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The vendor assumes no responsibility for any inaccuracies that may be contained in this document,
makes no commitment to update or to keep current the information in this manual, or to notify any
person or organization of the updates. Please Note: For the most up-to-date version of this
manual, please see our web site at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product
described in this manual at any time and without notice. This product, including software, if any,
and documentation may not, in whole or in part, be copied, photocopied, reproduced, translated or
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IN NO EVENT WILL SUPERMICRO BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL, SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING
FROM THE USE OR INABILITY TO USE THIS PRODUCT OR DOCUMENTATION,
EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR,
SUPERMICRO SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE,
OR DATA STORED OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF
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Any disputes arising between manufacturer and customer shall be governed by the laws of Santa
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claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class B
digital device pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
manufacturer’s instruction manual, may cause interference with radio communications. However,
there is no guarantee that interference will not occur in a particular installation. If this equipment
does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, you are encouraged to try to correct the interference by one or more
of the following measures:
*Reorient or relocate the receiving antenna.
*Increase the separation between the equipment and the receiver.
*Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
*Consult the dealer or an experienced radio/television technician for help.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate
Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate”
WARNING: Handling of lead solder materials used in this
product may expose you to lead, a chemical known to the
State of California to cause birth defects and other reproductive harm.
Manual Revision 1.1a
Release Date: January 22, 2010
Bus Inversion (DBI), Advanced Digital Media Boost, Smart Memory Access, and
Thermal Management 2 (TM2)
Memory
Four DIMM slots support Dual/Single Channel DDR2 800/667 MHz up •
to 8 GB of ECC/Non-ECC Unbuffered DDR2 SDRAM
Chipset
Intel 3200•
Intel ICH9R•
Expansion Slots
One (1) Universal PCI-E x8 slot or one (1) PCI 32-bit slot•
One (1) 32-bit PCI 33MHz •
One (1) SIM 1U (Available only on X7SBL-LN2) •
BIOS
8 Mb Firmware Hub Phoenix BIOS •
DMI 2.3, PCI 2.2, ACPI 1.0/2.0, Plug and Play (PnP), SMBIOS 2.3 •
PC Health Monitoring
Onboard voltage monitors for CPU cores, Memory Voltage, +1.8V, +3.3V, •+5V,
+5V Standby, +12V, −12V, and VBAT
CPU 4-phase-switching voltage regulator•
Status monitor for fan speed & System OH/Fan Fail LED/Control•
Pulse Width Modulation Fan Control & Low noise fan speed control•
Environmental temperature monitoring via BIOS•
Power-up mode control for recovery from AC power loss•
SuperDoctor III, NMI•
System Resource alert via SuperDoctor III•
Slow blinking LED for suspend state indicator•
BIOS support for USB keyboard•
Main switch override mechanism•
1-6
Chapter 1: Introduction
ACPI Features
Slow blinking LED for suspend state indicator•
BIOS support for USB keyboard•
Main switch override mechanism•
Internal/external modem ring-on•
Onboard I/O
Intel ICH9R SATA Controller, 6 connectors for 6 devices with support of RAID •
functions 0, 1, 5 and 10 (RAID 5: supported by Intel's RAID Controller in the
Windows OS environment only)
1 oppy port interface (up to 2.88 MB) •
1 Fast UART 16550 compatible serial port and 1 header•
Intel 82573V and 82573L Gigabit Ethernet Controllers (Two LANS under •
LAN2)
PS/2 mouse and PS/2 keyboard ports•
Up to 7 USB (2 rear ports, 2 headers, and 1 on-board connector)•
VGA Connector•
SIM 1U IPMI Slot•
Winbond 83627HG (Super I/O), Hardware Monitor: W83793G•
XGI Volari Z9S with 32 MB DDR2•
Temperature
Monitoring CPU, chassis environment•
CPU Thermal Trip support•
Thermal Monitor 2 (TM2) (available if supported by the CPU)•
Intel 82573 Platform LAN Connect (PLC) PCI Design•
Note 1: For more information on the ICH9R, please refer to Intel's website at
www.intel.com.
Note 2: The Intel 3200 chipset does not support add-in graphics cards in the
PCI-E interface provided by the Memory Controller Hub (MCH)
1-9
X7SBL-LN1/LN2 User’s Manual
1-3 Special Features
Recovery from AC Power Loss
BIOS provides a setting for you to determine how the system will respond when
AC power is lost and then restored to the system. You can choose for the system
to remain powered off (in which case you must hit the power switch to turn it back
on) or for it to automatically return to a power- on state. See the Power Lost Control
setting in the Advanced section to change this setting. (Default: Last State).
1-4 PC Health Monitoring
This section describes the PC health monitoring features of the X7SBL-LN1/LN2.
All have an onboard System Hardware Monitor chip that supports PC health moni-
toring.
Onboard Voltage Monitors for the CPU Cores, Memory Voltage, +1.8V, +3.3V, +5V,
+5V Standby, +12V, −12V and Vbatt.(via SuperO Doctor)
An onboard voltage monitor will scan these voltages continuously. Once a voltage
becomes unstable, a warning is given or an error message is sent to the screen.
Users can adjust the voltage thresholds to dene the sensitivity of the voltage
monitor.
Fan Status Monitor with Firmware Control
The PC health monitor can check the RPM status of the cooling fans. The onboard
CPU and chassis fans are controlled by Thermal Management via BIOS (under
Hardware Monitoring in the Advanced Setting).
Environmental Temperature Control
The thermal control sensor monitors the CPU temperature in real time and will turn
on the thermal control fan whenever the CPU temperature exceeds a user-dened
threshold. The overheat circuitry runs independently from the CPU. Once it detects
that the CPU temperature is too high, it will automatically turn on the thermal fan
control to prevent any overheat damage to the CPU. The onboard chassis thermal
circuitry can monitor the overall system temperature and alert users when the chas-
sis temperature is too high.
1-10
Chapter 1: Introduction
I/O Virtualization Technology
With the Intel ICH9R built in, the X7SBL-LN1/LN2 supports I/O Virtualization Tech-
nology (VT-d) that enables multiple operating systems and applications to run in
independent partitions. Each partition uses its own subset of host physical memory,
and behaves like a virtual machine (VM), providing isolation and protection across
multiple partitions. This feature is available when a processor that supports I/O
Virtualization Technology is installed on the motherboard.
CPU Overheat LED and Control
This feature is available when the user enables the CPU overheat warning function
in the BIOS. This allows the user to dene an overheat temperature. When this tem-
perature is exceeded, both the overheat fan and the warning LED are triggered.
System Resource Alert
This feature is available when used with Supero Doctor III in the Windows OS en-
vironment or used with Supero Doctor II in Linux. Supero Doctor is used to notify
the user of certain system events. For example, if the system is running low on
virtual memory and there is insufcient hard drive space for saving the data, you
can be alerted of the potential problem. You can also congure Supero Doctor to
provide you with warnings when the system temperature goes beyond a pre-de-
ned range.
1-5 ACPI Features
ACPI stands for Advanced Conguration and Power Interface. The ACPI specica-
tion denes a exible and abstract hardware interface that provides a standard
way to integrate power management features throughout a PC system, including
its hardware, operating system and application software. This enables the system
to automatically turn on and off peripherals such as CD-ROMs, network cards, hard
disk drives and printers. This also includes consumer devices connected to the PC
such as VCRs, TVs, telephones and stereos.
In addition to enabling operating system-directed power management, ACPI
provides a generic system event mechanism for Plug and Play and an operating
system-independent interface for conguration control. ACPI leverages the Plug
and Play BIOS data structures while providing a processor architecture-independent
implementation that is compatible with Windows 2000, Windows XP and Windows
2003 Server Operating Systems.
1-11
X7SBL-LN1/LN2 User’s Manual
Slow Blinking LED for Suspend-State Indicator
When the CPU goes into a suspend state, the chassis power LED will start blinking
to indicate that the CPU is in suspend mode. When the user presses any key, the
CPU will wake-up and the LED will automatically stop blinking and remain on.
1-6 Super I/O
The disk drive adapter functions of the Super I/O chip include a data separator,
write pre-compensation circuitry, decode logic, data rate selection, a clock generator,
drive interface control logic and interrupt and DMA logic. The Super I/O supports
two 360 K, 720 K, 1.2 M, 1.44 M or 2.88 M disk drives and data transfer rates of
250 Kb/s, 500 Kb/s or 1 Mb/s.
It also provides two high-speed, 16550 compatible serial communication ports
(UARTs). Each UART includes a 16-byte send/receive FIFO, a programmable baud
rate generator, complete modem control capability and a processor interrupt sys-
tem. Both UARTs provide legacy speed with baud rate of up to 115.2 Kbps as well
as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which support
higher speed modems.
The Super I/O provides functions that comply with the ACPI (Advanced Congura-
tion and Power Interface), which includes support of legacy and ACPI power man-
agement through a SMI or SCI function pin. It also features auto power management
to reduce power consumption.
1-12
Chapter 2: Installation
Chapter 2
Installation
2-1 Static-Sensitive Devices
Electrostatic-Discharge (ESD) can damage electronic com ponents. To prevent dam-
age to your system board, it is important to handle it very carefully. The following
measures are generally sufcient to protect your equipment from ESD.
Precautions
Use a grounded wrist strap designed to prevent static discharge.•
Touch a grounded metal object before removing the board from the antistatic •
bag.
Handle the board by its edges only; do not touch its components, peripheral •
chips, memory modules or gold contacts.
When handling chips or modules, avoid touching their pins.•
Put the motherboard and peripherals back into their antistatic bags when not •
in use.
For grounding purposes, make sure your computer chassis provides excellent •
conductivity between the power supply, the case, the mounting fasteners and
the motherboard.
Use only the correct type of onboard CMOS battery as specied by the •
manufacturer. Do not install the onboard battery upside down to avoid possible
explosion.
Unpacking
The motherboard is shipped in antistatic packaging to avoid static damage. When
unpacking the board, make sure the person handling it is static protected.
2-2 Motherboard Installation
Note: Be sure to mount the motherboard into the chassis before you install the
CPU onto the motherboard.
All motherboards have standard mounting holes to t different types of chassis.
Make sure that the locations of all the mounting holes for both motherboard and
chassis match. Make sure that the metal standoffs click in or are screwed in tightly.
Then use a screwdriver to secure the motherboard onto the motherboard tray.
2-1
X7SBL-LN1/LN2 User’s Manual
Note: Some components are very close to the mounting holes. Please take
precautionary measures to prevent damage to these components when install-
ing the motherboard to the chassis.
2-3 Processor and Heatsink Installation
Warning: When handling the processor package, avoid placing direct pres-
!
sure on the label area of the fan.
Notes:
1. Always connect the power cord last and always remove it before adding,
removing or changing any hardware components. Make sure that you install the
processor into the CPU LGA 775 socket before you install the CPU heatsink.
2. The Intel LGA 775 Processor package contains the CPU fan and heatsink
assembly. If you buy a CPU separately, make sure that you use only Intel-
certied multi-directional heatsink and fan.
3. Make sure to install the motherboard into the chassis before you install the
CPU heatsink and fan.
4. When purchasing an LGA 775 Processor or when receiving a motherboard
with an LGA 775 Processor pre-installed, make sure that the CPU plastic cap
is in place and none of the CPU pins are bent; otherwise, contact the retailer
immediately.
5. Refer to the MB Features Section for more details on CPU support.
Installation Overview
For proper system setup, please fol-
low the following procedure:
Install the heatsink backplate 1.
into the chassis if needed.
Install the motherboard into the 2.
chassis.
Install the CPU onto the moth-3.
erboard.
Install the heatsink and/or 4.
cooling fans (if any).
Connect the fan and power 5.
cables (if any).
Heatsink
CPU
CPU
Socket
Mother-
board
CPU Retention
Bracket (Pre-
Installed)
Backplate
2-2
Installation of the LGA 775 Processor
PnP Cap on
top of the
Load Plate
1. Press the load lever to release
the load plate, which covers the CPU
socket, from its locking position.
2. Gently lift the load lever to open the
load plate.
Load Plate
(with PnP Cap
attached)
Chapter 2: Installation
3. Use your thumb and your index n-
ger to hold the CPU at the top center
edge and the bottom center edge of
the CPU.
4. Align CPU Pin1 (the CPU corner
marked with a triangle) against the
socket corner that is marked with a
triangle cutout.
Socket Key
(Socket Notch)
CPU Key (semi-
circle cutout)
below the circle.
Corner with a
triangle cutout
2-3
Triangle
Top Center Edge
Bottom Center Edge
golden dot
CPU Pin1
X7SBL-LN1/LN2 User’s Manual
5. Alig n t he CPU key t hat is the
semi-circle cutout below a golden dot
against the socket key, the Notch on
the same side of the triangle cutout
on the socket.
6. Once aligned, carefully lower the
CPU straight down to the socket.
(**Do not drop the CPU on the socket.
Do not move the CPU horizontally or
vertically. Do not rub the CPU against
the surface or against any pins of the
socket to avoid damage to the CPU
or the socket.)
7. With the CPU inside the socket,
inspect the four corners of the CPU
to make sure that the CPU is properly
installed.
Load Lever
8. Use your thumb to gently push the
load lever down to the lever lock.
9. If the CPU is properly installed into
the socket, the plastic PnP cap will be
automatically released from the load
plate when the load lever is pushed
in the lever lock. Remove the PnP cap
from the motherboard.
Note: Please save the plastic
PnP cap. The motherboard
must be shipped with the PnP
cap properly installed to protect
the CPU socket pins. Shipment
without the PnP cap properly
installed will cause damage to
the socket pins.
CPU in the CPU socket
Plastic cap
is released
from the
load plate
if CPU
properly
installed.
2-4
Installation of the Heatsink
Screw 1
Screw 2
1. Do not apply any thermal grease to
the heatsink or the CPU die, the required
amount has already been applied.
2. Place the heatsink on top of the
CPU so that the four mounting holes
are aligned with those on the retention
mechanism.
3. Screw in two diagonal screws (eg. the
#1 and the #2 screws) until just snug (do
not fully tighten the screws, which may
damage the CPU).
Chapter 2: Installation
4. Finish the installation by fully tighten-
ing all four screws.
2-5
X7SBL-LN1/LN2 User’s Manual
Removal of the Heatsink
Warning: We do not recommend that the CPU or the heatsink be
!
1. Unscrew and remove the heatsink screws
from in the sequence as show in the picture
on the right.
2. Hold and gently wriggle the heatsink to
loosen it from the CPU. (Do not use excessive
force when loosening the heatsink!)
3. Once the heatsink is loosened, remove it
from the CPU socket.
4. Clean the surfaces of the CPU and the
heatsink to remove the old thermal grease.
Reapply the proper amount of thermal
grease on the surface before re-installing the
CPU and the heatsink.
removed. However, if you do need to uninstall the heatsink, please
follow these instructions below to prevent damage to the CPU or the
CPU socket.
2-6
Chapter 2: Installation
2-4 Installing DIMMs
Note: Check the Supermicro web site for recommended memory modules.
Warning: Exercise extreme care when installing or removing
DIMM modules to prevent any possible damage. Also note that
!
DIMM Installation
the memory is interleaved to improve performance (see step
1).
Insert the desired number of DIMMs into the memory slots, starting with 1.
DIMM1A. The memory scheme is interleaved so you must install two modules
at a time, beginning with DIMM1A, DIMM1B, then, DIMM2A and DIMM2B
Insert each DIMM module vertically into its slot. Pay attention to the notch 2.
along the bottom of the module to prevent inserting the DIMM module incor-
rectly.
Gently press down on the DIMM module until it snaps into place in the slot. 3.
Repeat for all modules (see step 1 above).
Memory Support
The X7SBL-LN1/LN2 supports up to 8 GB Unbuffered ECC or non-ECC DDR2
800/677 MHz in 4 DIMMs. Populating DIMM#1A, DIMM#1B, and/or DIMM#2A,
DIMM#2B with memory modules of the same size and of the same type will result
in dual channel, two-way interleaved memory which is faster than the single chan-
nel, non-interleaved memory.
Notes:
Due to the OS limitations, some operating systems may not show more than 1.
4GB of memory.
Both Unbuffered ECC and Non-ECC memory modules can be installed in the 2.
memory slots.
Due to memory allocation to system devices, memory remaining available for 3.
operational use will be reduced when 4 GB of RAM is used. The reduction in
memory availability is disproportional. (Refer to the following Memory Avail-
ability Table for details.)
2-7
X7SBL-LN1/LN2 User’s Manual
Top View of DDR2 Slot
Note: Notch
should align
with the
receptive point
on the slot
Notch
Notch
Release
Tab
Release
Tab
DDR2 DIMM
Possible System Memory Allocation & Availability
System DeviceSizePhysical Memory
Firmware Hub ash memory (System
BIOS)
Local APIC4 KB3.99
Area Reserved for the chipset2 MB3.99
I/O APIC (4 Kbytes)4 KB3.99
PCI Enumeration Area 1256 MB3.76
PCI Express (256 MB)256 MB3.51
PCI Enumeration Area 2 (if needed)
-Aligned on 256-MB boundary-
VGA Memory16 MB2.85
TSEG1 MB2.84
Memory available to OS and other applications
1 MB3.99
512 MB3.01
Remaining (-Available)
(4 GB Total System Memory)
2.84
Installing and Removing DIMMs
To Remove:
Use your thumbs
to gently push
the release tabs
near both ends of
the module. This
should release it
from the slot.
To Install: Insert module vertically and press down until it
snaps into place. Pay attention to the alignment notch at the
bottom.
Top View of DDR2
2-8
Chapter 2: Installation
2-5 Control Panel Connectors/IO Ports
The I/O ports are color coded in conformance with the PC 99 specication. See
the image below for the colors and locations of the various I/O ports.
1. Back Panel Connectors/IO Ports
BackPanelI/OPortLocationsandDenitions
2
4
Back Panel Connectors
1. Keyboard (Purple)
2. PS/2 Mouse (Green)
3. Back Panel USB Port 0
4. Back Panel USB Port 1
5. COM Port 1 (Turquoise)
6. VGA Port (Blue)
7. Gigabit LAN 1
8. Gigabit LAN 2 (X7SBL-LN2 only)
(*See Section 2-5 for details.)
5
3
1
6
7
8
2-9
X7SBL-LN1/LN2 User’s Manual
FP Power Button
OH/Fan Fail LED
1
NIC1 LED
FP Reset Button
2
HDD LED
Power LED
Vcc
Vcc
Ground
Ground
1920
Vcc
X
Ground
NMI
X
Vcc
PWR Fail LED
NIC2 LED
Vcc
Vcc
2. Front Control Panel
JF1 contains header pins for various buttons and indicators that are normally lo-
cated on a control panel at the front of the chassis. See the image below for the
descriptions of the various control panel buttons and LED indicators. Refer to the
following section for descriptions and pin denitions.
A. JF1
Header Pins
A
2-10
3.FrontControlPanelPinDenitions
FP Power Button
OH/Fan Fail LED
1
NIC1 LED
FP Reset Button
2
HDD LED
Power LED
Vcc
Vcc
Ground
Ground
1920
Vcc
X
Ground
NMI
X
Vcc
PWR Fail LED
NIC2 LED
Vcc
Vcc
Chapter 2: Installation
NMI Button
The non-maskable interrupt button
header is located on pins 19 and 20
of JF1. Refer to the table on the right
for pin denitions.
Power LED
The Power LED connection is located
on pins 15 and 16 of JF1. Refer to the
table on the right for pin denitions.
NMI Button
PinDenitions(JF1)
Pin# Denition
19Control
20Ground
Power LED
PinDenitions(JF1)
Pin# Denition
15+5V
16Ground
A. NMI
B. PWR LED
Header Pins
A
B
2-11
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