The information in this User’s Manual has been carefully reviewed and is believed to be accurate.
The vendor assumes no responsibility for any inaccuracies that may be contained in this document,
makes no commitment to update or to keep current the information in this manual, or to notify any
person or organization of the updates. Please Note: For the most up-to-date version of this
manual, please see our web site at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product
described in this manual at any time and without notice. This product, including software, if any,
and documentation may not, in whole or in part, be copied, photocopied, reproduced, translated or
reduced to any medium or machine without prior written consent.
IN NO EVENT WILL SUPER MICRO COMPUTER, INC. BE LIABLE FOR DIRECT, INDIRECT,
SPECIAL, INCIDENTAL, SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE
USE OR INABILITY TO USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF
THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER MICRO COMPUTER, INC.
SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA ST ORED OR USED
WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.
Any disputes arising between manufacturer and customer shall be governed by the laws of Santa
Clara County in the State of California, USA. The State of California, County of Santa Clara shall
be the exclusive venue for the resolution of any such disputes. Super Micro's total liability for all
claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class
A digital device pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the manufacturer’s instruction manual, may cause harmful
interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your
own expense.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate
warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate
Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate”
WARNING: Handling of lead solder materials used in this
product may expose you to lead, a chemical known to
the State of California to cause birth defects and other
reproductive harm.
Manual Revision 1.0c
Release Date: June 16, 2009
Unless you request and receive written permission from Super Micro Computer, Inc., you may not
copy any part of this document.
Information in this document is subject to change without notice. Other products and companies
referred to herein are trademarks or registered trademarks of their respective companies or mark
holders.
This manual is written for system integrators, PC technicians and
knowledgeable PC users. It provides information for the installation and use of the
X7DBU/X7DGU motherboard. The X7DBU/X7DGU supports dual
Intel
XEON 64-bit Quad-core/Dual-core processors at a front side bus speed of 1.333
GHz/1.066 GHz/667 MHz. With dual 64-bit Xeon Quad-core/Dual-core processors,
the 5000 chipset, and 8 DDR2 FBD 667/533 memory modules built-in, the X7DBU/
X7DGU offers substantial functionality and performance enhancements to the motherboards based on the Core microarchitecture while remaining compatible with the
32-bit based software. The features include Virtualization Technology, Execution
Trace Cache, Thermal Monitor 2 (TM2), Enhanced Intel SpeedStep technology, Advanced Dynamic Execution, Advanced Transfer Cache, Streaming SIMD Extensions
3 (SSE3) and Extended Memory 64 Technology (EM64T). These features allow the
motherboard to operate at much higher speeds with better power management in
much safer environments than the traditional motherboards. The X7DBU/X7DGU
is ideal for high performance dual processor (DP) enterprise server environments.
This product is intended to be professionally installed.
Preface
Manual Organization
Chapter 1 describes the features, specifi cations and performance of the mainboard
and provides detailed information about the chipset.
Chapter 2 provides hardware installation instructions. Read this chapter when
installing the processor, memory modules and other hardware components into the
system. If you encounter any problems, see Chapter 3, which describes troubleshooting procedures for video, memory and system setup stored in the CMOS.
Chapter 4 includes an introduction to the BIOS and provides detailed information
on the CMOS Setup utility.
Appendix A provides BIOS POST Error Beep Codes. Appendix B, and Appendix
C listOS and Software Installation Instructions.
Conventions Used in the Manual:
Special attention should be given to the following symbols for proper installation and
to prevent damage done to the components or injury to yourself:
Warning: Important information given to ensure proper system installation
or to prevent damage to the components.
Note: Additional Information given to differentiate various models or to ensure correct system setup.
iii
X7DBU/X7DGU User's Manual
Table of Contents
Preface
About This Manual ...................................................................................................... iii
Manual Organization ................................................................................................... iii
Conventions Used in the Manual ..................................................................................iii
Appendix A: BIOS POST Beep Codes ...................................................................... A-1
Appendix B: Installing the Windows OS ....................................................................B-1
Appendix C: Installing Other Software Programs and Drivers...................................C-1
vi
Chapter 1: Introduction
Chapter 1
Introduction
1-1 Overview
Checklist
Congratulations on purchasing your computer motherboard from an acknowledged
leader in the industry. Supermicro boards are designed with the utmost attention to
detail to provide you with the highest standards in quality and performance. Check
that the following items have all been included with your motherboard. If anything
listed here is damaged or missing, contact your retailer.
All the following items are included in the Retail Box.
One (1) Supermicro Mainboard
One (1) ribbon cable for IDE devices (CBL-036L-02)
One (1) fl oppy ribbon cable (CBL-022)
One (1) Supermicro CD containing drivers and utilities
One (1) User's/BIOS Manual
1-1
X7DBU/X7DGU User's Manual
Contacting Supermicro
Headquarters
Address: Super Micro Computer, Inc. 980 Rock Ave. San Jose, CA 95131 U.S.A.
Tel: +1 (408) 503-8000
Fax: +1 (408) 503-8008
Email: marketing@supermicro.com (General Information) support@supermicro.com (Technical Support)
Web Site: www.supermicro.com
Europe
Address: Super Micro Computer B.V. Het Sterrenbeeld 28, 5215 ML 's-Hertogenbosch, The Netherlands
Tel: +31 (0) 73-6400390
Fax: +31 (0) 73-6416525
Email: sales@supermicro.nl (General Information) support@supermicro.nl (Technical Support) rma@supermicro.nl (Customer Support)
Note 1: The drawings and pictures shown in this manual were based on PCB
Revision 1.02, the latest revision available at the time of publishing of the manual.
The motherboard you’ve received may or may not look exactly the same as the
graphics shown in the manual.
Note 2: X7DGU is for OEM only.
1-3
X7DBU/X7DGU User's Manual
JD1
F
n
2
X7DBU/X7DGU Motherboard Layout
(not drawn to scale)
Buzzer
SP1
Intel 5000
(North Bridge)
I2C1
I2C2
J27
J28
X7DBU
SXB2: PCI-E x8
SXB1: PCI-E x16
KB/MS
USB 0/1
COM1
JCOM1
VGA
J15
LAN1
JLAN1
LAN2
JLAN2
LE2
JKM1
Rear UID
SW1
UIO PWR
Battery
J11
Bank4
Bank3
Bank2
Bank1
LAN
CTRL
Fan6
J7B3
J7B2
J7B1
J14
Fan5
J9B2
J9B1
J8B3
J8B2
J8B1
PCI-X 133 MHz
Fan7
CPU Fan1
DIMM4B
DIMM4A
DIMM3B
DIMM3A
DIMM2B
DIMM2A
DIMM1B
DIMM1A
PWR SMB
J9
J17
J5
Intel ESB2
(South Bridge)
JWOR1
JPG1
ES1000
Video CTRL
COM2
4-Pin PWR
8-Pin PWR
JPW2
JPW1
20-Pin Main PWR
JPW3
Fa
J
CPU1
FP CTRL
Fan2
LE1
JOH1
JP1
CPU2
I-SATA4
I-SATA3
I-SATA2
I-SATA1
I-SATA0
SGPIO1
J29
J30
SGPIO2
BIOS
JBT1
J7
Video Memory
JWD
JK1
JWOL1
JPL2
USB4
JPL1
I-SATA5
S I/O
USB2/3
Fan8
CPU FAN2
J18
SMB
JL1
Fan
IDE#1
SIMSO
Floppy
J
Fan4
Notes:
1. Jumpers not indicated are for test purposes only.
2. See Chapter 2 for detailed information on jumpers, I/O ports and JF1 front panel
connections.
3. " ", "
" and " " indicate Pin 1 locations.
4. The X7DBU uses the Intel 5000P chip and the X7DGU uses the Intel 5000X
chip.
5. The X7DGU model is for OEM only.
6. When LE1 is on, make sure to remove the power cable before removing or
installing components.
7. All SXB1 (J5), SXB2 (J9) and PCI-X 133 MHz (J14) slots are designed to be
used with riser cards. When used with riser cards, the left IO slot (SXB1) supports
one PCI-E x8 and one UIO devices, while the right IO slots (SXB2, PC1-X: J14)
can support a PCI-E x8 or a PCI-X 133 MHz device.
1-4
Chapter 1: Introduction
Quick Reference ( X7DBU/X7DGU)
Jumper Description Default Setting
JBT1 CMOS Clear See Chapter 2
2
JI
C1 (J27) SMBBus to PCI-X/PCI-E Slots Off (Disabled)
JI2C2 (J28) SMBBus to PCI-X/PCI-E Slots Off (Disabled)
JPG1 VGA Enable Pins 1-2 (Enabled)
JPL1/ JPL2 GLAN1/GLAN2 Enable Pins 1-2 (Enabled)
JWD Watch Dog Pins 1-2 (Reset)
ConnectorDescription
ATX PWR (JPW1) Primary 20-Pin ATX PWR Connector
Aux. PWR/CPU PWR +12V 4-pin PWR (JWP2)/+12V 8-pin PWR(JPW3)
UIO PWR (J11) Power Connector for the Universal IO slots
Buzzer (SP1) Internal Speaker
Chassis Intrusion (JL1) Chassis Intrusion Header
COM1/COM2 COM1(JCOM1)/COM2(JCOM2) Serial Port Connectors
DIMM#1A-DIMM#4B Memory DDR2 Fully Buffered (FBD) Slots
FAN 1-8 Fans 1-6 (System Fans), Fans 7-8: CPU Fans
(Fans 1-4: 3-pin Fans, Fans 5-8: 4-pin Fans)
Floppy (J22) Floppy Disk Drive Connector
FP CTRL (JF1) Front Control Panel Connector
GLAN 1/2 (JLAN1/2) G-bit Ethernet Ports
IDE#1 (JIDE1) IDE#1 Hard Drive
Keylock (JK1) Keylock Header
OH LED (JOH1) Overheat LED Indicator
PCI-X (J14) PCI-X 133MHz Slot (*See Note 7 on Page 1-4)
PWR LED/SPKR (JD1) PWR LED(pins1-3)/Speaker Header (pins 4-7)
PWR SMB (J17) Power System Management (I
SATA0-SATA5 Intel SATA 0-5 Connectors
SGPIO1/2 (J29, J30) Serial General Purpose Input/Output Headers
SIMSO SIM SO-DIMM IPMI Slot
SMB (J18) System Management Bus Header
SXB1 (J5) PCI-Exp x16 slot (*See Note 7 on Page 1-4)
SXB2 (J9) PCI-Exp x8 slot (*See Note 7 on Page 1-4)
UID (SW1) Rear Unit Identifi cation Switch
USB 0/1 Back Panel USB Ports 0/1
USB 2/3,USB4 Front Panel USB Connectors 2/3, FP USB Connector 4
VGA (J15) (Note) VGA Connector
WOL (JWOL1) Wake-on-LAN Header
WOR (JWOR1) Wake-on-Ring Header
2
C) Header
LE IndicatorsDescription
LE1 Onboard Power LED Indicator
LE2 Unit Identifi cation (UID) LED Indicator Note: The X7DGU model is for OEM only.
1-5
X7DBU/X7DGU User's Manual
Motherboard Features
CPU
®
• Dual Intel
bus speed of 1.333 GHz/1.066 GHz/667 MHz
Memory
• 8 240-pin DIMM sockets with support up to 32 GB DDR2 Fully Buffered (FBD)
ECC 667/533 Memory (*See Section 2-3 in Chapter 2 for DIMM Slot Population.)
Chipset
*X7DBU:
• Intel 5000P chipset, including: the 5000P Memory Control Hub (MCH) and the
Enterprise South Bridge 2 (ESB2).
64-bit Xeon LGA 771 Quad-core/Dual-core processors at a front side
*X7DGU:
• Intel 5000X chipset, including: the 5000X Memory Control Hub (MCH) and the
Enterprise South Bridge 2 (ESB2).
Expansion Slots
*X7DBU:
• Two PCI-Express slots (SXB1: PCI-E x8 + x8 Single Slot, SXB2: PCI-E x8)
• One 64-bit PCI-X 133 MHz slot (J14)
*X7DGU (for OEM only):
• Two PCI-Express slots (SXB1: PCI-E x16, SXB2: PCI-E x8)
• One 64-bit PCI-X 133 MHz slot (J14)
BIOS
• 8 Mb Phoenix
®
Flash ROM
• DMI 2.3, PCI 2.2, ACPI 1.0/2.0, Plug and Play (PnP), SMBIOS 2.3 and USB
Keyboard support
PC Health Monitoring
• Onboard voltage monitors for CPU cores, chipset voltage, memory voltage,
HT voltage, +1.8V, +3.3V, +5V, 12V, 12V, +3.3V Standby, +5V standby and
VBAT
• Fan status monitor with fi rmware control
• CPU/chassis temperature monitors
• Low noise fan speed control
1-6
Chapter 1: Introduction
• Platform Environment Control Interface (PECI) ready
2
• I
C temperature sensing logic
• Thermal Monitor 2 (TM2) support
• CPU slow-down on temperature overheat
• CPU thermal trip support for processor protection
• Power-up mode control for recovery from AC power loss
• Pulse Width Modulation Fan Control (Fans 5-8)
• Auto-switching voltage regulator for CPU cores
• System overheat/Fan Fail LED Indicator and control
• Chassis intrusion detection
• System resource alert via Supero Doctor III
ACPI Features
• Slow blinking LED for suspend state indicator
• Main switch override mechanism
• ACPI Power Management
• Power-on mode for power recovery
Onboard I/O
• Six SATA ports (supporting RAID0, RAID1, RAID10 and RAID5)
• One SIMSO IPMI socket (AOC-SIMSO)
• Two Giga-bit LAN ports with IOAT Technology
• One IDE w/two devices supported
• One fl oppy port interface
• Two COM ports(1 header, 1 port)
• Up to fi ve USB 2.0 (Universal Serial Bus) (2 ports, 2 Headers)
• ATI ES1000 16MB Graphic Controller
• Super I/O: Winbond W83627HG w/Hardware Monitor support: W83793G
Other
• External modem ring-on
• Wake-on-LAN (WOL)
• Wake-on-Ring (WOR)
• Console redirection
• Onboard Fan Speed Control by Thermal Management via BIOS
• SDDC support
CD/Diskette Utilities
• BIOS fl ash upgrade utility and device drivers
Dimensions
• Proprietary 13.035" (L) x 12.075" (W) (331.09mm x 306.71mm)
1-7
X7DBU/X7DGU User's Manual
VGA
CONN
VRM
J9
J14
PCIX SLOT
VGA
ES1000
PROCESSOR#2
1067/1333
J5
PCI-E X16 SLOT
PWR
36PIN
PCI-EX8
PCI-EXP X8 SLOT
PCI-X133
PCI32
/33MMZ
PCI-EX8
PCI-EX8
MT/S
PORT
#4,5
(Intel 5000)
PORT
#6,7
PCIE X8
PORT
#1,2
MCH
PORT PORT
#0#2,3
PORT PORT
#4#3
ESB2
PROCESSOR#1
1067/1333
MT/S
FBD CHNL0
FBD CHNL1
FBD CHNL2
FBD CHNL3
PCIE X4
ATA100
3.0Gb/S
USB2.0
VRM
#1B#2B#3B
#1A
#2A#3A
FBD DIMM
FBD DIMM
IDE CONN
#5
#4
#3
#2
#1
#0
SATA
#4
#3
#2
#1
#0
USB
#4B
#4A
FBD DIMM
FBD DIMM
HF
LPC
FWH
DDR
RJ45
KUMERAN
GB LAN
GILGAL
SIO
W83627
RJ45
FDD
MS
KB
COM1
COM2
System Block Diagram for the X7DBU
Note: This is a general chipset block diagram. Please see the previous Motherboard
Features pages for details on the features of each motherboard.
1-8
Chapter 1: Introduction
1-2 Chipset Overview
Built upon the functionality and the capability of the 5000P/5000X chipset, the
X7DBU/X7DGU motherboard provides the performance and feature set required
for dual processor-based servers with confi guration options optimized for com-
munications, presentation, storage, computation or database applications. The
5000P/5000X chipset supports a single or dual Intel 64-bit Quad-core/Dual-core
processor(s) with front side bus speeds of up to 1.333 GHz. The chipset consists
of the 5000P/5000X Memory Controller Hub (MCH) and the Enterprise South Bridge
2 (ESB2),
The 5000P/5000X MCH chipset is designed for symmetric multiprocessing across
two independent front side bus interfaces. Each front side bus uses a 64-bit wide,
1333 MHz data bus that transfers data at 10.7 GB/sec. The MCH chipset connects
up to 8 Fully Buffered DIMM modules, providing up to 32 GB of DDR2 FBD ECC
memory. The MCH chipset also provides three x8 PCI-Express interface to the
ESB2. In addition, the 5000P/5000X chipset offers a wide range of RAS features,
including memory interface ECC, x4/x8 Single Device Data Correction, CRC, parity
protection, memory mirroring and memory sparing.
Xeon Quad-core/Dual-core Processor Features
Designed to be used with conjunction of the 5000P/5000X chipset, the Xeon Quadcore/Dual-core Processor provides a feature set as follows:
The Xeon Quad-core/Dual-core Processor
*L1 Cache Size: Instruction Cache (32KB/16KB), Data Cache (32KB/24KB)
*L2 Cache Size: 4MB/2MB (per core)
*Data Bus Transfer Rate: 8.5 GB/s
*Package: FC-LGA6/FC-LGA4, 771 Lands
1-9
X7DBU/X7DGU User's Manual
1-3 Special Features
Recovery from AC Power Loss
BIOS provides a setting for you to determine how the system will respond when
AC power is lost and then restored to the system. You can choose for the system
to remain powered off (in which case you must hit the power switch to turn it back
on) or for it to automatically return to a power- on state. See the Power Lost Control setting in the Advanced section (Boot Features) to change this setting. (Note:
Default: Last State).
1-4 PC Health Monitoring
This section describes the PC health monitoring features of the X7DBU/X7DGU.
All have an onboard System Hardware Monitor chip that supports PC health monitoring.
Onboard Voltage Monitors for CPU Cores, Memory, Chipset, HT,
+1.8V, +3.3V, +5V, +12V, −12V, +3.3V Standby, +5V standby and
VBAT
An onboard voltage monitor will scan these voltages continuously. Once a voltage
becomes unstable, a warning is given or an error message is sent to the screen.
Users can adjust the voltage thresholds to defi ne the sensitivity of the voltage
monitor.
Fan Status Monitor with Firmware Control
The PC health monitor can check the RPM status of the cooling fans. The onboard
CPU and chassis fans are controlled by Thermal Management via BIOS (under
Hardware Monitoring in the Advanced Setting).
Environmental Temperature Control
The thermal control sensor monitors the CPU temperature in real time and will turn
on the thermal control fan whenever the CPU temperature exceeds a user-defi ned
threshold. The overheat circuitry runs independently from the CPU. Once it detects
that the CPU temperature is too high, it will automatically turn on the thermal fan
control to prevent any overheat damage to the CPU. The onboard chassis thermal
circuitry can monitor the overall system temperature and alert users when the chassis temperature is too high.
1-10
Chapter 1: Introduction
System Resource Alert
This feature is available when used with Supero Doctor III in the Windows OS
environment or used with Supero Doctor II in Linux. Supero Doctor is used to
notify the user of certain system events. For example, if the system is running low
on virtual memory and there is insuffi cient hard drive space for saving the data,
you can be alerted of the potential problem. You can also confi gure Supero Doctor
to provide you with warnings when the system temperature goes beyond a predefi ned range.
1-5 ACPI Features
ACPI stands for Advanced Confi guration and Power Interface. The ACPI specifi -
cation defi nes a fl exible and abstract hardware interface that provides a standard
way to integrate power management features throughout a PC system, including
its hardware, operating system and application software. This enables the system
to automatically turn on and off peripherals such as CD-ROMs, network cards, hard
disk drives and printers. This also includes consumer devices connected to the PC
such as VCRs, TVs, telephones and stereos.
In addition to enabling operating system-directed power management, ACPI
provides a generic system event mechanism for Plug and Play and an operating
system-independent interface for confi guration control. ACPI leverages the Plug
and Play BIOS data structures while providing a processor architecture-independent
implementation that is compatible with Windows 2000, Windows XP and Windows
2003 Server Operating Systems.
Slow Blinking LED for Suspend-State Indicator
When the CPU goes into a suspend state, the chassis power LED will start blinking
to indicate that the CPU is in suspend mode. When the user presses any key, the
CPU will wake-up and the LED will automatically stop blinking and remain on.
Main Switch Override Mechanism
When an ATX power supply is used, the power button can function as a system suspend button to make the system enter a SoftOff state. The monitor will be suspended
and the hard drive will spin down. Pressing the power button again to "wake-up" the
whole system. During the SoftOff state, the ATX power supply provides power to
keep the required circuitry in the system "alive." In case the system malfunctions and
you want to turn off the power, just press and hold the power button for 4 seconds.
This option can be set in the Power section of the BIOS Setup routine.
1-11
X7DBU/X7DGU User's Manual
External Modem Ring-On
Wake-up events can be triggered by a device such as the external modem ringing
when the system is in the SoftOff state. Note that external modem ring-on can only
be used with an ATX 2.01 (or above) compliant power supply.
Wake-On-LAN (WOL)
Wake-On-LAN is defi ned as the ability of a management application to remotely
power up a computer that is powered off. Remote PC setup, up-dates and asset
tracking can occur after hours and on weekends so that daily LAN traffi c is kept
to a minimum and users are not interrupted. The motherboard has a 3-pin header
(WOL) to connect to the 3-pin header on a Network Interface Card (NIC) that has
WOL capability. In addition, an onboard LAN controller can also support WOL
without any connection to the WOL header. The 3-pin WOL header is to be used
with a LAN add-on card only.
Note: Wake-On-LAN requires an ATX 2.01 (or above) compliant power supply.
1-6 Power Supply
As with all computer products, a stable power source is necessary for proper and
reliable operation. It is even more important for processors that have high CPU
clock rates.
The X7DBU/X7DGU can only accommodate 20-pin ATX power supplies. Although
most power supplies generally meet the specifi cations required by the CPU, some
are inadequate. The 12V 4-pin and the 12V 8-pin power connections are also required to ensure adequate power supply to the system. In addition, the UIO power
connector, located at J11, is required to supply power to Universal IO slots. Also
your power supply must supply 1.5A for the Ethernet ports.
It is strongly recommended that you use a high quality power supply that meets ATX
power supply Specifi cation 2.01 or above. It must also be SSI compliant (info at
http://www.ssiforum.org/). Additionally, in areas where noisy power transmission is
present, you may choose to install a line fi lter to shield the computer from noise. It
is recommended that you also install a power surge protector to help avoid problems
caused by power surges.
1-12
Chapter 1: Introduction
1-7 Super I/O
The disk drive adapter functions of the Super I/O chip include a fl oppy disk drive
controller that is compatible with industry standard 82077/765, a data separator,
write pre-compensation circuitry, decode logic, data rate selection, a clock generator, drive interface control logic and interrupt and DMA logic. The wide range of
functions integrated onto the Super I/O greatly reduces the number of components
required for interfacing with fl oppy disk drives. The Super I/O supports 360 K, 720
K, 1.2 M, 1.44 M or 2.88 M disk drives and data transfer rates of 250 Kb/s, 500 Kb/s
or 1 Mb/s. It also provides two high-speed, 16550 compatible serial communication
ports (UARTs). Each UART includes a 16-byte send/receive FIFO, a programmable
baud rate generator, complete modem control capability and a processor interrupt
system. Both UARTs provide legacy speed with baud rate of up to 115.2 Kbps
as well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which
support higher speed modems.
The Super I/O provides functions that comply with ACPI (Advanced Confi guration
and Power Interface), which includes support of legacy and ACPI power management through an SMI or SCI function pin. It also features auto power management
to reduce power consumption.
The IRQs, DMAs and I/O space resources of the Super I/O can fl exibly adjust
to meet ISA PnP requirements, which support ACPI and APM (Advanced Power
Management).
1-13
X7DBU/X7DGU User's Manual
Notes
1-14
Chapter 2: Installation
Chapter 2
Installation
2-1 Static-Sensitive Devices
Electro-Static-Discharge (ESD) can damage electronic com ponents. To prevent
damage to your system board, it is important to handle it very carefully . The following
measures are generally suffi cient to protect your equipment from ESD.
Precautions
• Use a grounded wrist strap designed to prevent static discharge.
• Touch a grounded metal object before removing the board from the antistatic
bag.
• Handle the board by its edges only; do not touch its components, peripheral
chips, memory modules or gold contacts.
• When handling chips or modules, avoid touching their pins.
• Put the motherboard and peripherals back into their antistatic bags when not in
use.
• For grounding purposes, make sure your computer chassis provides excellent
conductivity between the power supply, the case, the mounting fasteners and
the motherboard.
• Use only the correct type of onboard CMOS battery as specifi ed by the manu-
facturer. Do not install the onboard battery upside down to avoid possible explosion.
Unpacking
The motherboard is shipped in antistatic packaging to avoid static damage. When
unpacking the board, make sure the person handling it is static protected.
2-1
X7DBU/X7DGU User's Manual
!
2-2 Processor and Heatsink Installation
When handling the processor package, avoid placing
direct pressure on the label area of the fan.
(Notes: 1. Always connect the power cord last and always remove it before adding,
removing or changing any components. Make sure that you install the processor
into the CPU socket before you install the CPU heatsink.
2. Intel's boxed Xeon CPU package contains the CPU fan and heatsink assembly.
If you buy a CPU separately, make sure that you use only Intel-certifi ed multi-di-
rectional heatsink and fan.
3. Make sure to install the motherboard into the chassis before you install the CPU
heatsink and fan.
4. When purchasing an LGA 771 CPU or when receiving a motherboard with an LGA
771 CPU pre-installed, make sure that the CPU plastic cap is in place and none of
the CPU pins are bent; otherwise, contact the retailer immediately.
5. Refer to the MB Features Section for more details on CPU support.
Installation of the LGA771 Processor
Socket Clip
Load Plate
1. Press the socket clip to release
the load plate, which covers the CPU
socket, from its locking position.
2. Gently lift the socket clip to open the
load plate.
Load Plate
2-2
3. Use your thumb and your index fi nger
!
to hold the CPU at the North Center
Edge and the South Center Edge of
the CPU.
4. Align CPU Pin1 (the CPU corner
marked with a triangle) against the
socket corner that is marked with a
triangle cutout.
5. Align the CPU key that is the semi-
circle cutout below a gold dot against the
socket key , the notch on the same side of
the triangle cutout on the socket.
6. Once aligned, carefully lower the CPU
straight down to the socket. (**Do not
drop the CPU on the socket. Do not
move the CPU horizontally or vertically.
Do not rub the CPU against the surface
or against any pins of the socket to avoid
damage to the CPU or the socket.)
North Center Edge
South Center Edge
Socket Key
(Socket Notch)
CPU Key
(semi-circle
cutout) below
the circle.
Corner with a
triangle cutout
Chapter 2: Installation
gold dot
CPU Pin1
7. With the CPU inside the socket,
inspect the four corners of the CPU
to make sure that the CPU is properly
installed.
8. Use your thumb to gently push the
socket clip down to the clip lock.
9. If the CPU is properly installed into
the socket, the plastic cap will be automatically released from the load plate
when the clip is pushed into the clip
lock. Remove the plastic cap from the
motherboard.
(Warning: Please keep the plastic
cap. The motherboard and the CPU
must be shipped with the plastic cap
properly installed to protect the CPU
pins. Shipment without the CPU plastic
cap properly installed will void the warranty.)
Socket clip
CPU in the CPU socket
Plastic cap
is released
from the
load plate
if the CPU
is properly
installed.
2-3
X7DBU/X7DGU User's Manual
!
Installation of the Heatsink
CEK Heatsink Installation
1. Do not apply any thermal grease to
the heatsink or the CPU die-the required
amount has already been applied.
2. Place the heatsink on top of the CPU so
that the four mounting holes are aligned with
those on the retention mechanism.
3. Screw in two diagonal screws (ie the #1
and the #2 screws) until just snug. Do not
fully tighten the screws to avoid possible
damage to the CPU.
4. Finish the installation by fully tightening
all four screws.
CEK Passive Heatsink
Screw#1
Screw#1
Screw#2
To Un-install the Heatsink
(Warning: We do not recommend that
the CPU or the heatsink be removed.
However, if you do need to uninstall
the heatsink, please follow the instructions below to uninstall the heatsink to
avoid damage done to the CPU or the
CPU socket.)
Screw#2
2-4
Chapter 2: Installation
1. Unscrew and remove the heatsink screws
from the motherboard in the sequence as show
in the picture on the right.
2. Hold the heatsink as shown in the picture
on the right and gently wiggle the heatsink to
loosen it from the CPU. (Do not use excessive
force when wiggling the heatsink!!)
3. Once the heatsink is loosened, remove the
heatsink from the CPU socket.
4. Clean the surface of the CPU and the
heatsink to get rid of the old thermal grease.
Reapply the proper amount of thermal grease
on the surface before you re-install the CPU
and the heatsink.
Screw#1
Screw#4
Screw#3
Screw#2
Mounting the Motherboard in the Chassis
All motherboards have standard mounting holes to fi t different types of chas-
sis. Make sure that the locations of all the mounting holes for both motherboard
and chassis match. Make sure that the metal standoffs click in or are screwed in
tightly. Then, use a screwdriver to secure the motherboard onto the motherboard
tray. (Note: some components are very close to the mounting holes. Please take
precautionary measures to prevent damage done to these components when you
install the motherboard to the chassis.)
2-5
X7DBU/X7DGU User's Manual
2-3 Installing DIMMs
Note: Check the Supermicro web site for recommended memory modules.
CAUTION
Exercise extreme care when installing or removing DIMM
modules to prevent any possible damage. Also note that the
memory is interleaved to improve performance (see step 1).
DIMM Installation
1. Insert the desired number of DIMMs into the memory slots, starting with DIMM
#1A. The memory scheme is interleaved so you must install two modules
at a time, beginning with DIMM #1A, then DIMM #2A and so on. (*See the
Memory Installation Table Below.)
2. Insert each DIMM module vertically into its slot. Pay attention to the notch along
the bottom of the module to prevent inserting the DIMM module incorrectly.
3. Gently press down on the DIMM module until it snaps into place in the slot.
Repeat for all modules (see step 1 above).
Memory Support
The X7DBU/X7DGU supports up to 32 GB fully buffered (FBD) ECC DDR2 667/533
in 8 DIMMs. Populating DIMM modules with pairs of memory modules of the
same size and same type will result in Interleaved Memory which will increase
(*Notes: i. DIMM slot# specified: DIMM slot to be populated; “--
-“: DIMM slot not to be populated. ii. Both FBD 533 MHz and
667MHz DIMMs are supported; however, you need to use the
memory modules of the same speed and of the same type on a
motherboard. iii. Interleaved memory is supported when pairs
of DIMM modules are installed. For best performance, please
install memory modules in both
memory to work properly, you need to follow the restrictions
listed above. )
Bank 1
(Channel 0)
Bank 2
(Channel 1)
Bank 3
(Channel 2)
Branch 0 and Branch 1. iv. For
Bank 4
(Channel 3)
Note 1: Due to OS limitations, some operating systems may not show more than
4 GB of memory.
Note 2: Due to memory allocation to system devices, memory remaining available
for operational use will be reduced when 4 GB of RAM is used. The reduction in
memory availability is disproportional. (Refer to the Memory Availability Table on
the next page for details.)
2-6
D
D lot
Possible System Memory Allocation & Availability
Chapter 2: Installation
System DeviceSizePhysical Memory
Remaining (-Available)
(4 GB Total System Memory)
Firmware Hub fl ash memory
1 MB3.99
(System BIOS)
Local APIC4 KB3.99
Area Reserved for the
2 MB3.99
chipset
I/O APIC (4 Kbytes)4 KB3.99
PCI Enumeration Area 1256 MB3.76
PCI Express (256 MB)256 MB3.51
PCI Enumeration Area 2
512 MB3.01
(if needed) -Aligned on
256-MB boundary-
VGA Memory16 MB2.85
TSEG1 MB2.84
Memory available to System
2.84
BIOS & OS applications
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Use your thumbs to gently
push the release tabs near
both ends of the module.
This should release it from
the slot.
Installing and Removing DIMMs
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To Install: Insert module vertically and press down until it
snaps into place. Pay attention to the alignment notch at
the bottom.
2-7
X7DBU/X7DGU User's Manual
1
2
3
4
5
6
7
8
9
2-4 Control Panel Connectors/IO Ports
The I/O ports are color coded in conformance with the PC 99 specifi cation. See the
fi gure below for the colors and locations of the various I/O ports.
A. Back Panel Connectors/IO Ports
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Back Panel I/O Port Locations and Defi nitions
Back Panel Connectors
1. Keyboard (Purple)
2. PS/2 Mouse (Green)
3. Back Panel USB Port 0
4. Back Panel USB Port 1
5. COM Port 1 (Turquoise)
6. VGA Port (Blue) 7. Gigabit LAN 1
8. Gigabit LAN 2
9. Rear UID Switch
(See Section 2-5 for details.)
2-8
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