Supermicro X8DTE-F operation manual

X8DT6
X8DTE

X8DT6-F

X8DTE-F

USER’S MANUAL

Revision 1.1a

The information in this User’s Manual has been carefully reviewed and is believed to be accurate.
The vendor assumes no responsibility for any inaccuracies that may be contained in this document,
makes no commitment to update or to keep current the information in this manual, or to notify any
person or organization of the updates. Please Note: For the most up-to-date version of this

manual, please see our website at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product
described in this manual at any time and without notice. This product, including software and docu­mentation, is the property of Supermicro and/or its licensors, and is supplied only under a license.
Any use or reproduction of this product is not allowed, except as expressly permitted by the terms
of said license.

IN NO EVENT WILL SUPER MICRO COMPUTER, INC. BE LIABLE FOR DIRECT, INDIRECT,
SPECIAL, INCIDENTAL, SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE
USE OR INABILITY TO USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF
THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER MICRO COMPUTER, INC.
SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED OR USED
WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa
Clara County in the State of California, USA. The State of California, County of Santa Clara shall be
the exclusive venue for the resolution of any such disputes. Supermicro's total liability for all claims
will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class
A digital device pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the manufacturer’s instruction manual, may cause harmful
interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your
own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate
warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate
Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate”.

WARNING: Handling of lead solder materials used in this
product may expose you to lead, a chemical known to
the State of California to cause birth defects and other
reproductive harm.

Manual Revision 1.1a
Release Date: April 4, 2011

Unless you request and receive written permission from Super Micro Computer, Inc., you may not
copy any part of this document.

Information in this document is subject to change without notice. Other products and companies
referred to herein are trademarks or registered trademarks of their respective companies or mark
holders.

Copyright © 2011 by Super Micro Computer, Inc.
All rights reserved.

Printed in the United States of America

Preface

About this Manual

This manual is written for system integrators, PC technicians and knowledgeable
PC users. It provides information for the installation and use of the
X8DT6-F/X8DTE/X8DTE-F motherboard.

About this Motherboard

The X8DT6/X8DT6-F/X8DTE/X8DTE-F supports the Intel® 5500/5600
Series Processor platform, the fi rst dual-processing platform that supports the Intel
QuickPath Interconnect (QPI) Technology, providing the next generation point-to­point system interface to replace the current Front Side Bus. With the 5500/5600
Series Processor platform built in, the X8DT6/X8DT6-F/X8DTE/X8DTE-F offers
substantial enhancement in system performance with increased bandwidth and
unprecedented scalability optimized for high-end servers, High Performance Com­puting (HPC) systems and intensive applications. Please refer to our web site (http://
www.supermicro.com/products/) for updates on supported processors. This product
is intended to be installed and serviced by professional technicians.

Preface

X8DT6/

Manual Organization

Chapter 1 describes the features, specifi cations and performance of the mother-

board and provides detailed information about the chipset.
Chapter 2 provides hardware installation instructions. Read this chapter when in-

stalling the processor, memory modules and other hardware components into the
system. If you encounter any problems, see Chapter 3, which describes trouble­shooting procedures for video, memory and system setup stored in the CMOS.

Chapter 4 includes an introduction to the BIOS and provides detailed information
on running the CMOS Setup utility.

Appendix A lists BIOS POST Error Codes. Appendix B provides Software Instal­lation Instructions.

Conventions Used in the Manual

Special attention should be given to the following symbols for proper installation and
to prevent damage done to the components or injury to yourself:

Danger/Caution: Instructions to be strictly followed to prevent catastrophic
system failure or to avoid bodily injury.

iii

X8DT6/X8DT6-F/X8DTE/X8DTE-F User's Manual

Warning: Important information given to ensure proper system installation
or to prevent damage to the components.

Note: Additional Information given to differentiate various models or to
ensure correct system setup.

iv

Contacting Supermicro

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.
San Jose, CA 95131 U.S.A.

Tel: [phone]
Fax: [phone]
Email: [e-mail] (General Information)

[e-mail] (Technical Support)

Web Site: www.supermicro.com

Europe

Address: Super Micro Computer B.V.

Het Sterrenbeeld 28, 5215 ML
's-Hertogenbosch, The Netherlands

Tel: [phone]
Fax: [phone]
Email: [e-mail] (General Information)

[e-mail] (Technical Support)
[e-mail] (Customer Support)

Asia-Pacifi c

Address: Super Micro Computer, Inc.

4F, No. 232-1, Liancheng Rd.
Chung-Ho 235, Taipei County
Taiwan, R.O.C.

Tel: [phone]
Fax: [phone]
Web Site: www.supermicro.com.tw
Technical Support:
Email: [e-mail]
Tel: [phone], ext.132 or 139

v

X8DT6/X8DT6-F/X8DTE/X8DTE-F User's Manual

Table of Contents

Preface
Chapter 1 Introduction

1-1 Overview .........................................................................................................1-1

1-2 Chipset Overview ............................................................................................1-9

1-3 Special Features ........................................................................................... 1-10

1-4 PC Health Monitoring .................................................................................... 1-10

Fan Status Monitor with Firmware Control via SD II or III .......................... 1-10

Environmental Temperature Control .............................................................1-10

System Resource Alert .................................................................................1-10

1-5 ACPI Features ................................................................................................1-11

Slow Blinking LED for Suspend-State Indicator ............................................1-11

Main Switch Override Mechanism .................................................................1-11

Wake-On-LAN (WOL) ....................................................................................1-11

1-6 Power Supply ................................................................................................1-12

1-7 Super I/O ....................................................................................................... 1-12

1-8 Overview of the Winbond WPCM450 Controller (For X8DT6-F/X8DTE-F Only)

......................................................................................................................1-13

Chapter 2 Installation

2-1 Static-Sensitive Devices ..................................................................................2-1

Precautions .....................................................................................................2-1

Unpacking .......................................................................................................2-1

2-2 Motherboard Installation ..................................................................................2-2

Tools Needed ..................................................................................................2-2

Installation Instructions ....................................................................................2-2

2-3 Processor and Heatsink Installation................................................................2-3

Installing a CPU Heatsink ............................................................................... 2-5

2-4 Memory Installation ........................................................................................ 2-7

2-5 Control Panel Connectors/IO Ports................................................................2-11

1. Back Panel Connectors/IO Ports ...............................................................2-11

ATX PS/2 Keyboard and PS/2 Mouse Ports ............................................ 2-12

Universal Serial Bus (USB) ...................................................................... 2-13

Serial Ports ............................................................................................... 2-14

Video Connector .......................................................................................2-14

Ethernet Ports .......................................................................................... 2-15

2. Front Control Panel ...................................................................................2-16

3. Front Control Panel Pin Defi nitions .......................................................... 2-17

NMI Button ............................................................................................... 2-17

vi

Table of Contents

Power LED ..............................................................................................2-17

HDD LED .................................................................................................. 2-18

NIC1/NIC2 LED Indicators .......................................................................2-18

Overheat (OH)/Fan Fail LED....................................................................2-19

Power Fail LED ........................................................................................ 2-19

Reset Button ........................................................................................... 2-20

Power Button ........................................................................................... 2-20

2-6 Connecting Cables ........................................................................................ 2-21

Power Connectors ...................................................................................2-21

Fan Headers ............................................................................................. 2-22

Chassis Intrusion .....................................................................................2-22

Internal Speaker .......................................................................................2-23

Power LED/Speaker ................................................................................. 2-23

Wake-On-LAN ..........................................................................................2-24

Overheat LED/Fan Fail (JOH1) ................................................................2-24

T-SGPIO Headers .................................................................................... 2-25

RAIDKey Header (Optional for X8DT6/X8DT6-F only) ............................ 2-25

Power SMB (I
IPMB I

2

C SMB .......................................................................................... 2-26

2

C) Connector .................................................................... 2-26

DOM Power Connector ............................................................................ 2-27

2-7 Jumper Settings ............................................................................................ 2-28

Explanation of Jumpers ................................................................................ 2-28

SAS Enable/Disable (X8DT6/X8DT6-F) ................................................... 2-28

CMOS Clear .............................................................................................2-29

Watch Dog Enable/Disable ...................................................................... 2-29

2

I

C Bus to PCI-Exp. Slots ........................................................................ 2-30

VGA Enable .............................................................................................. 2-30

GLAN Enable/Disable .............................................................................. 2-31

2-8 Onboard LED Indicators ............................................................................... 2-32

GLAN LEDs .............................................................................................. 2-32

IPMI Dedicated LAN LEDs (X8DT6-F/X8DTE-F Only) ............................ 2-32

SAS Heartbeat LED Indicator .................................................................. 2-33

BMC Heartbeat LED ................................................................................ 2-33

Onboard Power LED ............................................................................... 2-34

2-9 Floppy Drive, Serial ATA and SAS Connections ........................................... 2-35

Floppy Connector .....................................................................................2-35

Serial ATA Ports........................................................................................2-36

SAS Ports (X8DT6/X8DT6-F only) ........................................................... 2-36

vii

X8DT6/X8DT6-F/X8DTE/X8DTE-F User's Manual

Chapter 3 Troubleshooting

3-1 Troubleshooting Procedures ........................................................................... 3-1

Before Power On ............................................................................................ 3-1

No Power ........................................................................................................ 3-1

No Video ......................................................................................................... 3-2

Losing the System’s Setup Confi guration ....................................................... 3-2

Memory Errors ............................................................................................... 3-2

3-2 Technical Support Procedures ........................................................................ 3-3

3-3 Frequently Asked Questions ...........................................................................3-3

3-4 Returning Merchandise for Service.................................................................3-4

Chapter 4 BIOS

4-1 Introduction ...................................................................................................... 4-1

Starting BIOS Setup Utility ..............................................................................4-1

How To Change the Confi guration Data ......................................................... 4-1

Starting the Setup Utility ................................................................................. 4-2

4-2 Main Setup ......................................................................................................4-2

4-3 Advanced Setup Confi gurations...................................................................... 4-4

4-4 Security Settings ........................................................................................... 4-23

4-5 Boot Confi guration ........................................................................................4-25

4-6 Exit Options ................................................................................................... 4-27

Appendix A BIOS Error Beep Codes

A-1 BIOS Error Beep Codes .................................................................................A-1

Appendix B Software Installation Instructions

B-1 Installing Software Programs .......................................................................... B-1

B-2 Confi guring Supero Doctor III ......................................................................... B-2

viii

Chapter 1: Introduction

Chapter 1

Introduction

1-1 Overview

Checklist

Congratulations on purchasing your computer motherboard from an acknowledged
leader in the industry. Supermicro boards are designed with the utmost attention
to detail to provide the highest standards in quality and performance. Check that
the following items have all been included with your motherboard. If anything listed
here is damaged or missing, contact your retailer.

The following items are included in the retail box.

One (1) Supermicro Mainboard

•

One (1) fl oppy ribbon cable (CBL-0022L) •

One (1) USB cable (CBL-0083L)•

One (1) Serial/COM cable (CBL-010L)•

Four (4) Serial ATA cables (CBL-0044L) (For X8DT6/X8DT6-F)•

Six (6) Serial ATA cables (CBL-0044L) (For X8DTE/X8DTE-F)•

Two (2) SAS cables for SATA/SAS Backplane (CBL-0097L-02) (For X8DT6/•
X8DT6-F)

One (1) I/O backpanel shield (MCP-260-00027-0N)

•

One (1) Supermicro CD containing drivers and utilities•

One (1) User's/BIOS Manual•

1-1

X8DT6/X8DT6-F/X8DTE/X8DTE-F User's Manual

X8DT6/X8DT6-F Image

Note: The drawings and pictures shown in this manual were based on the

latest PCB Revision available at the time of publishing of the manual. The
motherboard you’ve received may or may not look exactly the same as
the graphics shown in the manual.

1-2

Chapter 1: Introduction

FAN5

KB/MOUSE

USB 0/1

COM1

VGA

LAN
CTRL

COM2

FAN6

IPMI

LAN

PHY

LAN1

LAN2

FAN8/

CPU2 Fan

LAN
CTRL

BMC
CTRL

D1

SLOT7 PCI-E 2.0 X8

SLOT6 PCI-E 2.0 X8

JPL1

SLOT5 PCI-E 2.0 X8

SLOT4 PCI-E 2.0 X8

JPL2

SLOT3 PCI-E 2.0 X4

SLOT1 PCI-E X4
JI2C2

JI2C1

X8DT6/X8DT6-F/X8DTE/X8DTE-F Layout

P1-DIMM3A
P1-DIMM3B
P1-DIMM2A
P1-DIMM2B
P1-DIMM1A

P1-DIMM1B

CPU1

CP

JPI2C1

JPW1

CPU2

P2-DIMM1B

P2-DIMM1A

P2-DIMM2B
P2-DIMM2A
P2-DIMM3B
P2-DIMM3A

X8DT6/E Series

Intel 5520

Battery

JBT1

JPB

JPG1

BIOS

Intel ICH10R

South Bridge

USB6/7

T-SGPIO1
T-SGPIO2

USB4/5

TPM

USB3

7

JP7

USB2

I-SATA5
I-SATA4
I-SATA3

IOH

JIBTN1

I-SATA2
I-SATA1
I-SATA0

JWF1

SAS CTRL

JWD

Rev. 2.01

LSI 2008

JL1

JPW2

LED1

JPS1

JPW3

SAS0~3

SAS4~7

FAN1

FAN7

CPU1 Fan

JF1

LE1

FAN2

JD1

JOH1

FAN3

SP1

SIO

FLOPPY

J5

JWOL

FAN4

Differences between the models

X8DT6 X8DTE X8DT6-F X8DTE-F

SAS (2008 SATA 2) Yes No Yes No

RAIDKey Optional No Optional No

IPMI 2.0 w/KVM &

IPMI LAN

No No Yes Yes

Slot 4: PCI-E 2.0 x8 No Yes No Yes

Notes

IPMI Dedicated LAN is for X8DT6-F/X8DTE-F only.1.
SAS connectors, jumpers, and the LSI 2008 SATA 2 chip are available on 2.

the X8DT6/X8DT6-F only. For SAS RAID confi guration, refer to the LSI User
Guide posted on our website @ http://www.supermicro.com/support/manuals/

IPMI 2.0 and the Dedicated LAN (w/KVM support) are available on the 3.
X8DT6-F/X8DTE-F only. For more information, please refer to the user guide
posted on our website @ http://www.supermicro.com/support/manuals/

1-3

X8DT6/X8DT6-F/X8DTE/X8DTE-F User's Manual

Motherboard Layout

FAN5

KB/MOUSE

USB 0/1

COM1

IPMI

FAN6
LAN

P1-DIMM3A
P1-DIMM3B
P1-DIMM2A
P1-DIMM2B
P1-DIMM1A

P1-DIMM1B

JPI2C1

JPW1

CPU2

JPW2

JPW3

FAN1

FAN7

CPU1 Fan

VGA

LAN
CTRL

COM2

PHY

LAN1

LAN2

FAN8/

CPU2 Fan

LAN
CTRL

BMC
CTRL

D1

Jumpers not indicated are for test purposes only. 1.

SLOT7 PCI-E 2.0 X8

SLOT6 PCI-E 2.0 X8

JPL1

SLOT5 PCI-E 2.0 X8

SLOT4 PCI-E 2.0 X8

JPL2

SLOT3 PCI-E 2.0 X4

SLOT1 PCI-E X4
JI2C2

JI2C1

Battery

CPU1

CP

JBT1

JPB

JPG1

BIOS

Intel ICH10R

South Bridge

USB6/7

T-SGPIO1
T-SGPIO2

USB4/5

JF1

LE1

SIO

SAS0~3

SAS4~7

FAN4

SP1

J5

JWOL

FAN2

JOH1

FAN3

FLOPPY

JD1

P2-DIMM1B

P2-DIMM1A

P2-DIMM2B
P2-DIMM2A
P2-DIMM3B
P2-DIMM3A

X8DT6/E Series

Intel 5520

IOH

TPM

7

USB3

JP7

USB2

I-SATA5
I-SATA4

I-SATA3

JIBTN1

I-SATA2
I-SATA1

I-SATA0

JWF1

LSI 2008

SAS CTRL

JWD

Rev. 2.01

JL1

LED1

JPS1

" " indicates the location of Pin 1. Also, refer to Chapter 2 for detailed infor-2.
mation on the onboard components.

When LE1 is on, the onboard power connection is on. Make sure to unplug 3.
the power cables before removing or installing components.

Slot 4: PCI-E 2.0 x8 is available on the 4.

X8DTE/X8DTE-F

To avoid possible system overheating, be sure to provide adequate airfl ow to 5.
the system.

Warning: To prevent damage to the power supply or motherboard, please
use a power supply that contains a 24-pin and two 8-pin power connec­tors. Be sure to connect these connectors to the 24-pin (JPW1) and the
two 8-pin (JPW2, JPW3) power connectors on the motherboard. Failure
in doing so will void the manufacturer warranty on your power supply and

motherboard.

1-4

Chapter 1: Introduction

X8DT6/E-F Quick Reference

Jumper Description Default Setting

JBT1 CMOS Clear (See Section 2-7)

2

C1/JI2C2 SMB to PCI Slots 2-3 (Disabled)

JI

JPG1 VGA Enable Pins 1-2 (Enabled)

JPL1/JPL2 LAN Ports 1/2 Enable Pins 1-2 (Enabled) (For a Rev. 1.31 or later board)

JPS1 SAS Enable Pins 1-2 (Enabled) (X8DT6/X8DT6-F)

JWD Watch Dog Pins 1-2 (Reset)

Connector Description

COM1/COM2 COM1/COM2 Serial Port/Header

FAN 1-8 System/CPU Fan Headers (Fans 7~8: CPU Fans)

Floppy Floppy Disk Drive Connector

JIBTN1 RAIDKey for RAID 5 SAS support (optional for X8DT6/X8DT6-F)

2

J5 IPMB I

C Header (for an IPMI card) (X8DTE-F/X8DT6-F)
JD1 PWR LED/Speaker Header (Pins 4~7: Speaker)
JF1 Front Panel Connector
JL1 Chassis Intrusion Header
JOH1 Overheat LED Header

2

1 Power Supply SMBbus I2C Header

JPIC
JPW1 24-pin ATX Main Power Connector (Warning on Pg. 1-4)
JPW2, JPW3 8-pin Secondary Power Connector (Warning on Pg. 1-4)
JWF1 DOM (Disks_On_Module) Power Header
JWOL Wake-On-LAN Header
LAN1/2, IPMI_LAN Gigabit Ethernet (RJ45) Ports 1/2 & IPMI_Dedicated LAN

IPMI_LAN is for X8DTE-F/ X8DT6-F only)

(
I-SATA0 ~ I-SATA5 (Intel South Bridge) SATA Ports
SAS 0~3, 4~7 SAS Ports 0~3, 4~7 (X8DT6/X8DT6-F only)
SP1 Internal Speaker/Buzzer
TPM TPM (Trusted_Platform_Module) Header
T-SGPIO-1/T-SGPIO-2 Serial General Purpose Input/Output Headers
USB 0/1, 2,3, 4/5, 6/7 Universal Serial Bus (USB) Ports
VGA VGA Con nec tor

LED Description

D1 BMC Heartbeat LED Indicator (X8DTE-F/X8DT6-F only)
LE1 Onbo ard St and by LED Ind ica tor
LED1 SAS LEDs (LED1: SAS Heartbeat LED) (X8DT6/X8DT6-F only)

Note: Jumpers JPL1/JPL2 are available for the PCB Rev. 1.31 or a later vision of
motherboard only.

1-5

X8DT6/X8DT6-F/X8DTE/X8DTE-F User's Manual

Motherboard Features

CPU

Two Intel•
two full-width Intel QuickPath Interconnect (QPI) links with a total of up to 51.2
GB/s Data Transfer Rate (6.4 GT/s per direction)

®

5500/5600 Series (LGA 1366) processors; each processor supports

Memory

Twelve 240-pin DIMM sockets support up to 192 GB of DDR3 Registered ECC •
or up to 48 GB of Unbuffered ECC/Non ECC Memory (See Section 2-4 in
Chapter 2 for DIMM Slot Population.)

Chipset

Intel 5520 chipset, including: the 5520 (IOH-36D) and the ICH10R (South •
Bridge).

Expansion Slots

Three PCI-E 2.0 x8 slots (Slots 5~7) (X8DT6/X8DT6-F)•
Four PCI-E 2.0 x8 slots (Slots 4~7) (X8DTE/X8DTE-F)•
One PCI-E 2.0 x4 slot (Slot 3) •
One PCI-E x4 slot (Slot 1) •

BIOS

4 MB AMI SPI Flash ROM•
PCI 2.2, ACPI 1.0/2.0/3.0, Plug and Play (PnP), DMI 2.3, USB Keyboard sup-•

port, and APM 1.2

PC Health Monitoring

Onboard voltage monitors for CPU1 Vcore/CPU2 Vcore, CPU1 DIMM/CPU2 •
DIMM, 1.5V, 3.3Vcc (V), 3.3V SB (V), 12Vcc (V), 5Vin, and Battery Voltage.

Fan status monitor with fi rmware control

•

CPU/chass is temper ature moni tors•
Platfo rm Enviro nment Co ntrol Inte rf ace (PECI) read y•
Ther mal Mo nitor 2 ( TM2) supp or t•
CPU fan auto - of f in sle ep mode•
CPU slow- dow n on tempe rature over heat•
Pulse Wi dth Mo dulati on (PW M) Fan Contr ol •
CPU ther mal tr ip supp or t for pro ces sor pr otecti on, power L ED•
Power-up mod e cont rol for r ecover y fr om AC power l oss•
Auto- switc hing vol tage r egulato r for CPU c ore s•
System over heat /Fan Fail LED I ndic ator and c ontr ol•
Chassis i ntrus ion detec tion•

1-6

Chapter 1: Introduction

System re sourc e aler t vi a Super o Doc tor III•

ACPI Features

Slow blinking LED for suspend state indicator•
Main switch override mechanism•
ACPI Pow er Ma nag eme nt•
Keyboard Wakeup from Soft-off •

Onboard I/O

Intel ICH10R supports six SATA2 ports (with RAID0, RAID1, RAID10, RAID5 •
supported in the Windows OS Environment and RAID0, RAID1, RAID10 in the
Linux) (Note 1)

LSI 2008 SA TA 2 supports eight SAS ports with RAID 5 optional, using RAIDKey

•

(Part# AOC-IMRRAKey-2008-LSI) (For X8DT6/X8DT6-F) (Note 2)
Dual Intel 82574 Gigabit Ethernet controllers support Giga-bit LAN1/LAN 2

•

por ts, and Rea ltek PHY
One fl oppy por t inter fac e and t wo COM po rt s (1 header, 1 port)

•

One VGA Por t supp or ted by the W PCM4 50 BM C Cont rolle r•
PS/2 mo use and PS /2 keyboa rd por ts•
Up to eigh t USB 2.0 (Uni versal S erial Bus) (2 Back panel USB Po rts, 2 Fro nt •

USB Hea ders , and 2 Type A Header s)
Super I/ O: Winbo nd W83 627HG

•

IPMI 2.0 w ith fu ll K VM supp or t (X8DT6 - F/X8 DTE-F o nly) (Note 3)•

Other

Wake-on-LAN (WOL)•
Console redirection•
Onboa rd Fan Spee d Contr ol by Ther mal Ma nagem ent via BI OS•

CD/Diskette Utilities

BIOS fl ash upgrade utility and device drivers•

Dimensions

Ext . ATX 12.00" (L) x 13.00 " (W ) (304. 80 mm x 3 30. 20 mm)•

Note 1: For details on Intel SATA HostRAID confi guration, please refer to
the user guide posted @http://www.supermicro.com/support/manuals/.

Note 2: For details on LSI SAS RAID confi guration, please refer to the
User's Guide @http://www.supermicro.com/support/manuals/.

Note 3: For details on IPMI confi guration, please refer to the Embedded
IPMI User's Guide posted on our web site @http://www.supermicro.com/
support/manuals/.

1-7

X8DT6/X8DT6-F/X8DTE/X8DTE-F User's Manual

Ports
#0~3
Ports
#4~7

PHY#1

PHY#1

#1-3

#1-2

#1-1

DDR3

800/1066/1333

Slot 4

PCI-E X8

LSI 2008

SAS2

Optional

LAN#1

LAN#2

Optional

#1-4

#1-6

#1-5

Slot 5

PCI-E X8

Slot 7

PCI-E X8

Slot 1

PCI-E X8

PCI-E X8

Slot 6

PCI-E X8

PCI-E X8

Optional

PCI-E X4

PCI-E X1

PCI-E X1

Processor #2

QPI

PCI-E X8

PCI-E X8

LANE1/2/3/4

LANE5

LANE6

Ports

#7-8

Ports
#5-6

Ports

#3-4

Ports

#9-10

Processor #1

QPI

Intel 5520

IOH-36D

Ports

#1-2

Port

#0

ESI

DMI

Intel

ICH10R

QPI

PCI-E X4

PCIE X4

3.0 Gb/S

#0-2

#0-1

DDR3

PCI-E X8

Slot 3

#2

#1

#0

SATA

#0-6

#0-5

#0-4

#0-3

800/1066/1333

#5

#4

#3

SIO

HG

USB 2.0

COM2
internal

USB

USB #0~#9

BMC
WPCM450

VGA

PCI 33MHz

SPI

MS

KB

W83627

COM1
External

Block Diagram of the 5520 Platform

Note 1: This is a general block diagram. Please see the previous Mother-

board Features pages for details on the features of each motherboard.
Note 2: Slot 4: PCI-E 2.0 x8 is available on the X8DTE/X8DTE-F only.

1-8

Chapter 1: Introduction

1-2 Chipset Overview

Built upo n the cap abilit y of the Inte l 5520 plat for m, the X8 DT6/X8 DT6 -F/X8 DTE/
X8DTE-F motherboard provides the performance and feature set required for
dual-processor-based high-end servers optimized for High Performance Comput­ing (HPC), Cluste ring, and intens ive applicat ions. The 552 0 platfor m consists o f
the 55 0 0 /5 6 00 Serie s (LGA 136 6) pro c es so r, the 552 0 (IO H ub), and the I C H10R
(South Bridge). With the QuickPath Interconnect (QPI) controller built in, the
5500/560 0 Series Processor is the fi rst DP platform that offers the next genera-
tion point-to-point system interconnect interface that replaces the current Front
Side Bus Technology, substantially enhancing system performance with increased
bandwidth and scalability.

The 552 0 I O H u b connects to e ach proces s o r t h r ou g h a n in d e p e n de nt QuickPath
Interconnect link. Each link consists of 20 pairs of unidirectional dif ferential lanes
for data transferring in addition to a differential forwarded clock. A full-width
QuickPath interconnect link pair provides 84 signals. Each processor supports two
Quick Path links, o ne goin g to the othe r proc esso r and the ot her to th e 5520.

The 5520 plat form supports up to 36 PCI Express Gen2 lanes, peer-to-peer read
and write transactions. The ICH 1 0R provides up to 6 PCI-Express ports, six SATA
por ts and e ight US B conn ecti ons.

In additi on, the 5 520 plat for m also of fers a w ide ran ge of R AS (Relia bilit y, Avail­ability and Serviceability) features. These features include memory interface ECC,
x4/x8 S ingle Devic e Data C orrec tion (SDD C), Cyclic Redund ancy Chec k (CRC),
parit y pr otect ion, o ut- of- ban d regi ster ac ce ss vi a SM Bus, m emor y m ir ror ing, an d
Hot-p lug supp or t on the P CI- Ex pres s Inter fac e.

Main Features of the 5500/5600 Series Processor and the
5520 Chipset

Four processor cores in each processor with 8MB shared cache among cores•

Two full-width Intel QuickPath interconnect links, up to 6.4 GT/s of data transfer •
rate in each direction

Virtualization Technology, Integrated Management Engine supported

•

Point-to-point cache coherent interconnect, Fast/narrow unidirectional links, and •
Concurrent bi-directional traffi c

Error detection via CRC and Error correction via Link level retry

•

1-9

X8DT6/X8DT6-F/X8DTE/X8DTE-F User's Manual

1-3 Special Features

Recovery from AC Power Loss

BIOS provides a setting for you to determine how the system will respond when
AC power is lost and then restored to the system. You can choose for the system
to remain powered off (in which case you must hit the power switch to turn it back
on) or for it to automatically return to a power- on state. See the Advanced BIOS
Setup section to change this setting. The default setting is Last State.

1-4 PC Health Monitoring

This section describes the PC health monitoring features of the X8DT6/X8DT6-F/
X8DTE/X8DTE-F. The motherboard has an onboard System Hardware Monitor
chip that supports PC health monitoring. An onboard voltage monitor will scan
these onboard voltages continuously: CPU1 Vcore/CPU2 Vcore, CPU1 DIMM/
CPU2 DIMM, 1.5V, 3.3Vcc (V), 3.3V SB (V), 12Vcc (V), 5Vin, and Battery Voltage.
Once a voltage becomes unstable, a warning is given or an error message is sent
to the screen. Users can adjust the voltage thresholds to defi ne the sensitivity of
the voltage monitor.

Fan Status Monitor with Firmware Control via SD II or III

The PC health monitor can check the RPM status of the cooling fans. The onboard
CPU and chassis fans are controlled by Thermal Management via BIOS (under
Hardware Monitoring in the Advanced Setting).

Environmental Temperature Control

The thermal control sensor monitors the CPU temperature in real time, and will turn
on the thermal control fan whenever the CPU temperature exceeds a user-defi ned
threshold. The overheat circuitry runs independently from the CPU. Once it detects
that the CPU temperature is too high, it will automatically turn on the thermal fan
control to avoid overheating to the CPU. The onboard chassis thermal circuitry
can monitor the overall system temperature and alert users when the chassis
temperature is too high.

To avoid possible system overheating, please be sure to provide adequate
airfl ow to your system.

System Resource Alert

This feature is available when used with Sup ero Doctor III in the Windows OS

1-10

Chapter 1: Introduction

environment or used with Supero Doctor II in Linux. Supero Doctor is used to
notif y the user of c ert ain system events. You can als o confi gure Supero Doctor
to provid e you with war nings when t he system/C PU temperat ures, volt ages and
fan spee ds go beyon d a pre -de fi ned range.

1-5 ACPI Features

ACPI stands for Advanced Confi guration and Power Interface. The ACPI specifi ca-
tion defi nes a fl exible and abstract hardware interface that provides a standard
way to integrate power management features throughout a PC system, including
its hardware, operating system and application software. This enables the system
to automatically turn on and off peripherals such as CD-ROMs, network cards, hard
disk drives and printers.

In addition to enabling operating system-directed power management, ACPI
provides a generic system event mechanism for Plug and Play and an operating
system-independent interface for confi guration control. ACPI leverages the Plug
and Play BIOS data structures while providing a processor architecture-independent
implementation that is compatible with the Windows XP/2003/2008/Vista Operating
System.

Slow Blinking LED for Suspend-State Indicator

When the CPU goes into a suspend state, the chassis power LED will start blinking
to indicate that the CPU is in suspend mode. When the user presses any key, the
CPU will wake-up and the LED will automatically stop blinking and remain on.

Main Switch Override Mechanism

When an ATX power supply is used, the power button can function as a system
suspend button to make the system enter a SoftOff state. The monitor will be
suspended and the hard drive will spin down. Pressing the power button again
will cause the whole system to wake-up. During the SoftOff state, the ATX power
supply provides power to keep the required circuitry in the system "alive." In case
the system malfunctions and you want to turn off the power, just press and hold
the power button for 4 seconds. This option can be set in the Power section of the
BIOS Setup routine.

Wake-On-LAN (WOL)

Wake-On-LAN is defi ned as the ability of a management application to remotely
power up a computer that is powered off. Remote PC setup, up-dates and asset
tracking can occur after hours and on weekends so that daily LAN traffi c is kept
to a minimum and users are not interrupted. The motherboard has a 3-pin header

1-11

X8DT6/X8DT6-F/X8DTE/X8DTE-F User's Manual

(WOL) to connect to the 3-pin header on a Network Interface Card (NIC) that has
WOL capability. In addition, an onboard LAN controller can also support WOL
without any connection to the WOL header. The 3-pin WOL header is to be used
with a LAN add-on card only.

Note: Wake-On-LAN requires an ATX 2.01 (or above) compliant power
supply.

1-6 Power Supply

As with all computer products, a stable power source is necessary for proper and
reliable operation. It is even more important for processors that have high CPU
clock rates.

The X8DT6/X8DT6-F/X8DTE/X8DTE-F can accommodate 24-pin ATX power sup­plies. Although most power supplies generally meet the specifi cations required by
the CPU, some are inadequate. In addition, the two 12V 8-pin power connections
are also required to ensure adequate power supply to the system. Also your power
supply must supply 1.5A for the Ethernet ports.

Warning: To prevent damage to the power supply or the motherboard,
please use a power supply that contains a 24-pin and two 8-pin power
connectors. Be sure to connect these connectors to the 24-pin (JPW1)
and the two 8-pin (JPW2,JPW3) power connectors on the motherboard
for adequate power supply to your system. Failure in doing so will void the
manufacturer warranty on your power supply and the motherboard.

It is strongly recommended that you use a high quality power supply that meets ATX
power supply Specifi cation 2.02 or above. It must also be SSI compliant (For more
information, please refer to the web site at http://www.ssiforum.org/). Additionally, in
areas where noisy power transmission is present, you may choose to install a line
fi lter to shield the computer from noise. It is recommended that you also install a
power surge protector to help avoid problems caused by power surges.

1-7 Super I/O

The disk drive adapter functions of the Super I/O chip include a fl oppy disk drive
controller that is compatible with industry standard 82077/765, a data separator,
write pre-compensation circuitry, decode logic, data rate selection, a clock genera­tor, drive interface control logic and interrupt and DMA logic. The wide range of
functions integrated onto the Super I/O greatly reduces the number of components
required for interfacing with fl oppy disk drives. The Super I/O supports 360 K, 720
K, 1.2 M, 1.44 M or 2.88 M disk drives and data transfer rates of 250 Kb/s, 500 Kb/s
or 1 Mb/s. It also provides two high-speed, 16550 compatible serial communication
ports (UARTs). Each UART includes a 16-byte send/receive FIFO, a programmable

1-12

Chapter 1: Introduction

baud rate generator, complete modem control capability and a processor interrupt
system. Both UARTs provide legacy speed with baud rate of up to 115.2 Kbps
as well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which
support higher speed modems.

The Super I/O provides functions that comply with ACPI (Advanced Confi guration
and Power Interface), which includes support of legacy and ACPI power manage­ment through an SMI or SCI function pin. It also features auto power management
to reduce power consumption.

1-8 Overview of the Winbond WPCM450 Controller (For
X8DT6-F/X8DTE-F Only)

The Winbond WPCM450 Controller is a Baseboard Management Controller (BMC)
that supports the 2D/VGA-compatible Graphics Core with the PCI interface,
Virtual Media, and Keyboard/Video/Mouse Redirection (KVMR) modules. With
blade-oriented Super I/O capability built in, the WPCM450 Controller is ideal for
legacy-reduced server platforms.

The WPCM450 interfaces with the host system via a PCI interface to communicate
with the Graphics core. It supports USB 2.0 and 1.1 for remote keyboard/mouse/
virtual media emulation. It also provides LPC interface to control Super IO functions.
The WPCM450 is connected to the network via an external Ethernet Phy module.

The WPCM450 communicates with onboard components via six SMBus interfaces,
fan control, and Platform Environment Control Interface (PECI) buses.

1-13

X8DT6/X8DT6-F/X8DTE/X8DTE-F User's Manual

Notes

1-14

Chapter 2: Installation

Chapter 2

Installation

2-1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic com ponents. T o prevent dam­age to your system board, it is important to handle it very carefully. The following
measures are generally suffi cient to protect your equipment from ESD.

Precautions

Use a grounded wrist strap designed to prevent static discharge.•

Touch a grounded metal object before removing the board from the antistatic •
bag.

Handle the board by its edges only; do not touch its components, peripheral

•

chips, memory modules or gold contacts.

When handling chips or modules, avoid touching their pins.

•

Put the motherboard and peripherals back into their antistatic bags when not •
in use.

For grounding purposes, make sure your computer chassis provides excellent

•

conductivity between the power supply, the case, the mounting fasteners and
the motherboard.

Use only the correct type of onboard CMOS battery as specifi ed by the

•

manufacturer. Do not install the onboard battery upside down to avoid possible
explosion.

Unpacking

The motherboard is ship ped in antistatic p ackaging to avoid static damage. When
unpacking the board, make sure the person handling it is static protected.

2-1

X8DT6/X8DT6-F/X8DTE/X8DTE-F User's Manual

2-2 Motherboard Installation

All motherboards have standard mounting holes to fi t different types of chassis.
Make sure that the locations of all the mounting holes for both motherboard and
chassis match. Although a chassis may have both plastic and metal mounting
fasteners, metal ones are highly recommended because they ground the mother­board to the chassis. Make sure that the metal standoffs click in or are screwed in
tightly. Then use a screwdriver to secure the motherboard onto the motherboard
tray. Note: Some components are very close to the mounting holes. Please take
precautionary measures to prevent damage to these components when installing
the motherboard to the chassis.

Tools Needed

1. Phillips Screwdriver

Locations of Mounting Holes

2. Pan head #6 screws

Installation Instructions

Install the IO shield into the chassis. 1.

Locate the mounting holes on the motherboard. Refer to the layout above for 2.
mounting hole locations.

Locate the matching mounting holes on the chassis. Align the mounting holes 3.
on the motherboard against the mounting holes on the chassis.

Install standoffs in the chassis as needed.4.

Install the motherboard into the chassis carefully to avoid damage to mother-5.
board components.

Warning: To avoid damaging the motherboard and its components, please
do not apply any force greater than 8 lb/sq.in (8 lbs. per square inch) when
installing a screw into a mounting hole.

X8DT6/E Series Rev. 2.01

Insert a Pan head #6 screw into a mounting hole on the motherboard and its 6.
matching mounting hole on the chassis, using a Phillips screwdriver.

Repeat Step 4 to insert #6 screws to all mounting holes.7.

Make sure that the motherboard is securely placed on the chassis.8.

2-2

2-3 Processor and Heatsink Installation

!

When handling the processor package, avoid placing direct pressure on
the label area of the fan.

Notes:

Always connect the power cord last and always remove it before adding, re-1.
moving or changing any hardware components. Make sure that you install the
processor into the CPU socket before you install the CPU heatsink.

Make sure to install the motherboard into the chassis before you install the 2.
CPU heatsink and heatsink fans.

When purchasing a motherboard without a 5500/5600 Series processor pre-3.
installed, make sure that the CPU socket plastic cap is in place, and none of
the CPU socket pins are bent; otherwise, contact the retailer immediately.

Chapter 2: Installation

Refer to the M B Features S ecti on for mo re deta ils on CPU s uppor t.4.

Installing an LGA 1366 Processor

Press the socket clip to release 1.
the load plate, which covers the
CPU socket, from its locking
position.

Gently lift the socket clip to 2.
open the load plate.

Hold the plastic cap at its north 3.
and south center edges to re­move it from the CPU socket.

Socket Clip

Plastic Cap

Load Plate

Hold the north & south edges of
the plastic cap to remove it

2-3

X8DT6/X8DT6-F/X8DTE/X8DTE-F User's Manual

After removing the plastic cap, 1.
using your thumb and the index
fi nger, hold the CPU at the
north and south center edges.

Align the CPU key, the semi-2.
circle cutout, against the socket
key, the notch below the gold
color dot on the side of the
socket.

Once both the CPU and the 3.
socket are aligned, carefully
lower the CPU straight down
into the socket. (Do not rub the
CPU against the surface of the
socket or its pins to avoid dam­aging the CPU or the socket.)

CPU CPU SocketLoad Plate

Socket Keys

With the CPU inside the socket, 4.
inspect the four corners of the
CPU to make sure that the CPU
is properly installed.

Once the CPU is securely 5.
seated on the socket, lower the
CPU load plate to the socket.

Use your thumb to gently push 6.
the socket clip down to the clip
lock.

Warning: Please save the
plastic cap. The mother­board must be shipped
with the plastic cap prop­erly ins tal led to p rotec t the
CPU socket pins. Ship­ment without the plastic
cap properly installed will
cause damage to the sock­et pins.

CPU Keys

2-4

Installing a CPU Heatsink

Do not apply any thermal 1.
grease to the heatsink or the
CPU die because the required
amount has already been ap­plied.

Chapter 2: Installation

Place the heatsink on top of the 2.
CPU so that the four mounting
holes are aligned with those on
the retention mechanism.

Install two diagonal screws (ie 3.
the #1 and t he #2 s crews) and
tighten them until just snug
(-do not f ully tig hten the sc rews
to avoid possible damage to
the CPU.)

Screw#1

Screw#1

Install Screw#1

Screw#2

Screw#2

Finish the installation by fully 4.
tightening all four screws.

2-5

X8DT6/X8DT6-F/X8DTE/X8DTE-F User's Manual

Removing the Heatsink

Warni ng: We do not recommend that the CPU or the heatsink be re­moved. However, if you do need to remove the heatsink, please follow
the inst ructions be low to uninstall th e heatsink and prevent da mage to
the CPU or ot her co mpone nts.

Unplug the power cord from the 1.
power supply.

Disconnect the heatsink fan 2.
wires from the CPU fan header.

Using a screwdriver, loosen and 3.
remove the heatsink screws
from the motherboard in the se­quence as show in the picture
on the right.

Using a screwdriver to
remove Screw#1

Hold the heatsink as shown 4.
in the picture on the right and
gently wriggle the heatsink to
loosen it from the CPU. (Do not
use excessive force when wrig­gling the heatsink.)

Once the CPU is loosened, 5.
remove the heatsink from the
CPU socket.

To reinstall the CPU and the 6.
heatsink, clean the surface of
the CPU and the heatsink to get
rid of the old thermal grease.
Reapply the proper amount of
thermal grease on the surface
before reinstalling them on the
motherboard.

Remove Screw#2

2-6

Chapter 2: Installation

2-4 Memory Installation

Note: Check the S uper micro we b site for r ecom mende d memor y mo dules .

CAUTION

Exercise extreme care when installing or removing DIMM

module s to prevent any po ssib le damag e. Also n ote that th e

memor y is i nterl eaved to imp rove per fo rman ce (See ste p 1).

DIMM Installation

Insert the desired number of DIMMs into the memory slots, starting with 1.
DIMM #P1-DIMM1A. When populating two DIMM modules within a channel,
always start with Bank1 fi rst. For optimal memory performance, please install
a pair (or pairs) of memory modules of the same type and same speed at a
time with the maximum of 12 modules.

Insert each DIMM module vertically into its slot. Pay attention to the notch 2.
along the bottom of the module to prevent inserting the DIMM module incor­rectly.

Gently press down on the DIMM module until it snaps into place in the slot. 3.
Repeat for all modules.

DIMM DDR3

Note: Notch

should align

with the

receptive point

on the slot

3

To Remove:

Use your thumbs
to gently push
the release tabs
near both ends of
the module. This
should release it
from the slot.

X8DT6/E Series

Release Tab

Notch

Release

Tab

Rev. 2.01

To In s ta l l : Ins er t mod ule ver t ica lly an d pres s dow n until i t
snaps in to plac e. Pay at tent ion to t he ali gnme nt notc h at
the bottom.

Notch

Release

Tab

Release Tab

2-7

X8DT6/X8DT6-F/X8DTE/X8DTE-F User's Manual

Memory Support

The X8DT6/X8DT6-F/X8DTE/X8DTE-F supports up to 192 GB of Registered ECC
or up to 48 GB of Unbuffered ECC/Non ECC DDR3 1333 MHz/1066 MHz/800 MHz
in 12 DIMMs. Please note that Memory Speed support is also depending on the
type of CPU used in the motherboard.

DIMM Module Population Confi guration

For memor y to wor k pro perl y, follow the tab les be low for me mor y inst allati on.

Memory Population for Optimal Performance

-For a motherboard with One CPU (CPU1) installed

Branch 0 Branch 1 Branch 2

3 DIMMs P1 DIMM1A P1 DIMM2A P1 DIMM3A
6 DIMMs P1 DIMM1A P1 DIMM1B P1 DIMM2A P1 DIMM2B P1 DIMM3A P1 DIMM3B

Memory Population for Optimal Performance

-For a motherboard with One CPU (CPU2) installed

Branch 0 Branch 1 Branch 2

3 DIMMs P2 DIMM1A P2 DIMM2A P2 DIMM3A
6 DIMMs P2 DIMM1A P2 DIMM1B P2 DIMM2A P2 DIMM2B P2 DIMM3A P2 DIMM3B

Memory Population for Optimal Performance

-For a motherboard with Two CPUs installed

CPU1 CPU2

Branch 0 Branch 1 Branch 3 Branch 0 Branch 1 Branch 3

6 DIMMs 1A 2A 3A 1A 2A 3A
12

DIMMs

DIMM
Slots per
Channel

2 1 Reg. DDR3 ECC 800,1066,1333 SR or DR
2 1 Reg. DDR3 ECC 800,1066 QR
2 2 Reg. DDR3 ECC 800,1066 Mixing SR, DR
2 2 Reg. DDR3 ECC 800 Mixing SR, DR,QR

1A 1B 2A 2B 3A 3B 1A 1B 2A 2B 3A 3B

DIMM Population Table

DIMMs
Populated
per Channel

DIMM Type (Reg.=
Registered)

Speeds (in MHz) Ranks per DIMM

(any combination;
SR=Single Rank,
DR=Dual Rank,
QR=Quad Rank)

2-8