2-12

Serial Ports ............................................................................................... 2-13

Video Connector .......................................................................................2-13

Unit Identifi er Switches .............................................................................2-14

Front Control Panel ....................................................................................... 2-15

Front Control Panel Pin Defi nitions............................................................... 2-16

Power LED .............................................................................................. 2-16

HDD/FP UID Switch ................................................................................. 2-16

NIC1 LED Indicator .................................................................................. 2-17

NIC2 LED Indicator .................................................................................. 2-17

Overheat (OH)/Fan Fail/PWR Fail/UID LED ............................................ 2-18

Power Fail LED ........................................................................................2-18

Reset Button ........................................................................................... 2-19

Power Button ........................................................................................... 2-19

2-6 Connecting Cables ........................................................................................ 2-20

20-pin Proprietary Main Power and 8-pin PCI-E Graphic Card Power

Connectors ...............................................................................................2-20

Fan Headers ............................................................................................. 2-21

NMI Header .............................................................................................. 2-22

Internal Buzzer ......................................................................................... 2-22

T-SGPIO Headers .................................................................................... 2-23

PWR I

IPMB I

2

C (SMB) Connector ...................................................................... 2-24

2

C SMB .........................................................................................2-24

2-7 Jumper Settings ............................................................................................2-25

Explanation of Jumpers ................................................................................ 2-25

GLAN Enable/Disable ..............................................................................2-25

CMOS Clear ............................................................................................. 2-26

Watch Dog Enable/Disable ...................................................................... 2-26

VGA Enable .............................................................................................. 2-27

J_UID_OW (-Overwriting) ........................................................................ 2-28

2-8 Onboard Indicators ........................................................................................2-29

GLAN LEDs .............................................................................................. 2-29

Onboard Power LED

.....................................................................2-30

BMC Activity LED ..................................................................................... 2-30

2-9 Serial ATA Connections ................................................................................. 2-31

Serial ATA Ports........................................................................................ 2-31

Chapter 3 Troubleshooting

3-1 Troubleshooting Procedures ........................................................................... 3-1

vii

X8DTG-DF User's Manual

Before Power On ............................................................................................ 3-1

No Power ........................................................................................................ 3-1

No Video ......................................................................................................... 3-2

Losing the System’s Setup Confi guration ....................................................... 3-2

Memory Errors ...............................................................................................3-2

3-2 Technical Support Procedures ........................................................................3-3

3-3 Frequently Asked Questions ........................................................................... 3-3

3-4 Returning Merchandise for Service.................................................................3-4

Chapter 4 BIOS

4-1 Introduction ...................................................................................................... 4-1

Starting BIOS Setup Utility ..............................................................................4-1

How To Change the Confi guration Data ......................................................... 4-1

Starting the Setup Utility ................................................................................. 4-2

4-2 Main Setup ......................................................................................................4-2

4-3 Advanced Setup Confi gurations...................................................................... 4-4

4-4 Security Settings ...........................................................................................4-22

4-5 Boot Confi guration ........................................................................................4-24

4-6 Exit Options ................................................................................................... 4-25

4-7 BIOS Recovery ............................................................................................. 4-26

How to Recover the AMIBIOS Image (-the Main BIOS Block) ..................... 4-26

4.7.1 Boot Sector Recovery from a USB Device ..........................................4-26

4.7.2 Boot Sector Recovery from an IDE CD-ROM ..................................... 4-27

4.7.3 Boot Sector Recovery from a Serial Port ("Serial Flash") ................... 4-27

Appendix A BIOS Error Beep Codes

A-1 BIOS Error Beep Codes ................................................................................. A-1

Appendix B Installing the Windows OS

B-1 Installing the Windows OS for a RAID System ..............................................B-1

B-2 Installing the Windows OS for a Non-RAID System ....................................... B-2

Appendix C Software Installation Instructions

C-1 Installing Software Programs .........................................................................C-1

C-2 Confi guring Supero Doctor III ......................................................................... C-2

viii

Chapter 1: Introduction

Chapter 1

Introduction

1-1 Overview

Checklist

Congratulations on purchasing your computer motherboard from an acknowledged
leader in the industry. Supermicro boards are designed with the utmost attention to
detail to provide you with the highest standards in quality and performance. Check
that the following items have all been included with your motherboard. If anything
listed here is damaged or missing, contact your retailer.

The following items are included in the bulk package.

One (1) Supermicro Mainboard

•

One (1) Supermicro CD containing drivers and utilities•

1-1

X8DTG-DF User's Manual

X8DTG-DF Motherboard Image

Note: The drawings and pictures shown in this manual were based on the

latest PCB Revision available at the time of publishing of the manual. The
motherboard you’ve received may or may not look exactly the same as
the graphics shown in the manual.

1-2

Chapter 1: Introduction

X8DTG-DF Motherboard Layout

J11

I-SATA6

SBX 1B

I-SATA4I-SATA5

I-SATA3

I-SATA2

I-SATA1

T-SGPIO0

T-SGPIO1

FAN8

LE4

SW1

JWD1

SBX 1A

JSPK1

PCI-E 2.0

x4 in x16 Slot

JPCIE1

JNMI1

J_UID_OW

JPCIE3

USB2/3

VGA

Intel
ICH10R
(South Bridge)

CPU2

COM1

LE2

Winbond
450R
BMC

CMOS

CLEAR

BIOS

X8DTG-DF

IPMB

JLPC80

LAN2

JPG1

JPL1

Intel
5520
IOH-36D

P2 DIMM1A

P2 DIMM1B

LAN1

Intel
82576
LAN CTRL

P2 DIMM2B

P2 DIMM2A

USB0/1

IPMI_LAN

P2 DIMM3B

P2 DIMM3A

PHY

J12

SBX 2A

+

SBX 2B

JPCIE2

Notes:

Jumpers not indicated are for test purposes only. For more information on 1.
jumpers or components, refer to Chapter 2.

" " indicates the location of Pin 1.2.

FAN7

JPW1

FAN4

JPI2C (PWR I2C)

P1 DIMM3B

P1DIMM3A

P1 DIMM2A

P1 DIMM2B

P1 DIMM1B

P1 DIMM1A

JBAT1

Battery

FAN3

CPU1

FAN6

FAN5

Front Panel CTRL

LE1

JPW2

JPW3

FAN1

4

FAN2

JL1

1

When LE1 LED is on, the onboard power connection is on. Make sure to 3.
unplug the power cables before removing or installing components.

1-3

X8DTG-DF User's Manual

X8DTG-DF Quick Reference

VGA

Intel
ICH10R
(South Bridge)

I-SATA6

I-SATA4I-SATA5

LE4

J11

SBX 1A

JPCIE1

SBX 1B

SW1

JWD1

JNMI1

JSPK1

J_UID_OW

JPCIE3

PCI-E 2.0

x4 in x16 Slot

USB2/3

COM1

IPMB

LE2

Winbond
450R
BMC

CMOS

CLEAR

BIOS

X8DTG-DF

JLPC80

JPL1

LAN2

JPG1

Intel
82576
LAN CTRL

Intel
5520
IOH-36D

LAN1

USB0/1

IPMI_LAN

PHY

J12

SBX 2A

+

JPCIE2

FAN7

I-SATA3

I-SATA2

I-SATA1

T-SGPIO0

T-SGPIO1

FAN8

JPW1

P1 DIMM3B

P1DIMM3A

P1 DIMM2A

P1 DIMM2B

CPU2

P1 DIMM1B

P1 DIMM1A

JBAT1

Battery

P2 DIMM1A

P2 DIMM1B

P2 DIMM2B

P2 DIMM2A

CPU1

P2 DIMM3B

P2 DIMM3A

SBX 2B

FAN6

FAN5

Front Panel CTRL

LE1

JPW2

FAN4

JPI2C (PWR I2C)

FAN3

1-4

JPW3

FAN2

JL1

FAN1

4

1

Chapter 1: Introduction

X8DTG-DF Quick Reference (See Chapter 2 for Details)

Jumper Description Default Setting

JBT1 CMOS Clear (See Section 2-8)
JPG1 VGA Enable Pins 1-2 (Enabled)
JPL1 LAN1/2 Enable Pins 1-2 (Enabled)
J_UID_OW Red LED OW (Pins 7/8 of JF1) (Page 2-31) Off (Overwrites)
JWD1 Watch Dog Pins 1-2 (Reset)

Connector Description

COM1 COM1 Serial Port
FAN 1-8 System/CPU Fan Headers
IPMB IPMB (SMB I

2

C) Header (for IPMI)
JF1 Front Panel Connector
JL1 Chassis Intrusion
JLPC80 JLPC80 Connector
JNMI1 NMI (Non-Maskable Interrupt) Header
JPSK1 Internal Speaker/Buzzer Header
JPW1 12V 20-pin Power Connector (See Chpt. 2)
JPW2/JPW3 12V 8-pin PCI-Exp. Power Connectors (See Chpt. 2)
LAN1/2 Gigabit Ethernet (RJ45) Ports
(IPMI dedicated) LAN LAN (RJ45) Port for IPMI 2.0
PCI-E Slot PCI-Express 2.0 x4 in x 16 slot (JPCIE3)
PWR I

2

C (JPI2C) Power SMB (System Management Bus) I2C Header
SATA1 ~ SATA6 (Intel South Bridge) SATA Ports
SBX 1A/2A Slots PCI-E slots GPU for (Graphics Processing Unit) support

(J11/J12)
SBX 1B/2B Slots PCI-E slots for GPU support (JPCIE1/JPCIE2)
SW1 Unit Identifi er Switch
T-SGPIO-0/T-SGPIO-1 Serial General Purpose Input/Output Headers
USB0/1, USB 2/3 Universal Serial Bus (USB) Ports 0/1, 2/3
VGA Video Port

LED Description

LE1 Onboa rd Stan dby PWR war ning LE D Indic ator
LE2 BMC LED Indicator
LE4 (Rear) Unit Identifi er (UID) LED Indicator

Warning: To avoid possible system overheating, please be sure to provide
adequate airfl ow to your system.

1-5

X8DTG-DF User's Manual

Motherboard Features

CPU

Two Intel•
two full-width Intel QuickPath Interconnect (QPI) links with a total of up to 51.2
GT/s Data Transfer Rate (6.4 GT/s per direction)

®

5500 Series (LGA 1366) processors with each processor supporting

Memory

Twelve 240-pin DIMM sockets support up to 96 GB of Registered ECC or 24 •
GB of Unbuffered ECC/Non-ECC DDR3 1333/1066/800 MHz Memory. (For
Unbuffered ECC/Non-ECC memory, maximum of 2 GB per DIMM is supported.
See Pages 2-7, 2-8 in Chapter 2 for memory Population.)

Chipset

Intel 5520 chipset, including: the 5520 (IOH-36D) and the ICH10R (South •
Bridge).

Expansion Slot

One PCI-E x4 Gen. 2.0 in x16 slot•

SMC Proprietary Slots

Four SBX slots (SBX 1A/2A & SBX 1B/2B) for riser cards (Refer to www.super-•
micro.com/support/resources/riser/ for details.)

BIOS

32 Mb AMI SPI Flash ROM•
ACPI 1.0/2.0/3.0, Plug and Play (PnP), DMI 2.3, SMBIOS 2.3, and USB Key-•

board support

PC Health Monitoring

Onboard voltage monitors for CPU1 VCore, CPU2 VCore, +5Vin, • 12Vcc (V),
V P1 DIMM, V P2 DIMM, +3.3Vcc (V), and Battery Voltage

Fan status monitor with fi rmware control

•

CPU/chass is temper ature moni tors•
Platfo rm Enviro nment Co ntrol Inte rf ace (PECI) read y•
CPU fan auto - of f in sle ep mode•
CPU slow- dow n on tempe rature over heat•
Pulse Wi dth Mo dulati on (PW M) Fan Contro l•
CPU ther mal tr ip supp or t for pro ces sor pr otecti on, power L ED•
Power-up mod e cont rol for r ecover y fr om AC power l oss•
Auto- switc hing vol tage r egulato r for CPU c ore s•
System over heat /Fan Fail LED I ndic ator and c ontr ol•
System re sourc e aler t vi a Super o Doc tor III•

1-6

Chapter 1: Introduction

ACPI Features

Slow blinking LED for suspend state indicator•
Main switch override mechanism•
ACPI Pow er Ma nag eme nt•
Keyboard Wakeup from Soft-off •

Onboard I/O

Intel ICH10R supports six SA T A ports (RAID0, RAID1, RAID10, RAID5 supported •
in the Windows OS Environment and RAID 0, RAID 1, RAID 10 supported by
the Linux OS)

Winbond WPCM450 BMC (Baseboard Management Controller) supports IPMI

•

2.0 with K V M supp or t
Intel 82576 Du al-L A N Gi gabi t Ether net C ontr oll er sup por t s dual G ig a- bi t L AN

•

ports
Onboar d PHY Chip su ppor ts IP MI dedic ated L AN

•

One CO M por t•
Up to four U SB 2.0 (Univer sal Serial Bu s) c onnecti ons (2 Ports and 2 Fro nt •

Headers)
Super I/ O: Winbo nd W83 527HG

•

Other

Console redirection•
Onboa rd Fan Spee d Contr ol by Ther mal Ma nagem ent via BI OS•

CD/Diskette Utilities

BIOS fl ash upgrade utility and device drivers•

Dimensions

Propr ietar y 16.6 4" (L) x 7.71" (W) (422.6 6 mm x 195.8 3 mm)•

1-7

X8DTG-DF User's Manual

#1

#1

#1

#2

DDR3 DIMM

PCI-E x16

#2

#2

DDR3 DIMM

PCI-E x16

PCI-E x16

AA
BB

PROCESSOR#0

CC

PCI-E x16

PCI-E x4

PCI-E x16

PCI

Port1

Ports

#3-6

Ports

#7-10

Ports

#1-2

QPI

QPI

Intel 5520

IOH

36D

ESI

CLINK

DMI

ICH10R

PROCESSOR#1

QPI

Port0

Ports

2,1

CLINK

LPC

SATA #1
SATA #2
SATA #3
SATA #4
SATA #5

SATA #6

VF016
SST25

SPI

PE

4-1
PE

5

SATA

#2

#2

#2

DDR3 DIMM

Intel

82576

RJ45

RJ45

#1

#1

#1

DD
EE
FF

DDR3 DIMM

LPCIO W83527
ACPI

KBC

DDR II

Winbond

BMC/VGA

RMII

VGA CONN

RTL8201N PHY

Dedicated LAN

Block Diagram of the 5500 Series Processor Platform

Note: This is a general block diagram. Please see the previous Mother-

board Features pages for details on the features of each motherboard.

1-8

Chapter 1: Introduction

1-2 Chipset Overview

Built up on the func tionalit y and the c apabilit y of the 55 00 Seri es Proce ssor, the
X8DTG- DF mother board provide s the perf ormance and f eature set require d for
dual-processor-based systems with confi guratio n opti mized f or inten sive ap plic a -
tions, H igh Per fo rma nce C omput ing (H PC)/Cluste r IU ser ver p latf orms . The Inte l
5520 plat f or m c ons ist s of th e 55 0 0 S er ie s (LGA 1366) pro c es so r, the 5520 (IO H ­36D), and the ICH10R (South Bridge). With the Intel QuickPath interconnect (QPI)
contr olle r buil t in, the 5 5 00 S er ies P roc es sor p lat for m is t he fi rst dual-processing
platform to offer the next generation point-to-point system interconnect that re­places the current Front Side Bus Technology, substantially enhancing system
performance by utilizing serial link interconnections with increased bandwidth
and scalability.

The IOH connects to each processor through an independent QPI (QuickPath
interconnect) link. Each link consists of 20 pairs of unidirectional differential lanes
for tra nsmis sio n and re cei ving i n addit ion t o a dif fer entia l for wa rded c lo ck. A f ull ­width Q PI link pair p rovide s 84 si gnals. Ea ch proc ess or suppo rt s two Q uickPat h
links, one g oing to th e other pr oce ssor an d the othe r to the 5 520 chip s.

The 552 0 chip set supp or ts PC I Exp ress G en2 la nes pe er-to -pe er read a nd wr ite
transactions. The ICH10R provides multiple PCI-Express SATA and USB con­nections.

In additi on, the 5 520 plat for m also of fers a w ide ran ge of R AS (Relia bilit y, Avail­ability and Serviceability) features. These features include memory interface ECC,
x4/x8 S ingle Devic e Data C orrec tion (SDD C), Cyclic Redund ancy Chec k (CRC),
parity protection, out-of-band register access via SMBus, memory mirroring,
memor y spa ring, a nd Hot- plug su ppor t on t he PCI -E xpre ss Inter f ace.

Main Features of the 5500 Series Processor and the 5520
Chipset

Four processor cores in each processor with 8MB shared cache among cores•

Two full-width Intel QuickPath interconnect links, up to 6.4 GT/s of data transfer •
rate in each direction

Virtualization Technology, Integrated Management Engine supported

•

Point-to-point cache coherent interconnect, Fast/narrow unidirectional links, and •
Concurrent bi-directional traffi c

1-9

X8DTG-DF User's Manual

1-3 Special Features

Recovery from AC Power Loss

BIOS provides a setting for you to determine how the system will respond when AC
power is lost and then restored to the system. You can choose for the system to
remain powered off (in which case you must press the power switch to turn it back
on) or for it to automatically return to a power- on state. See the Advanced BIOS
Setup section to change this setting. The default setting is Last State.

1-4 PC Health Monitoring

This section describes the PC health monitoring features of the X8DTG-DF. All have
an onboard System Hardware Monitor chip that supports PC health monitoring.
An onboard voltage monitor will scan these onboard voltages continuously: CPU1
VCore, CPU2 VCore, +5Vin, 12Vcc (V), V P1 DIMM, V P2 DIMM, +3.3Vcc (V),
and Battery Voltage. Once a voltage becomes unstable, a warning is given or an
error message is sent to the screen. Users can adjust the voltage thresholds to
defi ne the sensitivity of the voltage monitor.

Fan Status Monitor with Firmware Control

The PC health monitor can check the RPM status of the cooling fans. The onboard
CPU and chassis fans are controlled by Thermal Management via BIOS (under
Hardware Monitoring in the Advanced Setting).

Environmental Temperature Control

The thermal control sensor monitors the CPU temperature in real time and will turn
on the thermal control fan whenever the CPU temperature exceeds a user-defi ned
threshold. The overheat circuitry runs independently from the CPU. Once it detects
that the CPU temperature is too high, it will automatically turn on the thermal fan
control to prevent any overheat damage to the CPU. The onboard chassis thermal
circuitry can monitor the overall system temperature and alert users when the chas­sis temperature is too high.

To avoid possible system overheating, please be sure to provide adequate
airfl ow to your system.

System Resource Alert

This feature is available when used with Supero D octor III in the Windows OS
environment or used with Supero Doctor II in Linux. Supero Doctor is used to
notif y the user of cer tain system events. For example, you can also confi gure

1-10

Chapter 1: Introduction

Supero Doctor to provide you with warnings when the system temperature, CPU
temperat ures, volt ages a nd fan spe eds go beyon d a pre- defi ned range.

1-5 ACPI Features

ACPI stands for Advanced Confi guration and Power Interface. The ACPI specifi ca-
tion defi nes a fl exible and abstract hardware interface that provides a standard
way to integrate power management features throughout a PC system, including
its hardware, operating system and application software. This enables the system
to automatically turn on and off peripherals such as CD-ROMs, network cards, hard
disk drives and printers.

In addition to enabling operating system-directed power management, ACPI
provides a generic system event mechanism for Plug and Play and an operating
system-independent interface for confi guration control. ACPI leverages the Plug
and Play BIOS data structures while providing a processor architecture-independent
implementation that is compatible with Windows XP/Windows 2003/Windows 2008/
Windows Vista Operating Systems.

Slow Blinking LED for Suspend-State Indicator

When the CPU goes into a suspend state, the chassis power LED will start blinking
to indicate that the CPU is in suspend mode. When the user presses any key, the
CPU will wake-up and the LED will automatically stop blinking and remain on.

Main Switch Override Mechanism

When an ATX power supply is used, the power button can function as a system
suspend button to make the system enter a SoftOff state. The monitor will be
suspended and the hard drive will spin down. Pressing the power button again
will cause the whole system to wake-up. During the SoftOff state, the ATX power
supply provides power to keep the required circuitry in the system "alive." In case
the system malfunctions and you want to turn off the power, just press and hold
the power button for 4 seconds. This option can be set in the Power section of the
BIOS Setup routine.

1-6 Power Supply

As with all computer products, a stable power source is necessary for proper and
reliable operation. It is even more important for processors that have high CPU
clock rates.

It is strongly recommended that you use a high quality power supply that meets ATX
power supply Specifi cation 2.02 or above. It must also be SSI compliant (For more

1-11

X8DTG-DF User's Manual

information, please refer to the web site at http://www.ssiforum.org/). Additionally, in
areas where noisy power transmission is present, you may choose to install a line
fi lter to shield the computer from noise. It is recommended that you also install a
power surge protector to help avoid problems caused by power surges.

Note 1. For the proprietary 20-pin main power connector (JPW1) and the
8-pin PCI-Exp. Graphic card power connectors (JPW2/JPW3) to work prop­erly , please customize your power cables based on the SMC PWR Connec­tor Pin-Out Defi nitions listed in the tables on Page 2-20 in Chapter 2.

2. For the PCI-Exp. Graphic cards to work properly, please connect the
PCI-E graphic card power connectors (JPW2/JPW3) to the power sup­ply.

1-7 Overview of the Winbond WPCM450 Controller

The Winbond WPCM450, a Baseboard Management Controller (BMC), supports
the 2D/VGA-compatible Graphics Core with the PCI interface, Virtual Media, and
Keyboard/Video/Mouse (KVM) Redirection modules.

The WPCM450 BMC interfaces with the host system via a PCI interface to com­municate with the graphics core. It supports USB 2.0 and 1.1 for remote keyboard/
mouse/virtual media emulation. It also provides LPC interface to control Super IO
functions. The WPCM450 is connected to the network via an external Ethernet
PHY module.

The WPCM450 communicates with onboard components via six SMBus interfaces,
fan control, Platform Environment Control Interface (PECI) buses.

Note: For more information on IPMI confi guration, please refer to the
Embedded IPMI User's Guide posted on our website @ http://www.super­micro.com/support/manuals/.

1-12

Chapter 2: Installation

Chapter 2

Installation

2-1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic com ponents. T o prevent dam­age to your system board, it is important to handle it very carefully. The following
measures are generally suffi cient to protect your equipment from ESD.

Precautions

Use a grounded wrist strap designed to prevent static discharge.•

Touch a grounded metal object before removing the board from the antistatic •
bag.

Handle the board by its edges only; do not touch its components, peripheral

•

chips, memory modules or gold contacts.

When handling chips or modules, avoid touching their pins.

•

Put the motherboard and peripherals back into their antistatic bags when not •
in use.

For grounding purposes, make sure your computer chassis provides excellent

•

conductivity between the power supply, the case, the mounting fasteners and
the motherboard.

Use only the correct type of onboard CMOS battery as specifi ed by the

•

manufacturer. Do not install the onboard battery upside down to avoid possible
explosion.

Unpacking

The motherboard is shipped in antist atic packag i n g t o avo id static da m a ge. When
unpacking the board, make sure the person handling it is static protected.

2-1

X8DTG-DF User's Manual

2-2 Motherboard Installation

All motherboards have standard mounting holes to fi t different types of chassis.
Make sure that the locations of all the mounting holes for both motherboard and
chassis match. Although a chassis may have both plastic and metal mounting
fasteners, metal ones are highly recommended because they ground the mother­board to the chassis. Make sure that the metal standoffs click in or are screwed in
tightly. Then use a screwdriver to secure the motherboard onto the motherboard
tray. Note: Some components are very close to the mounting holes. Please take
precautionary measures to prevent damage to these components when installing
the motherboard to the chassis.

Tools Needed

1. Phillips Screwdriver

2. Pan head #6 screws

Locations of Mounting Holes

Installation Instructions

X8DTG-DF

Install the IO shield into the chassis. 1.

Locate the mounting holes on the mother-2.
board. Refer to the layout above for mount­ing hole locations.

Locate the matching mounting holes on the 3.
chassis. Align the mounting holes on the
motherboard against the mounting holes on
the chassis.

Install standoffs in the chassis as needed.4.

Install the motherboard into the chassis carefully to avoid damage to mother-5.
board components.

Warning: To avoid damaging the motherboard and its components, please
do not apply any force greater than 8 lb/sq.in (8 lbs. per square inch) when
installing a screw into a mounting hole.

Insert a Pan head #6 screw into a mounting hole on the motherboard and its 6.
matching mounting hole on the chassis, using a Phillips screwdriver.

Repeat Step 4 to insert #6 screws to all mounting holes.7.

Make sure that the motherboard is securely placed on the chassis.8.

2-2

2-3 Processor and Heatsink Installation

!

When handling the processor package, avoid placing direct pressure on
the label area of the fan.

Notes:

Always connect the power cord last and always remove it before adding, re-1.
moving or changing any hardware components. Make sure that you install the
processor into the CPU socket before you install the CPU heatsink.

Make sure to install the motherboard into the chassis before you install the 2.
CPU heatsink and heatsink fans.

When purchasing a motherboard without the 5500 Series processor pre-3.
installed, make sure that the CPU socket plastic cap is in place, and none of
the CPU socket pins are bent; otherwise, contact the retailer immediately.

Chapter 2: Installation

Refer to the M B Features S ecti on for mo re deta ils on CPU s uppor t.4.

Installing an LGA 1366 Processor

Press the socket clip to release 1.
the load plate, which covers the
CPU socket, from its locking
position.

Gently lift the socket clip to 2.
open the load plate.

Hold the plastic cap at its north 3.
and south center edges to re­move it from the CPU socket.

Socket Clip

Plastic Cap

Load Plate

Hold the north & south edges of
the plastic cap to remove it

2-3

X8DTG-DF User's Manual

After removing the plastic cap, using 4.
your thumb and the index fi nger,
hold the CPU at the north and south
center edges.

Align the CPU key, the semi-circle 5.
cutout, against the socket key, the
notch below the gold color dot on
the side of the socket.

Once both the CPU and the socket 6.
are aligned, carefully lower the CPU
straight down into the socket. (Do
not rub the CPU against the surface
of the socket or its pins to avoid
damaging the CPU or the socket.)

Socket Keys CPU CPU SocketLoad Plate

With the CPU inside the socket, in-7.
spect the four corners of the CPU to
make sure that the CPU is properly
installed.

Once the CPU is securely seated 8.
on the socket, lower the CPU load
plate to the socket.

Use your thumb to gently push the 9.
socket clip down to the clip lock.

Warning: Please save the plas­tic ca p. The mot her board m ust
be shipped with the plastic cap
properly installed to protect the
CPU socket pins. Shipment
without the plastic cap properly
installed will cause damage to
the socket pins.

CPU Keys

2-4

Installing a CPU Heatsink

Do not apply any thermal 1.
grease to the heatsink or the
CPU die because the required
amount has already been ap­plied.

Chapter 2: Installation

Place the heatsink on top of the 2.
CPU so that the four mounting
holes are aligned with those on
the retention mechanism.

3. Install two diagonal screws (ie
the #1 and the #2 screws) and
tighten them until just snug (-do
not fully tighten the screws to
avoid possible damage to the
CPU.)

Screw#1

Screw#1

Install Screw#1

Screw#2

Screw#2

4. Finish the installation by fully
tightening all four screws.

2-5

X8DTG-DF User's Manual

Removing the Heatsink

Warni ng: We do not recommend that the CPU or the heatsink be re­moved. However, if you do need to remove the heatsink, please follow
the inst ructions be low to uninstall th e heatsink and prevent da mage to
the CPU or ot her co mpone nts.

Unplug the power cord from the 1.
power supply.

Disconnect the heatsink fan 2.
wires from the CPU fan header.

Using a screwdriver, loosen and 3.
remove the heatsink screws
from the motherboard in the se­quence as show in the picture
on the right.

Using a screwdriver to
remove Screw#1

Hold the heatsink as shown 4.
in the picture on the right and
gently wriggle the heatsink to
loosen it from the CPU. (Do not
use excessive force when wrig­gling the heatsink.)

Once the heatsink is loosened, 5.
remove it from the CPU socket.

To reinstall the CPU and the 6.
heatsink, clean the surface of
the CPU and the heatsink to get
rid of the old thermal grease.
Reapply the proper amount of
thermal grease on the surface
before reinstalling them on the
motherboard.

Remove Screw#2

2-6

Chapter 2: Installation

2-4 Memory Installation

Note: Check the S uper micro we b site for r ecom mende d memor y mo dules .

CAUTION

Exercise extreme care when installing or removing DIMM

module s to prevent any po ssib le damag e. Also n ote that th e

memor y is i nterl eaved to imp rove per fo rman ce (See ste p 1).

DIMM Installation

Insert the desired number of DIMMs into the memory slots, starting with 1.
P1-DIMM 1A. For best memory performance, please install memory modules
of the same type and same speed on the memory slots as indicated on the
tables below. (See the Memory Installation Table Below.)

Insert each DIMM module vertically into its slot. Pay attention to the notch 2.
along the bottom of the module to prevent inserting the DIMM module incor­rectly.

Gently press down on the DIMM module until it snaps into place in the slot. 3.
Repeat for all modules.

Memory Population for Optimal Performance

-For a motherboard with One CPU (CPU1) installed

Branch 0 Branch 1 Branch 2

3 DIMMs P1 DIMM1A P1 DIMM2A P1 DIMM3A
6 DIMMs P1 DIMM1A P1 DIMM1B P1 DIMM2A P1 DIMM2B P1 DIMM3A P1 DIMM3B

Memory Population for Optimal Performance

-For a motherboard with One CPU (CPU2) installed

Branch 0 Branch 1 Branch 2

3 DIMMs P2 DIMM1A P2 DIMM2A P2 DIMM3A
6 DIMMs P2 DIMM1A P2 DIMM1B P2 DIMM2A P2 DIMM2B P2 DIMM3A P2 DIMM3B

Memory Population for Optimal Performance

-For a motherboard with Two CPUs installed

CPU1 CPU2

Branch 0 Branch 1 Branch 3 Branch 0 Branch 1 Branch 3

6 DIMMs 1A 2A 3A 1A 2A 3A
12

DIMMs

1A 1B 2A 2B 3A 3B 1A 1B 2A 2B 3A 3B

2-7

X8DTG-DF User's Manual

Memory Support

The X8DTG-DF supports up to 96 GB of Registered ECC or up to 24 GB of Unbuf­fered ECC/Non-ECC DDR3 1333/1066/800 MHz Memory in 12 DIMMs.

Note1: With Unbuffered ECC/Non ECC memory, maximum of 2 GB of
memory is supported per DIMM slot.

Note 2: memory speed support is dependent on the type of CPU used
on the board.

DIMM Module Population Confi guration

For memor y to wor k pro perl y, follow the tab les be low for me mor y inst allati on:

DIMM Population Table

DIMM
Slots per
Channel

2 1 Reg. DDR3 ECC 800,1066,1333 SR or DR
2 1 Reg. DDR3 ECC 800,1066 QR
2 2 Reg. DDR3 ECC 800,1066 Mixing SR, DR
2 2 Reg. DDR3 ECC 800 Mixing SR, DR,QR

DIMMs
Populated
per Channel

DIMM Type (Reg.=
Registered)

Speeds (in MHz) Ranks per DIMM

(any combination;
SR=Single Rank,
DR=Dual Rank,
QR=Quad Rank)

Note 1: Due to OS limitations, some operating systems may not show

more than 4 GB of memory.
Note 2: Due to memory allocation to system devices, the amount of mem-

ory that remains available for operational use will be reduced when 4 GB
of R AM is us ed. The r educt ion in m emor y avai labili ty is di spro por tio nal.

Possible System Memory Allocation & Availability

System Device Size Physical Memory Available

Firmware Hub fl ash memory (System BIOS) 1 MB 3.99 GB
Local APIC 4 KB 3.99 GB
Area Reserved for the chipset 2 MB 3.99 GB
I/O APIC (4 Kbytes) 4 KB 3.99 GB
PCI Enumeration Area 1 256 MB 3.76 GB
PCI Express (256 MB) 256 MB 3.51 GB
PCI Enumeration Area 2 (if needed) -Aligned on 256-M

boundary­VGA Memory 16 MB 2.85 GB
TSEG 1 MB 2.84 GB
Memory available for the OS & other applications 2.84 GB

512 MB 3.01 GB

(4 GB Total System Memory)

2-8

Installing and Removing DIMMs

Chapter 2: Installation

X8DTG-DF

Release Tab

Notch

Release

Tab

DIMM DDR3

Note: Notch

should align

with the

receptive point

on the slot

Notch

Release

Tab

To Install :

Inser t m odul e ver tic all y and p res s down u ntil i t snap s
into plac e. Pay at tent ion to t he ali gnme nt notc h at
the bottom.

3

Release Tab

To Remove:

Use your thumbs to gently push the release tabs near both
ends of the module. This should release it from the slot.

2-9