Supermicro X8DT3, X8DTi, X8DT3-F, X8DTi-F, X8DT3-LN4F USER MANUAL

X8DT3
X8DTi

X8DT3-F

X8DTi-F

X8DT3-LN4F

X8DTi-LN4F

USER’S MANUAL

Revision 1.2c

The information in this User’s Manual has been carefully reviewed and is believed to be accurate.
The vendor assumes no responsibility for any inaccuracies that may be contained in this document,
makes no commitment to update or to keep current the information in this manual, or to notify any
person or organization of the updates. Please Note: For the most up-to-date version of this

manual, please see our website at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product
described in this manual at any time and without notice. This product, including software and docu­mentation, is the property of Supermicro and/or its licensors, and is supplied only under a license.
Any use or reproduction of this product is not allowed, except as expressly permitted by the terms
of said license.

IN NO EVENT WILL SUPER MICRO COMPUTER, INC. BE LIABLE FOR DIRECT, INDIRECT,
SPECIAL, INCIDENTAL, SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE
USE OR INABILITY TO USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF
THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER MICRO COMPUTER, INC.
SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED OR USED
WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa
Clara County in the State of California, USA. The State of California, County of Santa Clara shall be
the exclusive venue for the resolution of any such disputes. Supermicro's total liability for all claims
will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class
A digital device pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the manufacturer’s instruction manual, may cause harmful
interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your
own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate
warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate
Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate”.

WARNING: Handling of lead solder materials used in this
product may expose you to lead, a chemical known to
the State of California to cause birth defects and other
reproductive harm.

Manual Revision 1.2c

Release Date: March 9, 2012

Unless you request and receive written permission from Super Micro Computer, Inc., you may not
copy any part of this document.

Information in this document is subject to change without notice. Other products and companies
referred to herein are trademarks or registered trademarks of their respective companies or mark
holders.

Copyright © 2012 by Super Micro Computer, Inc.
All rights reserved.

Printed in the United States of America

Preface

About this Manual

This manual is written for system integrators, PC technicians and knowledgeable

PC users. It provides information for the installation and use of the X8DT3/

X8DTi/X8DT3-F/X8DTi-F/X8DT3-LN4F/X8DTi-LN4F motherboard.

About this Motherboard

The X8DT3/X8DTi/X8DT3-F/X8DTi-F/X8DT3-LN4F/X8DTi-LN4F supports

the Intel® 5500/5600* Series Processor platform, the rst dual-processing platform

that supports the Intel QuickPath Interconnect (QPI) Technology, providing the next

generation point-to-point system interface to replace the current Front Side Bus.

With the 5500/5600* Series Processor platform built in, the X8DT3/X8DTi/X8DT3-

F/X8DTi-F/X8DT3-LN4F/X8DTi-LN4F offers substantial enhancement in system

performance with increased bandwidth and unprecedented scalability optimized

for high-end servers, High Performance Computing (HPC) systems and intensive

applications. Please refer to our web site (http://www.supermicro.com/products/)

for updates on supported processors. This product is intended to be installed and

serviced by professional technicians. (*The 5600 Series processors are supported

by a Rev. 2.00 or later version motherboard.)

Preface

Manual Organization

Chapter 1 describes the features, specications and performance of the mother-

board and provides detailed information about the chipset.

Chapter 2 provides hardware installation instructions. Read this chapter when in-

stalling the processor, memory modules and other hardware components into the

system. If you encounter any problems, see Chapter 3, which describes trouble-

shooting procedures for video, memory and system setup stored in the CMOS.

Chapter 4 includes an introduction to the BIOS and provides detailed information

on running the CMOS Setup utility.

Appendix A lists BIOS POST Error Codes. Appendix B provides Software Instal-

lation Instructions.

iii

X8DT3/X8DTi/X8DT3-F/X8DTi-F/X8DT3-LN4F/X8DTi-LN4F User's Manual

Conventions Used in the Manual

Special attention should be given to the following symbols for proper installation and

to prevent damage done to the components or injury to yourself:

Danger/Caution: Instructions to be strictly followed to prevent catastrophic

system failure or to avoid bodily injury.

Warning: Important information given to ensure proper system installation

or to prevent damage to the components.

Note: Additional Information given to differentiate various models or to

ensure correct system setup.

iv

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.

San Jose, CA 95131 U.S.A.

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

Web Site: www.supermicro.com

Europe

Address: Super Micro Computer B.V.

Het Sterrenbeeld 28, 5215 ML

's-Hertogenbosch, The Netherlands

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

[e-mail] (Customer Support)

Contacting Supermicro

Asia-Pacic

Address: Super Micro Computer, Inc.

4F, No. 232-1, Liancheng Rd.

Chung-Ho 235, Taipei County

Taiwan, R.O.C.

Tel: [phone]

Fax: [phone]

Web Site: www.supermicro.com.tw

Email: [e-mail] (Technical Support)

Tel: [phone] (Technical Support)

v

X8DT3/X8DTi/X8DT3-F/X8DTi-F/X8DT3-LN4F/X8DTi-LN4F User's Manual

Table of Contents

Preface

Chapter 1 Introduction

1-1 Overview ......................................................................................................... 1-1

1-3 Chipset Overview ............................................................................................ 1-9

1-4 Special Features ........................................................................................... 1-10

1-5 PC Health Monitoring .................................................................................... 1-10

1-6 ACPI Features ................................................................................................1-11

1-7 Power Supply ................................................................................................ 1-12

1-8 Super I/O ....................................................................................................... 1-12

1-9 Overview of the Winbond WPCM450 Controller (For X8DT3/i-F/X8DT3/i-LN4F

Only) ...................................................................................................................... 1-13

Chapter 2 Installation

2-1 Static-Sensitive Devices .................................................................................. 2-1

2-2 Motherboard Installation .................................................................................. 2-2

2-3 Processor and Heatsink Installation................................................................ 2-3

Installing a CPU Heatsink ............................................................................... 2-5

2-4 Memory Installation ........................................................................................ 2-7

2-5 Control Panel Connectors/IO Ports............................................................... 2-12

1. Back Panel Connectors/IO Ports .............................................................. 2-12

ATX PS/2 Keyboard and PS/2 Mouse Ports ............................................ 2-13

Universal Serial Bus (USB) ...................................................................... 2-14

Serial Ports ............................................................................................... 2-15

Video Connector ....................................................................................... 2-15

Ethernet Ports .......................................................................................... 2-16

2. Front Control Panel ................................................................................... 2-17

3. Front Control Panel Pin Denitions .......................................................... 2-18

NMI Button ............................................................................................... 2-18

Power LED .............................................................................................. 2-18

HDD LED .................................................................................................. 2-19

NIC1/NIC2 LED Indicators ....................................................................... 2-19

Overheat (OH)/Fan Fail LED.................................................................... 2-20

Power Fail LED ........................................................................................ 2-20

Reset Button ........................................................................................... 2-21

Power Button ........................................................................................... 2-21

2-6 Connecting Cables ........................................................................................ 2-22

Power Connectors ................................................................................... 2-22

Fan Headers ............................................................................................. 2-23

vi

Table of Contents

Chassis Intrusion ..................................................................................... 2-23

Internal Speaker ....................................................................................... 2-24

Power LED/Speaker ................................................................................. 2-24

Wake-On-LAN .......................................................................................... 2-25

Overheat LED/Fan Fail (JOH1) ................................................................ 2-25

T-SGPIO Headers .................................................................................... 2-26

I-Button (Optional for X8DT3/-F/LN4F only) ............................................ 2-26

Power SMB (I2C) Connector .................................................................... 2-27

IPMB I2C SMB .......................................................................................... 2-27

TPM Header ............................................................................................. 2-28

DOM Power Connector ............................................................................ 2-28

2-7 Jumper Settings ............................................................................................ 2-29

Explanation of Jumpers ................................................................................ 2-29

GLAN Enable/Disable .............................................................................. 2-29

CMOS Clear ............................................................................................. 2-30

Watch Dog Enable/Disable ...................................................................... 2-30

I2C Bus to PCI-Exp. Slots ........................................................................ 2-31

VGA Enable .............................................................................................. 2-31

SAS Enable/Disable (X8DT3/X8DT3-F/X8DT3-LN4F only) ..................... 2-32

SAS RAID Select (X8DT3/X8DT3-F/ X8DT3-LN4F only) ........................ 2-32

BMC Enable ............................................................................................. 2-33

2-8 Onboard LED Indicators ............................................................................... 2-34

GLAN LEDs .............................................................................................. 2-34

IPMI Dedicated LAN LEDs (X8DT3/i-F/-LN4F Only) ............................... 2-34

SAS Heartbeat/Activity LED Indicators .................................................... 2-35

BMC Heartbeat LED ................................................................................ 2-35

Onboard Power LED ............................................................................... 2-36

2-9 Floppy Drive, Serial ATA and SAS Connections ........................................... 2-37

Floppy Connector ..................................................................................... 2-37

Serial ATA Ports........................................................................................ 2-38

SAS Ports (X8DT3/X8DT3-F/X8DT3-LN4F only) ..................................... 2-38

Chapter 3 Troubleshooting

3-1 Troubleshooting Procedures ........................................................................... 3-1

Before Power On ............................................................................................ 3-1

No Power ........................................................................................................ 3-1

No Video ......................................................................................................... 3-1

Losing the System’s Setup Conguration ....................................................... 3-2

Memory Errors ............................................................................................... 3-2

3-2 Technical Support Procedures ........................................................................ 3-2

vii

X8DT3/X8DTi/X8DT3-F/X8DTi-F/X8DT3-LN4F/X8DTi-LN4F User's Manual

3-3 Frequently Asked Questions ........................................................................... 3-3

3-4 Returning Merchandise for Service................................................................. 3-4

Chapter 4 BIOS

4-1 Introduction ...................................................................................................... 4-1

Starting BIOS Setup Utility .............................................................................. 4-1

How To Change the Conguration Data ......................................................... 4-2

Starting the Setup Utility ................................................................................. 4-2

4-2 Main Setup ...................................................................................................... 4-2

4-3 Advanced Setup Congurations...................................................................... 4-4

4-4 Security Settings ........................................................................................... 4-24

4-5 Boot Conguration ........................................................................................ 4-26

4-6 Exit Options ................................................................................................... 4-27

Appendix A BIOS Error Beep Codes

A-1 BIOS Error Beep Codes .................................................................................A-1

Appendix B Software Installation Instructions

B-1 Installing Software Programs ..........................................................................B-1

B-2 Conguring Supero Doctor III .........................................................................B-2

viii

Chapter 1: Introduction

Chapter 1

Introduction

1-1 Overview

Checklist

Congratulations on purchasing your computer motherboard from an acknowledged

leader in the industry. Supermicro boards are designed with the utmost attention

to detail to provide the highest standards in quality and performance. Check that

the following items have all been included with your motherboard. If anything listed

here is damaged or missing, contact your retailer.

The following items are included in the retail box.

• One (1) Supermicro Mainboard

• One (1) oppy ribbon cable (CBL-0022L)

• One (1) USB cable (CBL-0083L)

• One (1) Serial/COM cable (CBL-010L)

• Four (4) Serial ATA cables (CBL-0044L) (For X8DT3/X8DT3-F/X8DT3-LN4F)

• Six (6) Serial ATA cables (CBL-0044L) (For X8DTi/X8DTi-F/X8DTi-LN4F)

• Two (2) SAS cable for SATA/SAS Backplane (CBL-0097L-02) (For X8DT3/

X8DT3-F/X8DT3-LN4F)

• One (1) I/O backpanel shield (MCP-260-00027-0N)

• One (1) Supermicro CD containing drivers and utilities

• One (1) User's/BIOS Manual

1-1

X8DT3/X8DTi/X8DT3-F/X8DTi-F/X8DT3-LN4F/X8DTi-LN4F User's Manual

X8DT3/X8DTi/X8DT3-F/X8DTi-F/X8DT3-LN4F/X8DTi-LN4F Image

Note: The drawings and pictures shown in this manual were based on the

latest PCB Revision available at the time of publishing of the manual. The

motherboard you’ve received may or may not look exactly the same as

the graphics shown in the manual.

1-2

Chapter 1: Introduction

I-SATA2

X8DT3/X8DTi/X8DT3-F/X8DTi-F/X8DT3-LN4F/X8DTi-LN4F Layout

KB/MOUSE

USB 0/1

COM1

VGA

Fan8/
CPU1 FAN

LAN1

LAN3

LAN2
LAN4

LAN

CTRL

Rev. 2.01

LAN

CTRL

(X8DT3/i-LN4F)

X8DT3/i Series

Battery

COM2

JPL1
JPL2

Fan6

Fan5

Dedicated LAN

(X8DT3/i-F/-LN4F only)

JLAN1

JLAN2

JI2C1

JI2C2

JPW2

P1-DIMM3A

P1-DIMM3B

P1-DIMM2A

P1-DIMM2B

P1-DIMM1A

P1-DIMM1B

Slot6 PCI-E 2.0x8

Slot5 PCI-E 2.0x8 in x16

Slot4 PCI-E 2.0 x16

Slot3

PCI 33 MHz

Slot2 PCI-E x4

Slot1 PCI 33MHz

JP3

CPU1

SPEC

BMC/VGA

CTRL

J28
J27

JPW3

BIOS

JBT1

D1

JPB

USB4/5

USB6/7

JPG1

JUSB3

JUSB2

ICH10R

South Bridge

USB3

USB2

J6

CPU2

P2-DIMM1B

P2-DIMM1A

P2-DIMM2B

P2-DIMM2A

P2-DIMM3B

P2-DIMM3A

Intel 5520

North Bridge

TPM Header

LES2

LES1

LSI

I-BUTTON

JP7

I-SATA1

I-SATA0

1068E

(*X8DT3 Models only)

JWF1

JL1

JWD

T-SGPIO2

I-SATA5

I-SATA4

T-SGPIO1

I-SATA3

Differences between the models

SATA (ICH10R) Yes Yes Yes Yes Ye s Yes

SAS (1068E) Yes No Yes No Ye s No

I-Button Optional No Optional No Optional No

IPMI 2.0 w/KVM No No Yes Yes Yes Yes

LAN3/LAN4 &

JPL2 (Jumper)

X8DT3 X8DTi X8DT3-F X8DTi-F X8DT3-LN4F X8DTi-LN4F

No No No No Yes Yes

Notes

JPW1

SP1

LE1

SI/O

J5

SAS4~7

JSM2

(*X8DT3 Models only)

SAS0~3

JSM1

JWOL

JPS2

JPS1

Fan4

Fan1

Fan7/
CPU2

JF1

Floppy

JOH1

Fan2

Fan3

JD1

1

1

1

1. LAN Port 3, LAN Port 4, and LAN Controller#2 are for the X8DT3/i-LN4F

only. IPMI Dedicated LAN is for X8DT3/i-F, X8DT3/i-LN4F only.

2. SAS connectors, jumpers, and the LSI 1068E chip are available on the

X8DT3/-F/-LN4F only. For SAS RAID conguration, refer to the LSI User

Guide posted on our website @ http://www.supermicro.com/support/manuals/

3. IPMI 2.0 and the Dedicated LAN (w/KVM support) are available on the

X8DT3/i-F/-LN4F only. For more information, please refer to the user guide

posted on our website @ http://www.supermicro.com/support/manuals/

1-3

X8DT3/X8DTi/X8DT3-F/X8DTi-F/X8DT3-LN4F/X8DTi-LN4F User's Manual

Motherboard Layout

KB/MOUSE

USB 0/1

COM1

VGA

Fan8/
CPU1 FAN

LAN1
LAN3

LAN2
LAN4

LAN

CTRL

Rev. 2.01

LAN

CTRL

(X8DT3/i-LN4F)

X8DT3/i Series

Battery

COM2

JPL1
JPL2

Fan6

Fan5

Dedicated LAN

(X8DT3/i-F/-LN4F only)

JLAN1

JLAN2

JI2C1

JI2C2

JPW2

P1-DIMM3A

P1-DIMM3B

P1-DIMM2A

P1-DIMM2B

P1-DIMM1A

P1-DIMM1B

Slot6 PCI-E 2.0x8

Slot5 PCI-E 2.0x8 in x16

Slot4 PCI-E 2.0 x16

Slot3

PCI 33 MHz

Slot2 PCI-E x4

Slot1 PCI 33MHz

JP3

CPU1

SPEC

BMC/VGA

CTRL

J28
J27

JPW3

BIOS

JBT1

D1

JPB

USB4/5

USB6/7

JPG1

ICH10R

South Bridge

USB3

USB2

J6

CPU2

P2-DIMM1B

P2-DIMM1A

P2-DIMM2B

P2-DIMM2A

P2-DIMM3B

P2-DIMM3A

Intel 5520

North Bridge

LES2

LSI

I-BUTTON

JP7

I-SATA1

1068E

(*X8DT3 Models only)

JWF1

T-SGPIO2

I-SATA5

T-SGPIO1

I-SATA3

TPM Header

LES1

JL1

JWD

JPW1

SP1

LE1

SI/O

J5

SAS4~7

JSM2

(*X8DT3 Models only)

SAS0~3

JSM1

JWOL

JPS2

JPS1

Fan4

Fan1

Fan7/
CPU2

JF1

Floppy

JOH1

Fan2

Fan3

JD1

1

1

1

Notes:

1. Jumpers not indicated are for test purposes only.

2. For IPMI conguration, please refer to the Winbond BMC User's Guide

posted on our website @ http://www.supermicro.com/support/manuals/.

3. " " indicates the location of Pin 1. Also, refer to Chapter 2 for detailed infor-

mation on the onboard components.

4. When LE1 is on, the onboard power connection is on. Make sure to unplug

the power cables before removing or installing components.

5. To avoid possible system overheating, be sure to provide adequate airow

to the system.

6. JPB (BMC Enable jumper), JWF1 (DOM PWR connector), TPM (Trusted

Platform Module header), the 5600 Series processors, and 1.35V DIMM

modules are supported by the Rev. 2.00 or later version motherboard.

1-4

Chapter 1: Introduction

Quick Reference

Jumper Description Default Setting

JBT1 CMOS Clear (See Section 5-10)

JI2C1/JI2C2 SMB to PCI Slots 2-3 (Disabled)

JPB BMC Enable (for F models) Pins 1-2 (Enabled) (for R. 2.00 & later board)

JPG1 VGA Enable Pins 1-2 (Enabled)

JPL1/JPL2 LAN1/2 & LAN 3/4 Enable Pins 1-2 (Enabled) (JP2: for LN4 models)

JPS1 SAS Enable Pins 1-2 (Enabled) (Note 5 P. 1-4)

JPS2 SAS RAID Enable Closed (SR RAID Enabled) (Note5 P1-4)

JWD Watch Dog Pins 1-2 (Reset)

Connector Description

COM1/COM2 COM1/COM2 Serial Port/Header

FAN 1-8 System/CPU Fan Headers (Fans 7~8: CPU Fans)

Floppy Floppy Disk Drive Connector

I-Button I-Button for data storage (optional for X8DT3/-F/LN4F only)

J5 IPMB I2C Header (for an IPMI card)

J6 Power Supply SMBbus I2C Header

JD1 PWR LED/Speaker Header (Pins 4~7: Speaker)

JF1 Front Panel Connector

JL1 Chassis Intrusion Header

JOH1 Overheat LED Header

JWF1 DOM (Disk-On-Module) Power Header (for R. 2.0 & later)

JPW1/JPW2, JPW3 8-pin Secondary PWR, 24-pin ATX PWR (See Warning)

JWOL Wake-On-LAN Header

LAN1/2, LAN 3/4,
IPMI_Dedicated LAN

I-SATA0 ~ I-SATA5 (Intel South Bridge) SATA Ports

SAS 0~3, 4~7 SAS Ports 0~3, 4~7 (X8DT3/-F/-LN4F only)

T-SGPIO-1/T-SGPIO-2 Serial General Purpose Input/Output Headers

TPM Header Trusted Platform Module (TPM) Header (for R. 2.0 & later)

USB 0/1, 2,3, 4/5, 6/7 Universal Serial Bus (USB) Ports

VGA VGA Connector

Gigabit Ethernet (RJ45) Ports (See Note 5 on P. 1-4)

LED Description

D1 BMC Heartbeat LED Indicator

LE1 Onboard Standby LED Indicator

LES1/LES2 SAS LEDs (LES1: SAS Heartbeat, LES2: SAS Activity LEDs)

Note: To provide adequate power to the system, be sure to connect JPW1,

JPW2 and JPW3 to the power supply. Refer to the warning on P. 1-12 for

more information.

1-5

X8DT3/X8DTi/X8DT3-F/X8DTi-F/X8DT3-LN4F/X8DTi-LN4F User's Manual

Motherboard Features

CPU

• Two Intel

ing two full-width Intel QuickPath Interconnect links with a total of up to 51.2

GB/s Data Transfer Rate (6.4 GB/s per direction)

Memory

®

5500/5600* Series (LGA 1366) processors, each processor support-

• DIMM sockets support up to 192 GB of DDR3 Reg. ECC or up to 48 GB of DDR3

Unbuffered ECC/Non-ECC 1333 MHz/1066 MHz/800 MHz memory in 12 slots

Chipset

• Intel 5520 chipset, including: the 5520 (North Bridge) and the ICH10R (South

Bridge).

Expansion Slots

• One PCI-E 2.0 x16 slot (Slot 4) (X8DTi/X8DTi-F only)

• Three PCI-E 2.0 x8 (in x16) slots (Slot 5/Slot 6, and Slot 4 for X8DT3/X8DT3-F/

X8DTi/3-LN4 only)

• One PCI-E x4 slot (Slot 2) or Two PCI-E 2.0 x8 slots (for X8DTi/ X8DTi-F)

• Two 32-bit PCI 33 slot (Slot 1 and Slot 3)

BIOS

• 32 Mb AMI SPI Flash ROM

• PCI 2.2, ACPI 1.0/2.0/3.0, Plug and Play (PnP), DMI 2.3, Wakeup, USB Key-

board support, and SMBIOS 2.3

PC Health Monitoring

• Onboard voltage monitors for CPU1 Vcore/CPU2 Vcore, CPU1 DIMM/CPU2

DIMM, 1.5V, 3.3Vcc (V), 3.3V SB (V), 12Vcc (V), 5Vin, and Battery Voltage.

• Fan status monitor with rmware control

• CPU/chassis temperature monitors

• Platform Environment Control Interface (PECI) ready

• Thermal Monitor 2 (TM2) support

• CPU fan auto -of f in sleep mode

• CPU slow-down on temperature overheat

• Pulse Width Modulation (PWM) Fan Control

• CPU thermal trip support for processor protection, power LED

• Power-up mode control for recover y from AC power loss

• Auto-switching voltage regulator for CPU cores

• System overheat/Fan Fail LED Indicator and control

• Chassis intrusion detection

1-6

Chapter 1: Introduction

• System resource alert via Supero Doctor III

ACPI Features

• Slow blinking LED for suspend state indicator

• Main switch override mechanism

• ACPI Power Management

• Keyboard Wakeup from Soft-off

Onboard I/O

• Intel ICH10R supports six SATA2 ports (with RAID0, RAID1, RAID10, RAID5

supported in the Windows OS Environment) (Note 1)

• LSI 1068E supports eight SAS ports (with RAID 5 optional) (For X8DT3/-F/-

LN4F) (Note 2)

• Intel 82576EB dual-port Gigabit Ethernet controllers support Giga-bit LAN

ports (an additional 82576EB is available on the X8DT3/i-LN4F only)

• One oppy port interface and two COM ports (1 header, 1 port)

• One VGA Port suppor ted by the WPCM450 BMC Controller

• PS/2 mouse and PS/2 keyboard ports

• Up to eight USB 2.0 (Universal Serial Bus) (2 Backpanel USB Ports, 2 Front

USB Headers, and 2 Type A Headers)

• Super I/O: Winbond W83627HG

• IPMI 2.0 with full KVM support (X8DT3/i-F/-LN4F only) (Note 3)

Other

• Wake-on-LAN (WOL)

• Console redirection

• Onboard Fan Speed Control by Thermal Management via BIOS

CD/Diskette Utilities

• BIOS ash upgrade utility and device drivers

Dimensions

• Ext. ATX 12.00" (L) x 13.00" (W) (304.80 mm x 330.20 mm)

Note 1: For SATA HostRAID conguration instructions, please refer to the

Intel SATA HostRAID User's Guide posted at http://www.supermicro.com/

support/manuals/.

Note 2: For LSI SAS RAID conguration instructions, please refer to the

LSI MegaRAID User's Guide posted at http://www.supermicro.com/sup-

port/manuals/.

Note 3: For IPMI conguration instructions, refer to the Embedded IPMI

User's Guide posted at http://www.supermicro.com/support/manuals/.

1-7

X8DT3/X8DTi/X8DT3-F/X8DTi-F/X8DT3-LN4F/X8DTi-LN4F User's Manual

#4

PHY#1

X16 SLOT

PHY#2

PCI-E X16/8

Ports#0~3

Ports#4~7

PHY#1

PHY#2

#1-1

LAN#2

82576EB

Option

SAS
LSI 1068
B3
Option

LAN#1

82576EB

BMC WPCM450

#1-2

DDRIII

#1-4

#1-3

800/1066/1333

(Optional)

PCI-E X4

#6

#3

#1

#1-6

#1-5

PCI-E X4

PCI-E X8

SPEC

PCI-33

PCI-33

VRD VRD

6 PHASE 6 PHASE

PROCESSOR#2

QPI

PCI-E X8

LANE 1/2/3/4

LANE5

LANE6

SPI

Ports

#7-10

Ports
#1-2

Ports
#3-4
Ports
#5-6

Port

#7

Port

#8

PCI-E X8

#5

PCI-E X8

#2

PCI-E X8

PCI-E X16

PCI-E X4

PCI 33MHz

QPI

Intel 5520

Port

#0

ESI

DMI

Intel ICH10R

W83627

PROCESSOR#1

QPI

PCIE X4

3.0 Gb/S

USB 2.0

LPC

SIO

HG

#0

#0

TPM

#0-6

#0-5

#0-4

#0-3

#0-2

#0-1

DDRIII

800/1066/1333

#5

#4

#3

#2

#1

SATA

28
#5

#3

#2

#1

#9

#8

#7

#6

USB

MS

KB

COM1
External

COM2
internal

Block Diagram of the 5520 Platform

Note: This is a general block diagram. Please see the previous Mother-

board Features pages for details on the features of each motherboard.

1-8

Chapter 1: Introduction

1-3 Chipset Overview

Built upon the capability of the Intel 5520 platform, the X8DT3/X8DTi/X8DT3-F/

X8DTi-F/X8DT3-LN4F/X8DTi-LN4F motherboard provides the performance and

feature set required for dual-processor-based high-end systems with congura-

tion optimized for workstations, High Performance Computing (HPC) systems,

and intensive applications. The 5520 platform consists of the 5500/5600 Series

(LGA 1366) processor, the 5520 (North Bridge), and the ICH10R (South Bridge).

With the QuickPath Interconnect (QPI) controller built in, the 5520 platform is the

rst dual-processing platform that offers the next generation point-to -point system

interconnect inter face to replace the current Front Side Bus Technology, substan-

tially enhancing system performance with increased bandwidth and scalability.

The 5520 North Bridge connects to each processor through an independent Quick-

Path Interconnect link. Each link consists of 20 pairs of unidirectional differential

lanes for data transferring in addition to a differential forwarded clock. A full-width

QuickPath interconnect link pair provides 84 signals. Each processor supports two

QuickPath links, one going to the other processor and the other to the 5520.

The 5520 platform supports up to 36 PCI Express Gen2 lanes, peer-to-peer read

and write transactions. The ICH10R provides up to 6 PCI-Express ports, six SATA

ports and 10 USB connections.

In addition, the 5520 platform also offers a wide range of RAS (Reliability, Avail-

ability and Serviceability) features. These features include memory interface ECC,

x4/x8 Single Device Data Correction (SDDC), Cyclic Redundancy Check (CRC),

parity protection, out-of-band register access via SMBus, memory mirroring, and

memory sparing.

Main Features of the 5500/5600 Series Processor and the
5520 Chipset

•Four processor cores in each processor with 8MB shared cache among cores

•Two full-width Intel QuickPath interconnect links, up to 6.4 GT/s of data transfer

rate in each direction

•Virtualization Technology, Integrated Management Engine supported

•Point-to-point cache coherent interconnect, Fast/narrow unidirectional links, and

Concurrent bi-directional trafc

•Error detection via CRC and Error correction via Link level retry

1-9

X8DT3/X8DTi/X8DT3-F/X8DTi-F/X8DT3-LN4F/X8DTi-LN4F User's Manual

1-4 Special Features

Recovery from AC Power Loss

BIOS provides a setting for you to determine how the system will respond when AC

power is lost and then restored to the system. You can choose for the system to

remain powered off (in which case you must press the power switch to turn it back

on) or for it to automatically return to a power- on state. See the Advanced BIOS

Setup section to change this setting. The default setting is Last State.

1-5 PC Health Monitoring

This section describes the PC health monitoring features of the X8DT3/X8DTi/

X8DT3-F/X8DTi-F/X8DT3-LN4F/X8DTi-LN4F. All have an onboard System Hard-

ware Monitor chip that supports PC health monitoring. An onboard voltage monitor

will scan these onboard voltages continuously: CPU1 Vcore/CPU2 Vcore, CPU1

DIMM/CPU2 DIMM, 1.5V, 3.3Vcc (V), 3.3V SB (V), 12Vcc (V), 5Vin, and Battery

Voltage. Once a voltage becomes unstable, a warning is given or an error mes-

sage is sent to the screen. Users can adjust the voltage thresholds to dene the

sensitivity of the voltage monitor.

Fan Status Monitor with Firmware Control

The PC health monitor can check the RPM status of the cooling fans. The onboard

CPU and chassis fans are controlled by Thermal Management via BIOS (under

Hardware Monitoring in the Advanced Setting).

Environmental Temperature Control

The thermal control sensor monitors the CPU temperature in real time and will turn

on the thermal control fan whenever the CPU temperature exceeds a user-dened

threshold. The overheat circuitry runs independently from the CPU. Once it detects

that the CPU temperature is too high, it will automatically turn on the thermal fan

control to prevent any overheat damage to the CPU. The onboard chassis thermal

circuitry can monitor the overall system temperature and alert users when the chas-

sis temperature is too high.

Warning: To avoid possible system overheating, please be sure to provide

adequate airow to your system.

System Resource Alert

This feature is available when used with Supero Doctor III in the Windows OS

1-10

Chapter 1: Introduction

environment or used with Supero Doctor II in Linux. Supero Doctor is used to

notify the user of certain system events. For example, you can also congure

Supero Doctor to provide you with warnings when the system temperature, CPU

temperatures, voltages and fan speeds go beyond a pre-dened range.

1-6 ACPI Features

ACPI stands for Advanced Conguration and Power Interface. The ACPI specica-

tion denes a exible and abstract hardware interface that provides a standard

way to integrate power management features throughout a PC system, including

its hardware, operating system and application software. This enables the system

to automatically turn on and off peripherals such as CD-ROMs, network cards, hard

disk drives and printers.

In addition to enabling operating system-directed power management, ACPI

provides a generic system event mechanism for Plug and Play and an operating

system-independent interface for conguration control. ACPI leverages the Plug

and Play BIOS data structures while providing a processor architecture-independent

implementation that is compatible with the Windows XP/2003/2008/Vista Operating

System.

Slow Blinking LED for Suspend-State Indicator

When the CPU goes into a suspend state, the chassis power LED will start blinking

to indicate that the CPU is in suspend mode. When the user presses any key, the

CPU will wake-up and the LED will automatically stop blinking and remain on.

Main Switch Override Mechanism

When an ATX power supply is used, the power button can function as a system

suspend button to make the system enter a SoftOff state. The monitor will be

suspended and the hard drive will spin down. Pressing the power button again

will cause the whole system to wake-up. During the SoftOff state, the ATX power

supply provides power to keep the required circuitry in the system "alive." In case

the system malfunctions and you want to turn off the power, just press and hold

the power button for 4 seconds. This option can be set in the Power section of the

BIOS Setup routine.

Wake-On-LAN (WOL)

Wake-On-LAN is dened as the ability of a management application to remotely

power up a computer that is powered off. Remote PC setup, up-dates and asset

tracking can occur after hours and on weekends so that daily LAN trafc is kept

to a minimum and users are not interrupted. The motherboard has a 3-pin header

1-11

X8DT3/X8DTi/X8DT3-F/X8DTi-F/X8DT3-LN4F/X8DTi-LN4F User's Manual

(WOL) to connect to the 3-pin header on a Network Interface Card (NIC) that has

WOL capability. In addition, an onboard LAN controller can also support WOL

without any connection to the WOL header. The 3-pin WOL header is to be used

with a LAN add-on card only.

Note: Wake-On-LAN requires an ATX 2.01 (or above) compliant power

supply.

1-7 Power Supply

As with all computer products, a stable power source is necessary for proper and

reliable operation. It is even more important for processors that have high CPU

clock rates.

The X8DT3/X8DTi/X8DT3-F/X8DTi-F/X8DT3-LN4F/X8DTi-LN4F can accommodate

24-pin ATX power supplies. Although most power supplies generally meet the

specications required by the CPU, some are inadequate. In addition, the two 12V

8-pin power connections are also required to ensure adequate power supply to the

system. Also your power supply must supply 1.5A for the Ethernet ports.

Warning: To prevent damage to the power supply or motherboard, please

use a power supply that contains a 24-pin and two 8-pin power connectors.

Be sure to connect these connectors to the 24-pin (JPW3) and the two

8-pin (JPW1,JPW2) power connectors on the motherboard for adequate

power supply to your system. Failure in doing so will void the manufacturer

warranty on your power supply and motherboard.

It is strongly recommended that you use a high quality power supply that meets ATX

power supply Specication 2.02 or above. It must also be SSI compliant (For more

information, please refer to the web site at http://www.ssiforum.org/). Additionally, in

areas where noisy power transmission is present, you may choose to install a line

lter to shield the computer from noise. It is recommended that you also install a

power surge protector to help avoid problems caused by power surges.

1-8 Super I/O

The disk drive adapter functions of the Super I/O chip include a oppy disk drive

controller that is compatible with industry standard 82077/765, a data separator,

write pre-compensation circuitry, decode logic, data rate selection, a clock genera-

tor, drive interface control logic and interrupt and DMA logic. The wide range of

functions integrated onto the Super I/O greatly reduces the number of components

required for interfacing with oppy disk drives. The Super I/O supports 360 K, 720

K, 1.2 M, 1.44 M or 2.88 M disk drives and data transfer rates of 250 Kb/s, 500 Kb/s

or 1 Mb/s. It also provides two high-speed, 16550 compatible serial communication

1-12

Chapter 1: Introduction

ports (UARTs). Each UART includes a 16-byte send/receive FIFO, a programmable

baud rate generator, complete modem control capability and a processor interrupt

system. Both UARTs provide legacy speed with baud rate of up to 115.2 Kbps

as well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which

support higher speed modems.

The Super I/O provides functions that comply with ACPI (Advanced Conguration

and Power Interface), which includes support of legacy and ACPI power manage-

ment through an SMI or SCI function pin. It also features auto power management

to reduce power consumption.

1-9 Overview of the Winbond WPCM450 Controller (For
X8DT3/i-F/X8DT3/i-LN4F Only)

The Winbond WPCM450 Controller is a Baseboard Management Controller (BMC)

that supports the 2D/VGA-compatible Graphics Core with the PCI interface,

Virtual Media, and Keyboard/Video/Mouse Redirection (KVMR) modules. With

blade-oriented Super I/O capability built-in, the WPCM450 Controller is ideal for

legacy-reduced server platforms.

The WPCM450 interfaces with the host system via a PCI interface to communicate

with the Graphics core. It supports USB 2.0 and 1.1 for remote keyboard/mouse/

virtual media emulation. It also provides LPC interface to control Super IO functions.

The WPCM450 is connected to the network via an external Ethernet Phy module.

The WPCM450 communicates with onboard components via six SMBus interfaces,

fan control, and Platform Environment Control Interface (PECI) buses.

1-13

X8DT3/X8DTi/X8DT3-F/X8DTi-F/X8DT3-LN4F/X8DTi-LN4F User's Manual

Notes

1-14

Chapter 2: Installation

Chapter 2

Installation

2-1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic com ponents. To prevent dam-

age to your system board, it is important to handle it very carefully. The following

measures are generally sufcient to protect your equipment from ESD.

Precautions

•Use a grounded wrist strap designed to prevent static discharge.

•Touch a grounded metal object before removing the board from the antistatic

bag.

•Handle the board by its edges only; do not touch its components, peripheral

chips, memory modules or gold contacts.

•When handling chips or modules, avoid touching their pins.

•Put the motherboard and peripherals back into their antistatic bags when not

in use.

•For grounding purposes, make sure your computer chassis provides excellent

conductivity between the power supply, the case, the mounting fasteners and

the motherboard.

•Use only the correct type of onboard CMOS battery as specied by the

manufacturer. Do not install the onboard battery upside down to avoid possible

explosion.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When

unpacking the board, make sure the person handling it is static protected.

2-1

X8DT3/X8DTi/X8DT3-F/X8DTi-F/X8DT3-LN4F/X8DTi-LN4F User's Manual

2-2 Motherboard Installation

All motherboards have standard mounting holes to t different types of chassis.

Make sure that the locations of all the mounting holes for both motherboard and

chassis match. Although a chassis may have both plastic and metal mounting

fasteners, metal ones are highly recommended because they ground the mother-

board to the chassis. Make sure that the metal standoffs click in or are screwed in

tightly. Then use a screwdriver to secure the motherboard onto the motherboard

tray. Note: Some components are very close to the mounting holes. Please take

precautionary measures to prevent damage to these components when installing

the motherboard to the chassis.

Tools Needed

1. Phillips Screwdriver

2. Pan head #6 screws

Locations of Mounting Holes

Installation Instructions

Rev. 2.01

1. Install the IO shield into the chassis.

2. Locate the mounting holes on the motherboard. Refer to the layout above for

mounting hole locations.

3. Locate the matching mounting holes on the chassis. Align the mounting holes

on the motherboard against the mounting holes on the chassis.

4. Install standoffs in the chassis as needed.

5. Install the motherboard into the chassis carefully to avoid damage to mother-

board components.

Warning: To avoid damaging the motherboard and its components, please

do not apply any force greater than 8 lb/sq.in (8 lbs. per square inch) when

installing a screw into a mounting hole.

6. Insert a Pan head #6 screw into a mounting hole on the motherboard and its

matching mounting hole on the chassis, using a Phillips screwdriver.

7. Repeat Step 4 to insert #6 screws to all mounting holes.

8. Make sure that the motherboard is securely placed on the chassis.

X8DT3/i Series

2-2

Chapter 2: Installation

!

2-3 Processor and Heatsink Installation

Warning: When handling the processor package, avoid placing direct

pressure on the label area of the fan.

Notes:

1. Always connect the power cord last and always remove it before adding, re-

moving or changing any hardware components. Make sure that you install the

processor into the CPU socket before you install the CPU heatsink.

2. Make sure to install the motherboard into the chassis before you install the

CPU heatsink and heatsink fans.

3. When purchasing a 5500/5600 Series processor or when receiving a moth-

erboard with a 5500/5600 Series processor pre-installed, make sure that the

CPU plastic cap is in place, and none of the CPU pins are bent; otherwise,

contact the retailer immediately.

4. Refer to the Motherboard Features Section for more details on CPU support.

1. Press the socket clip to release

the load plate, which covers the

CPU socket, from its locking

position.

Socket Clip

Load Plate

2. Gently lift the socket clip to

open the load plate.

Plastic Cap

3. Hold the plastic cap at its north

and south center edges to re-

move it from the CPU socket.

Hold the north & south edges of
the plastic cap to remove it

2-3

X8DT3/X8DTi/X8DT3-F/X8DTi-F/X8DT3-LN4F/X8DTi-LN4F User's Manual

1. After removing the plastic cap,

using your thumb and the index

nger, hold the CPU at the

north and south center edges.

2. Align the CPU key, the semi-

circle cutout, against the socket

key, the notch below the gold

color dot on the side of the

socket.

3. Once both the CPU and the

socket are aligned, carefully

lower the CPU straight down

into the socket. (Do not rub the

CPU against the surface of the

socket or its pins to avoid dam-

aging the CPU or the socket.)

4. With the CPU inside the socket,

inspect the four corners of the

CPU to make sure that the CPU

is properly installed.

5. Once the CPU is securely

seated on the socket, lower the

CPU load plate to the socket.

CPU CPU SocketLoad Plate

Socket Keys

CPU Keys

6. Use your thumb to gently push

the socket clip down to the clip

lock.

Warning: Please save the

plastic cap. The mother-

board must be shipped

with the plastic cap prop-

erly installed to protect the

CPU socket pins. Ship-

ment without the plastic

cap properly installed will

cause damage to the sock-

et pins.

2-4

Installing a CPU Heatsink

1. Do not apply any thermal

grease to the heatsink or the

CPU die because the required

amount has already been ap-

plied.

Chapter 2: Installation

2. Place the heatsink on top of the

CPU so that the four mounting

holes are aligned with those on

the retention mechanism.

3. Install two diagonal screws (ie

the #1 and the #2 screws) and

tighten them until just snug

(-do not fully tighten the screws

to avoid possible damage to

th e CP U.)

4. Finish the installation by fully

tightening all four screws.

Screw#1

Screw#1

Install Screw#1

Screw#2

Screw#2

2-5

X8DT3/X8DTi/X8DT3-F/X8DTi-F/X8DT3-LN4F/X8DTi-LN4F User's Manual

Removing the Heatsink

Warning: We do not recommend that the CPU or the heatsink be re-

moved. However, if you do need to remove the heatsink, please follow

the instructions below to uninstall the heatsink and prevent damage to

the CPU or other components.

1. Unplug the power cord from the

power supply.

2. Disconnect the heatsink fan

wires from the CPU fan header.

3. Using a screwdriver, loosen and

remove the heatsink screws

from the motherboard in the se-

quence as show in the picture

on the right.

4. Hold the heatsink as shown

in the picture on the right and

gently wriggle the heatsink to

loosen it from the CPU. (Do not

use excessive force when wrig-

gling the heatsink.)

Using a screwdriver to

remove Screw#1

Remove Screw#2

5. Once the CPU is loosened,

remove the heatsink from the

CPU socket.

6. To reinstall the CPU and the

heatsink, clean the surface of

the CPU and the heatsink to get

rid of the old thermal grease.

Reapply the proper amount of

thermal grease on the surface

before reinstalling them on the

motherboard.

2-6

Chapter 2: Installation

2-4 Memory Installation

Note: Check the Supermicro web site for recommended memory modules.

CAUTION

Exercise extreme care when installing or removing DIMM

modules to prevent any possible damage. Also note that the

memory is interleaved to improve per formance (See step 1).

DIMM Installation

1. Insert the desired number of DIMMs into the memory slots, starting with

DIMM #P1-DIMM1A. When populating two DIMM modules within a channel,

always start with Bank1 rst. For optimal memory performance, please install

3 memory modules of the same type and same speed at a time with the

maximum of 12 modules. (See the Memory Installation Tables on Pages 2-8,

2-9.)

2. Insert each DIMM module vertically into its slot. Pay attention to the notch

along the bottom of the module to prevent inserting the DIMM module incor-

rectly.

3. Gently press down on the DIMM module until it snaps into place in the slot.

Repeat for all modules.

Rev. 2.01

X8DT3/i Series

To Remove:
Use your thumbs
to gently push
the release tabs
near both ends of
the module. This
should release it
from the slot.

Notch

Release

Tab

DIMM DDR3

Note: Notch

should align

with the

receptive point

on the slot

To I nst a ll: Inser t module vertically and press down until it
snaps into place. Pay attention to the alignment notch at
the bottom.

3

Release Tab

2-7

Notch

Release

Tab

Release Tab

X8DT3/X8DTi/X8DT3-F/X8DTi-F/X8DT3-LN4F/X8DTi-LN4F User's Manual

Memory Population for Optimal Performance

-For a motherboard with One CPU (CPU1) installed

Branch 0 Branch 1 Branch 2

3 DIMMs P1 DIMM1A P1 DIMM2A P1 DIMM3A

6 DIMMs P1 DIMM1A P1 DIMM1B P1 DIMM2A P1 DIMM2B P1 DIMM3A P1 DIMM3B

Memory Population for Optimal Performance

-For a motherboard with One CPU (CPU2) installed

Branch 0 Branch 1 Branch 2

3 DIMMs P2 DIMM1A P2 DIMM2A P2 DIMM3A

6 DIMMs P2 DIMM1A P2 DIMM1B P2 DIMM2A P2 DIMM2B P2 DIMM3A P2 DIMM3B

Memory Population for Optimal Performance

-For a motherboard with Two CPUs installed

CPU1 CPU2

Branch 0 Branch 1 Branch 3 Branch 0 Branch 1 Branch 3

6 DIMMs 1A 2A 3A 1A 2A 3A

12
DIMMs

1A 1B 2A 2B 3A 3B 1A 1B 2A 2B 3A 3B

Memory Support

The X8DT3/X8DTi/X8DT3-F/X8DTi-F/X8DT3-LN4F/X8DTi-LN4F supports up to

192 GB Registered ECC DDR3 or up to 48 GB Unbuffered ECC/Non-ECC 1333

MHz/1066 MHz/800 MHz in 12 DIMMs. Please note that Memory Speed support

depends on the type of CPU used in the motherboard.

DIMMModulePopulationConguration

For memory to work properly, follow the tables below for memory installation.

Memory Support for the motherboards w/5500 Series Processors

installed

RDIMM Population for the Motherboard w/5500 Processors Installed

DIMM
Slots per
Channel

2 1 Reg. DDR3 ECC 800,1066,1333 SR or DR

2 1 Reg. DDR3 ECC 800,1066 QR

2 2 Reg. DDR3 ECC 800,1066 Mixing SR, DR

2 2 Reg. DDR3 ECC 800 Mixing SR, DR, QR

DIMMs
Populated
per Channel

DIMM Type (Reg.=
Registered)

Speeds (in MHz) Ranks per DIMM

(any combination;
SR=Single Rank,
DR=Dual Rank,
QR=Quad Rank)

2-8